CN105898996A - Laser groove machining process-based printed circuit board fabrication equipment - Google Patents
Laser groove machining process-based printed circuit board fabrication equipment Download PDFInfo
- Publication number
- CN105898996A CN105898996A CN201610409428.0A CN201610409428A CN105898996A CN 105898996 A CN105898996 A CN 105898996A CN 201610409428 A CN201610409428 A CN 201610409428A CN 105898996 A CN105898996 A CN 105898996A
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- Prior art keywords
- frame
- laser
- base material
- rack
- vertical
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- 238000003754 machining Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 65
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000002679 ablation Methods 0.000 claims abstract description 20
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 46
- 230000005540 biological transmission Effects 0.000 claims description 36
- 230000005611 electricity Effects 0.000 claims description 8
- 230000001737 promoting effect Effects 0.000 claims description 5
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 7
- 230000003628 erosive effect Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses laser groove machining process-based printed circuit board fabrication equipment, which comprises a rack, a conveying mechanism, lifting mechanisms and a laser device, wherein the rack is sequentially provided with a conveying trough, an ablation chamber and a detection chamber from bottom to top; the rack comprises a left rack and a right rack; the left rack and the right rack are symmetrically arranged on the left and right; the conveying trough is formed in the lower parts of the left rack and the right rack; the conveying mechanism is transversely arranged in the conveying trough; a pair of lifting mechanisms in the vertical direction is arranged in a gap between the front side walls of the left rack and the right rack and the gap between the rear side walls; the laser device is located on the left outer side wall and the right outer side wall of the ablation chamber; the laser device comprises a left laser device and a right laser device; the left laser device is arranged on the left side wall of the corresponding left rack; and the right laser device is arranged on the right side wall of the corresponding right rack. Two surfaces of a base material can be processed; the laser groove machining process-based printed circuit board fabrication equipment is fast and convenient; the base material can be sequentially ablated and detected from bottom to top through the conveying mechanism and the lifting mechanisms; the equipment cost is reduced; and the work efficiency is improved.
Description
Technical field:
The present invention relates to the processing technique field of printed circuit board (PCB), in particular to a kind of base
Print circuit plates making equipment in laser Pocket Machining technique.
Background technology:
Fast development along with high-density packages substrate, it is desirable to components and parts chips area and encapsulation
Area reduces accordingly, improves packaging efficiency and becomes inevitable.Printed circuit board to be met is light, thin,
Short, little, the feature of flexible structure, reduces the live width/line-spacing on substrate, makes finer
Circuit become a kind of selection.In conventional line makes, lateral erosion, long flow path, sewage disposal
The always insurmountable problem such as difficulty, excessive lateral erosion not only affects the attractive in appearance of circuit, sternly
Severe one even can not meet the conductance calls in line transmission for high-frequency high-speed signal integrity.
Long flow path not only increases fault odds in manufacturing process, also increases the cost of making.
The sewage kind produced in processing technology is many, and processing cost is big, also pollutes environment, and then impact
The fast development of printed circuit board industry.
At present, the method making fine-line mainly has three kinds: subtractive process, semi-additive process and add
Cheng Fa.Subtractive process is to use most common circuit manufacturing method, and it is first with photochemical method or silk
Bite method or galvanoplastic of net form circuitous pattern in the transfer of the copper surface of copper-clad plate, then with chemistry corruption
Outside the method for erosion will form circuit, unnecessary layers of copper part etches away, and leaves required circuit
Figure.But subtractive process side etching phenomenon when fine-line makes is the most serious, is susceptible to circuit short
The problem such as road, open circuit, Copper Foil is also wasted seriously.Semi-additive process uses passes through graphic plating
Relatively thin layers of copper thickeies circuit, and with method for chemially etching by the Bao Tongshi of logicalnot circuit part
Carve and remove.The fine-line lateral erosion that the method makes is less, and circuit cross section is the most rectangular.
