201031510 六、發明說明： 【發明所屬之技術領域】 本發明係關於對脆性材料基板照射雷射光束以沿彼此 交叉之兩方向割斷脆性材料基板之方法。 【先前技術】 以往，玻璃基板等之脆性材料基板之割斷方法，係廣 泛地進行使刀輪等壓接滾動而形成劃線後，沿劃線對基板 © 從垂直方向施加外力以割斷基板之方法。 通常’在使用刀輪進行了脆性材料基板之劃線後，易 因刀輪賦予脆性材料基板之機械應力而產生基板之缺陷， 在進行裂斷時會產生因上述缺陷導致之破裂等。 因此’近年來使用雷射割斷脆性材料基板之方法已被 實用化。此方法’係將雷射光束照射於基板而將基板加熱 至未達熔融溫度之溫度後’藉由以冷卻媒體冷卻基板使基 板產生熱應力，並藉由此熱應力從基板表面形成大致垂直 方向之裂痕。此使用雷射光束之脆性材料基板之割斷方法 中，由於利用熱應力，因此工具不直接接觸於基板，而可 使割斷面成為缺口等較少之平滑面，維持基板之強度。 又，亦提出了一種使用雷射在彼此交又之兩方向割斷 脆性材料基板之方法（例如專利文獻丨等）。此提案方法，係 對脆性基板照射雷射光束而形成半切割狀態之第丨裂痕 後，同樣地藉由雷射光束之照射形成與第丨裂痕交叉之全 切割狀態之帛2 $痕，接著對帛1 ^浪之半切割部再度照 201031510 射雷射光束而成為全切割狀態。 [專利文獻1]日本特開2007- 301806 【發明内容】 然而，如上述提案方法所述，對第丨裂痕之半切割部 再度照射雷射光束而將脆性基板全切割時，有時會於第上 裂痕與帛2 Μ之交點部分產生缺口。當作為割斷後之角 Ρ之脆丨生基板之交點部分產生缺陷時，割斷後之脆性基板 之尺寸精度則會降低，且所產生之玻璃屑會附著於基板表 面等而成為不良情形之原因。 本發明係有鑑於上述習知問題而完成者，其目的在於 提供在使用雷射在彼此交叉之兩方向割斷脆性材料基板時 抑制於交點部分產生之缺口之方法。 根據本發明，係提供一種脆性材料基板之割斷方法， is .第1步驟，係使雷射光束一邊相對脆性材料基板移 動' 一邊對其照射，在將該基板加熱至未達熔融溫度之溫 度後，對該基板喷吹冷卻媒體使其冷卻，並藉由產生於該 基板之熱應力形成由垂直裂痕構成之第丨劃線；第2步驟， 接著在與第1劃線交又之方向使雷射光束一邊相對該基板 移動、一邊對其照射，在將該基板加熱至未達熔融溫度之 溫度後，對該基板噴吹冷卻媒體使其冷卻，並藉由產生於 該基板之熱應力割斷該基板；以及第3步驟，接著再度對 第1劃線照射雷射光束以使該垂直裂痕伸展，以第丨劃線 割斷該基板，其特徵在於：該第3步驟中對第丨劃線照射 201031510 之雷射光束之照射點相對該相對移動方向之垂直方向之最 大寬度（以下亦記載為「照射寬度」）設為 1.0mm以下。 此處，在該第2步驟中，最好係在與第i劃線交又之 方向使雷射光束一邊相對該基板移動、一邊對其照射後， 對該基板喷吹冷卻媒體使其冷卻以形成垂直裂痕，其次再 度照射雷射光束以使該垂直裂痕伸展，藉以割斷該基板。 又’為了增大照射用以將脆性材料基板割斷之雷射光 束之條件裕度，最好係將第丨劃線之垂直裂痕深度設為該 ❹ 基板厚度之25%以上。 進而，該第3步驟中，將依下述式（1)算出之輸入能量 Q設為0.085J/mm以下， Q=P/SxL/VxW . . . (1) 式中’ Q :輸入能量（J/ mm) P ·雷射輸出（J/ s) S .雷射點面積（mni2) L .照射長度（mm) ❹ V .相對移動速度（mm/ s) W ·照射寬度（mm)。 根據本發明之脆性材料基板之割斷方法，在彼此交叉 之兩方向割斷脆性材料基板時，可抑制交點部分之缺口之 產生。藉此’割斷後之脆性材料基板之尺寸精度提升，且 可大幅地抑制因玻璃屑導致之不良情形。 田將第1劃線之垂直裂痕深度設為前述脆性材料基板 厚度之25%以上時，用以割斷脆性材料基板之雷射光束之 201031510 照射條件之裕度係增大。 【實施方式】 以下’雖更詳細地說明本發明之脆性材料基板之割斷 方法，但本發明並不限定於此等實施形態。 圖1顯示用於本發明之割斷方法之實施之割斷裝置一 例之概說圖。此圖之割斷裝置，具備可於架台u上相對紙 面於垂直方向（γ方向）移動自如之滑動台ι2、可於滑動台上 於圖之左右方向（X方向）移動自如之台座19、以及設於台座 19上之旋轉機構25,設於此旋轉機構25上之旋轉台26所 裝載固定之脆性材料基板50可藉由此等移動手段在水平面 内移動自如。 滑動台12安裝成可於一對導軌14, 15上移動自如，該 一對導軌14, 15係於架台11上面相隔既定距離平行配置。 又’於一對導軌14，15之間與導軌丨4，15平行地設有可藉 由未圖示馬達正反旋轉自如之導螺桿13。於滑動台12之底 面設有球體螺帽16。此球體螺帽16螺合於導螺桿丨3。藉 由導螺桿13之正轉或反轉，使球體螺帽16移動於γ方向， 藉此安裝有球體螺帽16之滑動台12係在導軌14，15上移 動於Y方向。 又’台座19係被支撐成可移動於在滑動台I]上相隔 既定距離平行配置一對導引構件21。又，於一對導引構件 21間與導引構件21平行地設有可藉由馬達23正反旋轉自 如之導螺桿22。又，於台座19之底面設有球體螺帽24， 201031510 其螺α於導螺才干22<>藉由導螺桿2 螺帽24移動於Χ方向， 正轉或反轉，使球體 -斜^丨舰” 與球體_24 一起沿 一對導引構件21移動於χ方向。 冷 於台座19上設有旋轉機構乃。 卜邮·右斿鲑么又’於此旋轉機構25 轉6。割斷對象即脆性材料基板50,藉由真空 吸附固定於旋轉台26上 錯由異工 直方向之中心軸旋轉。轉機構25係使旋轉台26繞垂 參 於旋轉台26上方，藉由從安裳台32垂下之 件 W將支撐台支撐成與旋轉台26分離對向。於支撑u 設有.用以於脆性材料基板5以面形成起始裂痕之刀輪 35'用以對脆性材料基板5〇，照射雷射光束之開口 (未圖 示）、以及用以冷卻脆性材料基板5〇表面之冷卻喷嘴37。 刀輪35,係藉由晶片保持具36保持成可升降於塵接於 脆性材料基板50之位置與非接觸之位置，僅在形成作為劃 線開始起點之起始裂痕時下降至壓接於脆性材料基板5〇之 位置。為了抑制裂痕自起始裂痕往無法預測之方向產生之 先行現象，起始裂痕之形成位置，最好係形成於脆性材料 基板5 0之表面侧端之内側。 於安裝台32上設有雷射輸出裝置34。自雷射輸出裝置 34射出之雷射光束LB，係藉由反射鏡44反射至下方，透 過保持於保持構件33内之光學系統，自形成於支撐台3 ! 之開口照射於固定在旋轉台26上之脆性材料基板50。 又’設於支撐台31之射出雷射光束lb之開口附近之 冷卻噴嘴37係朝向脆性材料基板5〇與空氣一起喷出作為 201031510 冷卻媒體的水。被喷射冷卻媒體之脆性材料基板50上之位 置’係在割斷預定線5 i a上且在雷射光束LB之照射區域後 側（參照圖2)。 於安裝台32設有用以辨識預先刻印於脆性材料基板5〇 之對準標記之一對CCD攝影機38, 39。藉由此等CCD攝影 機38, 39，檢測脆性材料基板5〇之載置時之位置偏移，例 如當脆性材料基板50偏移角度β時旋轉台26即旋轉， 當脆性材料基板50偏移γ時滑動台12即移動_γ。 此種構成之割斷裝置，在割斷脆性材料基板時，首 先係藉由將脆性材料基板5〇載置於旋轉台26上而藉由吸 引手段固定。接著，藉由CCD攝影機38及39，拍攝設在 跪材料基板50之對準標記，並如前所述地，根據攝影資 料將脆性材料基板5 0定位於既定位置。 其次，如前所述，藉由刀輪35於脆性材料基板5〇形 成起始裂痕。接著，從雷射輸出裝置34射出雷射光束LB。 雷射光束LB藉由反射鏡44,如圖 50表面大致垂直地照射。且於同 2所示地對脆性材料基板201031510 VI. Description of the Invention: [Technical Field] The present invention relates to a method of irradiating a brittle material substrate with a laser beam to cut a brittle material substrate in two directions crossing each other. [Prior Art] Conventionally, a method of cutting a brittle material substrate such as a glass substrate is a method in which a scribing wheel or the like is rolled by a cutter wheel to form a scribe line, and an external force is applied from the scribe line to the substrate in a vertical direction to cut the substrate. . In general, when the scribing of the brittle material substrate is performed using