1277612 玖、發明說明： 【發明所屬之技術領域】 本發明係關於用以在脆性材料基板表面形成劃線之劃 線方法及劃線裝置，該劃線係用以分割使用於平面顯示器 (以下稱為FPD)之玻璃基板、半導體晶圓等脆性材料基板 〇 【先前技術】 以下所說明的習知技術，係在使用於各種平面顯示器 之一種脆性材料基板、即玻璃基板或貼合該脆性材料基板 所構成的母脆性材料基板上，形成劃線之情形。 貼合一對玻璃基板所構成之液晶顯示面板等FPD，係 將一對母玻璃基板彼此互相貼合後加以分割，使各母玻璃 基板形成為構成FPD之既定尺寸的玻璃基板。各母玻璃基 板’預先以鑽石製之刀具等形成劃線後，沿該劃線分割。 又’依平面顯示器之種類或製造方法之差異，亦有在貼合 别之母玻璃基板先形成劃線，而後分割該母玻璃基板之情 形。 若使用刀具等以機械方式形成劃線，所形成之劃線周 邊部’則成為蓄積殘留應力之狀態。並且，沿劃線分割母 玻璃基板時，在分割出之玻璃基板表面側緣的邊緣部及其 周邊部’會蓄積殘留應力。此種殘留應力，係使不必要之 放痕伸長於玻璃基板表面附近的潛在應力，若將該殘留應 力釋放’則會產生不必要之裂痕而有使玻璃基板之分割面 邊緣°卩形成缺口之虞。由於玻璃基板之分割面邊緣部形成 1277612 缺口而產生的碎片’會有對所製造之FPD帶來不良影響之 虞。 近年來’為了要在母玻璃基板表面形成劃線，使用雷 射光束之方法已實用化。使用雷射光束在母玻璃基板形成 劃線之方法，如圖8所示，對母玻璃基板5()從雷射振盪 裝置61照射雷射光束LB。從雷射振盪裝置61照射之雷射 光束LB，在母玻璃基板50表面形成沿母玻璃基板50上之 劃線預定線SL的橢圓狀雷射點LS。母玻璃基板5()與從雷 射振盈裝置61照射之雷射光束LB，係沿雷射點Ls之長邊 方向相對移動。 母玻璃基板50，係以雷射光束[Β加熱至比軟化母玻 璃基板50之溫度為低的溫度。藉此，形成雷射點之母 玻璃基板50表面，則不會被軟化而加熱。 又，在母玻璃基板50表面之雷射光束LB之照射區域 附近，將冷卻水等之冷媒從冷卻嘴吹進，以助形成劃線。 在雷射光束LB所照射之母玻璃基板5〇表面，以雷射光束 LB之加熱產生壓縮應力，並且藉由吹進冷媒產生拉伸應力 。如此’因在與產生壓縮應力之區域近接的區域產生拉伸 應力，在兩區域間，產生依據各應力之應力傾斜，在母玻 璃基板50，從預先形成於母玻璃基板5〇端部之切口 沿 劃線預定線SL，形成垂直裂痕於母玻璃基板5〇之厚度方 向。即，該垂直裂痕線為劃線。 & 因微小而 如此形成於母玻璃基板50表面之垂直裂痕 通常無法以肉眼目視’故稱為盲裂痕Be。 1277612 圖9，係表示以雷射劃線裝置劃線之母玻璃基板$ 〇上 之盲裂痕BC之形成狀態的模式立體圖，圖1 〇，係表示該 母玻璃基板50上之物理變化狀態的示意俯視圖。 從雷射振盪裝置61振盪之雷射光束，在母玻璃基板 50表面形成橢圓形之雷射點LS。雷射點LS，係以長軸與 劃線預定線一致之方式照射。 在此情形，形成於母玻璃基板50之雷射點LS，係外 周緣部之熱能強度比中央部之熱能強度大。此種雷射點LS ，藉由將熱能強度係高斯分布之雷射光束改成使長軸方向 之各端部為最大之熱能強度的熱能分布來形成。因此，在 位於劃線預定線SL上之長軸方向的各端部，熱能強度分 別為最大’被各端部夾住之雷射點Ls中央部分之熱能強 度’則比各端部之熱能強度小。 母玻璃基板50，係沿雷射點LS之長軸方向相對移動 ’因此’母玻璃基板50，沿劃線預定線SL，以雷射點LS 之長轴方向之一方端部的熱能強度加熱後，以雷射點Ls 中央部之小熱能強度加熱，進一步再以大熱能強度加熱。 然後’朝向從雷射點LS之後方側端部例如沿長軸方向離 既定間隔L之劃線上的冷卻點cP，從冷卻嘴62吹進冷媒 〇 藉此’在雷射點LS與冷卻點CP之間產生溫度梯度， 對冷卻點CP產生大拉伸應力於與雷射點LS相反側之區域 。並且’利用該拉伸應力，從形成於母玻璃基板5〇端部 之切口 TR沿劃線預定線，形成垂直裂痕於母玻璃基板5〇 1277612 之厚度t方向。 母玻璃基板50，係以橢圓狀之雷射點LS加熱。在此 情形，母玻璃基板50，雖藉由雷射點Ls之一方端部之大 熱能強度，將熱從其表面朝向内部三維傳達，但是藉由雷 射點LS對母玻璃基板50相對移動，以雷射點前端部加 熱之部分，則在以雷射點LS中央部之小熱能強度加熱後 ’再度以雷射點LS後端部之大熱能強度加熱。 如此，母玻璃基板50表面，以大熱能強度加熱後，在 以小熱能強度加熱期間，將其熱確實傳導至内部。此時， 防止母玻璃基板50表面繼續以大熱能強度加熱，能防止 母玻璃基板50表面軟化。然後，再度以大熱能強度加熱 母玻璃基板50，則確實加熱至母玻璃基板5〇内部，而在 母玻璃基板50表面及内部產生壓縮應力。並且，藉由將 /令媒p人進產生该壓縮應力之區域附近的冷卻點Cp，來產生 拉伸應力。 若在雷射點LS之加熱區域產生壓縮應力，在冷媒之冷 卻點cp產生拉伸應力，則藉由產生於雷射點Ls與冷卻點 CP間之熱擴散區域的壓縮應力，對冷卻點cp產生大拉伸 應力於與雷射點LS相反側區域。並且，利用該拉伸應力 k I成於母玻璃基板5 〇端部之切口 TR沿劃線預定線產 生盲裂痕。 劃線之盲裂痕BC形成於母玻璃基板5 0後，母玻璃基 板50，則供應至下面之分割步驟，在盲裂痕兩側，以 產生背曲力矩（使盲裂痕BC沿母玻璃基板50厚度方向伸展 1277612 )之方式對母玻璃基板50施加作用力。藉此，母玻璃基板 50，則沿著沿劃線預定線形成之盲裂痕B(：分割。 【發明内容】 ° 在如上述之劃線裝置，形成於母玻璃基板5〇表面之雷 射點LS，係成為使熱能強度於長軸方向為最大的方式來形 成熱能強度分布。如此，藉由使熱能強度在長軸方向之各 端部最大，且以2階段加熱母玻璃基板5〇表面，母玻璃 基板50則成為傳熱至基板内部之狀態。因此僅靠使用形 成冷卻點cp之冷媒的短時間冷卻，則在雷射點Ls與冷卻 CP間不此獲得充份之熱應力梯度，而不能形成深盲 4痕（垂直裂痕）。因此，在前述分割步驟會有產生母玻璃 基板50分割不良之虞。 本發明，係欲解決如上述之問題，其目的在於提供： 能在母玻璃基板等脆性材料基板有效率且確實地形成劃線 的脆性材料基板之劃線方法及劃線裝置。 本發明之脆性材#基板之劃線方法，係沿脆性材料基 板表面之劃線預定線，以形成溫度比該脆性材料基板之軟 化點為低的雷射點之方式，邊將雷射光束連續地照射且移 動邊將《亥雷射點後方之沿劃線預定線的區域附近以冷媒 冷卻而形成冷卻點’藉此沿劃線預定線連續形成盲裂痕， 其特徵在於： ^邊形成至少一個輔助冷卻點邊劃線，該輔助冷卻點， 係位於比省冷部點更靠近雷射點#，用來預先以冷媒冷卻 沿劃線預定線之區域。 1277612 該輔助冷卻點，係以冷卻溫度比形成該冷卻 溫度為高的冷媒形成。 令部 又，本發明之脆性材料基板之劃線裝置，係具備· 雷射光束照射機構，係以溫度比該跪性材料 化點為低的雷射點形成於該雜材料基板表面之軟 雷射光束連續地照射而移動；及 I 將BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scribing method for forming a scribing surface on a surface of a brittle material substrate, and a scribing device for dividing into a flat panel display (hereinafter referred to as A fragile material substrate such as a glass substrate or a semiconductor wafer of FPD) [Prior Art] A conventional technique described below is a brittle material substrate used for various flat-panel displays, that is, a glass substrate or a substrate for bonding the brittle material. A scribe line is formed on the mother brittle material substrate. In an FPD such as a liquid crystal display panel formed by laminating a pair of glass substrates, a pair of mother glass substrates are bonded to each other and then divided so that each mother glass substrate is formed into a glass substrate having a predetermined size of the FPD. Each mother glass substrate ' is formed by scribing in advance with a diamond-made cutter or the like, and is divided along the scribe line. Further, depending on the type of the flat display or the manufacturing method, it is also possible to form a scribe line on the bonded mother glass substrate and then divide the mother glass substrate. When a scribe line is mechanically formed using a cutter or the like, the formed scribe line peripheral portion ′ is in a state in which residual stress is accumulated. Further, when the mother glass substrate is divided along the scribe line, residual stress is accumulated in the edge portion of the side edge of the surface of the divided glass substrate and the peripheral portion thereof. Such residual stress is a potential stress that causes unnecessary scratches to be elongated near the surface of the glass substrate. If the residual stress is released, an unnecessary crack is generated and the edge of the divided surface of the glass substrate is notched. Hey. The debris generated by the formation of the 1277612 notch at the edge portion of the divided surface of the glass substrate may adversely affect the manufactured FPD. In recent years, in order to form a scribe line on the surface of a mother glass substrate, a method of using a laser beam has been put into practical use. Using the laser beam to form a scribe line on the mother glass substrate, as shown in Fig. 8, the laser beam LB is irradiated from the laser oscillating device 61 to the mother glass substrate 5 (). The laser beam LB irradiated from the laser oscillation device 61 forms an elliptical laser spot LS along the predetermined line SL of the mother glass substrate 50 on the surface of the mother glass substrate 50. The mother glass substrate 5 () and the laser beam LB irradiated from the laser oscillation device 61 are relatively moved in the longitudinal direction of the laser spot Ls. The mother glass substrate 50 is heated at a temperature lower than the temperature of the softened mother glass substrate 50 by a laser beam [Β. Thereby, the surface of the mother glass substrate 50 on which the laser spot is formed is not softened and heated. Further, in the vicinity of the irradiation region of the laser beam LB on the surface of the mother glass substrate 50, a refrigerant