CN102643017B - Non-contact type breaking method and equipment and method and equipment for cutting and breaking - Google Patents
Non-contact type breaking method and equipment and method and equipment for cutting and breaking Download PDFInfo
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- CN102643017B CN102643017B CN201110061013.6A CN201110061013A CN102643017B CN 102643017 B CN102643017 B CN 102643017B CN 201110061013 A CN201110061013 A CN 201110061013A CN 102643017 B CN102643017 B CN 102643017B
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Abstract
The invention discloses a non-contact type breaking method and equipment and a method and equipment for cutting and breaking. First temperature gas is sprayed along a cutting line formed by cutting by using a first spray nozzle; and second temperature gas is sprayed along the cutting line by using a second spray nozzle, wherein the first temperature is higher than the second temperature. Steam in a SteamBreak process is replaced by using gas spraying, and thus the problems of water stain residue and glass scraps in the SteamBreak process are solved; meanwhile, the first temperature gas with higher temperature is sprayed by the first spray nozzle, so that surface volume of a glass material of an array substrate quickly extends, vertical cracks are pressed to expand and further the array substrate is cracked; and then the second temperature gas with lower temperature is sprayed in a short time through the second spray nozzle, so that the array substrate quickly shrinks and further the straightness of the vertical cracks is enhanced. The problem that the straightness of the vertical cracks is poorer due to the fact that quick chilling shrink cannot be realized in a traditional Heat Break process is solved.
Description
Technical field
The present invention relates to the cutting technique of display panels, relate in particular to a kind of method, equipment of contactless sliver, and method, the equipment of a kind of cutting and sliver.
Background technology
Flat-panel monitor (Flat Panel Display, FPD) is compared with traditional cathode tube (CRT) indicating meter, have thin, light, power consumption is little, radiation is low, not flicker, to advantages such as HUMAN HEALTH infringement are little, become the indicating meter of main flow.Flat-panel monitor comprises the broad varietys such as liquid-crystal display (LCD), plasma display (PDP) and light emitting diode indicator (LED).
One of critical process of manufacturing flat-panel monitor is exactly the sliver technique after face glass cutting and cutting.Take LCD display as example, and the widely used face glass cutting technique of industry is diamond wheel (Diamond wheel) cutting at present, and Diamond wheel comprises standard (Normal) type and high infiltration (Penett) type.After the array substrate of glass material being cut by Diamond wheel cutting technique, on the surface of array substrate, deep slotting be will form one, transverse crack and vertical crack produced.
As shown in Figure 1, for take the sectional schematic diagram that line of cut is section after Diamond wheel cutting, as can be seen from Figure 1, utilize cutting wheel to complete after cutting scribing operation on array substrate surface, under line of cut, formed the vertical crack perpendicular to array substrate surface, vertical crack is divided into three regions from top to bottom, comprises the rib shape region of fracture (Median Crack), the post-rift extension fracture of rib shape region (the Median Crack Extension) that in the rear burst region (Damage Zone) directly forming of cutting, cutting process, form under pressure.As shown in Figure 2, for the front view after Diamond wheel cutting, as can be seen from Figure 2 after cutting, vertical crack is divided into the trizonal degree of depth from top to bottom, when cutting operation completes, vertical crack does not run through whole array substrate, and array substrate does not also split completely.
After pair array substrate cut, will carry out sliver technique, and utilize sliver moment to make the vertical crack forming when cutting longitudinally run through whole array substrate, array substrate is split, reach the object that makes glass separation.Sliver technique mainly contains contact sliver and contactless sliver, and conventional contactless sliver technique has following two kinds at present:
The contactless sliver technique of the first is steam sliver (Steam Break) technique, first adopt water-vapour spray that temperature and pressure is higher on the surface at the line of cut place of array substrate, the glass material surface volume of array substrate is expanded rapidly, the vertical crack pressurized expansion that cutting forms, vertical crack runs through whole array substrate, finally makes array substrate split.The High Efficiency Thermal conductivity of Steam Break technology utilization water, make vertical crack pressurized obvious, and after water-vapour spray, evaporation of water is taken away surperficial heat, accelerating glass surface temperature declines, process of expansion and contraction in this short period of time can be strengthened the craspedodrome of vertical crack, makes the surface of fracture of array substrate as far as possible vertical.
