CN105898996B - A kind of print circuit plates making equipment based on laser Pocket Machining technique - Google Patents
A kind of print circuit plates making equipment based on laser Pocket Machining technique Download PDFInfo
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- CN105898996B CN105898996B CN201610409428.0A CN201610409428A CN105898996B CN 105898996 B CN105898996 B CN 105898996B CN 201610409428 A CN201610409428 A CN 201610409428A CN 105898996 B CN105898996 B CN 105898996B
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- rack
- base material
- laser
- laser aid
- vertical
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000003754 machining Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 65
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 238000002679 ablation Methods 0.000 claims abstract description 21
- 230000007723 transport mechanism Effects 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 38
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 230000001737 promoting effect Effects 0.000 claims description 9
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of print circuit plates making equipment based on laser Pocket Machining technique, including rack, transport mechanism, hoisting mechanism and laser aid；Rack offers conveying trough, ablation room and sensing chamber successively from top to bottom；Rack includes left frame and right rack；Left frame and right rack are symmetrical set；Left frame and right frame lower offer conveying trough；Transport mechanism is horizontally installed in conveying trough；The hoisting mechanism of a pair of of vertical direction is provided in the gap between gap and rear wall between left frame and the front side wall of right rack；Laser aid is located on ablation room or so lateral wall；Laser aid includes left laser aid and right laser aid；Left laser aid is mounted on the left side wall of left frame；Right laser aid is mounted on the right side wall of right rack.The present invention can process base material two sides, quick and convenient, and base material can carry out ablation, detection successively from below to up by transport mechanism, hoisting mechanism, reduce equipment cost, improve work efficiency.
Description
Technical field：
The present invention relates to the processing technique fields of printed circuit board (PCB), and laser Pocket Machining is based in particular to one kind
The print circuit plates making equipment of technique.
Background technology：
With the fast development of high-density packages substrate, it is desirable that component chips area is corresponding to package area to be reduced,
Improving packaging efficiency becomes inevitable.The characteristics of meeting light printed circuit board, thin, short, small, flexible structure, reduces on substrate
Line width/line-spacing, making finer circuit becomes a kind of selection.In conventional line making, lateral erosion, long flow path, at sewage
Difficult wait of reason is always insurmountable problem, and excessive lateral erosion not only influences the beauty of circuit, and severe patient cannot even meet
For the conductance calls of high-frequency high-speed signal integrity in line transmission.Long flow path not only increases what failure in manufacturing process occurred
Probability also increases the cost of making.The sewage species generated in manufacture craft are more, and processing cost is big, also pollute environment, and then
Influence the fast development of printed circuit board industry.
At present, there are mainly three types of the methods for making fine-line：Subtractive process, semi-additive process and addition process.Subtractive process is to make
With most common circuit manufacturing method, it is first to be turned with photochemical method or silk screen method or galvanoplastic on the copper surface of copper-clad plate
Shifting forms circuitous pattern, then is etched away with the method for chemical attack by layers of copper part extra outside circuit is formed, and leaves required
The circuitous pattern wanted.But subtractive process side etching phenomenon most serious when fine-line makes easily occurs line short, open circuit etc. and asks
Topic, copper foil also waste seriously.Semi-additive process thickeies circuit using by graphic plating in relatively thin layers of copper, and with chemistry
The thin copper of logicalnot circuit part is etched removal by engraving method.The fine-line lateral erosion that the method makes is smaller, circuit cross section base
This is rectangular.But current extra thin copper foil is since cost is higher, using also not universal, according to common copper-clad plate subtract copper make it is ultra-thin
Copper foil, it is difficult to ensure that the uniformity consistency that whole plate is thinned.During graphic plating, for the fine-line of less than 50 μm line widths, ensure
The thin dry film against corrosion of circuit resolution is difficult simultaneously in plating line acid and alkali-resistance, and dry film dissolving and plating phenomenon are easier to occur.Chen Yuan
Bright et al. (plating and close etching, 2012, vol.34, NO.7:It 5-9) points out, semi-additive process, which makes fine-line, should select less than 5 μm
Extra thin copper foil.According to Copper treatment is subtracted, less than 5 μm thickness are more difficult to control, copper seed layer may be caused to be stripped, follow-up copper facing
The combination power of layer and base material is poor.Addition process is to be deposited on using electroless copper on photosensitive material, directly formed circuitous pattern with
Hole metallization layer.In the making of multilayer circuit, plate copper thickness and hole metallization duration is variant, easily trigger hole
The combination power of metallization problem, layers of copper and base material also is difficult to be guaranteed.Since addition process is to the particular/special requirement of base material, it is fabricated to
This is also very high, is not used widely also temporarily.