But current extra thin copper foil is due to relatively costly, application is not the most universal, subtracts according to common copper-clad plate
Copper makees extra thin copper foil, it is difficult to ensure that the uniformity consistency that imposite is thinning.During graphic plating, right
Fine-line in the 50 following live widths of μm, it is ensured that the against corrosion thin dry film of circuit resolution is difficult to same
Time at plating line acid and alkali-resistance, dry film dissolves and plating phenomenon is easier to occur.Chen Yuanming et al. (electricity
Plating and close etching, 2012, vol.34, NO.7:5-9) to point out, semi-additive process makes fine-line
The extra thin copper foil of below 5 μm should be selected.According to subtracting Copper treatment, the 5 following thickness of μm are more difficult
Controlling, copper seed layer may be caused to be stripped, follow-up copper plate is poor with the adhesion of base material.
Addition process is to use electroless copper to be deposited on sensitive material, directly forms circuitous pattern and Kong Jin
Genusization layer.In the making of multilayer circuit, copper facing thickness had with hole metallization duration
Difference, easily causes hole metallization problem, and layers of copper also is difficult to be guaranteed with the adhesion of base material.
Due to the addition process particular/special requirement to base material, cost of manufacture is the highest, does not the most also obtain extensively
Application.
In the manufacture of printed circuit board, the success or failure that make of via directly affect electrical connection
Performance.Digital control hole drilling and laser drill are widely used in micropore making.Digital control hole drilling can bore institute
There is the hole of material, but when aperture is less than 250 μm, and boring cost exponentially increases, uncomfortable
Suitable large batch of micropore produces；CO2 laser drill can process the aperture of more than 50 μm, produces
Efficiency is high, but CO2 laser is only applicable to resin medium layer, between 50 μm～75 μm
Micropore, it is more difficult to control, after boring, the residual film of dielectric material or carbide residue are more；UV
Laser can process the aperture of 25 μ m diameter, clean Non-carbonized in the hole of molding, make 25 μm～
Hole cost between 125 μm is little, but using UV laser to make large-diameter borehole cost is finger
Several levels increases.
In order to provide, a kind of Making programme is simple, operation is implemented easily, cost of manufacture is controlled, simultaneously
Product quality and production efficiency, printed circuit based on laser Pocket Machining technique can be improved
Board manufacturing method, the application for a patent for invention of Application No. CN201410339246.1 discloses one
Planting method for manufacturing printed circuit board based on laser Pocket Machining technique, this invention is first to base material
One side uses UV laser to carry out ablation, gradually processes fine-line groove and interlayer interconnection is micro-
Hole groove；Again interlayer interconnection microvia groove clogged electrically conductive ink and solidify；When base material another side
Fine-line Pocket Machining is complete, base material two sides carries out black holes simultaneously, completes groove electro-coppering,
Carry out printed circuit board subsequent fabrication process again.This invention is it can be avoided that conventional fine circuit makes
Middle blind hole fills out disposably adding of the problem that copper back plate face layers of copper is partially thick, employing micropore and fine rule groove
Work, can save during conventional line makes expose, develop, the flow process such as etching, it is to avoid circuit
Lateral erosion problem when the folder film problem of addition and etching, simplifies production process, decreases technique
Produce the generation of waste water, reduce cost of manufacture.
Summary of the invention:
In prior art, a kind of method for manufacturing printed circuit board based on laser Pocket Machining technique
In, how to make UV laser cutting machine the two sides of base material be carried out fly-cutting, to produce essence
Thin line groove.