In Steam Break technique, the doping of spraying the water in vapor of use is difficult to control, if the doping of water is very few, easily makes sliver operation insufficient, and array substrate is difficult for splitting completely; If the doping of water is too much, can make glass surface have water stain residual; In addition, after moisture evaporation, the glass chip producing in cutting process can be attached to glass surface, be difficult to be removed, thereby affect the follow-up technological effects such as polarizer sheet sticking, and these glass chip can easily be attached near miscellaneous equipment array substrate, cause device interior to pollute, the wearing and tearing of the parts that drive up.
The contactless sliver technique of the second is heating sliver (Heat Break) technique, is the improvement project to Steam Break technique.The surface at the line of cut place of Heat Break process using High Temperature High Pressure air spray array substrate, expands rapidly glass surface volume, the vertical crack pressurized expansion that cutting forms, and then array substrate is split.Heat Break technique is due to the water that do not adulterate, therefore overcome the problem of water stain residual and glassivation chip, but warm air is blown over behind line of cut peripheral region, owing to there is no moisture evaporation, do not take away the effect of amount of heat, can not fast reducing in the temperature on room temperature environment lower-glass surface, process of expansion and contraction is slow, makes the craspedodrome of vertical crack poor, sliver poor effect.
In sum, in sliver technique after array substrate cutting, water-vapour spray due to Steam Break technique use high temperature, high pressure, there is water stain residual and problem that glass chip is adhered to, Heat Break technique exists again process of expansion and contraction slow, make the poor problem of craspedodrome of vertical crack, therefore, need to find at present a kind of sliver mode that can simultaneously overcome the problems referred to above.
Summary of the invention
The embodiment of the present invention provides method, the equipment of a kind of contactless splinter method, equipment and cutting and sliver, in order to solve, has water stain residual and glass chip is adhered to or the craspedodrome of vertical crack is poor problem in prior art.
A contactless breaking device, comprising:
For the line of cut forming at upper surface after cut along array substrate, spray the first nozzle of the first temperature gas, and
For after the setting duration of first nozzle ejection the first temperature gas, along described line of cut, spray the second nozzle of the second temperature gas;
With described the first nozzle and second nozzle is connected respectively, for regulating the web member of distance between the pneumatic outlet of described the first nozzle and the pneumatic outlet of second nozzle;
Described web member, also for controlling the first nozzle ejection, go out that the first temperature gas projects to direction on line of cut and to spray direction of travel identical, and controlling second nozzle, to eject the direction that the second temperature gas projects on line of cut contrary with injection direction of travel;
Wherein, the first temperature is higher than the second temperature.
A method for contactless sliver, described method comprises:
Control the line of cut that the first nozzle forms at upper surface after cut along array substrate and spray the first temperature gas, the direction that the first temperature gas is projected on line of cut is identical with injection direction of travel;
After the setting duration of first nozzle ejection the first temperature gas, to control second nozzle and spray the second temperature gas along described line of cut, the direction that the second temperature gas is projected on line of cut is contrary with injection direction of travel.
An equipment for glass cutting and sliver, comprising:
For cutting the cutting wheel of array substrate;
Line of cut in upper surface formation after cutting along array substrate sprays the first nozzle of the first temperature gas; And
After the setting duration of first nozzle ejection the first temperature gas, along described line of cut, spray the second nozzle of the second temperature gas;
With described the first nozzle and second nozzle is connected respectively, for regulating the web member of distance between the pneumatic outlet of described the first nozzle and the pneumatic outlet of second nozzle;
Described web member, also for controlling the first nozzle ejection, go out that the first temperature gas projects to direction on line of cut and to spray direction of travel identical, and controlling second nozzle, to eject the direction that the second temperature gas projects on line of cut contrary with injection direction of travel;
The first temperature is higher than the second temperature.