In the manufacture of printed circuit board, the making success or failure of via hole directly affect the performance of electrical connection.Digital control hole drilling
It is widely used in laser drill in micropore making.Digital control hole drilling can bore the hole of all material, but work as aperture and be less than 250 μm, bore
Hole cost exponentially increases, and is not suitable for large batch of micropore production；CO2 laser drill can process 50 μm or more of aperture, raw
Produce efficient, but CO2 laser is only applicable to resin medium layer, for the micropore between 50 μm~75 μm, it is more difficult to control, after drilling
Dielectric material residual film or carbide residue are more；UV laser can process the aperture of 25 μ m diameters, clean carbon-free in molding hole
Change, the hole cost made between 25 μm~125 μm is little, but makes large-diameter borehole cost using UV laser and exponentially increase
It is long.
For provide a kind of production process is simple, operation implement easily, cost of manufacture it is controllable, while product quality can be improved
And production efficiency, based on the method for manufacturing printed circuit board of laser Pocket Machining technique, Application No.
The application for a patent for invention of CN201410339246.1 discloses a kind of printed circuit board based on laser Pocket Machining technique and makes
Method, the invention carry out ablation using UV laser to base material one side first, gradually process fine-line groove and interlayer interconnection
Micropore groove；Electrically conductive ink is clogged to interlayer interconnection microvia groove again and is cured；When base material another side fine-line Pocket Machining
It is complete, black holes is carried out at the same time to base material two sides, groove electro-coppering is completed, then carries out printed circuit board subsequent fabrication process.The hair
It is bright can avoid the problem that conventional fine circuit make in blind hole fill out that plate face layers of copper after copper is partially thick, using micropore and filament groove
Disposable processing can save the flows such as exposure during conventional line makes, development, etching, the folder film of circuit addition is avoided to ask
Lateral erosion problem when topic and etching, simplifies production process, reduces the generation of technique productions waste water, reduce cost of manufacture.
The content of the invention：
In the prior art, in a kind of method for manufacturing printed circuit board based on laser Pocket Machining technique, how to swash UV
Light cutting machine carries out fly-cutting to the two sides of base material, to produce fine-line groove.
In order to achieve the above objectives, the present invention provides a kind of print circuit plates makings based on laser Pocket Machining technique to set
It is standby, including base material 50, rack 10, transport mechanism 20, hoisting mechanism 30 and laser aid 40；Rack 10 opens up successively from top to bottom
There are conveying trough 101, ablation room 102 and sensing chamber 103；Rack 10 includes left frame 12 and right rack 11；Left frame 12 and right machine
Frame 11 has being symmetrical set for gap；Left frame 12 and right rack 11 include upper bracket 112 and pedestal 111；Upper bracket 112
It is fixed on the upper surface of pedestal 111；Left frame 12 and 11 lower part of right rack offer the conveying trough 101 extended transversely through；Transmission
Mechanism 20 is horizontally installed in conveying trough 101；Transport mechanism 20 includes support base 21, transmission shaft 24, conveyer belt 22 and base material peace
Shelve 23；The conveyer belt 22 is arranged to from left to right transmit；The support base 21 is arranged in pairs；Pivot between the support base 21
It is connected to transmission shaft 24；10 left and right sides of rack is each provided with a pair of of support base 21；Transmission is fixed on the transmission shaft 24
Gear set 25；The conveyer belt 22 is mounted on by pair of right and left transmission gear group 25 on transmission shaft 24；Base material mounting bracket 23 is vertical
To being fixed on conveyer belt 22；Base material 50 is vertically inserted into base material mounting bracket 23.