such as cooling water is blown from the cooling nozzle to assist in forming a scribe line. On the surface of the mother glass substrate 5 irradiated by the laser beam LB, the compressive stress is generated by heating of the laser beam LB, and tensile stress is generated by blowing the refrigerant. Thus, the tensile stress is generated in the region close to the region where the compressive stress is generated, and the stress is tilted according to each stress between the two regions, and the slit is formed on the mother glass substrate 50 from the end portion of the mother glass substrate 5 A predetermined crack is formed along the line SL to form a vertical crack in the thickness direction of the mother glass substrate 5'. That is, the vertical crack line is a scribe line. & Vertical cracks formed on the surface of the mother glass substrate 50 due to the small size are generally not visually visible to the naked eye, so they are called blind cracks Be. 1277612 FIG. 9 is a schematic perspective view showing a state in which a blind crack BC is formed on a mother glass substrate $ scribed by a laser scribing device, and FIG. 1 is a schematic view showing a state of physical change on the mother glass substrate 50. Top view. The laser beam oscillated from the laser oscillation device 61 forms an elliptical laser spot LS on the surface of the mother glass substrate 50. The laser spot LS is irradiated in such a manner that the long axis coincides with the predetermined line of the scribe line. In this case, the laser beam LS formed on the mother glass substrate 50 has a thermal energy intensity greater than that of the central portion. Such a laser spot LS is formed by changing a laser beam having a Gaussian heat intensity distribution into a heat energy distribution that maximizes the thermal energy intensity at each end portion in the long axis direction. Therefore, at each end portion in the long-axis direction on the predetermined line SL, the thermal energy intensity is the maximum 'the thermal energy intensity at the central portion of the laser spot Ls sandwiched by the respective ends' is higher than the thermal energy intensity at each end portion. small. The mother glass substrate 50 is relatively moved along the long axis direction of the laser spot LS. Therefore, the mother glass substrate 50 is heated along the predetermined line SL of the line, and is heated at the thermal energy intensity at one end of the long axis direction of the laser spot LS. It is heated by the small thermal energy intensity at the center of the laser spot Ls, and further heated with a large thermal energy intensity. Then, 'the cooling point cP on the scribe line from the rear side of the laser beam LS, for example, in the longitudinal direction away from the predetermined interval L, is blown into the refrigerant from the cooling nozzle 62, thereby 'at the laser point LS and the cooling point CP. A temperature gradient is generated between them, and a large tensile stress is generated to the cooling point CP on a side opposite to the laser spot LS. Further, by the tensile stress, a slit is formed in a predetermined direction from the slit TR formed at the end portion of the mother glass substrate 5 to form a vertical crack in the thickness t direction of the mother glass substrate 5 〇 1277612. The mother glass substrate 50 is heated by an elliptical laser spot LS. In this case, the mother glass substrate 50 conveys heat three-dimensionally from the surface toward the inside by the large thermal energy intensity at one end portion of the laser spot Ls, but the mother glass substrate 50 relatively moves by the laser spot LS. The portion heated at the front end of the laser spot is heated by the large thermal energy intensity at the rear end portion of the laser spot LS after being heated by the small thermal energy intensity at the center of the laser spot LS. Thus, the surface of the mother glass substrate 50 is heated to a large thermal energy intensity and then thermally conducted to the inside during heating with a small thermal energy intensity. At this time, the surface of the mother glass substrate 50 is prevented from continuing to be heated by a large thermal energy, and the surface of the mother glass substrate 50 can be prevented from softening. Then, when the mother glass substrate 50 is heated again with a large thermal energy intensity, it is surely heated to the inside of the mother glass substrate 5, and compressive stress is generated on the surface and inside of the mother glass substrate 50. Further, tensile stress is generated by causing the medium p to enter the cooling point Cp near the region where the compressive stress is generated. If a compressive stress is generated in the heating region of the laser spot LS, and a tensile stress is generated at the cooling point cp of the refrigerant, the compressive stress generated in the thermal diffusion region between the laser spot Ls and the cooling point CP is applied to the cooling point cp. A large tensile stress is generated in the region opposite to the laser spot LS. Further, the slit TR is formed by the slit TR at the end portion of the mother glass substrate 5 to form a blind crack along the predetermined line of the scribe line. After the blind crack BC of the scribe line is formed on the mother glass substrate 50, the mother glass substrate 50 is supplied to the lower dividing step on both sides of the blind crack to generate a back bending moment (the blind crack BC is along the thickness of the mother glass substrate 50). The direction of stretching 1277612) exerts a force on the mother glass substrate 50. Thereby, the mother glass substrate 50 is formed along the predetermined line along the scribe line by the blind crack B (: division). [Invention] In the scribe line device as described above, the laser spot is formed on the surface of the mother glass substrate 5 LS is a thermal energy intensity distribution in such a manner that the thermal energy intensity is maximized in the long axis direction. Thus, by heating the end portions of the thermal energy intensity at the