For reaching above-mentioned purpose, the invention provides a kind of print based on laser Pocket Machining technique
Printed circuit board making apparatus, including base material 50, frame 10, connecting gear 20, hoisting mechanism
30 and laser aid 40；Frame 10 offers conveying trough 101, ablation room the most successively
102 and sensing chamber 103；Frame 10 includes left frame 12 and right frame 11；Left frame 12
Being symmetrical set of gap is had with right frame 11；Left frame 12 and right frame 11 all include
Upper bracket 112 and base 111；Upper bracket 112 is fixed on the upper surface of base 111；
Left frame 12 and right frame 11 bottom offer the conveying trough 101 extended transversely through；Connecting gear
20 are horizontally installed in conveying trough 101；Connecting gear 20 includes supporting seat 21, power transmission shaft
24, conveyer belt 22 and base material installing rack 23；Described conveyer belt 22 is set to from left to right pass
Send；Described support seat 21 is arranged in pairs；It is articulated with power transmission shaft 24 between described support seat 21；
Described frame body 11 left and right sides is each provided with a pair support seat 21；Described power transmission shaft 24
On be fixed with transmission gear group 25；Described conveyer belt 22 is by pair of right and left transmission gear group 25
It is arranged on power transmission shaft 24；Base material installing rack 23 is vertically fixed on conveyer belt 22；Base material
50 are vertically inserted in base material installing rack 23；
The gap between gap and rear wall between the front side wall of left frame 12 and right frame 11
Inside it is provided with the hoisting mechanism 30 of vertical direction；Hoisting mechanism 30 includes a pair lifting conveyer belt
311；Promote conveyer belt 311 to be arranged on about a pair lifting transmission shaft；The lifting of top passes
Axle is sent laterally to be articulated in the left and right sidewall that left frame 12 is relative with the upper bracket 112 of right frame 11
On；The transmission shaft that promotes of lower section is laterally articulated in the base 111 of left frame 12 and right frame 11
On relative left and right sidewall；Promote transmission shaft to include promoting central shaft 313 and being fixed in lifting
The lifting gear train 314 of mandrel 313；One piece uniformly it is fixed with on described lifting transmission shaft 311
Horizontally disposed lift block 312 and the clamping plate 315 front and back arranged for a pair；
Laser aid 40 is positioned on the lateral wall, left and right of ablation room 102；Ablation room about 102
Laser window 1111 is offered on sidewall；Laser aid 40 includes that left laser aid 42 and the right side are swashed
Electro-optical device 41；Left laser aid 42 is arranged on the left side wall of left frame 12；Right laser fills
Put on 41 right side walls being arranged on right frame 11；Left laser aid 42 and right laser aid 41
It is symmetrical set；Left laser aid 42 is identical with right laser aid 41 structure；Right laser fills
Put 41 to include vertically to the vertical mechanism 411 slided, longitudinal mechanism 412 and of longitudinal sliding motion
Level is fixed on the laser head 413 in longitudinal mechanism 412 to the left；Ablation room about 102 sidewall
On offer the chute 110 being vertically arranged a pair；Vertical mechanism 411 level is plugged in chute 110
In；
Detection light source it is provided with in sensing chamber 103；Inspection is offered on sensing chamber about 103 sidewall
Survey observation window 1112.
Preferred as technique scheme, vertical mechanism 411 is by a pair vertical rack and fixing
Lateral frame composition on vertical rack；Vertical mechanism 411 lateral frame offers level and longitudinally sets
The longitudinal chute 4151 put；It is articulated with the second leading screw between longitudinal chute about 4151 medial wall
415；Vertical rack lower end forms slide block；Pivot between chute about 110 medial wall of front side
It is connected to the first leading screw 413；It is fixed with guide rod 414 between chute about 110 medial wall of front side；
The slide block of the vertical rack lower end on front side of vertical mechanism 411 is screwed onto on leading screw 413；Vertical machine
The slide block of the vertical rack lower end on rear side of structure 411 is plugged on guide rod 414；Longitudinal mechanism 412
It is screwed onto on the second leading screw 415 by the slide block of lower end.
Preferred as technique scheme, base material installing rack 23 is the length offering mounting groove
Cube；23 4 angles of base material installing rack are cut；The center of base material installing rack 23 rear and front end
Offer rectangular channel.