the cutter wheel, it is easy to cause a defect of the substrate due to the mechanical stress applied to the brittle material substrate by the cutter wheel, and cracking due to the above-mentioned defect occurs when the crack is broken. Therefore, in recent years, a method of cutting a brittle material substrate by using a laser has been put into practical use. The method 'heats the substrate to a temperature below the melting temperature after irradiating the laser beam to the substrate'. The substrate is thermally stressed by cooling the substrate with a cooling medium, and thereby forming a substantially vertical direction from the surface of the substrate by thermal stress. Cracks. In the cutting method of the brittle material substrate using the laser beam, since the thermal stress is utilized, the tool does not directly contact the substrate, and the cut surface can be made into a smooth surface with a small gap or the like, and the strength of the substrate can be maintained. Further, a method of cutting a brittle material substrate in two directions by using a laser (for example, a patent document, etc.) has been proposed. In the proposed method, after the laser beam is irradiated to the brittle substrate to form a third crack in the half-cut state, the laser beam is irradiated to form a full-cut state of the cross-cutting state, and then帛 1 ^ The half-cut of the wave is again taken in 201031510 to shoot the laser beam and become fully cut. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-301806. However, as described in the above-mentioned proposed method, when the half-cut portion of the second crack is irradiated again with the laser beam and the brittle substrate is completely cut, the A gap is formed in the intersection of the upper crack and the 帛2 Μ. When a defect occurs in the intersection portion of the brittle twin substrate which is cut off, the dimensional accuracy of the brittle substrate after the cutting is lowered, and the generated glass frit adheres to the surface of the substrate and the like, which is a cause of failure. The present invention has been made in view of the above-described conventional problems, and an object thereof is to provide a method of suppressing a notch generated at an intersection portion when a brittle material substrate is cut in two directions crossing each other using a laser. According to the present invention, there is provided a method for cutting a brittle material substrate, wherein the first step is to irradiate the laser beam while moving relative to the brittle material substrate, and after heating the substrate to a temperature less than the melting temperature. Spraying a cooling medium on the substrate to cool it, and forming a second scribe line formed by vertical cracks by thermal stress generated on the substrate; second step, then making a ray in the direction opposite to the first scribe line The light beam is irradiated while moving relative to the substrate, and after the substrate is heated to a temperature that does not reach the melting temperature, a cooling medium is sprayed onto the substrate to be cooled, and the thermal stress is generated by the substrate. And the third step, and then irradiating the first scribe line with the laser beam to extend the vertical crack, and cutting the substrate by the first scribe line, wherein the third step irradiates the first scribe line with 201031510 The maximum width of the irradiation spot of the laser beam with respect to the vertical direction of the relative movement direction (hereinafter also referred to as "irradiation width") is 1.0 mm or less. Here, in the second step, it is preferable that after the laser beam is moved in the direction opposite to the i-th scribe line and is irradiated to the substrate, the cooling medium is blown onto the substrate to be cooled. A vertical crack