A method for glass cutting and sliver, described method comprises:
Control described cutting wheel cutting array substrate; And
Control the line of cut that the first nozzle in described contactless breaking device forms at upper surface after cut along array substrate and spray the first temperature gas, the direction that the first temperature gas is projected on line of cut is identical with injection direction of travel;
After the setting duration of first nozzle ejection the first temperature gas, the second nozzle of controlling in described contactless breaking device sprays the second temperature gas along described line of cut, and the direction that the second temperature gas is projected on line of cut is contrary with injection direction of travel.
Beneficial effect of the present invention is as follows:
The embodiment of the present invention use the first nozzle along cutting after line of cut spray the first temperature gas, re-use subsequently second nozzle and spray the second temperature gas along line of cut, wherein, the first temperature is higher than the second temperature, owing to using gas injection to replace the water-vapour spray in existing Steam Break technique, overcome and in Steam Break technique, had water stain residual and problem that glass chip is adhered to; Simultaneously, after the first higher temperature gas of the first nozzle ejection temperature, can make the glass material surface volume of array substrate expand rapidly, the vertical crack pressurized expansion that cutting process forms, and then array substrate is split, subsequently at short notice by the second lower temperature gas of second nozzle injection temperature, make the rapid shrinkage of array substrate, this process of expanding with heat and contract with cold fast can be strengthened the craspedodrome of vertical crack again, has overcome in existing Heat Break technique because shrinkage fast causes the poor problem of craspedodrome of vertical crack.
Accompanying drawing explanation
Fig. 1 be take the sectional schematic diagram that line of cut is section after Diamond wheel cutting in prior art;
Fig. 2 is the front view after Diamond wheel cutting in prior art;
Fig. 3 is contactless breaking device schematic diagram in the embodiment of the present invention one;
Fig. 4 is cutting and the device structure schematic diagram of sliver in the embodiment of the present invention one;
Fig. 5 (a), Fig. 5 (b) and Fig. 5 (c) they are the stereographic map of sliver process in the embodiment of the present invention two, along sectional view and the vertical view of line of cut;
Fig. 6 is when in the embodiment of the present invention two, the double-deck array substrate after laminating carries out sliver respectively, the schematic diagram that the line of cut of take is section;
Fig. 7 is when in the embodiment of the present invention two, cutting and sliver operate, the schematic diagram that the line of cut of take is section.
Embodiment
In order to realize the object of the embodiment of the present invention, the embodiment of the present invention proposes a kind of new contactless sliver technique after glass cutting, use the first nozzle along cutting after line of cut spray the first temperature gas, re-use subsequently second nozzle and spray the second temperature gas along line of cut, wherein, the first temperature is higher than the second temperature, owing to using gas injection to replace the water-vapour spray in existing Steam Break technique, overcome and in Steam Break technique, had water stain residual and problem that glass chip is adhered to; Simultaneously, after the first higher temperature gas of the first nozzle ejection temperature, can make the glass material surface volume of array substrate expand rapidly, the vertical crack pressurized expansion that cutting process forms, and then array substrate is split, subsequently at short notice by the second lower temperature gas of second nozzle injection temperature, make the rapid shrinkage of array substrate, this process of expanding with heat and contract with cold fast can be strengthened the craspedodrome of vertical crack again, has overcome in existing Heat Break technique because shrinkage fast causes the poor problem of craspedodrome of vertical crack.
Below in conjunction with Figure of description, the embodiment of the present invention is described in detail.The sliver operation relating in various embodiments of the present invention is carried out preferably cut (as Diamond wheel cutting) at the array substrate of glass material after.
Embodiment mono-
As shown in Figure 3, be contactless breaking device schematic diagram in the embodiment of the present invention one, described contactless breaking device comprises the first nozzle 11 and the second nozzle 12 that sprays the second temperature gas that sprays the first temperature gas.The first temperature gas that the first nozzle 11 ejects is the gas of High Temperature High Pressure, reaches the glass material surface volume of array substrate is expanded, the vertical crack pressurized expansion that cutting process forms, and then the object that array substrate is split; The second temperature gas that second nozzle 12 ejects is low temperature high pressure gas, the object that the craspedodrome of vertical crack is improved to reach array substrate expanding with heat and contract with cold in the short period of time of surface.