Vertical side is provided in the gap between gap and rear wall between left frame 12 and the front side wall of right rack 11
To hoisting mechanism 30；Hoisting mechanism 30 includes a pair of of promotion conveyer belt 311；Conveyer belt 311 is promoted to carry up and down mounted on a pair of
It rises on transmission shaft；The promotion transmission shaft of top is laterally articulated in the opposite left and right of upper bracket 112 of left frame 12 and right rack 11
On side wall；The promotion transmission shaft of lower section is laterally articulated in the opposite left and right sidewall of pedestal 111 of left frame 12 and right rack 11；
Promoting transmission shaft includes promoting central shaft 313 and is fixed on the promotion gear set 314 for promoting central shaft 313.
Horizontally disposed lift block 312 and the clamping plate 315 of front and rear setting are fixed on the promotion conveyer belt 311,
In one piece of horizontally disposed lift block 312 and a pair of front and rear clamping plate 315 set be used as one group of component, the promotion conveyer belt
The component described in three groups is uniformly fixed on 311.
Laser aid 40 is located on the left and right lateral wall of ablation room 102；Laser window is offered in 102 left and right sidewall of ablation room
1111；Laser aid 40 includes left laser aid 42 and right laser aid 41；Left laser aid 42 is mounted on a left side for left frame 12
On side wall；Right laser aid 41 is mounted on the right side wall of right rack 11；41 or so pairs of left laser aid 42 and right laser aid
Claim to set；Left laser aid 42 is identical with right 41 structure of laser aid；Right laser aid 41 is included vertically to the vertical machine of slip
Structure 411, longitudinal mechanism 412 of longitudinal sliding motion and the horizontal laser head 4131 being fixed on to the left in longitudinal mechanism 412；Ablation room
A pair of sliding slot 110 being vertically arranged is offered in 102 left and right sidewalls；411 level of vertical mechanism is plugged in sliding slot 110.
Detection light source is provided in sensing chamber 103；Detection observation window 1112 is offered in 103 left and right sidewall of sensing chamber.
As the preferred of above-mentioned technical proposal, vertical mechanism 411 is by a pair of of vertical rack and is fixed on vertical rack
Lateral frame forms；411 lateral frame of vertical mechanism offers horizontal longitudinally disposed longitudinal chute 4151；Longitudinal chute 4151 or so
The second leading screw 415 is articulated between madial wall；Vertical rack lower end forms sliding block；The sliding slot of front side about 110 madial wall it
Between be articulated with the first leading screw 413；The sliding slot of front side is fixed with guide rod 414 between madial wall about 110；411 front side of vertical mechanism
The sliding block of vertical rack lower end be screwed onto on the first leading screw 413；The sliding block of the vertical rack lower end of 411 rear side of vertical mechanism is inserted
It is located on guide rod 414；Longitudinal mechanism 412 is screwed onto by the sliding block of lower end on the second leading screw 415.
As the preferred of above-mentioned technical proposal, base material mounting bracket 23 is the cuboid for offering mounting groove；Base material mounting bracket
23 4 angles are removed；The center of 23 rear and front end of base material mounting bracket opens up rectangular channel.
As the preferred of above-mentioned technical proposal, the gap of left frame 12 and right rack 11 is more than a pair of of clamping plate 315 or so
The distance of both sides.
As the preferred of above-mentioned technical proposal, the gap of a pair of of clamping plate 315 is identical with the thickness of base material 50.