is formed, and the laser beam is again irradiated to extend the vertical crack to cut the substrate. Further, in order to increase the conditional margin of the laser beam for cutting the brittle material substrate, it is preferable to set the vertical crack depth of the second scribe line to 25% or more of the thickness of the ruthenium substrate. Further, in the third step, the input energy Q calculated by the following formula (1) is set to 0.085 J/mm or less, and Q=P/SxL/VxW (1) where 'Q: input energy ( J/ mm) P · Laser output (J/s) S. Laser spot area (mni2) L. Irradiation length (mm) ❹ V. Relative movement speed (mm/s) W · Irradiation width (mm). According to the cutting method of the brittle material substrate of the present invention, when the brittle material substrate is cut in two directions crossing each other, the occurrence of the notch at the intersection portion can be suppressed. Thereby, the dimensional accuracy of the brittle material substrate after cutting is improved, and the problem caused by the glass swarf can be greatly suppressed. When the vertical crack depth of the first scribe line is set to 25% or more of the thickness of the brittle material substrate, the margin of the 201031510 irradiation condition for cutting the laser beam of the brittle material substrate is increased. [Embodiment] Hereinafter, the method of cutting a brittle material substrate of the present invention will be described in more detail, but the present invention is not limited to these embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an example of a cutting device used for the execution of the cutting method of the present invention. The cutting device of the figure has a sliding table ι2 that can be moved in the vertical direction (γ direction) with respect to the paper surface on the gantry u, and a pedestal 19 that can be moved freely on the sliding table in the left-right direction (X direction) of the drawing, and The rotating mechanism 25 on the pedestal 19, the brittle material substrate 50 mounted on the rotating table 26 provided on the rotating mechanism 25 can be moved in the horizontal plane by means of such a moving means. The slide table 12 is mounted to be movable on a pair of guide rails 14, 15, which are arranged in parallel with each other at a predetermined distance from the upper surface of the mount 11. Further, a lead screw 13 which is rotatable in a forward and reverse direction by a motor (not shown) is provided between the pair of guide rails 14, 15 in parallel with the guide rails 4, 15. A spherical nut 16 is provided on the bottom surface of the slide table 12. This ball nut 16 is screwed to the lead screw 丨3. By the forward rotation or the reverse rotation of the lead screw 13, the ball nut 16 is moved in the γ direction, whereby the slide table 12 to which the ball nut 16 is attached is moved on the guide rails 14, 15 in the Y direction. Further, the pedestal 19 is supported so as to be movable so as to be arranged in parallel with each other at a predetermined distance on the slide table I]. Further, a lead screw 22 which is rotatable forward and backward by the motor 23 is provided in parallel with the guide member 21 between the pair of guiding members 21. Further, a spherical nut 24 is provided on the bottom surface of the pedestal 19, 201031510, and the snail α is used to guide the stem 22<> by the lead screw 2, the nut 24 is moved in the Χ direction, forward or reverse, so that the sphere - oblique ^ The stern ship moves along the pair of guiding members 21 in the χ direction together with the spherical body _24. The rotating pedestal 19 is provided with a rotating mechanism. The zipper and the right cymbal are again 'rotating the mechanism 25 to 6. The cutting object That is, the brittle material substrate 50 is fixed by being attached to the rotating table 26 by vacuum