CN103917052B - A kind of method of use laser direct structuring technique processing circuit board - Google Patents
A kind of method of use laser direct structuring technique processing circuit board Download PDFInfo
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Abstract
The present invention relates to a kind of method of use laser direct structuring technique processing circuit board, first to covered on baseplate material conductive layer carry out it is thinning, after thickening operation treatment through hole, plating again, conductive layer is directly removed with laser selective, so as to obtain meeting design requirement conductive pattern structure.Step is：First, monitor disk is made, i.e., removes conductive layer from the monitoring area of the pattern glazing etching off with laser；Then, this is covered into conductive is carried out thinning with microetch liquid, and microetch is thinning untill when exposing base material at monitor disk pattern；Finally, to the baseplate material after thinning and cover conductive and drilled, after hole metallization, removed with laser direct forming and cover partial electroconductive layer on baseplate material, leave the conductive layer of needs.The present invention solves current techniques because Kong Huahou conductive layers are too thick, is not suitable for directly being removed with laser or mechanical means the processing problem of conductive layer, while having widened the use scope of laser photoetching method processing PCB.
Description
Technical field
The invention belongs to circuit board manufacturing area, especially a kind of side of use laser direct structuring technique processing circuit board
Method.
Background technology
The making of subtractive process circuit board includes a series of process：Punching, hole metallization and electro-coppering thicken, make and lead
Electric line, making welding resistance character, external form processing etc..Wherein, one of most important process, is exactly the making of circuit, i.e., according to
Design requirement, gets rid of the metal conducting layer of non-conductive pattern part, with the metal layer part for retaining as circuit.
Unwanted conductive layer is removed generally with printing -- engraving method, figure is first carried out on copper coated foil plate surface and is turned
Moving, it would be desirable to the conductive layer of the conductive pattern part of reservation, typically Copper Foil, use protectiveness material -- resist is covered,
And non-conductive pattern part, i.e., the copper that will remove then it is exposed outside.During etching, etchant and naked sudden and violent metallic copper phase mutual connection
Touch, react, the purpose in copper dissolution to etchant solutions, having reached removing.
Printing -- the machining accuracy of engraving method is affected by many factors, it is difficult to control, and causes the circuitous pattern made
The requirement of physical dimension off-design, is not suitable for manufacturing extremely fine circuit structure, such as due to pattern transfer precision is not high, side
Corrosion effect etc., is all the problem for a long time in procedure for processing circuit board.Additionally, engraving method flow it is long and complex, it is necessary to
Process equipment, material it is many so that high accuracy, high-quality board production need the high cost of fund, place, staffing,
Production process is flexible poor, and the threshold that industry enters is high, can not meet the demand that localization nearby, quickly, flexibly makes.
In recent years, laser technology is increasingly received in the application of electron trade because the advantage such as high precision, step be few, environmentally friendly
Concern, mainly has two kinds of technologies to enter practical field in circuit board fabrication industry at present：Laser direct imaging technology, and most
The nearly laser direct structuring technique for occurring.
Laser direct imaging is LDI-Laser Direct Imaging technologies, and the thing of material is not produced in process
Reason is removed, and simply acts on material laser energy, is allowed to photosensitive and the reactions such as polymerization, decomposition occur, and the physics of material is moved
Except by being completed by subsequent developing procedure.Substantially flow is to be connected on the board substrate of coating photosensitive material with laser straight and exposed
Light, formed line pattern positive or negative latent image, it is developed after obtain anti-plate or anti-etching mask, then directly etch or
Anti- plating metal resist.This technology does not need the operations such as photomechanical production, pad pasting, reduces producing equipment, shortens flow, and
Crudy and precision are improve, manufacture flexibility is increased, is applied in batch production.
And so-called laser direct structuring technique, compared to above-mentioned laser direct imaging technology further, direct light during processing
Etching off removes material, or even removal conductive layer, it is not necessary to develop, in this embodiment it is not even necessary to follow-up etching work procedure.Substantially flow is, according to
The patterning of design requirement, throws laser and shines on material surface, vaporizes selected material sublimation or produces other forms
Change, so as to be gone to remove, directly forms mask pattern against corrosion, is then etched processing or other processing, obtains final
Conductive structure.If what is removed is conductive layer, subsequent process steps, a step are no longer needed just to obtain the conductive structure of needs.This
The technology with the manufacture PCB of laser one-step shaping circuit pattern is planted, is referred to as laser direct forming i.e. LDS-Laser Direct
Structuring, it is necessary to equipment and procedure of processing it is less, operate simpler, Product Precision and quality are higher, used as future
Technology, starts to move towards high-end market.