respective ends in the long axis direction and heating the surface of the mother glass substrate 5 in two stages, The mother glass substrate 50 is in a state of being transferred to the inside of the substrate. Therefore, only a short-time cooling using the refrigerant forming the cooling point cp does not obtain a sufficient thermal stress gradient between the laser spot Ls and the cooling CP. It is impossible to form a deep blind 4 mark (vertical crack). Therefore, there is a problem that the mother glass substrate 50 is poorly divided in the above-described dividing step. The present invention is to solve the above problems, and an object thereof is to provide: a mother glass substrate A method for scribing a brittle material substrate, such as a brittle material substrate, and a scribing device. The brittle material of the present invention is a method of scribing a substrate along a surface of a brittle material substrate. The predetermined line is scribed to form a laser spot having a temperature lower than a softening point of the brittle material substrate, and the laser beam is continuously irradiated and moved to scribe a line along the trailing line behind the Hailei shooting point. The vicinity of the area is cooled by the refrigerant to form a cooling point, whereby the blind crack is continuously formed along the predetermined line of the scribe line, and is characterized in that: the edge forms at least one auxiliary cooling point side scribe line, and the auxiliary cooling point is located in the lower part of the cold section. The point is closer to the laser point #, and is used to preliminarily cool the area along the predetermined line by the refrigerant. 1277612 The auxiliary cooling point is formed by a cooling medium having a cooling temperature higher than the cooling temperature forming the cooling temperature. The scribing device for the brittle material substrate is provided with a laser beam irradiation mechanism that continuously irradiates and moves the soft laser beam formed on the surface of the impurity substrate at a laser spot having a temperature lower than the elastic material point. ; and I will
構’係將該雷射點加熱之區域後方之沿劃線預 疋線的區域附近，以冷媒連續冷卻； 以沿脆性材料基板表面之劃線預定線形成盲裂 特徵在於，具備： 乂 & 2少一個辅助冷卻機構，係將比該冷卻機構冷卻之區 域更靠近以該雷射光束照射機構形成之雷射點側的區域， 以溫度比冷卻機構之冷媒溫度為高的冷媒加以。 【實施方式】 依圖式說明本發明之實施形態如下。 圖1，係母玻璃基板之概略俯視圖，以示意表示本發 明之脆性材料基板之劃線方法的實施形態。該劃線方法， 係分割母玻璃基板來形成構成液晶顯示板等FPD之複數個 玻璃基板時，為了在分割母玻璃基板之前，形成劃線之盲 裂痕於母玻璃基板而實施。 如圖1所示，在母玻璃基板50表面，沿著劃線預定線 SL ’藉由雷射光束之照射形成雷射點LS1。又，在母玻璃 基板50表面之劃線預定線SL之劃線開始位置附近的母玻 璃基板50側緣部，預先形成沿該劃線預定線之切口（切痕 11 1277612 )TR。 雷射”’、έ LS1係形成橢圓形狀，以長徑沿劃線預定線％ 之狀態，對母破璃基板5〇表面朝箭頭A所示之方向相對 移動。 ^此日卞，形成於母玻璃基板50之雷射點LS1，係外周緣 ^之熱能強度成為比中央部之熱能強度大。此種雷射點 LSI，係藉由將熱能強度為高斯分布之雷射光束改成使長 軸方向之各ί而部為最大熱能強度的熱能分布來形成。因此 二在：於劃線預定線SL上之長軸方向各端部，熱能強度 分別變成最大，而夹於各端部間之雷射點LS1中央部分的 熱能強度，則比各端部之熱能強度小。 橢圓形狀之雷射點LSI，沿著母玻璃基板50表面之劃 線預疋線SL移動，依序加熱劃線預定線sl。 雷射點LS卜以比母玻璃基板5G軟化之軟化點溫度低 的溫度，並且邊對母玻璃基板5〇以高速移動，邊加熱母 玻璃基板50。藉此，形成雷射點LS1之母玻璃基板5〇表 面’則不被溶解而加熱。 母玻璃基板50表面，在雷射點LS1進行方向之後方， 形成主冷卻點MCP。主冷卻點Mcp，係藉由在母玻璃基板 50表面從冷卻嘴吹進冷卻水、水與壓縮空氣之混合流體、 壓縮空氣、He氣體、I氣體、c〇2氣體等之冷媒，來冷卻 母玻璃基板50表面而形成，以與對母玻璃基板5〇之雷射 點LSI相同方向，而且，與雷射點LS1之移動速度二的 速度，順沿母玻璃基板5G表面之劃線預定線&移動。 12 1277612 又，在母玻璃基板5〇表面，形成輔助冷卻點Acp，位 於主冷卻點MCP進行方向之前方，接近於主冷卻點Mcp， 且沿著劃線預定線SL。輔助冷卻點ACP，係藉由從冷卻嘴 吹進冷卻水、水與壓縮空氣之混合流體、壓縮空氣、“氣 體、t氣體、C〇2氣體等之冷媒於母玻璃基板5〇表面，將 母玻璃基板50表面以吹進輔助冷卻點Acp之冷媒溫度比吹 進主冷卻點MCP之冷媒溫度為高之狀態來冷卻。輔助冷卻 點ACP，亦與主冷卻點MCP同樣，以與對母玻璃基板5〇之 雷射點LSI相同方向，而且，與雷射點LS1之移動速度相 等的速度，順沿母玻璃基板5〇表面之劃線預定線SL移動 〇 母玻璃基板50表面，沿著劃線預定線SL，以雷射點 LSI依序加熱後，在尚未以形成主冷卻點Mcp之冷媒冷卻 其加熱部分之前，藉由形成辅助冷卻點ACp之冷媒，以比 主β卻點MCP南之冷卻溫度冷卻，然後，以形成主冷卻點 MCP之冷媒，冷卻至比輔助冷卻點ACP低之冷卻溫度。 母玻璃基板50，以雷射點LS1加熱，就在其表面產生 壓縮應力，此後，藉由形成輔助冷卻點Acp之冷媒，一旦 冷卻後，進一步藉由形成主冷卻點Mcp之冷媒，來冷卻。 藉此，沿著劃線預定線，形成沿垂直方向深入之盲裂痕BC 的線。 此理由被認為如下：以雷射點LS1加熱母玻璃基板5〇 表面而產生壓縮應力後，藉由以形成輔助冷卻點之冷 媒將母玻璃基板50 —旦冷卻，產生拉伸應力。而後，以 13 1277612 產生此種拉伸應力之狀態，進一步藉由形成主冷卻點Mcp 之冷媒冷卻，則因在母玻璃基板5〇表面，已成為產生拉 伸應力之狀態，故以形成主冷卻點MCP之冷媒的冷卻所產 生之拉伸應力，則容易對母玻璃基板50表面作用，而在 母玻璃基板50，形成沿垂直方向深入之盲裂痕Bc。 又，在如圖10所示之習知技術之雷射劃線方法，被認 為··因以雷射點LS加熱母玻璃基板5〇表面後，吹進冷媒 來冷卻母玻璃基板50表面，故在形成盲裂痕上產生多餘 之熱衝擊（thermal shock)。 然而，在本發明之劃線方法，亦被認為··藉由將輔助 冷卻點ACP設置於主冷卻點Mcp與雷射點LS1之間，使上 述之多餘之熱衝擊緩和，將被熱衝擊消失之能量消耗於使 盲裂痕伸長之力量。 劃線之盲裂痕形成於母玻璃基板5〇後，母玻璃基板 50則供應至下面之分割步驟，在盲裂痕兩側，以產生使 盲裂痕沿母玻璃基板50之厚度方向伸長的彎曲矩之方式 ，對母玻璃基板50加力。藉此，母玻璃基板5〇則沿著沿 劃線預定線SL形成之盲裂痕分割。 圖2，係表示本發明之脆性材料基板之劃線裝置之實 施形態的概略構成圖。本發明之劃線裝置，例如，係形成 用以從母玻璃基板50分割成使用在FpD之複數個玻璃基板 的劃線之裝置。該劃線裝置，如圖2所示，在水平之架台 11上具有滑動台12’沿既定之水平方向（γ方向）往復移動 !277612 滑動台12,係支撐於沿γ方向平行 a 面之一對導執14及15，处、 — 木口 11上 5施以水平狀態沿各導 滑動。在兩導軌14及15 導執14及15 之中間部’設置與各導勅 15平行之滾珠螺桿13，使 導執14及 更乂馬達（未圖示）旋轉。清 13，能正轉及逆轉，在哕爷政戚 濃珠螺桿 轉在忒滾珠螺桿13安裝球螺帽lfi 3 合狀態。滾珠螺帽16，以不旋轉之狀態’:16呈螺 12,藉由滾珠螺桿13之正轉 "動台 於兩方向。藉此’與球螺帽16 一體安 動 沿導軌14及15滑動於γ方向。 σ 則 在滑動台12上，以水平狀態配置台座19 支樓於平行配置在滑動自12上 :19, 各導軌21，係沿與滑動台12滑動方向導之軌/方滑動。 :向配置。又，在各導軌21間之中央部，與各導:：Χ 订配置滾珠螺桿22，使滾珠螺桿22以 平 。 1運U正轉及逆轉 在滾珠螺桿22,以螺合狀態安裝球螺帽24 24,係以不旋轉之狀態一體安裝於台 — 衣累中i Μ之正轉及逆轉，沿滾珠螺桿22移動滚珠螺桿 夕勒於兩方向。葬 台座1Θ，則沿各導執21滑動於x方向。 曰匕， 以 在台座19上，設置旋轉機構25，在該旋轉機 水平狀態設置旋轉台26,用以載置切斷對 基板5 0。旋轉機構2 5，能使旋轉台？ β 、 沿垂直方向之 、、 軸周圍旋轉，以對基準位置改為任意旋轉角度 旋轉旋轉台2 6 〇在旋轉台2 6上，如丨士 例如以吸附失頭固定母 15 1277612 玻璃基板50。 、 在旋轉台26上方，與旋轉台26離開適當之間隔，配 置支持台3卜該支持台3卜以水平狀態支撐於以垂直狀態 配置的光學保持具33之下端部。光學保持具33之上端部 ，安裝於設置在架台U上之安裝台32下面。在安裝台U 上’設置振盪雷射光束之雷射振盪器34，從雷射振盪器Μ 振盪之雷射光束，則照射於保持在光學保持具Μ内之光 學系統。 從雷射振盈器34振盛之雷射光束，熱能強度分布係正· 規分布’藉由設置於光學保持具33内之光學系統，改成 如圖1所不之橢圓形狀之雷射點LS1，並且，以使其長軸 方向平打於旋轉台26之移動方向的χ方向之方式，照射 於載置在旋轉台26上之母玻璃基板5〇。 、在支持σ 31，對光學保持具3 3離開適當之間隔，對 向載置於旋轉口 26上之母玻璃基板5〇，配置輔助冷卻嘴 41 ,亥輔助冷卻鳴4 j，係用以將冷卻水、水與壓縮空氣之 _ 作匕。/瓜體壓縮空氣、He氣體等之冷媒吹進於雷射點[si ( 藉由從光學保持纟33㈣之雷射光束形成於母玻璃基板） 之後方位置。 又在支持台31，對該輔助冷卻嘴41離開4mm以上 之間Pm ’配置主冷卻嘴37。該主冷卻嘴37，係用以將冷卻 水、水與壓、％空氣之混合流體、壓縮空氣、He氣體等之冷 媒吹進於被辅助冷郤嘴41冷卻之母玻璃基板之後方位置 k主々卻鳴37吹進於母玻璃基板5〇之冷媒的冷卻溫度 16 1277612 ，係比從辅助冷卻嘴41吹進於母破璃基板5()之冷媒的冷 卻溫度低。 又，在支持台31，對從光學保持具3 3照射之雷射點 LSI，在與主冷卻嘴37相反側，對向載置在旋轉台26上之 母玻璃基板50，設置刀輪35。刀輪35，係沿從光學保持 具33照射之雷射點LSI的長軸方向配置，在載置於旋轉台 26上之母玻璃基板50側緣部，形成沿該劃線預定線之方 向的切口（切痕）。