Preferred as technique scheme, the gap of left frame 12 and right frame 11 is more than one
Distance to clamping plate 315 left and right sides.
Preferred as technique scheme, the gap of a pair clamping plate 315 and base material 50
Thickness is identical.
Preferred as technique scheme, the distance between clamping plate 315 and lift block 312
Height less than base material 50.
Preferred as technique scheme, when hoisting mechanism 30 runs up, clamping plate
315 upstreams being positioned at lift block 312.
Preferred as technique scheme, the width of the mounting groove of base material installing rack 23 and base
The thickness of material 50 is identical.
The beneficial effects of the present invention is: two sides is processed by base material by left and right laser aid, soon
Speed is convenient, and to produce fine-line groove, and base material can pass through connecting gear, hoisting mechanism
Carry out ablation, detection the most successively, decrease equipment cost, improve work efficiency.
Accompanying drawing illustrates:
Fig. 1 is the structural representation faced of the present invention；
Fig. 2 is the structural representation that the right side of the present invention regards；
Fig. 3 be the present invention Fig. 1 in the cross-sectional view of A-A；
Fig. 4 is the structural representation of the vertical view of the present invention；
Fig. 5 be the present invention Fig. 1 in the cross-sectional view of B-B；
Fig. 6 is the structural representation of the vertical view of the base material installing rack of the present invention；
In figure, 10, frame；101, conveying trough；102, ablation room；103, sensing chamber；
11, right frame；110, chute；111, base；1111, laser window；1112, detection is seen
Examine window；112, upper bracket；12, left frame；20, connecting gear；21, seat is supported；22、
Conveyer belt；23, base material installing rack；24, power transmission shaft；25, transmission gear group；30, promote
Mechanism；311, conveyer belt is promoted；312, lift block；313, central shaft is promoted；314, carry
Rise gear train；315, clamping plate；40, laser aid；41, right laser aid；411, hang down
Straight mechanism；412, longitudinal mechanism；413, laser head；414, guide rod；415, the second leading screw；
4151, longitudinal chute；42, left laser aid；50, base material.
Detailed description of the invention:
As it is shown in figure 1, for reaching above-mentioned purpose, the invention provides a kind of recessed based on laser
The print circuit plates making equipment of groove processing technique, including base material 50, frame 10, conveyer
Structure 20, hoisting mechanism 30 and laser aid 40；Frame 10 offers biography the most successively
Send groove 101, ablation room 102 and sensing chamber 103；Frame 10 includes left frame 12 and right machine
Frame 11；Left frame 12 and right frame 11 have being symmetrical set of gap；Left frame 12 He
Right frame 11 all includes upper bracket 112 and base 111；Upper bracket 112 is fixed on base 111
Upper surface on；
Left frame 12 and right frame 11 bottom offer the conveying trough 101 extended transversely through；Transmit
Mechanism 20 is horizontally installed in conveying trough 101；Connecting gear 20 includes supporting seat 21, passing
Moving axis 24, conveyer belt 22 and base material installing rack 23；Described conveyer belt 22 be set to from a left side to
Right transmission；Described support seat 21 is arranged in pairs；It is articulated with power transmission shaft between described support seat 21
24；Described frame body 11 left and right sides is each provided with a pair support seat 21；Described power transmission shaft
Transmission gear group 25 it is fixed with on 24；Described conveyer belt 22 is by pair of right and left transmission gear group
25 are arranged on power transmission shaft 24；Base material installing rack 23 is vertically fixed on conveyer belt 22；Base
Material 50 is vertically inserted in base material installing rack 23；
The gap between gap and rear wall between the front side wall of left frame 12 and right frame 11
Inside it is provided with the hoisting mechanism 30 of vertical direction；Hoisting mechanism 30 includes a pair lifting conveyer belt
311；Promote conveyer belt 311 to be arranged on about a pair lifting transmission shaft；The lifting of top passes
Axle is sent laterally to be articulated in the left and right sidewall that left frame 12 is relative with the upper bracket 112 of right frame 11