When the rear line of cut jet flow stream forming is cut along array substrate in the first nozzle 11 and second nozzle 12 edges, the first nozzle 11 is prior to second nozzle 12 jet flow stream, but the first nozzle 11 should be set in a rational duration prior to the duration of second nozzle 12 jet flow stream, if second nozzle 12 just sprays low temperature high pressure gas after waiting for the long time after the first nozzle 11 injection high temperature and high pressure gas, do not reach the object of expanding with heat and contract with cold in the short period of time; If second nozzle 12 just sprays low temperature high pressure gas after waiting for the too short time after the first nozzle 11 injection high temperature and high pressure gas, because two nozzle distances are nearer, the high temperature and high pressure gas and the low temperature high pressure gas that spray easily influence each other, for example: low temperature high pressure gas is ejected into behind array substrate surface, cryogenic gas is refracted in the scope of high temperature and high pressure gas injection, can affect the temperature that high temperature and high pressure gas arrives array substrate surface.
For this reason, contactless breaking device design in the embodiment of the present invention one web member 13 structures as shown in Figure 3, utilize web member 13 that the top of two nozzles is linked together, the corner dimension of being controlled between two nozzles by web member 13, and then the distance between the pneumatic outlet of two nozzles of control.
Angle between two nozzles that web member 13 is controlled is designed to the opposite direction angle form shown in Fig. 3, be that web member 13 is controlled the first nozzles 11 to eject the direction projection of the first temperature gas identical with the direction of spraying along line of cut to the direction on line of cut, control direction projection that second nozzle 12 ejects the second temperature gas to the direction on line of cut and the opposite direction spraying along line of cut.
In addition, web member 13 can also be controlled two nozzles along the speed of line of cut movable spray, for example, can drive web member 13 to move along line of cut by certain speed by exterior mechanical transmission apparatus, and then drive two nozzles to move along line of cut with identical travelling speed.
Design pressure by-pass valve control can also be distinguished in top at each nozzle, and the air pressure that is respectively used to gas that the first nozzle 11 and second nozzle 12 are ejected regulates.
The shape of the pneumatic outlet of the first nozzle 11 and second nozzle 12 can be identical, for example, be respectively along major axis and short axisymmetric shape.As the pneumatic outlet of the pneumatic outlet of rectangle or round rectangle, the shape of these two kinds of pneumatic outlets is all respectively along major axis and short axisymmetric shape.
When using two nozzles along line of cut jet flow stream, the major axis of pneumatic outlet is parallel with line of cut, and minor axis is vertical with line of cut.The pneumatic outlet of the first nozzle 11 of take is example, when the A point on line of cut sprays high temperature and high pressure gas, when the long axis direction of pneumatic outlet has just arrived A point, A point place starts to preheat, when the pneumatic outlet of the first nozzle 11 is pressed certain inswept A point of speed, the temperature at A point place raises gradually, and owing to being along the inswept A point of long axis direction, therefore, it is longer that A point is accepted gas time of High Temperature High Pressure, the glass material surface volume at A point place is fully expanded, and sliver effect is better.Similarly, it is parallel with line of cut that the pneumatic outlet of second nozzle 12 is also designed to major axis, and minor axis is vertical with line of cut, can make the temperature at A point place continue to reduce, until be reduced to optimum state, makes the craspedodrome of vertical crack better.
The size of pneumatic outlet can be according to the thickness of array substrate, material and break bar specification (the break bar specification difference that forms line of cut, vertical crack form after cutting is different) set, as: the length that can design major axis is 6mm～10mm, and the length of minor axis is 1mm～3mm.
Because sliver process is carried out after cutting process, therefore, the embodiment of the present invention can also combine the equipment of cutting and sliver process, the equipment that forms glass cutting and sliver, as shown in Figure 4, links together the cutting wheel using in contactless breaking device and cutting process 14, because cutting process is prior to contactless sliver process, therefore,, in the direction along cutting and sliver, the position of cutting wheel 14 is before contactless breaking device.