Using this technology, the Copper Foil below 25 μm of thickness of processing is easier, and Copper Foil of the processing thickness more than 35 μm is then
It is relatively difficult.Currently, the copper thickness of the general copper coated foil plate base material of in the market is based on thick 18 μm or 35 μm of kind, wherein
Cover the kind that copper thickness is 18 μm and be more suitable for laser direct structuring technique processing, can be used to economy, with quality work sheet
Face circuit board.
However, according to IPC standards, circuit board metallization hole hole wall copper conductive layer thickness needs to reach more than 18 μm.In order to
To the metallic copper that adequate thickness is coated on hole wall, using current technology, can continue to thicken existing simultaneously to electro-coppering in plate face
Metallic copper conductive layer, and due to the limitation of electroplating technology depth capability, because of thickening, increased thickness can exceed on hole wall
Copper it is thick, i.e., by after hole metallization, be covered with originally 18 μm of copper thicknesses on the baseplate material surface of Copper Foil will more than 36 μm, and
Originally being covered with 35 μm of copper thicknesses on the baseplate material surface of Copper Foil will be more than 53 μm.As described above, laser direct structuring technique
Processing Copper Foil of the thickness more than 35 μm is then relatively difficult, and this causes most of dual platens, multi-layer sheet, if not using specific substrate
Material, it is difficult to realize laser direct forming conductive structure.
It is not unique, but has its counterpart, and mechanically direct forming technique makes circuit board also similar processing difficulties.It is so-called it is mechanically direct into
Type circuit board technology, i.e., it is unwanted on selective removal baseplate material using the method for depthkeeping milling according to design requirement
Metal conducting layer, with retain lower metal layer as conductive pattern technology.Cone is mostly used during mechanically direct shaping circuit board processed
Shape or small-diameter cutter, such as working width are the taper mill of 0.1mm, and width is 0.2-0.5mm general-purpose taper mills, or directly
Footpath is 0.25mm, the flat-end cutter of a diameter of 0.4mm.These cutters, diameter is small or head point and it is thin, processed material is got over
Thick to process more difficult, it is necessary to the raceway groove of processing is narrower, the life-span of cutter is shorter.As described above, make double-sided PCB,
Required hole metallization technology, increased conductive layer thickness on baseplate material surface during multi-layer sheet, if not using specific substrate
Material, results in during using mechanically direct shaping circuit board technology processed, and dual platen, the multi-layer sheet outer layer for making hole metallization are conductive
In graphic procedure, occur that cutter consumption is fast, can not make fine pattern etc. processing problem.
The content of the invention
The present invention processes two-sided hole metallization circuit board and multilayer circuit board for laser direct forming circuit board process
During outer layer, the processing difficulties occurred because conductive layer is blocked up, there is provided one kind uses laser direct structuring technique processing circuit board
Method, this method propose new technology route, give key points for operation.According to the method for the present invention, in the market can be used
General baseplate material, single sided board, dual platen, multi-layer sheet are made with laser direct structuring technique, or mechanically direct forming technique
Outer layer conductive pattern, improves processing efficiency, obtains more preferable crudy.
The technical scheme is that：
A kind of method of use laser direct structuring technique processing circuit board, first subtracts to covering conductive layer on baseplate material
It is thin, then through hole, plating thicken operation process after, directly remove conductive layer with laser selective, its step is：
(1) monitor disk is made, i.e., removes conductive layer from the monitoring area of the pattern glazing etching off with laser；
(2) this is covered into conductive is carried out thinning with microetch liquid, and microetch is thinning until expose base at monitor disk pattern
Untill during material, make the conductive layer thickness left on insulating materials equal with the conductive layer thickness that laser light etching off is removed；
(3) to the baseplate material after thinning and cover conductive and drilled, after hole metallization, shelled with laser slitting
Partial electroconductive layer is covered on selective removal baseplate material, the conductive layer of needs is left, led so as to obtain meeting design requirement
Electric graphic structure.
And, step (1) in, the shape of the monitor disk and position are any pattern and any size for being adapted to processing,
Its position is to be used for the outside of conductive pattern profile of design requirement or leading according to design requirement on conductive material surface is covered
The region of the nonconductive structures in electrical pattern profile.