The structure is formed by cooling the refrigerant in the vicinity of the region along the line pre-twisted line behind the region where the laser spot is heated, and forming a blind crack along a predetermined line along the surface of the brittle material substrate, comprising: 乂& 2 One less auxiliary cooling mechanism is to be closer to the region on the laser spot side formed by the laser beam irradiation mechanism than the region where the cooling mechanism is cooled, and is to be supplied with a refrigerant having a temperature higher than the refrigerant temperature of the cooling mechanism. [Embodiment] An embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a schematic plan view of a mother glass substrate, showing an embodiment of a scribing method for a brittle material substrate of the present invention. In the scribing method, when a plurality of glass substrates constituting an FPD such as a liquid crystal display panel are formed by dividing a mother glass substrate, a blind crack of a scribe line is formed on the mother glass substrate before the mother glass substrate is divided. As shown in Fig. 1, on the surface of the mother glass substrate 50, a laser beam LS1 is formed by irradiation of a laser beam along a predetermined line SL'. Further, a slit (cut 11 1277612 ) TR along a predetermined line along the scribe line is formed in advance on the side edge portion of the mother glass substrate 50 near the scribe start position of the scribe line predetermined line SL on the surface of the mother glass substrate 50. The laser "', έ LS1 is formed into an elliptical shape, and the surface of the mother glass substrate 5 is relatively moved in the direction indicated by the arrow A in a state where the long diameter is along the predetermined line of the scribe line. ^This day, formed in the mother The laser spot LS1 of the glass substrate 50 has a thermal energy intensity greater than that of the central portion. The laser spot LSI is formed by changing the laser beam having a thermal energy intensity to a Gaussian distribution to the long axis. The direction of each of the directions is formed by the distribution of the thermal energy of the maximum thermal energy intensity. Therefore, at each end portion of the long-axis direction on the predetermined line SL, the thermal energy intensity becomes maximum, and the thunder is sandwiched between the ends. The thermal energy intensity at the central portion of the spot LS1 is smaller than the thermal energy intensity at each end portion. The elliptical-shaped laser spot LSI moves along the scribe line pre-strip SL on the surface of the mother glass substrate 50, sequentially heating the scribe line. Sl. The laser spot LS is heated at a temperature lower than the softening point temperature of the mother glass substrate 5G, and is heated at a high speed while moving the mother glass substrate 50. Thereby, the laser spot LS1 is formed. The surface of the mother glass substrate 5 is not dissolved The main cooling point MCP is formed on the surface of the mother glass substrate 50 after the direction of the laser spot LS1. The main cooling point Mcp is blown into the cooling water, water and compressed air from the cooling nozzle on the surface of the mother glass substrate 50. The refrigerant such as the mixed fluid, the compressed air, the He gas, the I gas, or the c〇2 gas is cooled to form the surface of the mother glass substrate 50 so as to be in the same direction as the laser spot LSI of the mother glass substrate 5, and The speed of the moving speed of the laser spot LS1 is two, and the line is moved along the line of the mother glass substrate 5G. 12 1277612 Further, on the surface of the mother glass substrate 5, an auxiliary cooling point Acp is formed, which is located at the main cooling point MCP. Before the direction of the direction, it is close to the main cooling point Mcp, and along the scribe line SL. The auxiliary cooling point ACP is blown into the cooling water, the mixed fluid of water and compressed air, compressed air, "gas" from the cooling nozzle. The refrigerant such as t gas or C〇2 gas is on the surface of the mother glass substrate 5, and the temperature of the refrigerant on the surface of the mother glass substrate 50 is higher than the temperature of the refrigerant blown into the main cooling point MCP. cool down. The auxiliary cooling point ACP is also the same as the main cooling point MCP, in the same direction as the laser spot LSI of the mother glass substrate 5, and at the same speed as the moving speed of the laser spot LS1, along the mother glass substrate 5〇 The surface scribe line SL is moved on the surface of the mother glass substrate 50, and is sequentially heated along the scribe line SL by the laser LSI, and then cooled before the heating portion of the refrigerant which has formed the main cooling point Mcp is cooled. The refrigerant forming the auxiliary cooling point ACp is cooled by the cooling temperature of the main β point MCP south, and then cooled to a cooling temperature lower than the auxiliary cooling point ACP by the refrigerant forming the main cooling point MCP. The mother glass substrate 50 is heated by the laser beam LS1 to generate a compressive stress on the surface thereof, and thereafter, by the refrigerant forming the auxiliary cooling point Acp, once cooled, it is further cooled by the refrigerant forming the main cooling point Mcp. Thereby, along the predetermined line of the scribe line, a line of the blind crack BC deep in the vertical direction is formed. The reason for this is considered as follows: after the surface of the mother glass substrate 5 is heated by the laser spot LS1 to generate a compressive stress, the mother glass substrate 50 is cooled by the refrigerant forming the auxiliary cooling point to generate a tensile stress. Then, in the state in which the tensile stress is generated at 13 1277612, and further cooling by the refrigerant forming the main cooling point Mcp, the tensile stress is generated on the surface of the mother glass substrate 5, so that main cooling is formed. The tensile stress generated by the cooling of the MCP refrigerant is likely to act on the surface of the mother glass substrate 50, and the mother glass substrate 50 is formed with a blind crack Bc deep in the vertical direction. Moreover, in the laser scribing method of the prior art shown in FIG. 10, it is considered that the surface of the mother glass substrate 5 is heated by the laser beam LS, and then the refrigerant