On；The transmission shaft that promotes of lower section is laterally articulated in the base 111 of left frame 12 and right frame 11
On relative left and right sidewall；Promote transmission shaft to include promoting central shaft 313 and being fixed in lifting
The lifting gear train 314 of mandrel 313；One piece uniformly it is fixed with on described lifting transmission shaft 311
Horizontally disposed lift block 312 and the clamping plate 315 front and back arranged for a pair；
Laser aid 40 is positioned on the lateral wall, left and right of ablation room 102；Ablation room about 102
Laser window 1111 is offered on sidewall；Laser aid 40 includes that left laser aid 42 and the right side are swashed
Electro-optical device 41；Left laser aid 42 is arranged on the left side wall of left frame 12；Right laser fills
Put on 41 right side walls being arranged on right frame 11；Left laser aid 42 and right laser aid 41
It is symmetrical set；Left laser aid 42 is identical with right laser aid 41 structure；Right laser fills
Put 41 to include vertically to the vertical mechanism 411 slided, longitudinal mechanism 412 and of longitudinal sliding motion
Level is fixed on the laser head 413 in longitudinal mechanism 412 to the left；Ablation room about 102 sidewall
On offer the chute 110 being vertically arranged a pair；Vertical mechanism 411 level is plugged in chute 110
In；
Detection light source it is provided with in sensing chamber 103；Inspection is offered on sensing chamber about 103 sidewall
Survey observation window 1112.
Vertical mechanism 411 is by a pair vertical rack and the lateral frame group being fixed on vertical rack
Become；Vertical mechanism 411 lateral frame offers longitudinal chute 4151 that level is longitudinally disposed；Vertical
The second leading screw 415 it is articulated with between chute about 4151 medial wall；Vertical rack lower end becomes
Type has slide block；It is articulated with the first leading screw 413 between chute about 110 medial wall of front side；Before
It is fixed with guide rod 414 between chute about 110 medial wall of side；On front side of vertical mechanism 411
The slide block of vertical rack lower end is screwed onto on leading screw 413；Vertically propping up on rear side of vertical mechanism 411
The slide block of frame lower end is plugged on guide rod 414；Longitudinal mechanism 412 is spirally connected by the slide block of lower end
On the second leading screw 415.
Base material installing rack 23 is the cuboid offering mounting groove；23 4 angles of base material installing rack
Cut；Rectangular channel is offered at the center of base material installing rack 23 rear and front end.
The gap of left frame 12 and right frame 11 more than a pair clamping plate 315 left and right sides away from
From.
The gap of a pair clamping plate 315 is identical with the thickness of base material 50.
Distance between clamping plate 315 and lift block 312 is less than the height of base material 50.
When hoisting mechanism 30 runs up, clamping plate 315 is positioned at the upstream of lift block 312.
The width of the mounting groove of base material installing rack 23 is identical with the thickness of base material 50.
During concrete operations, printed circuit board (PCB) system based on laser Pocket Machining technique of the present invention
The workflow making equipment is as follows:
The first step, conveyer belt 22 is driven from left mutually right transmission by motor (not shown),
In the base material installing rack 23 on conveyer belt 22 that staff is plugged in base material 50, transmit
Band 22 reaches at hoisting mechanism 30 with base material 50.
Second step, hoisting mechanism 30 is driven by motor (not shown) and transmits from the bottom up,
Paired hoisting mechanism 30 holds in the palm base by lift block 312 thereon and clamping plate 315 simultaneously
Material 50 moves upward and reaches ablation room 102, and laser aid 40 and right laser aid 41 are simultaneously
Base material 50 longitudinal direction and vertical direction are carried out ablation.
3rd step, after base material 50 ablation completes, hoisting mechanism 30 is by motor (not shown)
Again driving and transmit from the bottom up, base material 50 arrives the sensing chamber 103 being designed with detection light source,
Base material 50 staff is observed by detection observation window 1112 and judges that base material 50 is the most qualified.