Embodiment bis-
The present embodiment two of the present invention also provides a kind of method that in embodiment of utilization mono-, contactless breaking device carries out sliver operation, and the equipment of the contactless device in embodiment mono-and glass cutting and sliver can reach good cutting, sliver technological effect by Industry Control.
Due in sliver process, the thickness of glass of array substrate is different, and the parameter of using during sliver is also different, and the present embodiment two be take array substrate thickness as 0.5mm～1.1mm is example, and the sliver process of the present embodiment is described.
As shown in Fig. 5 (a), Fig. 5 (b) and Fig. 5 (c), be respectively the stereographic map of sliver process in the present embodiment, along the sectional view of line of cut direction and there is no the vertical view in web member 13 situations, specifically comprise the following steps:
Step 1: the first nozzle 11 of controlling injection the first temperature gas sprays the first temperature gas along the rear line of cut forming 22 of array substrate 21 cutting.
Before carrying out contactless sliver operation, pair array substrate 21 carried out cutting operation, at a line of cut 22 of upper surface formation of array substrate 21.
Step 2: the second nozzle 12 of controlling injection the second temperature gas sprays the second temperature gas along the rear line of cut forming 22 of array substrate 21 cutting.
What the first nozzle 11 ejected is high temperature and high pressure gas, and what second nozzle 12 ejected is low temperature high pressure gas.For the ease of realizing, the first temperature gas that the first nozzle 11 ejects is air, the second temperature gas that second nozzle 12 ejects can be also air, more preferably, because nitrogen has low-boiling characteristic, therefore, the gas that in the embodiment of the present invention, second nozzle 12 sprays can be also nitrogen, utilize liquid nitrogen to be converted to the low-boiling characteristic of gaseous state, eject the gaseous nitrogen of low temperature.
Because pneumatic outlet and array substrate 21 upper surfaces of two nozzles have certain distance, as at a distance of 50mm, therefore, the high temperature and high pressure gas that the first nozzle 11 ejects temperature when arriving array substrate 21 upper surface declines to some extent, the low temperature high pressure gas that second nozzle 12 ejects temperature when arriving array substrate 21 upper surface rises to some extent, in order to make the first temperature gas arrive the temperature on array substrate surface and the difference of the temperature that the second temperature gas arrives array substrate surface large (as the temperature difference is not less than 50 ℃), therefore, the difference of the gas temperature that other temperature that the first nozzle 11 ejects and second nozzle 12 eject is greater, the first temperature that ejects gas as the first nozzle 11 is 150 ℃～180 ℃ (temperature that arrives array substrate surface is roughly 60 ℃～70 ℃), the second temperature that second nozzle 12 ejects gas is 0 ℃～5 ℃ (arriving the temperature on array substrate surface lower than 10 ℃).
The air pressure that the first nozzle 11 sprays the first temperature gas and second nozzle 12 sprays the second temperature gas can be 0.2MPa～0.3MPa.
If the first nozzle 11 and second nozzle spray along line of cut with identical speed, step 1 can be from the setting duration T prior to step 2.
In the scheme of the present embodiment, set the size of duration T and the temperature difference of two nozzle ejection gases arrival array substrate upper surfaces, the speed V that the distance L between the pneumatic outlet of two nozzles and two nozzles spray along line of cut is relevant.
Set duration T and be the ratio of distance L between the pneumatic outlet of the first nozzle and the pneumatic outlet of second nozzle and the speed V spraying along line of cut, if L value is larger, represent two pneumatic outlets relatively far apart, for the effect that guarantees to expand with heat and contract with cold fast in array substrate surface, need to improve nozzle along the travelling speed of line of cut.And the first temperature gas arrives the temperature of line of cut and the difference of the temperature that the second temperature gas arrives line of cut is larger, even if the distance between the pneumatic outlet of the first nozzle 11 and the pneumatic outlet of second nozzle 12 is larger, also can meet the status requirements of expanding with heat and contract with cold.Or the first temperature gas arrives the temperature of line of cut and the difference of the temperature that the second temperature gas arrives line of cut is larger, even if two nozzles are slightly slow along the travelling speed of line of cut, also can meet the status requirements of expanding with heat and contract with cold.Therefore, the first temperature gas arrives the temperature of array substrate upper surface and the difference of the temperature that the second temperature gas arrives array substrate upper surface is larger, and the setting of described setting duration is slightly long also passable.