is blown to cool the surface of the mother glass substrate 50. Excessive thermal shock is created on the formation of blind cracks. However, in the scribing method of the present invention, it is also considered that by setting the auxiliary cooling point ACP between the main cooling point Mcp and the laser point LS1, the above-mentioned excess thermal shock is alleviated, and the thermal shock disappears. The energy is consumed by the force that causes the blind crack to elongate. After the blind cracks of the scribe lines are formed on the mother glass substrate 5, the mother glass substrate 50 is supplied to the lower dividing step, and on both sides of the blind cracks, a bending moment for causing the blind cracks to extend in the thickness direction of the mother glass substrate 50 is generated. In a manner, the mother glass substrate 50 is energized. Thereby, the mother glass substrate 5 is divided along the blind crack formed along the predetermined line SL. Fig. 2 is a schematic block diagram showing an embodiment of a scribing device for a brittle material substrate of the present invention. The scribing apparatus of the present invention is, for example, a device for dividing a mother glass substrate 50 into a scribe line of a plurality of glass substrates used in FpD. The scribing device, as shown in FIG. 2, has a sliding table 12' reciprocating in a horizontal direction (γ direction) on a horizontal gantry 11! 277612 The sliding table 12 is supported by one of the parallel sides in the γ direction. For the guides 14 and 15, the position, the wooden port 11 is applied with a horizontal state along the guides. A ball screw 13 parallel to each of the guide rollers 15 is provided at an intermediate portion of the guide rails 14 and 15 between the guides 14 and 15 to rotate the guide 14 and a further motor (not shown). Clear 13, can be turned forward and reversed, in the grandfather 戚 浓 浓 螺杆 螺杆 螺杆 转 转 转 转 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒The ball nut 16 is in a state of no rotation: 16 is a screw 12, and the ball is rotated in the forward direction by the ball screw 13 in both directions. Thereby, the ball nut 16 is integrally moved to slide in the γ direction along the guide rails 14 and 15. σ Then, on the slide table 12, the pedestal 19 is arranged in a horizontal state and arranged in parallel on the slide 12: 19, and each of the guide rails 21 slides along the rail/square which slides in the direction of sliding of the slide table 12. : To the configuration. Further, in the central portion between the respective guide rails 21, the ball screw 22 is placed in a respective order: the ball screw 22 is made flat. 1) U is rotated forward and reversed in the ball screw 22, and the ball nut 24 24 is mounted in a screwed state, and is integrally mounted on the table in a state of no rotation - the forward and reverse rotation of the garment is moved along the ball screw 22 The ball screw is in both directions. The burial pedestal is slid in the x direction along each guide 21. That is, a rotating mechanism 25 is provided on the pedestal 19, and a rotating table 26 is provided in a horizontal state of the rotating machine for placing the cutting target substrate 50. Rotating mechanism 2 5, can make the rotary table? β, in the vertical direction, around the axis, to change the reference position to any rotation angle Rotate the rotary table 2 6 〇 on the rotary table 26, such as a gentleman, for example, to absorb the lost head to fix the female 15 1277612 glass substrate 50. Above the rotary table 26, the support table 3 is disposed at an appropriate interval from the turntable 26, and the support table 3 is supported in a horizontal state on the lower end portion of the optical holder 33 disposed in a vertical state. The upper end of the optical holder 33 is mounted under the mounting table 32 provided on the gantry U. A laser oscillator 34 that oscillates a laser beam is disposed on the mounting table U, and the laser beam oscillated from the laser oscillator is irradiated to an optical system held in the optical holder. The laser beam oscillated from the laser oscillating device 34, the thermal energy intensity distribution is positively distributed, and the optical system disposed in the optical holder 33 is changed to an elliptical shaped laser spot as shown in FIG. LS1 is irradiated onto the mother glass substrate 5〇 placed on the turntable 26 so that the major axis direction thereof is flat in the χ direction of the moving direction of the turntable 26. When the σ 31 is supported, the optical holder 3 is separated from the optical spacers 3, and the mother glass substrate 5 is placed on the rotating glass 26, and the auxiliary cooling nozzle 41 is disposed. Cooling water, water and compressed air. The refrigerant such as compressed air and He gas is blown into the laser spot [si (after being formed on the mother glass substrate by the laser beam from the optical holding 纟33 (4)). Further, at the support table 31, the main cooling nozzle 37 is disposed between the auxiliary cooling nozzles 41 and Pm' between 4 mm or more. The main cooling nozzle 37 is for blowing a refrigerant such as cooling water, water and pressure, a mixture of air, compressed air, He gas, or the like into the mother glass substrate cooled by the auxiliary cooling nozzle 41. The cooling temperature of the refrigerant blown into the mother glass substrate 5 16 鸣 37 37 is lower than the cooling temperature of the refrigerant blown into the mother glass substrate 5 () from the auxiliary cooling nozzle 41. Further, the support table 31 is provided with a cutter wheel 35 on the mother glass substrate 50 placed on the turntable 26 on the side opposite to the main cooling nozzle 37 on the laser spot LSI irradiated from the optical holder 33. The cutter wheel 35 is disposed along the long axis direction of the laser spot LSI irradiated from the optical holder 33, and is formed on the side edge portion of the mother glass substrate 50 placed on the turntable 26 in the direction along the predetermined line of the scribe line. Incision (cut).