As the preferred of above-mentioned technical proposal, the distance between clamping plate 315 and lift block 312 are less than the height of base material 50
Degree.
As the preferred of above-mentioned technical proposal, when hoisting mechanism 30 is run up, clamping plate 315 is located at lift block 312
Upstream.
As the preferred of above-mentioned technical proposal, the width of the mounting groove of base material mounting bracket 23 is identical with the thickness of base material 50.
The beneficial effects of the present invention are：Base material processes two sides by left and right laser aid, quick and convenient, to produce
Fine-line groove, and base material can carry out ablation, detection successively from below to up by transport mechanism, hoisting mechanism, reduce and set
Standby cost, improves work efficiency.
Description of the drawings：
Fig. 1 is the structure diagram faced of the present invention；
Fig. 2 is the structure diagram that the right side of the present invention regards；
Fig. 3 is the cross-sectional view of A-A in Fig. 1 of the invention；
Fig. 4 is the structure diagram of the vertical view of the present invention；
Fig. 5 is the cross-sectional view of B-B in Fig. 1 of the invention；
Fig. 6 is the structure diagram of the vertical view of the base material mounting bracket of the present invention；
In figure, 10, rack；101st, conveying trough；102nd, ablation room；103rd, sensing chamber；11st, right rack；110th, sliding slot；111、
Pedestal；1111st, laser window；1112nd, observation window is detected；112nd, upper bracket；12nd, left frame；20th, transport mechanism；21st, support base；
22nd, conveyer belt；23rd, base material mounting bracket；24th, transmission shaft；25th, transmission gear group；30th, hoisting mechanism；311st, conveyer belt is promoted；
312nd, lift block；313rd, central shaft is promoted；314th, gear set is promoted；315th, clamping plate；40th, laser aid；41st, right laser dress
It puts；411st, vertical mechanism；412nd, longitudinal mechanism；4131st, laser head；413rd, the first leading screw；414th, guide rod；415th, the second leading screw；
4151st, longitudinal chute；42nd, left laser aid；50th, base material.
Specific embodiment：
As shown in Figure 1, in order to achieve the above objectives, the present invention provides a kind of printing electricity based on laser Pocket Machining technique
Road plate making apparatus, including base material 50, rack 10, transport mechanism 20, hoisting mechanism 30 and laser aid 40；Rack 10 from it is lower to
On offer conveying trough 101, ablation room 102 and sensing chamber 103 successively；Rack 10 includes left frame 12 and right rack 11；Left machine
Frame 12 and right rack 11 have being symmetrical set for gap；Left frame 12 and right rack 11 include upper bracket 112 and pedestal
111；Upper bracket 112 is fixed on the upper surface of pedestal 111.
Left frame 12 and 11 lower part of right rack offer the conveying trough 101 extended transversely through；Transport mechanism 20 is horizontally installed on
In conveying trough 101；Transport mechanism 20 includes support base 21, transmission shaft 24, conveyer belt 22 and base material mounting bracket 23；The conveyer belt
22 are arranged to from left to right transmit；The support base 21 is arranged in pairs；Transmission shaft 24 is articulated between the support base 21；It is described
10 left and right sides of rack is each provided with a pair of of support base 21；Transmission gear group 25 is fixed on the transmission shaft 24；The transmission
Band 22 is mounted on by pair of right and left transmission gear group 25 on transmission shaft 24；Base material mounting bracket 23 is vertically fixed in conveyer belt 22
On；Base material 50 is vertically inserted into base material mounting bracket 23.