suction, and is rotated by the central axis in the straight direction of the opposite direction. The rotating mechanism 25 is configured to rotate the rotating table 26 around the rotating table 26, from the Anshang table. The hanging member W supports the support table to be separated from the rotary table 26. The support u is provided with a cutter wheel 35' for forming an initial crack on the surface of the brittle material substrate 5 for the brittle material substrate 5 An opening (not shown) for illuminating the laser beam and a cooling nozzle 37 for cooling the surface of the brittle material substrate 5. The cutter wheel 35 is held by the wafer holder 36 so as to be lifted and lowered to the brittle material substrate. The position of 50 and the position of non-contact are only formed as the starting point of the scribe line. At the beginning of the crack, it is lowered to the position of the crucible material substrate 5 。. In order to suppress the first phenomenon of the crack from the initial crack to the unpredictable direction, the position at which the initial crack is formed is preferably formed on the brittle material substrate 5 . The inside of the surface side end of 0. A laser output device 34 is provided on the mounting table 32. The laser beam LB emitted from the laser output device 34 is reflected downward by the mirror 44 and is transmitted through the holding member 33. The optical system inside is irradiated to the brittle material substrate 50 fixed to the turntable 26 from the opening formed in the support table 3! Further, the cooling nozzle 37 provided near the opening of the laser beam lb of the support table 31 is oriented toward The brittle material substrate 5 is ejected together with air as water of the 201031510 cooling medium. The position on the brittle material substrate 50 on which the cooling medium is ejected is on the cut-off line 5 ia and behind the irradiation area of the laser beam LB ( Referring to Fig. 2), the mounting table 32 is provided with a pair of alignment marks for identifying the pre-marked on the brittle material substrate 5 to the CCD cameras 38, 39. By means of the CCD cameras 38, 39, etc. When the material substrate 5 is placed at a position offset, for example, when the brittle material substrate 50 is shifted by an angle β, the turntable 26 rotates, and when the brittle material substrate 50 is shifted by γ, the slide table 12 moves _γ. When the brittle material substrate is cut, the cutting device is first fixed by the suction means by placing the brittle material substrate 5 on the turntable 26. Then, the CCD cameras 38 and 39 are used for photographing. The alignment mark of the material substrate 50, and as described above, the brittle material substrate 50 is positioned at a predetermined position according to the photographic material. Next, as described above, the start of the formation of the brittle material substrate 5 by the cutter wheel 35 crack. Next, the laser beam LB is emitted from the laser output device 34. The laser beam LB is illuminated by the mirror 44 substantially perpendicularly to the surface of Fig. 50. And the brittle material substrate shown in the same
’使脆性材料基板50收縮而產生 以起始裂痕為開始點'Shrinking the brittle material substrate 50 to start with the initial crack