4th step, hoisting mechanism 30 is again driven by motor (not shown) and transmits from the bottom up
Base material 50 being sent sensing chamber arrive at upper bracket 112, staff observes according to the 3rd step
Base material is put in order by result.
Being exactly more than the whole processing and manufacturing process of one block of base material 50, follow-up base material 50 is the most not
Carry out above step disconnectedly and complete processing.
Above content is only the better embodiment of the present invention, for the ordinary skill people of this area
Member, according to the thought of the present invention, the most all can change it
Place, this specification content should not be construed as limitation of the present invention.
Claims (8)
1. a print circuit plates making equipment based on laser Pocket Machining technique, its feature
It is: making apparatus includes base material (50), frame (10), connecting gear (20), promotes
Mechanism (30) and laser aid (40)；Frame (10) offers transmission the most successively
Groove (101), ablation room (102) and sensing chamber (103)；Frame (10) includes left frame
And right frame (11) (12)；Left frame (12) and right frame (11) have the left and right in gap
It is symmetrical arranged；Left frame (12) and right frame (11) all include upper bracket (112) and the end
Seat (111)；Upper bracket (112) is fixed on the upper surface of base (111)；
Left frame (12) and right frame (11) bottom offer the conveying trough (101) extended transversely through；
Connecting gear (20) is horizontally installed in conveying trough (101)；Connecting gear (20) includes
Support seat (21), power transmission shaft (24), conveyer belt (22) and base material installing rack (23)；Institute
State conveyer belt (22) to be set to from left to right transmit；Described support seat (21) is arranged in pairs；
It is articulated with power transmission shaft (24) between described support seat (21)；Described frame body (11) is left
Right both sides are each provided with a pair support seat (21)；Described power transmission shaft is fixed with transmission on (24)
Gear train (25)；Described conveyer belt (22) is pacified by pair of right and left transmission gear group (25)
It is contained on power transmission shaft (24)；Base material installing rack (23) is vertically fixed on conveyer belt (22)；
Base material (50) is vertically inserted in base material installing rack (23)；
Between gap and rear wall between the front side wall of left frame (12) and right frame (11)
Gap in be provided with the hoisting mechanism (30) of vertical direction；Hoisting mechanism (30) includes one
To promoting conveyer belt (311)；Lifting conveyer belt (311) is arranged on about a pair and promotes transmission
On axle；The lifting transmission shaft of top is laterally articulated in left frame (12) and right frame (11)
On the left and right sidewall that upper bracket (112) is relative；The lifting transmission shaft of lower section is laterally articulated in a left side
On the left and right sidewall that frame (12) is relative with the base of right frame (11) (111)；Promote
Transmission shaft includes promoting central shaft (313) and being fixed on the lifting tooth promoting central shaft (313)
Wheels (314)；Uniformly be fixed with on described lifting transmission shaft (311) one piece horizontally disposed
Lift block (312) and the clamping plate (315) front and back arranged for a pair；
Laser aid (40) is positioned on the lateral wall, left and right of ablation room (102)；Ablation room (102)
Laser window (1111) is offered on the sidewall of left and right；Laser aid (40) includes left laser aid
And right laser aid (41) (42)；Left laser aid (42) is arranged on left frame (12)
Left side wall on；Right laser aid (41) is arranged on the right side wall of right frame (11)；Left
Laser aid (42) and right laser aid (41) are symmetrical set；Left laser aid (42)
Identical with right laser aid (41) structure；Right laser aid (41) includes vertically to slip
Vertical mechanism (411), longitudinal mechanism (412) of longitudinal sliding motion and level are fixed on vertical to the left
Laser head (413) in mechanism (412)；Offer on the sidewall of ablation room (102) left and right
The chute (110) being vertically arranged for a pair；Vertical mechanism (411) level is plugged in chute (110)
In；
Sensing chamber is provided with detection light source in (103)；Open on the sidewall of sensing chamber (103) left and right
It is provided with detection observation window (1112).