And, step (1) in, in the monitor disk manufacturing process, remove the certain thickness conductive layer in monitor disk position,
The thickness of removal is 0.1-30 μm, and its minimizing technology is laser photetching or the mechanical milling or control of depthkeeping processing of depthkeeping processing
Or other certain thickness conductive layer methods of removal of measurement.
And, step (2) in, to control thinning degree when thinning, control method can also be by controlling during etching
Between, speed controls thinning degree, or by with conductive layer thickness measuring apparatus measures residue conductive layer controls thinning degree.
And, step (2) in, the conductive layer is carried out microetch it is thinning when, using baseplate material method static soak
Micro etching method in microetch liquid swings baseplate material in microetch liquid and carries out the method for microetch or in microetch liquid
Wash away the micro etching method of baseplate material.
And, step (2) in, conductive layer is carried out microetch it is thinning when, the control method for thinning degree is：See
Monitor disk is examined, the thickness that thinning, to cut conductive layer is stopped during the position for exposing insulating substrate subtracts equal to conductive layer initial thickness
Go to make the conductive layer thickness removed during monitor disk.
And, step (3) in, after the baseplate material is through drilling and hole metallization, using laser direct structuring technique or
Mechanically direct forming technique, the conductive layer on selective removal base material beyond conductive pattern makes conductive pattern.
When the present invention makes circuit board single sided board, following methods step can be taken：
(1) monitor disk is made, i.e., with laser from the monitoring area of the pattern glazing etching off except thickness is 0.1-30 μm of conductive layer；
(2) this is covered into conductive is carried out thinning with microetch liquid, and microetch is thinning until expose base at monitor disk pattern
Untill during material, make the conductive layer thickness left on insulating materials equal with the conductive layer thickness that laser light etching off is removed；
(3) to the baseplate material after thinning and cover after conductive drills, peel off selectivity with laser slitting and go
Except partial electroconductive layer is covered on baseplate material, the conductive layer of needs is left, so as to obtain meeting design requirement conductive pattern structure.
Advantages of the present invention and effect are：
1st, solve and process two-sided or multiple-plate problem with laser and mechanically direct forming technique, by thinning in advance,
Make the thickness of surface copper after plating still in laser direct forming and mechanical mechanical equipment can be in the range of work.
2nd, the copper-clad plate with the present invention after thinning, is processed using laser direct forming, improves the precision of conductive pattern, is made
The precision of the circuit board conductive pattern for going out can be controlled easily at ± 5 μm, within even more small error range.
3rd, The present invention gives the method that makes uniform thin copper foil, meet and made of general conductive of covering
The demand of very thin conductive is covered, material cost is reduced.
4th, the inventive method is adapted to laser direct structuring technique and mechanically direct forming technique circuit board, compared to traditional
Learn etch processing PCB technology, it is not necessary to which light draws version, eliminates pad pasting, to processes such as version, exposure, development, etchings, both drops
Low cost, also shortens process time.
5th, using the inventive method, laser direct forming equipment, the milling of machinery carving have been widened significantly, and directly mechanical equipment can add
The scope of work, both approaches coordinate with chemical means, can increase considerably processing efficiency, reduce the processing cost of product.
Specific embodiment
Below with reference to an embodiment, the present invention is described further.Following embodiments is illustrative
, it is not limited, it is impossible to limit protection scope of the present invention with following embodiments.