為中心產生壓縮應力。接著， 脆性材料基板50之表面，使 拉伸應 201031510 A割斷預定線5 1 a於脆性材料基板5 0形成垂直裂痕5 3。 接著’藉由使雷射光束LB及冷卻喷嘴37依割斷預定 線51a相對移動，垂直裂痕53a即伸展而於脆性材料基板 5〇形成劃線52。在此實施形態之情形下，係在雷射光束LB 與冷卻喷嘴37固定於既定位置之狀態下，藉由滑動台12 與台座19、旋轉台26之旋轉機構25使脆性材料基板5〇移 動。當然，亦可在固定有脆性材料基板5〇之狀態下，使雷 射光束LB與冷卻喷嘴37移動。或者，亦可使脆性材料基 ® 板50及雷射光束LB/冷卻喷嘴37兩者移動。 其次，說明本發明之割斷方法。圖3係顯示本發明之 割斷方法-例之步驟圖。首先，如該圖⑷所示’第i步驟 係如前所述使雷射光束』及冷卻喷嘴37依割斷預定線… 相對移動，藉此使以未圖示起始裂痕為開始點之垂直裂痕 53a伸展於相對移動方向，於脆性材料基板5〇形成第丄劃 此處所使用之雷射务类 Q 由耵尤果LB並不特別限定，只要依據基 之材質或厚度'欲形成之垂直裂痕之深度等適當地決定 。當脆性材料基板5G為麵基板時，最好是使用在玻 嘲基板表面之吸收較大之、、念ι "、士“ 土 1/Zm之雷射光束。作為Compressive stress is generated for the center. Next, the surface of the brittle material substrate 50 is such that the tensile line 201031510 A cuts the predetermined line 5 1 a to form a vertical crack 53 on the brittle material substrate 50. Then, by causing the laser beam LB and the cooling nozzle 37 to relatively move along the cut predetermined line 51a, the vertical crack 53a is stretched to form the scribe line 52 on the brittle material substrate 5?. In the case of this embodiment, the brittle material substrate 5 is moved by the slide table 12, the pedestal 19, and the rotating mechanism 25 of the turntable 26 in a state where the laser beam LB and the cooling nozzle 37 are fixed at a predetermined position. Of course, the laser beam LB and the cooling nozzle 37 can be moved while the substrate of the brittle material is fixed. Alternatively, both the brittle material base plate 50 and the laser beam LB/cooling nozzle 37 can be moved. Next, the cutting method of the present invention will be described. Fig. 3 is a view showing the steps of the cutting method of the present invention. First, as shown in the figure (4), the "i-th step is to cause the laser beam" and the cooling nozzle 37 to be relatively cut by the predetermined line... thereby moving the vertical crack with the starting crack not shown as a starting point. 53a is stretched in the relative movement direction, and is formed on the brittle material substrate 5〇. The laser type Q used here is not particularly limited, and the vertical crack is formed according to the material or thickness of the base. Depth and the like are appropriately determined. When the brittle material substrate 5G is a surface substrate, it is preferable to use a laser beam having a large absorption on the surface of the glass substrate, and a laser beam of the earth 1/Zm.
上述雷射光束，可舉出C〇2雷射。雪M 形狀，最好係沿雷射光束之相先束對基板之照射 狀，；ta & 相對移動方向為細長之橢圓形 =對移動方向之照射長度[最好係 圍’照射寬度w最好们〜5mmn 之範 作為自冷卻噴嘴37噴出之冷卻媒體，可舉出水或酒精 201031510 等。又，在割斷後之脆性材料基板之使用上不會給予不良 影響之範圍内，亦可添加界面活性劑等之添加劑。冷卻媒 體之喷吹量通常為1〜2ml/min之範圍。冷卻媒體對基板 之冷卻，就可急速冷卻被雷射光束加熱之基板之觀點來 看，最好係採用將水與氣體（通常為空氣）一起喷射之所謂水 喷射方式。冷卻媒體之冷卻區域，最好係長徑丨〜5111111左右 之圓形或橢圓形狀。又，冷卻區域係在雷射光束之加熱區 域之相對移動方向後方，最好係形成為冷卻區域與加熱區 域之中心點間之距離成為5〜20mm左右。 雷射光束LB及冷卻喷嘴37之相對移動速度並無特別 限定’只要依據欲取得之垂直裂痕之深度等適當決定即 可。一般而§，若相對移動速度越慢，所形成之垂直裂痕 則越深。通常相對移動速度為數百sec。 構成劃線52a之垂直裂痕53a之深度雖無特別限定，但 為了擴大後步驟中照射用以割斷脆性材料基板之雷射光束 之條件、例如相對移動速度或雷射輸出等之裕度，最好係 相較於基板厚度為25%以上之深度。關於此點，將留於後 段之實施例中詳述。 其次’如圖3(b)所示’沿與第1劃線52a正交之割斷預 定線51b藉由使雷射光束lb及冷卻喷嘴37相對移動，而 形成第2劃線52b。第2劃線52b之形成條件，此處亦舉出 與第1劃線52a之形成條件相同之條件。 其次’如該圖3(c)所示，沿第2劃線52b再度照射雷射 光束LB。藉此使垂直裂痕53b往基板厚度方向伸展，以第 201031510 2劃線52b割斷基板50。該圖（b)及該圖（(；）相當於本發明之 第2步驟。此外，垂直裂痕53b，只要伸展至可在不施加外 力之狀態下割斷基板50之深度即可，並不—定要到達基板 5 0之相反面侧。 用以使垂直裂痕53b伸展至基板厚度方向之雷射光束 LB之照射條件，雖可依據基板5〇之後度或垂直裂痕53b 之深度等來適當決定，但此處亦例示通常形成前述第2劃 線5 2 b時之照射條件。 © 其次，第3步驟如該圖3(d)所示，沿第j劃線52a再度 照射雷射光束LB。藉此使垂直裂痕53a伸展於基板厚度方 向，以第1劃線52a割斷基板50。伸展後之垂直裂痕53a 之在基板厚度方向之深度，與垂直裂痕53b之情形同樣地， 只要伸展至可在不施加外力之狀態下割斷基板5〇之深度即 可’並不一定要到達基板50之相反面侧。 此奉重要的是，如圖4所示，係將照射於第i劃線52a 之雷射光束lb之照射點之照射寬度w設為10mm以下。 ® 如上述般將雷射光束LB之照射寬度w設為10mm以下 時，即較一般更為狹窄，藉此可有效地抑制兩個劃線之交 點部分之基板缺口之產生。較佳之照射寬度评為〇 9mm以 下。 圖5係顯示本發明之割斷方法之其他實施形態。此圖 中所示之割斷方法，首先第1步驟係如該圖（a)所示，與前 述同樣地使雷射光束LB及冷卻喷嘴37依割斷預定線5 la 相對移動’藉此於脆性材料基板50形成第！劃線52a。 11 201031510 其次’如該圖（b)所示，第2步驟係沿與第1劃線52a 正交之割斷預定線51b 一邊照射雷射光束lb—邊使其與冷 卻喷嘴3 7相對移動。圖3所示之實施形態中，雖係沿割斷 預定線51使雷射光束lb及冷卻喷嘴37相對移動，在形成 由垂直裂痕53a構成之第2劃線52a後，對第2劃線52b 再度照射雷射光束LB而割斷基板50,但本實施形態之割斷 方法中’係藉由使雷射光束LB及冷卻喷嘴37依割斷預定 線51b相對地移動一次’而形成較深之垂直裂痕53b以割 斷基板50。如上述’為了藉由一次之雷射光束lb照射與冷❹ 部來割斷基板50 ’例如只要使雷射光束lb與冷卻噴嘴37 之相對移動速度變慢、或使用較短波長之雷射光束Lb並對 基板之每一單位時間之能量賦予量增多即可。 其次，第3步驟如該圖3(c)所示，沿第i劃線52a再度 照射雷射光束LB。藉此使垂直裂痕53a伸展於基板厚度方 向，以第1劃線52a割斷基板50。與前述同樣地，第二次 照射於第1劃線52a之雷射光束LB之照射點之照射寬度w 設為1.0mm以下。又，伸展後之垂直裂痕53&之在基板厚 ◎ 度方向之深度’與前述同樣地，只要伸展至可在不施加外 力之狀態下割斷基板50之深度即可，並不一定要到達基板 5 0之相反面側。 以上，在所說明之各實施形態中雖係將第！劃線52丑 與第2劃| 52b各形成-條而割斷基板，但本發明當然亦 適用於’在大面積之基板50分別形成複數條第i劃線❿ 及第2劃線52b以割斷成多數個小面積基板之情形。又， 12 201031510 本發明之割斷方法，除了使兩個劃線正交之情形以外，太 然亦適用於以所欲之角度交又之情形。 