Vertical side is provided in the gap between gap and rear wall between left frame 12 and the front side wall of right rack 11
To hoisting mechanism 30；Hoisting mechanism 30 includes a pair of of promotion conveyer belt 311；Conveyer belt 311 is promoted to carry up and down mounted on a pair of
It rises on transmission shaft；The promotion transmission shaft of top is laterally articulated in the opposite left and right of upper bracket 112 of left frame 12 and right rack 11
On side wall；The promotion transmission shaft of lower section is laterally articulated in the opposite left and right sidewall of pedestal 111 of left frame 12 and right rack 11；
Promoting transmission shaft includes promoting central shaft 313 and is fixed on the promotion gear set 314 for promoting central shaft 313；It is described to promote transmission
With being fixed with horizontally disposed lift block 312 and the clamping plate 315 of front and rear setting, one of horizontally disposed promotion on 311
Block 312 and a pair of front and rear clamping plate 315 set are used as one group of component, and three groups are uniformly fixed on the promotion conveyer belt 311
The component.
Laser aid 40 is located on the left and right lateral wall of ablation room 102；Laser window is offered in 102 left and right sidewall of ablation room
1111；Laser aid 40 includes left laser aid 42 and right laser aid 41；Left laser aid 42 is mounted on a left side for left frame 12
On side wall；Right laser aid 41 is mounted on the right side wall of right rack 11；41 or so pairs of left laser aid 42 and right laser aid
Claim to set；Left laser aid 42 is identical with right 41 structure of laser aid；Right laser aid 41 is included vertically to the vertical machine of slip
Structure 411, longitudinal mechanism 412 of longitudinal sliding motion and the horizontal laser head 4131 being fixed on to the left in longitudinal mechanism 412；Ablation room
A pair of sliding slot 110 being vertically arranged is offered in 102 left and right sidewalls；411 level of vertical mechanism is plugged in sliding slot 110.
Detection light source is provided in sensing chamber 103；Detection observation window 1112 is offered in 103 left and right sidewall of sensing chamber.
Vertical mechanism 411 is made of a pair of of vertical rack and the lateral frame being fixed on vertical rack；Vertical mechanism 411 is horizontal
Stent offers horizontal longitudinally disposed longitudinal chute 4151；The second leading screw is articulated between 4151 or so madial wall of longitudinal chute
415；Vertical rack lower end forms sliding block；The sliding slot of front side is articulated with the first leading screw 413 between madial wall about 110；Front side
Sliding slot guide rod 414 is fixed with about 110 between madial wall；The sliding block of the vertical rack lower end of 411 front side of vertical mechanism is spirally connected
On the first leading screw 413；The sliding block of the vertical rack lower end of 411 rear side of vertical mechanism is plugged on guide rod 414；Longitudinal mechanism
412 are screwed onto by the sliding block of lower end on the second leading screw 415.
Base material mounting bracket 23 is the cuboid for offering mounting groove；23 4 angles of base material mounting bracket are removed；Base material is installed
The center of 23 rear and front end of frame opens up rectangular channel.
The gap of left frame 12 and right rack 11 is more than the distance of a pair of of 315 left and right sides of clamping plate.
The gap of a pair of of clamping plate 315 is identical with the thickness of base material 50.
The distance between clamping plate 315 and lift block 312 are less than the height of base material 50.
When hoisting mechanism 30 is run up, clamping plate 315 is located at the upstream of lift block 312.
The width of the mounting groove of base material mounting bracket 23 is identical with the thickness of base material 50.
During concrete operations, the workflow of the print circuit plates making equipment of the present invention based on laser Pocket Machining technique
Journey is as follows：
The first step, conveyer belt 22 are driven by stepper motor (not shown) from left mutually right transmission, and staff inserts base material 50
In the base material mounting bracket 23 on conveyer belt 22 being located at, conveyer belt 22 reaches with base material 50 at hoisting mechanism 30.
Second step, hoisting mechanism 30 are transmitted from the bottom up by the driving of stepper motor (not shown), paired hoisting mechanism 30
Simultaneously base material 50 is ask to move upwards by lift block 312 thereon and clamping plate 315 and reach ablation room 102, laser aid 40
Ablation is carried out to 50 longitudinal direction of base material and vertical direction simultaneously with right laser aid 41.