又，滑動台12及台座19之定位、旋轉機構25、雷射 振盪器3 4等’係以控制部（未圖示）控制。 以此種劃線裝置在母玻璃基板50|面形成盲裂痕時， 首先，要將母玻璃基板50之尺寸、劃線預定線之位置等 之資料輸入控制部。 然後，將母玻璃基板 • ^ ^ “ υ上丘以口及Further, the positioning of the slide table 12 and the pedestal 19, the rotation mechanism 25, the laser oscillator 34, and the like are controlled by a control unit (not shown). When such a scribing device forms a blind crack on the surface of the mother glass substrate 50|, first, the size of the mother glass substrate 50, the position of the predetermined line of the scribe line, and the like are input to the control unit. Then, the mother glass substrate • ^ ^
機構固定。形成此種狀態後，以CCD攝影機38及攝 設置於母玻璃基板5〇之對準標記。所攝影之對準標記 以顯示器28及29顯示，在影像處理裝置處理 50上之對準標記的位置資料。 土 旋轉台26對支持台31定位後，旋轉台 z b X 方—、晋 動，使母玻璃基板50側緣部之劃線預定綠 口丨 ,Κ 、尺對向於刀齡3 5 ;、、、、後，刀輪3 5下降，而在母玻璃基板^ 側緣部形成切口（切痕）TR。 -線預定線The organization is fixed. After this state is formed, the CCD camera 38 and the alignment marks provided on the mother glass substrate 5 are taken. The photographic alignment marks are displayed on the displays 28 and 29, and the position information of the alignment marks on the image processing apparatus 50 is processed. After the soil rotating table 26 is positioned on the support table 31, the rotating table zb X side is promoted, and the scribe line of the side edge portion of the mother glass substrate 50 is predetermined to be green, and the ruler is opposite to the blade age of 3 5; After that, the cutter wheel 35 is lowered, and a slit (cut) TR is formed on the side edge portion of the mother glass substrate. -Line booking line
此後，旋轉台26，邊沿劃線預定線滑動於X 從雷射振盪器34使雷射光束振盪，又， 方向，邊 攸補助冷卻嘴41 17 1277612 喷射冷卻水等之冷媒，並且從主冷卻嘴37將冷卻水等與 壓知S空氣一起喷射。 藉由從雷射振盪器34所振盪之雷射光束，在母玻璃基 板50上，沿母玻璃基板50之掃瞄方向，形成沿X轴方向 長之橢圓形狀之雷射點LSI。然後，在該雷射點LS1後方 ’從辅助冷卻嘴41將冷媒沿劃線預定線吹進而形成輔助 冷卻點ACP。進一步，在該輔助冷卻點ACP後方，從主冷 卻鳴3 7將冷媒沿劃線預定線SL吹進而形成主冷卻點Mcp 〇 . 藉此，如前述，藉由雷射點LSI之加熱，輔助冷卻點 ACP及主冷卻點MCP之冷卻所形成之應力梯度，則比未採 用輔助冷卻點ACP之習知時，能形成更深之垂直盲裂痕。 在母玻璃基板50形成盲裂痕後，母玻璃基板5〇，則 供應至下面之分割步驟，以沿盲裂痕之寬度方向作用彎曲 矩之方式，在母玻璃基板加力。藉此，母玻璃基板5〇，則 從設置於其側緣部之切口 TR沿盲裂痕分割。 又，在已往之實施形態的說明，係藉由從分別固定於 支持台31之主冷卻嘴37及輔助冷卻嘴41，將冷媒喷射於 劃線預定線SL上，來形成主冷卻點Mcp及輔助冷卻點 的構成，但是較佳者為構成：例如，具備使主冷卻嘴Μ 及輔助冷卻嘴41以單獨移動於χ方向及γ方向的機構，能 使在劃線預定線上自如地調整雷射點LS1與輔助冷卻點 ACP之間隔及辅助冷卻，點ACP貞纟冷卻點Mcp之間隔，或 能使輔助冷卻點ACP與主冷卻點Mcp之位置設定於從劃線 18 1277612 預定線上移離之位置。 又在本發明之實施形態，雖使用液晶顯示板之母玻 =基板作為脆性材料基板之一例來說明，但是本發明，亦 月匕適用於貼合玻璃基板、單板玻璃、半導體晶圓、陶究等 之劃線加工。 又，在上述之說明，雖對形成於母玻璃基板5〇之雷射 j LSI外周緣部的熱能強度，係比中央部之熱能強度大之 I4月幵y說月，但疋雷射點LS丨之熱能分布亦可高斯分布。 籲 〈實施例〉 其次，就使用該劃線裝置，以各種條件在玻璃基板形 成盲裂痕之實施例，加以說明。 〈實施例1> 將從200W之雷射振盪器34振盪之雷射光束，照射於 厚度3· Omm之鈉鈣玻璃基板來形成盲裂痕。形成於玻璃基 板之雷射點LSI，例如係長軸4· 〇_、短軸i · 5_之橢圓形 狀，分別形成主冷卻點MCP(藉由從主冷卻嘴37吹出之冷 鲁 媒形成）於從雷射點LSI之中心離開85mra之位置，辅助冷 卻點ACP於從主冷卻點MCP(藉由從輔助冷卻嘴ο吹出之 冷媒形成）向雷射點LSI離開l〇min之位置。 主冷卻嗔3 7使用喷嘴前端内徑〇 · 6mni ,輔助冷卻嘴41 使用喷嘴前端内徑0. 8 min。 從主冷卻嘴37將水與壓縮空氣之混合流體以〇 5MPa( 机畺· 1 〇L/miη)之壓力由高度5mm喷射於玻璃基板表面。 又’亦從輔助冷卻嘴41將壓縮空氣以〇· 2MPa(流量： 19 1277612 141/1^11)之壓力由高度1111111喷射於玻璃基板表面。再者， 將玻璃基板之移動速度從丨Q〇_/s至I80mm/S，每次各 1 Omm/s分成階段變化，在玻璃基板形成盲裂痕，測定其深 度δ。將其結果表示於圖3之圖表。又，為了比較，將不 以辅助冷卻嘴41形成輔助冷卻點ACP時之盲裂痕深度δ， 併列於圖3之圖表。 在此情形，以辅助冷卻嘴41形成辅助冷卻點ACP，與 不形成輔助冷卻點ACP時比較，盲裂痕深度δ則加深1 〇 %程 度0 〈實施例2> 玻璃基板係厚度1.1mm之鈉鈣玻璃基板，從主冷卻嘴 37將水與壓縮空氣之混合流體以〇.5Mpa(流量· 之壓力，亦從輔助冷卻嘴41將壓縮空氣以〇 2MPa(流量： 14L/miη)之壓力贺射，再者，將輔助冷卻嘴41對主冷卻嘴 37離開7mm之間隔配置。再者，將玻璃基板之移動速度從 100mm/s至400_/s，每次各2〇_/s分成階段變化，在玻 璃基板形成盲裂痕，測定其深度δ。將其結果表示於圖4 之圖表。又，為了比較，將不以輔助冷卻嘴41形成輔助 冷卻點ACP時之盲裂痕深度δ，併列於圖4之圖表。 又’其他實施條件則與實施例1相同。 在此h形，亦以輔助冷卻嘴4丨形成辅助冷卻點， 人不形成辅助冷部點ACp時比較，盲裂痕深度5則加深i⑽ 程度。 〈實施例3> 20 1277612 將使用輔助冷卻嘴41形成輔助冷卻點ACP之位置，對 使用主冷卻嘴37形成主冷卻點腳，在—〜15随間變化 ，將從輔助冷卻嘴41噴射冷媒時之壓力，變化成 流量 7L/min)、 0.2 MPa(流量 14L/min)及 〇 3 (流量 21L/min)，其他則與實施例1同樣之條件，來形成盲裂痕 ，測定其深度δ。將其結果表示於圖5之圖表。 在此情形，藉由以使輔助冷卻嘴41與主冷卻嘴37之 間之距離為lQmm附近之方式’形成輔助冷卻點Acp於玻璃 基板上，與不形成㈣冷卻點AGP時比較，盲裂痕深度§則 加深10%程度。 〈實施例4> 將使用輔助冷卻嘴41形成辅助冷卻點ACp之位置，對 使用主冷卻嘴37形成主冷卻點Mcp，在5mm〜9mm間變化 ，將從輔助冷卻嘴41噴射冷媒時之壓力，變化成0.1MPa( 流篁 7L/min)、0.2 MPa(流量 i4L/min)及 0.3 MPa(流量 21L/mln)，其他則與實施例2同樣之條件，來形成盲裂痕 ，測定其深度δ。將其結果表示於圖6之圖表。 在此情形’藉由以使輔助冷卻嘴41與主冷卻嘴37之 間之距離為7mm附近之方式，形成輔助冷卻點ACp於玻璃 基板上，與不形成輔助冷卻點ACP時比較，盲裂痕深度δ則 加深1 0%程度。 圖7係表示本發明之其他實施形態的示意俯視圖。藉 由k雷射振盪器34振盪之雷射光束，在母玻璃基板上 ’沿母玻璃基板50之掃瞄方向，形成沿X軸方向長之橢 21 Ϊ277612 圓形狀之雷射點LSI。然後，將冷媒從複數個之辅助冷卻 驚41沿劃線預韓吹進於該雷射點LS1後方，來形成複數 固輔助β卻點ACP。進_步，將冷媒從主冷卻嘴37沿劃線 預定線吹進於該複數個辅助冷卻點Acp後方，來形成主冷 卻點MCP。 7Thereafter, the rotary table 26 slides along the predetermined line of the scribe line to X to oscillate the laser beam from the laser oscillator 34, and in the direction of the side, the auxiliary cooling nozzle 41 17 1277612 injects cooling medium such as cooling water, and from the main cooling nozzle 37 The cooling water or the like is sprayed together with the pressure S air. A laser beam LSI having an elliptical shape elongated in the X-axis direction is formed on the mother glass substrate 50 in the scanning direction of the mother glass substrate 50 by the laser beam oscillated from the laser oscillator 34. Then, the refrigerant is blown from the auxiliary cooling nozzle 41 behind the laser beam LS1 along the predetermined line of the scribe line to form the auxiliary cooling point ACP. Further, after the auxiliary cooling point ACP, the refrigerant is blown along the predetermined line SL from the main cooling sound 37 to form the main cooling point Mcp. Thereby, as described above, the auxiliary cooling is performed by the heating of the laser spot LSI. The stress gradient formed by the cooling of the point ACP and the primary cooling point MCP can form a deeper vertical blind crack than the conventional ACP without the auxiliary cooling point. After the mother glass substrate 50 forms a blind crack, the mother glass substrate 5 is supplied to the lower dividing step to apply a bending moment in the width direction of the blind crack to force the mother glass substrate. Thereby, the mother glass substrate 5 is separated from the slit TR provided in the side edge portion thereof along the blind crack. Further, in the description of the conventional embodiment, the main cooling point Mcp and the auxiliary are formed by ejecting the refrigerant onto the scribe line predetermined line SL from the main cooling nozzle 37 and the auxiliary cooling nozzle 41 which are respectively fixed to the support table 31. The cooling point is configured to have a configuration in which the main cooling nozzle Μ and the auxiliary cooling nozzle 41 are separately moved