A kind of printing based on laser Pocket Machining technique the most according to claim 1 electricity
Road plate making apparatus, it is characterised in that: vertical mechanism (411) is by a pair vertical rack and consolidates
The lateral frame composition being scheduled on vertical rack；Vertical mechanism (411) lateral frame offers level
Longitudinally disposed longitudinal chute (4151)；Pivot between longitudinal chute (4151) medial wall, left and right
It is connected to the second leading screw (415)；Vertical rack lower end forms slide block；The chute (110) of front side
It is articulated with the first leading screw (413) up and down between medial wall；The chute (110) of front side is interior up and down
Guide rod (414) it is fixed with between sidewall；The vertical rack lower end of vertical mechanism (411) front side
Slide block be screwed onto on leading screw (413)；The vertical rack lower end of vertical mechanism (411) rear side
Slide block be plugged on guide rod (414)；Longitudinal mechanism (412) is spirally connected by the slide block of lower end
On the second leading screw (415).
A kind of printing based on laser Pocket Machining technique the most according to claim 1 electricity
Road plate making apparatus, it is characterised in that: base material installing rack (23) is the length offering mounting groove
Cube；(23) four angles of base material installing rack are cut；Base material installing rack (23) rear and front end
Center offer rectangular channel.
A kind of printing based on laser Pocket Machining technique the most according to claim 1 electricity
Road plate making apparatus, it is characterised in that: the gap of left frame (12) and right frame (11) is big
Distance in a pair clamping plate (315) left and right sides.
A kind of printing based on laser Pocket Machining technique the most according to claim 1 electricity
Road plate making apparatus, it is characterised in that: the gap of a pair clamping plate (315) and base material (50)
Thickness identical.
A kind of printing based on laser Pocket Machining technique the most according to claim 1 electricity
Road plate making apparatus, it is characterised in that: between clamping plate (315) and lift block (312)
Distance is less than the height of base material (50).
A kind of printing based on laser Pocket Machining technique the most according to claim 1 electricity
Road plate making apparatus, it is characterised in that: when hoisting mechanism (30) runs up, clamping plate
(315) upstream of lift block (312) it is positioned at.
A kind of printing based on laser Pocket Machining technique the most according to claim 3 electricity
Road plate making apparatus, it is characterised in that: the width of the mounting groove of base material installing rack (23) and base
The thickness of material (50) is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610409428.0A CN105898996B (en) | 2016-06-08 | 2016-06-08 | A kind of print circuit plates making equipment based on laser Pocket Machining technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610409428.0A CN105898996B (en) | 2016-06-08 | 2016-06-08 | A kind of print circuit plates making equipment based on laser Pocket Machining technique |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000025398A1 (en) * | 1998-10-26 | 2000-05-04 | Coherent, Inc. | High-power external-cavity optically-pumped semiconductor lasers |
| CN101909806A (en) * | 2007-12-27 | 2010-12-08 | 三星钻石工业股份有限公司 | Laser processing apparatus |
| CN105357890A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Printed circuit board manufacturing equipment based on laser groove processing technology |
| CN205726701U (en) * | 2016-06-08 | 2016-11-23 | 佛山市联智新创科技有限公司 | A kind of print circuit plates making equipment based on laser Pocket Machining technique |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000025398A1 (en) * | 1998-10-26 | 2000-05-04 | Coherent, Inc. | High-power external-cavity optically-pumped semiconductor lasers |
| CN101909806A (en) * | 2007-12-27 | 2010-12-08 | 三星钻石工业股份有限公司 | Laser processing apparatus |
| CN105357890A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Printed circuit board manufacturing equipment based on laser groove processing technology |
| CN205726701U (en) * | 2016-06-08 | 2016-11-23 | 佛山市联智新创科技有限公司 | A kind of print circuit plates making equipment based on laser Pocket Machining technique |
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