3rd step, after the completion of 50 ablation of base material, hoisting mechanism 30 is driven from the bottom up again by stepper motor (not shown)
Transmission, base material 50 reach the sensing chamber 103 for being designed with detection light source, and 50 staff of base material is observed by detecting observation window 1112
Judge whether base material 50 is qualified.4th step, hoisting mechanism 30 by stepper motor (not shown) are driven and transmit handle from the bottom up again
Base material 50 is sent out sensing chamber and is reached at upper bracket 112, and staff observes result according to the 3rd step and base material is put in order.
Above is exactly the entire processing and manufacturing process of one block of base material 50, and follow-up base material 50 continuously carries out above step
To complete to process.
More than content is only the better embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes, this specification content should not be construed as to this hair in specific embodiments and applications
Bright limitation.
Claims (5)
1. a kind of print circuit plates making equipment based on laser Pocket Machining technique, it is characterised in that：Making apparatus includes base
Material (50), rack (10), transport mechanism (20), hoisting mechanism (30) and laser aid (40)；Rack (10) is from top to bottom successively
Offer conveying trough (101), ablation room (102) and sensing chamber (103)；Rack (10) includes left frame (12) and right rack
(11)；Left frame (12) and right rack (11) have being symmetrical set for gap；Left frame (12) and right rack (11) include
Upper bracket (112) and pedestal (111)；Upper bracket (112) is fixed on the upper surface of pedestal (111)；
Left frame (12) and right rack (11) lower part offer the conveying trough (101) extended transversely through；Transport mechanism (20) is laterally set
It puts in conveying trough (101)；Transport mechanism (20) includes support base (21), transmission shaft (24), conveyer belt (22) and base material installation
Frame (23)；The conveyer belt (22) is arranged to from left to right transmit；The support base (21) is arranged in pairs；The support base (21)
Between be articulated with transmission shaft (24)；A pair of of support base (21) is each provided at left and right sides of the rack (10)；The transmission shaft
(24) transmission gear group (25) is fixed on；The conveyer belt (22) is mounted on transmission by pair of right and left transmission gear group (25)
On axis (24)；Base material mounting bracket (23) is vertically fixed on conveyer belt (22)；Base material (50) is vertically inserted into base material mounting bracket
(23) in；
Vertical side is provided in the gap between gap and rear wall between left frame (12) and the front side wall of right rack (11)
To hoisting mechanism (30)；Hoisting mechanism (30) includes a pair of of promotion conveyer belt (311)；It promotes conveyer belt (311) and is mounted on one
To being promoted up and down on transmission shaft；The promotion transmission shaft of top is laterally articulated in left frame (12) and the upper bracket of right rack (11)
(112) in opposite left and right sidewall；The promotion transmission shaft of lower section is laterally articulated in left frame (12) and the pedestal of right rack (11)
(111) in opposite left and right sidewall；Promoting transmission shaft includes promoting central shaft (313) and being fixed on promoting central shaft (313)
Promote gear set (314)；
Horizontally disposed lift block (312) and the clamping plate (315) of front and rear setting are fixed on the promotion conveyer belt (311),
One of horizontally disposed lift block (312) and a pair of front and rear clamping plate (315) set are as one group of component, the promotion
The component described in three groups is uniformly fixed on conveyer belt (311)；
Laser aid (40) is located on the left and right lateral wall of ablation room (102)；Laser is offered in ablation room (102) left and right sidewall
Window (1111)；Laser aid (40) includes left laser aid (42) and right laser aid (41)；Left laser aid (42) is mounted on
On the left side wall of left frame (12)；Right laser aid (41) is mounted on the right side wall of right rack (11)；Left laser aid (42)
It is symmetrical set with right laser aid (41)；Left laser aid (42) is identical with right laser aid (41) structure；Right laser dress