A kind of method of use laser direct structuring technique processing circuit board, first subtracts to covering conductive layer on baseplate material
It is thin, then through hole, plating thicken operation process after, directly remove conductive layer with laser selective, its step is：
(1) monitor disk is made, i.e., is led except monitor disk position is certain thickness from the monitoring area of the pattern glazing etching off with laser
Electric layer, the thickness of removal is 0.1-30 μm, and its minimizing technology is laser photetching or the mechanical milling of depthkeeping processing of depthkeeping processing
Or other certain thickness conductive layer methods of removal of control or measurement, the shape of the monitor disk and position are to be adapted to processing
Any pattern and any size, its position are the outsides of the conductive pattern profile for being used for design requirement on conductive material surface is covered
Or according to the region of the nonconductive structures in the conductive pattern profile of design requirement；
(2) this is covered into conductive is carried out thinning with microetch liquid, and microetch is thinning until expose base at monitor disk pattern
Untill during material, make the conductive layer thickness left on insulating materials equal with the conductive layer thickness that laser light etching off is removed, will when thinning
Control thinning degree, control method can also be by controlling etching period, speed to control thinning degree, or by with leading
Electric layer thickness measuring apparatus measures residue conductive layer controls thinning degree, the conductive layer is carried out microetch it is thinning when, using substrate
Micro etching method of the MATERIALS METHODS static soak in microetch liquid swings baseplate material in microetch liquid and carries out the side of microetch
Method washes away the micro etching method of baseplate material in microetch liquid, conductive layer is carried out microetch it is thinning when, for thinning degree
Control method be：Observation monitor disk, stop during the position for exposing insulating substrate thinning, to cut conductive layer thickness be equal to lead
Electric layer initial thickness subtracts the conductive layer thickness for making and being removed during monitor disk；
To the baseplate material after thinning and cover conductive drilled, after hole metallization, it is direct using laser
Forming technique or mechanically direct forming technique, the conductive layer on selective removal base material beyond conductive pattern make conductive pattern,
The conductive layer of needs is left, so as to obtain meeting design requirement conductive pattern structure；If it should be noted that making single sided circuits
Plate, then do not need the operating procedure of above-mentioned hole metallization, is peeled off with laser slitting and cover portion on selective removal baseplate material
Divide conductive layer, leave the conductive layer of needs, so as to obtain that there is the single-sided circuit board for meeting design requirement conductive pattern structure.
Embodiment
This example materials is：1.6mm is thick, two-sided to be covered with 35 μm of FR4 copper clad foil substrates of Copper Foil.
Product requirement：Hole wall copper is thick more than 18 μm, 50 μm of minimum feature spacing.
Monitor disk is calculated with German-Chinese CircuitCAM V7.0 and laser machine path, shelled by slitting with CircuitCAM V7.0
Conductive pattern Laser Processing path is calculated from method requirement, with German-Chinese DCT-DL400 laser direct formings machine and German-Chinese DCT-
DES300 all-in-one multifunctional machines Na2S2O8/H2SO4System enter row line processing, carried out with the mechanical machines of German-Chinese DCT-DM300 drilling and
Milling external form is processed, and hole metallization is carried out with German-Chinese DCT-TP300 holes equipment and electro-coppering thickeies.
Operating procedure is：
Data prepare：In data reading CircuitCAM V7.0, data inspection, addition Φ 5.0mm monitor disks are carried out
Laser path is calculated, and borehole data, milling shape data are derived respectively, and non-conducting areas are according to slitting stripping means in conductive pattern
Calculate machining path and derive data.
(1), the two-sided 35 μm of copper copper-clad plates of Qu Shengyi companies FR4,1.6mm1/1 are fixed to German-Chinese DCT-DL400 laser to step
On machine, the data of monitor disk laser path are read in, move data to the correct position outside conductive pattern edge, laser ginseng is set
Number is：Energy 20%, frequency 200KHz speed 400mm/ seconds, carries out photetching processing, produces monitor disk.
(2) step, is put into the copper-clad plate for being formed with monitor disk the microetch groove of DCT-DES300 all-in-ones, in the case where gently swinging
Place 10 minutes, take out observation monitor disk, do not expose insulating substrate, be placed again into microetch groove 1 minute, take out observation, monitoring
Disc portion sees base material, and observation is taken out after being placed again into 20 seconds, and monitor disk is substantially all to expose base material, now stops microetch,
Drilling operating is transferred to after washing drying.
Step (3), base material is original cover copper it is thinning after copper-clad plate, normally drilled with the mechanical machines of DCT-DM300, used
DCT-TP300 holes equipment opening and plating thicken, electroplating current density 1ASD, 1.5 hours time.
After workpiece holeization plating, it is placed in the machine table on German-Chinese DCT-DL400 laser machines, it is fixed, read in
Slitting stripping type machining path data derived from CircuitCAM, photetching processing is carried out after pin sensing positioning, obtains conductive pattern.Swash
Optical parameter is respectively, slitting laser：Energy 30%, frequency 300KHz, speed 400mm/ seconds；Peel off laser：Energy 50%, frequency
200KHz, speed 350mm/ seconds.