田 實施例1 —a仃化學強化之厚度 〇.55咖之納玻璃形成彼此直行且其交點為四十個之複數條The above-mentioned laser beam is exemplified by a C〇2 laser. The shape of the snow M is preferably illuminating the substrate along the first beam of the laser beam; ta & the relative movement direction is an elongated ellipse = the length of the illumination in the direction of movement [preferably the circumference of the illumination width w The cooling medium of 5 mmn is used as a cooling medium ejected from the cooling nozzle 37, and water or alcohol 201031510 can be cited. Further, an additive such as a surfactant may be added to the extent that the use of the brittle material substrate after the cutting is not adversely affected. The amount of the cooling medium to be sprayed is usually in the range of 1 to 2 ml/min. The cooling medium is cooled by the substrate, and the substrate heated by the laser beam can be rapidly cooled. It is preferable to use a so-called water jet method in which water is sprayed together with a gas (usually air). The cooling area of the cooling medium is preferably a circular or elliptical shape having a long diameter of about 5111111. Further, the cooling area is located behind the relative moving direction of the heating region of the laser beam, and it is preferable that the distance between the cooling region and the center point of the heating region is about 5 to 20 mm. The relative moving speed of the laser beam LB and the cooling nozzle 37 is not particularly limited as long as it is appropriately determined depending on the depth of the vertical crack to be obtained. In general, §, the slower the relative movement speed, the deeper the vertical crack formed. Usually the relative movement speed is hundreds of sec. The depth of the vertical crack 53a constituting the scribe line 52a is not particularly limited. However, in order to expand the conditions for irradiating the laser beam for cutting the brittle material substrate in the subsequent step, for example, the relative movement speed or the margin of the laser output, etc., it is preferable. The thickness is 25% or more compared to the substrate thickness. In this regard, it will be detailed in the examples in the latter paragraph. Next, as shown in Fig. 3 (b), the second scribe line 52b is formed by relatively moving the laser beam lb and the cooling nozzle 37 along the cutting predetermined line 51b orthogonal to the first scribe line 52a. The conditions for forming the second scribe line 52b are also the same as those for forming the first scribe line 52a. Next, as shown in Fig. 3(c), the laser beam LB is again irradiated along the second scribe line 52b. Thereby, the vertical crack 53b is extended in the thickness direction of the substrate, and the substrate 50 is cut by the scribe line 52b at 201031510 2 . The figure (b) and the figure ((;) correspond to the second step of the present invention. Further, the vertical crack 53b is stretched to a depth at which the substrate 50 can be cut without applying an external force, and is not fixed. The irradiation condition of the laser beam LB for extending the vertical crack 53b to the thickness direction of the substrate may be appropriately determined depending on the depth of the substrate 5 or the depth of the vertical crack 53b, etc. Here, the irradiation conditions when the second scribe line 5 2 b is normally formed are also exemplified. © Next, in the third step, as shown in FIG. 3( d ), the laser beam LB is again irradiated along the j-th scribe line 52 a. The vertical crack 53a is stretched in the thickness direction of the substrate, and the substrate 50 is cut by the first scribe line 52a. The depth of the vertical crack 53a after stretching in the thickness direction of the substrate is the same as that of the vertical crack 53b, as long as it is stretched to be not applied In the state of external force, the depth of