Put (41) include vertically the vertical mechanism (411) to slip, longitudinal sliding motion longitudinal mechanism (412) and level be fixed on to the left it is vertical
Laser head (4131) in mechanism (412)；A pair of sliding slot being vertically arranged is offered in ablation room (102) left and right sidewall
(110)；Vertical mechanism (411) level is plugged in sliding slot (110)；
Detection light source is provided in sensing chamber (103)；Detection observation window (1112) is offered in sensing chamber (103) left and right sidewall；
Vertical mechanism (411) is made of a pair of of vertical rack and the lateral frame being fixed on vertical rack；Vertical mechanism (411) is horizontal
Stent offers horizontal longitudinally disposed longitudinal chute (4151)；Second is articulated between the madial wall of longitudinal chute (4151) left and right
Leading screw (415)；Vertical rack lower end forms sliding block；The sliding slot (110) of front side is articulated with the first leading screw between madial wall up and down
(413)；The sliding slot (110) of front side is fixed with guide rod (414) between madial wall up and down；Vertical branch on front side of vertical mechanism (411)
The sliding block of frame lower end is screwed onto on the first leading screw (413)；The sliding block of vertical rack lower end on rear side of vertical mechanism (411) is plugged in
On guide rod (414)；Longitudinal mechanism (412) is screwed onto by the sliding block of lower end on the second leading screw (415)；Base material mounting bracket (23) is
Offer the cuboid of mounting groove；(23) four angles of base material mounting bracket are removed；The center of base material mounting bracket (23) rear and front end
Open up rectangular channel；
The gap of left frame (12) and right rack (11) is more than the distance at left and right sides of a pair of of clamping plate (315).
2. a kind of print circuit plates making equipment based on laser Pocket Machining technique according to claim 1, feature
It is：The gap of a pair of of clamping plate (315) is identical with the thickness of base material (50).
3. a kind of print circuit plates making equipment based on laser Pocket Machining technique according to claim 1, feature
It is：The distance between clamping plate (315) and lift block (312) are less than the height of base material (50).
4. a kind of print circuit plates making equipment based on laser Pocket Machining technique according to claim 1, feature
It is：When hoisting mechanism (30) is run up, clamping plate (315) is located at the upstream of lift block (312).
5. a kind of print circuit plates making equipment based on laser Pocket Machining technique according to claim 1, feature
It is：The width of the mounting groove of base material mounting bracket (23) is identical with the thickness of base material (50).
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| CN201610409428.0A CN105898996B (en) | 2016-06-08 | 2016-06-08 | A kind of print circuit plates making equipment based on laser Pocket Machining technique |
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| CN105898996B true CN105898996B (en) | 2018-05-18 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000025398A1 (en) * | 1998-10-26 | 2000-05-04 | Coherent, Inc. | High-power external-cavity optically-pumped semiconductor lasers |
| CN101909806A (en) * | 2007-12-27 | 2010-12-08 | 三星钻石工业股份有限公司 | Laser processing apparatus |
| CN105357890A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Printed circuit board manufacturing equipment based on laser groove processing technology |
| CN205726701U (en) * | 2016-06-08 | 2016-11-23 | 佛山市联智新创科技有限公司 | A kind of print circuit plates making equipment based on laser Pocket Machining technique |
-
2016
- 2016-06-08 CN CN201610409428.0A patent/CN105898996B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000025398A1 (en) * | 1998-10-26 | 2000-05-04 | Coherent, Inc. | High-power external-cavity optically-pumped semiconductor lasers |
| CN101909806A (en) * | 2007-12-27 | 2010-12-08 | 三星钻石工业股份有限公司 | Laser processing apparatus |
| CN105357890A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Printed circuit board manufacturing equipment based on laser groove processing technology |
| CN205726701U (en) * | 2016-06-08 | 2016-11-23 | 佛山市联智新创科技有限公司 | A kind of print circuit plates making equipment based on laser Pocket Machining technique |
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| CN105898996A (en) | 2016-08-24 |
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