in the χ direction and the γ direction, and the laser beam can be freely adjusted on the scribe line. The interval between LS1 and the auxiliary cooling point ACP and the auxiliary cooling, the interval between the point ACP and the cooling point Mcp, or the position of the auxiliary cooling point ACP and the main cooling point Mcp can be set to a position away from the predetermined line from the scribe line 18 1277612. Further, in the embodiment of the present invention, the mother glass = substrate of the liquid crystal display panel is used as an example of the brittle material substrate. However, the present invention is also applicable to a bonded glass substrate, a single glass, a semiconductor wafer, or a ceramic. Scrub processing. In addition, in the above description, the thermal energy intensity of the outer peripheral edge portion of the laser beam formed on the mother glass substrate 5 is higher than the thermal energy intensity of the central portion, but the laser light spot LS is said. The thermal energy distribution of 丨 can also be Gaussian. <Examples> Next, an embodiment in which a blind crack is formed on a glass substrate under various conditions using the scribing apparatus will be described. <Example 1> A laser beam oscillated from a 200 W laser oscillator 34 was irradiated onto a soda lime glass substrate having a thickness of 3 mm to form a blind crack. The laser spot LSI formed on the glass substrate is, for example, an elliptical shape having a major axis 4·〇_ and a short axis i·5_, and forms a main cooling point MCP (formed by a cold lubricant blown from the main cooling nozzle 37). At a position away from the center of the laser spot LSI by 85 mra, the auxiliary cooling point ACP is separated from the main cooling point MCP (formed by the refrigerant blown from the auxiliary cooling nozzle ο) to the position of the laser dot LSI by 10 min. 8分钟。 The main cooling 嗔 3 7 using the nozzle front end inner diameter 〇 · 6mni, the auxiliary cooling nozzle 41 using the nozzle front end inner diameter of 0. 8 min. The mixed fluid of water and compressed air from the main cooling nozzle 37 was sprayed on the surface of the glass substrate by a height of 5 mm at a pressure of MPa 5 MPa (machine 1 1 〇 L/miη). Further, compressed air was sprayed from the auxiliary cooling nozzle 41 to the surface of the glass substrate at a height of 1111111 at a pressure of MPa 2 MPa (flow rate: 19 1277612 141/1^11). Further, the moving speed of the glass substrate was changed from 丨Q 〇 _ / s to I 80 mm / S, and each time 1 Omm / s was changed in stages, a blind crack was formed on the glass substrate, and the depth δ was measured. The results are shown in the graph of Fig. 3. Further, for comparison, the blind crack depth δ when the auxiliary cooling nozzle 41 is not formed by the auxiliary cooling nozzle 41 will be listed in the graph of Fig. 3 . In this case, the auxiliary cooling nozzle 41 forms the auxiliary cooling point ACP, and the blind crack depth δ is deepened by 1% compared with the case where the auxiliary cooling point ACP is not formed. <Example 2> The glass substrate is a soda lime having a thickness of 1.1 mm. In the glass substrate, the mixed fluid of water and compressed air from the main cooling nozzle 37 is irradiated at a pressure of M5 MPa (flow rate, and compressed air from the auxiliary cooling nozzle 41 at a pressure of MPa2 MPa (flow rate: 14 L/miη)). Further, the auxiliary cooling nozzles 41 are disposed at intervals of 7 mm from the main cooling nozzles 37. Further, the moving speed of the glass substrate is changed from 100 mm/s to 400 mm/s, and each time 2 〇/s is divided into stages, The glass substrate is formed into a blind crack, and the depth δ is measured. The result is shown in the graph of Fig. 4. Further, for comparison, the blind crack depth δ when the auxiliary cooling nozzle 41 is not formed by the auxiliary cooling nozzle 41 will be listed in Fig. 4 Further, the other implementation conditions are the same as in the first embodiment. In this h-shape, the auxiliary cooling point is also formed by the auxiliary cooling nozzle 4, and the blind crack depth 5 is deepened by i(10) when the person does not form the auxiliary cold spot ACp. <Example 3> 20 127761 2 The auxiliary cooling nozzle 41 is used to form the position of the auxiliary cooling point ACP, and the main cooling nozzle 37 is used to form the main cooling point, and the pressure is changed from −5 to 15 when the refrigerant is injected from the auxiliary cooling nozzle 41 to the flow rate. 7 L/min), 0.2 MPa (flow rate: 14 L/min), and 〇3 (flow rate: 21 L/min) were subjected to the same conditions as in Example 1 to form a blind crack, and the depth δ was measured. The results are shown in the graph of Fig. 5. In this case, by forming the auxiliary cooling point Acp on the glass substrate in such a manner that the distance between the auxiliary cooling nozzle 41 and the main cooling nozzle 37 is around 1Qmm, the blind crack depth is compared with when the (four) cooling point AGP is not formed. § is 10% deeper. <Example 4> The position at which the auxiliary cooling nozzle 41 is used to form the auxiliary cooling point ACp is used to form the main cooling point Mcp using the main cooling nozzle 37, and the pressure is changed from 5 mm to 9 mm, and the pressure is injected from the auxiliary cooling nozzle 41. The change was 0.1 MPa (flowing 7 L/min), 0.2 MPa (flow rate i4 L/min), and 0.3 MPa (flow rate 21 L/mln). Otherwise, blind cracks were formed under the same conditions as in Example 2, and the depth δ was measured. The results are shown in the graph of Fig. 6. In this case, the auxiliary cooling point ACp is formed on the glass substrate in such a manner that the distance between the auxiliary cooling nozzle 41 and the main cooling nozzle 37 is about 7 mm, and the blind crack depth is compared with when the auxiliary cooling point ACP is not formed. δ is deepened by 10%. Fig. 7 is a schematic plan view showing another embodiment of the present invention. The laser beam oscillated by the k laser oscillator 34 forms a laser dot LSI having an elliptical shape of 21 Ϊ 277 612 in the X-axis direction along the scanning direction of the mother glass substrate 50 on the mother glass substrate. Then, the refrigerant is blown from the plurality of auxiliary cooling fins 41 along the scribe line to the rear of the laser spot LS1 to form a complex solid auxiliary β point ACP. In the step of stepping, the refrigerant is blown from the main cooling nozzle 37 along the predetermined line of the scribe line behind the plurality of auxiliary cooling points Acp to form the main cooling point MCP. 7