the substrate 5 is cut off, and it is not necessary to reach the opposite side of the substrate 50. It is important that, as shown in FIG. 4, the laser beam that will be irradiated on the i-th scribe line 52a The irradiation width w of the irradiation point of lb is set to 10 mm When the irradiation width w of the laser beam LB is set to 10 mm or less as described above, it is narrower than usual, whereby the occurrence of the substrate notch at the intersection of the two scribe lines can be effectively suppressed. The width is rated as 〇9 mm or less. Fig. 5 is a view showing another embodiment of the cutting method of the present invention. The cutting method shown in the figure first, as shown in the figure (a), is similar to the above. The light beam LB and the cooling nozzle 37 are relatively moved by the cut predetermined line 5 la 'by forming the scribe line 52a on the brittle material substrate 50. 11 201031510 Next, as shown in the figure (b), the second step is along with the 1 scribe line 52a The orthogonal cut line 51b illuminates the laser beam lb while moving relative to the cooling nozzle 37. In the embodiment shown in Fig. 3, the laser beam lb is made along the cut line 51. The cooling nozzle 37 is relatively moved. After the second scribe line 52a composed of the vertical crack 53a is formed, the second scribe line 52b is again irradiated with the laser beam LB to cut the substrate 50. However, in the cutting method of the present embodiment, By making the laser beam LB and the cooling nozzle 37 The cut predetermined line 51b is relatively moved once' to form a deeper vertical crack 53b to cut the substrate 50. As described above, in order to sever the substrate 50 by irradiating the laser beam lb with the cold head portion, for example, as long as the laser beam is made The relative movement speed of the lb and the cooling nozzle 37 is slow, or the laser beam Lb of a shorter wavelength is used and the amount of energy per unit time of the substrate is increased. Next, the third step is as shown in Fig. 3(c). As shown, the laser beam LB is again irradiated along the i-th scribe line 52a, whereby the vertical crack 53a is stretched in the thickness direction of the substrate, and the substrate 50 is cut by the first scribe line 52a. Similarly to the above, the irradiation width w of the irradiation spot of the laser beam LB irradiated to the first scribe line 52a for the second time is 1.0 mm or less. Further, in the same manner as described above, the vertical cracks 53 & the depth in the thickness direction of the substrate are extended so as to be able to cut the depth of the substrate 50 without applying an external force, and it is not necessary to reach the substrate 5 The opposite side of 0. As described above, in each of the embodiments described, it is the first! The scribe line 52 ugly and the second row | 52b each form a strip to cut the substrate, but the present invention is of course also applicable to 'formation of a plurality of i-th scribe lines 第 and second scribe lines 52b on the large-area substrate 50 to be cut into The case of most small-area substrates. Further, 12 201031510 The cutting method of the present invention, in addition to the case where the two lines are orthogonal, is also suitable for the case where it is left at the desired angle. Field Example 1—a thickness of chemical strengthening 〇.55 coffee glass forms a plurality of lines that are straight to each other and have an intersection of forty