Then, the circuit board of prepared conductive pattern is gone into the mechanical machines of DCT-DM300, reads in milling external form data, pin sensing is fixed
Milling Machining is carried out behind position, circuit board is obtained.
Claims (6)
1. a kind of method of use laser direct structuring technique processing circuit board, it is characterised in that：First lead to being covered on baseplate material
Electricity
Layer carry out it is thinning, then through hole, plating thicken operation treatment after, directly remove conductive layer with laser selective, its step
For：(1) monitor disk is made, i.e., removes conductive layer from the monitor disk area of the pattern glazing etching off with laser；
(2) conductive will be covered to be carried out thinning with microetch liquid, and microetch is thinning until being when exposing base material at monitor disk pattern
Only, make the conductive layer thickness left on insulating materials equal with the conductive layer thickness that laser light etching off is removed；
(3) to the baseplate material after thinning and cover conductive and drilled, after hole metallization, peeled off with laser slitting and selected
Partial electroconductive layer is covered on selecting property removal baseplate material, the conductive layer of needs is left, so as to obtain meeting design requirement conductive pattern
Shape structure.
2. it is a kind of with laser direct structuring technique process single-sided circuit board method, it is characterised in that：Its step is：
(1) monitor disk is made, i.e., with laser from the monitor disk area of the pattern glazing etching off except thickness is 0.1-30 μm of conductive layer；
(2) conductive will be covered to be carried out thinning with microetch liquid, and microetch is thinning until being when exposing base material at monitor disk pattern
Only, make the conductive layer thickness left on insulating materials equal with the conductive layer thickness that laser light etching off is removed；
(3) to the baseplate material after thinning and cover after conductive drills, selective removal base is peeled off with laser slitting
Partial electroconductive layer is covered on plate material, the conductive layer of needs is left, so as to obtain meeting design requirement conductive pattern structure.
3. the method for use laser direct structuring technique processing circuit board according to claim 1, it is characterised in that：Its step
For：Step (1) in, the shape of the monitor disk is any pattern and any size for being adapted to processing, the position of the monitor disk
It is the outside of the conductive pattern profile for being used for design requirement on conductive surface is covered or the conductive pattern according to design requirement
The region of the nonconductive structures in case profile.
4. the method for use laser direct structuring technique processing circuit board according to claim 1, it is characterised in that：Its step
For：Step (2) in, to control thinning degree, control method to can also be by controlling etching period, speed to control when thinning
Thinning degree is made, or thinning degree is controlled by with conductive layer thickness measuring apparatus measures residue conductive layer.
5. the method for use laser direct structuring technique processing circuit board according to claim 1, it is characterised in that：Its step
For：Step (2) in, the conductive layer is carried out microetch it is thinning when, using baseplate material static soak in microetch liquid
Micro etching method or in microetch liquid swing baseplate material carry out the method for microetch or wash away baseplate material in microetch liquid
Micro etching method.
6. the method for use laser direct structuring technique processing circuit board according to claim 1, it is characterised in that：Its step
For：Step (2) in, conductive layer is carried out microetch it is thinning when, the control method for thinning degree is：Observation monitor disk, dew
The thickness for stopping thinning, to cut conductive layer during the position for going out insulating substrate subtracts making monitor disk equal to conductive layer initial thickness
When the conductive layer thickness that removes.
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| CN104363704B (en) * | 2014-10-30 | 2017-12-29 | 江门崇达电路技术有限公司 | A kind of thick hole copper PCB preparation method |
| CN117352585A (en) * | 2021-03-02 | 2024-01-05 | 苏州太阳井新能源有限公司 | Electrode manufacturing method for preventing edge short circuit of photovoltaic cell and photovoltaic cell formed by method |
| CN113709982A (en) * | 2021-08-30 | 2021-11-26 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by processing electroplating hole mask and conductive pattern through laser |
| CN113923868A (en) * | 2021-09-07 | 2022-01-11 | 德中（天津）技术发展股份有限公司 | Method for manufacturing high-frequency microwave board by using laser |
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Address after: 300392 Huayuan Industrial Zone, Xiqing District, Tianjin (Outside the Ring) East District, Block C, No. 11 Huake Road, Haitai Patentee after: Germany and China (Tianjin) technology development Limited by Share Ltd Address before: Off the coast of Tianjin city Xiqing District 300384 ring road six Huayuan Thai Development No. 6 K1-5-102 Patentee before: TIANJIN DECOTER CO., LTD. |