母玻璃基板50表面，沿劃線預定線SL以雷射點 依序加熱後，以主冷卻點Mcp冷卻其加熱部分之前，依序 ，藉由複數個輔助冷卻.點ACP，以比形成主冷卻點之 冷媒溫度為高的溫度冷卻，此後，藉由形成主冷卻點MCP 之冷媒’以比形成輔助冷卻•點Acp之冷媒溫度低的溫度冷 卻。 β母玻璃基板50,以雷射點LS1加熱，則在其表面產生 壓縮應力，然後，以複數個辅助冷卻點ACp _旦冷卻後， 進一步以主冷卻點MCP冷卻。藉此，沿劃線預二：成垂 直方向深之盲裂痕線。 又，在圖8所示之習知技術的劃線方法，因以雷射點 LS加熱母玻璃基板5〇表面後，吹進冷媒來冷卻母玻璃基 板50表面，故被認為在形成盲裂痕上產生多餘之執衝^ -一…，W Υ唧點ACp從主 卻點MCP沿雷射點LSI側設置，使上述多終> # y 、 4 7倚、之熱衝擊餐 ’使被熱衝擊消失之能量消耗於使盲裂痕伸長之力旦 由將輔助冷卻點ACP設置複數個，依序冷卻母玻璃 能使多餘之熱衝擊的產生為零’比輔助冷卻點僅為1 1277612 能形成更殊之盲裂痕（垂直裂痕）。 形成主冷卻點與輔助冷卻點於玻璃基板之冷媒，因與 形成前述1個辅助冷卻點於母玻璃基板之情形相同，故在 此不詳述。 又，劃線裝置之構成，較佳者為構成··例如，具備使 主冷卻嘴37及複數個輔助冷卻嘴41以單獨移動於X方向 及Y方向的機構，能在劃線預定線上自如地調整雷射點 LSI與最位於雷射點側之輔助冷卻點Acp之間隔，最位於 主冷卻點MCP側之辅助冷卻點Acp與主冷卻點_之間隔 ，及複數個辅助冷卻點ACP彼此之間隔，再者，能使複= 個輔助冷卻點ACP與主冷卻點，之位置設定於從劃線預 定線上移離之位置。 如此 糟由將至少一個辅助冷卻點設置於母玻璃基相 上之雷射點與主冷卻點之間來達成本發明。The surface of the mother glass substrate 50 is sequentially heated by the laser beam at a predetermined line SL, and then cooled by the main cooling point Mcp, in sequence, by a plurality of auxiliary cooling points ACP, to form a main cooling The temperature of the refrigerant at the point is high temperature cooling, and thereafter, the refrigerant 'forming the main cooling point MCP is cooled at a temperature lower than the temperature of the refrigerant forming the auxiliary cooling point Acp. When the β mother glass substrate 50 is heated by the laser spot LS1, compressive stress is generated on the surface thereof, and then cooled by a plurality of auxiliary cooling points ACp_, and further cooled by the main cooling point MCP. In this way, the second line is drawn along the scribe line: a blind crack line that is deep in the vertical direction. Further, in the conventional scribing method shown in Fig. 8, since the surface of the mother glass substrate 5 is heated by the laser spot LS, the refrigerant is blown to cool the surface of the mother glass substrate 50, so that it is considered to form a blind crack. Excessive impulses are generated ^ - a ..., W Υ唧 point ACp is set from the main point MCP along the laser point LSI side, so that the above-mentioned multi-end ># y, 4 7 lean, the thermal shock meal 'make a thermal shock The energy of disappearance is consumed by the force that causes the blind crack to elongate. The auxiliary cooling point ACP is set to a plurality of times, and the cooling of the mother glass in sequence can make the generation of excess thermal shock zero. The ratio of the auxiliary cooling point is only 1 1277612. Blind cracks (vertical cracks). The refrigerant which forms the primary cooling point and the auxiliary cooling point on the glass substrate is the same as the case where the above-described one auxiliary cooling point is formed on the mother glass substrate, and therefore will not be described in detail. Further, the configuration of the scribing device is preferably a configuration including, for example, a mechanism for moving the main cooling nozzle 37 and the plurality of auxiliary cooling nozzles 41 in the X direction and the Y direction, and is freely slidable on a predetermined line Adjusting the interval between the laser spot LSI and the auxiliary cooling point Acp which is located most at the laser spot side, the interval between the auxiliary cooling point Acp at the main cooling point MCP side and the main cooling point _, and the plurality of auxiliary cooling points ACP are spaced apart from each other Furthermore, the position of the auxiliary cooling point ACP and the main cooling point can be set to a position away from the predetermined line of the scribe line. The invention is achieved by placing at least one auxiliary cooling point between the laser spot on the mother glass base phase and the primary cooling point.
本發明之脆性材料基板之劃線方法及裝置，如上述， 因在形成於母玻璃基板等之脆性材料基板表面之雷射點與 主冷部點間，且在接近主冷卻點之位置，形成輔助冷卻點 ，故2成深盲裂痕’因此能有效率地形成劃線。 【圖式簡單說明】 )圖式部分 圖 視圖 係表示本發明之劃線方法之實施狀態的示意4 圖2,係表示本發明之劃線裝置之實施狀態之一例的 前視圖。 23 !277612 圖3，係表示在實施例1形成盲裂痕之結果的圖表。 圖4,係表示在實施例2形成盲裂痕之結果的圖表。 圖5,係表示在實施例3形成盲裂痕之結果的圖表。 圖6，係表示在實施例4形成盲裂痕之結果的圖表。 圖7，係表示本發明之其他實施狀態的示意俯視圖。 圖8，係用以說明使用雷射光束之習知雷射劃線裝置 之動作的示意圖。The method and apparatus for scribing the brittle material substrate of the present invention are formed as described above between the laser spot formed on the surface of the brittle material substrate such as the mother glass substrate and the main cold portion, and at a position close to the main cooling point. Auxiliary cooling point, so 2% deep blind cracks' can therefore form a scribe line efficiently. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2 is a front view showing an embodiment of a scribing method of the present invention. 23!277612 Fig. 3 is a graph showing the result of forming a blind crack in Example 1. Fig. 4 is a graph showing the result of forming a blind crack in Example 2. Fig. 5 is a graph showing the result of forming a blind crack in Example 3. Fig. 6 is a graph showing the result of forming a blind crack in Example 4. Fig. 7 is a schematic plan view showing another embodiment of the present invention. Figure 8 is a schematic view for explaining the action of a conventional laser scribing device using a laser beam.
圖9，係表示以該雷射劃線裝置劃線所形成之母玻璃 基板上之盲裂痕狀態的示意立體圖。 圖10,係表示以該雷射劃線農置劃線之母坡填基板上 之物理變化狀態的示意俯視圖。 土 滑動台 台座 旋轉機構 旋轉台 光學保持具 雷射振盪裝置 主冷卻嘴 輔助冷卻嘴Fig. 9 is a schematic perspective view showing a state of blind cracks on a mother glass substrate formed by scribing the laser scribing device. Fig. 10 is a schematic plan view showing a state of physical change on a substrate on a mother slope of the laser scribing line. Soil sliding table pedestal rotating mechanism rotary table optical holder laser oscillating device main cooling nozzle auxiliary cooling nozzle
(一）元件代表符號 12 19 25 26 33 34 37 41 24(1) Component symbol 12 19 25 26 33 34 37 41 24