:線’沿所形成之劃線再度照射雷射光束，而將前述基板 d斷成複數個。玻璃基板之割斷係使用如圖3所示之方法 進行。雷射照射之具體條件如下所述。 改變雷射之輸出及相對移動速度而割斷玻璃基板，特 =出可割斷之條㈣圍，算出雷射之輸出能量為最小之條 牛之交點缺口率(%)。其結果顯示於表1。此外，「輸入能 =」相當於沿第1劃線再度照射雷射光束LB時之每一第1 劃線1mm之雷射能量值，由前述式（1)算出。 (第1劃線之雷射照射條件）The line 'is again irradiates the laser beam along the formed line, and the substrate d is broken into a plurality of pieces. The cutting of the glass substrate was carried out by the method shown in Fig. 3. The specific conditions of laser irradiation are as follows. The glass substrate is cut by changing the output of the laser and the relative moving speed. Specifically, the strip can be cut (4), and the gap rate (%) of the bull's intersection is calculated. The results are shown in Table 1. Further, "input energy =" corresponds to a laser energy value of 1 mm per first scribe line when the laser beam LB is again irradiated along the first scribe line, and is calculated by the above formula (1). (Laser illumination conditions for the first line)
雷射光束：C02雷射 雷射輪出：180W 相對移動速度：1000mm/see 雷射點··橢圓形（照射長度L: 38mm，照射寬度w 13mm) (第2劃線之雷射照射條件） 雷射光束：C02雷射Laser beam: C02 laser laser wheel: 180W Relative moving speed: 1000mm/see Laser point · · Ellipse (irradiation length L: 38mm, irradiation width w 13mm) (Laser line irradiation conditions) Laser beam: C02 laser
雷射輸出：50〜250W 相對移動速度：200〜i500mm/sec 雷射點：橢圓形（照射長度L: 38mm，照射寬度w 13 201031510 0.9mm) 比較例1及比較例7 第2劃線之雷射照射條件，係將雷射點之照射寬度％ 設為Umm’改變雷射之輸出及相對移動速度而 割斷玻璃基板，特定出可割斷之條件範圍，以輸出能量為 最小之條件算出交點缺口率^其結果配合表丄顯示。又， 為供參考’係於圖6顯示產生交點缺口時之光學顯微 片。 ‘，、、Laser output: 50~250W Relative moving speed: 200~i500mm/sec Laser point: elliptical (irradiation length L: 38mm, irradiation width w 13 201031510 0.9mm) Comparative Example 1 and Comparative Example 7 In the irradiation condition, the irradiation width % of the laser spot is set to Umm' to change the output of the laser and the relative moving speed, and the glass substrate is cut, the range of the cuttable condition is specified, and the intersection gap rate is calculated with the minimum output energy. ^ The results are shown in conjunction with the table. Again, for reference, the optical microscopy of the intersection of the intersections is shown in Figure 6. ‘,,,
從表1可理解’相較於實施例1之割斷方法中交點缺 口率為29%，比較例1及比較例2之割斷方法中交點缺口 率為較高值之59%及63%。 根據本發明之割斷方法’在使用雷射於彼此交又之兩 方向割斷脆性材料基板時，能抑制交點部分之缺口產生， 非常有用。 【圖式簡單說明】 圖1係能實施本發明之割斷方法之割斷裝置一例之 說圖。 201031510 圖2係說明雷射劃線之操作狀態之圖。 圖3係顯示本發明之割斷方法一例之步驟圖。 圖4係雷射裂斷步驟之雷射光束之照射點之示意圖。 圖5係顯示本發明之割斷方法另一例之步驟圖。 圖6係交點缺口之光學顯微鏡照片。As can be understood from Table 1, the intersection defect rate was 29% in the cutting method of Example 1, and the intersection notch ratio in Comparative Example 1 and Comparative Example 2 was 59% and 63% in the higher value. According to the cutting method of the present invention, it is very useful to suppress the occurrence of the notch at the intersection portion when the brittle material substrate is cut in two directions by using the laser. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an example of a cutting device capable of carrying out the cutting method of the present invention. 201031510 Figure 2 is a diagram illustrating the operational state of a laser scribing line. Fig. 3 is a flow chart showing an example of the cutting method of the present invention. Figure 4 is a schematic illustration of the illumination point of the laser beam in the laser splitting step. Fig. 5 is a view showing the steps of another example of the cutting method of the present invention. Figure 6 is an optical micrograph of the intersection gap.
【主要元件符號說明】 11 架台 12 滑動台 13 導螺桿 14, 15 導軌 16 球體螺帽 19 台座 21 導引構件 22 導螺桿 24 球體螺帽 25 旋轉機構 26 旋轉台 31 支撐台 32 安裝台 33 保持構件 34 雷射輸出裝置 35 刀輪 36 晶片保持具 201031510 37 冷卻喷嘴 38, 39 CCD攝影機 44 反射鏡 50 脆性材料基板 51, 51a, 51b 割斷預定線 52 劃線 52a 第1劃線 52b 第2劃線 53, 53a, 53b 垂直裂痕 LB 雷射光束 16[Main component symbol description] 11 Stand 12 Slide table 13 Lead screw 14, 15 Guide rail 16 Ball nut 19 Base 21 Guide member 22 Lead screw 24 Ball nut 25 Rotating mechanism 26 Rotary table 31 Support table 32 Mounting table 33 Holding member 34 Laser output device 35 Cutter wheel 36 Wafer holder 201031510 37 Cooling nozzle 38, 39 CCD camera 44 Mirror 50 Brittle material substrate 51, 51a, 51b Cutting line 52 Scribe 52a 1st line 52b 2nd line 53 , 53a, 53b vertical crack LB laser beam 16