For example, distance between the pneumatic outlet of the pneumatic outlet of the first nozzle 11 and second nozzle 12 is 20mm～50mm, the distance of the pneumatic outlet of the pneumatic outlet of the first nozzle 11 and second nozzle 12 and array substrate upper surface is all 50mm, and the first nozzle 11 and second nozzle 12 are 50mm/s～100mm/s along the travelling speed along line of cut.
It should be noted that, utilize the contactless breaking device of the embodiment of the present invention one to carry out after the described sliver operation of the embodiment of the present invention two, different according to the treating processes after array substrate sliver, the sliver degree of pair array substrate requires also incomplete same.For example, for the less array substrate of size, after sliver, directly by people's hand-sorted, can utilize the scheme of the embodiment of the present invention extension fracture region to be extended to the lower surface of array substrate, array substrate is divided completely; For larger-size array substrate, conventionally need to after sliver, use travelling belt to be transferred to mechanical manipulator and pick unit, in this case, require can not divide completely through the array substrate of sliver technique, otherwise, the array substrate surface of fracture phase mutual friction having split off in transmitting procedure, affects surface of fracture quality.Therefore, can will after sliver technique, need the array substrate of travelling belt transmission not exclusively to split, it is more deep with respect to the state after cutting that an extension fracture region makes it.
The scheme of the embodiment of the present invention two be take array substrate thickness and is described as 0.5mm～1.1mm as example, and in actual process process, according to the difference of array substrate thickness and array substrate material, parameters also can be different.
The embodiment of the present invention two take one deck array substrate as example illustrates contactless sliver process, double-deck array substrate after the embodiment of the present invention is also not limited to utilize similar sliver process to laminating carries out sliver operation, as shown in Figure 6, while carrying out sliver respectively for the double-deck array substrate to after laminating, the schematic diagram that the line of cut of take is section.Double-deck array substrate can be regarded as two monolayer array substrates and carries out respectively the process of sliver.
In addition, as shown in Figure 7, be to use the equipment of glass cutting that in embodiment mono-, Fig. 4 records and sliver cut and when sliver operates, the schematic diagram that the line of cut of take is section.
Cutting wheel 14 is along before being positioned at the first nozzle 11 in cut direction, and before the first nozzle 11 is positioned at second nozzle 12, in cutting, sliver process, when first web member 13 is subject to exterior mechanical transmission apparatus to drive by certain speed and direction motion, drive cutting wheel 14 by identical speed cutting array substrate, at the upper surface formation line of cut of array substrate; At cutting wheel 14, start to cut after for some time of array substrate, the first nozzle motion that web member 13 drives reaches line of cut, and the line of cut forming along cutting wheel 14 cuttings sprays high temperature and high pressure gas; At short notice, the second nozzle of drive also reaches the line of cut that cutting forms, and by second nozzle, to line of cut, sprays low temperature high pressure gas.Now, cutting, sliver operate on array base station and carry out simultaneously, have effectively improved cutting, sliver efficiency.
The equipment providing by the embodiment of the present invention and method, the high temperature and high pressure gas and the low temperature high pressure gas that utilize the first nozzle and second nozzle to spray respectively along the line of cut of array substrate, part, line of cut peripheral region is first heated, then cooling rapidly, form expanding with heat and contract with cold in the short period of time, the vertical crack perpendicular to array substrate upper surface that cutting is formed can access in the situation of abundant extension, improves the craspedodrome of vertical crack.The unfavorable condition that the scheme of the embodiment of the present invention can effectively reduce sliver process occurs, and can not pollute liquid crystal panel surface; And the structure of the embodiment of the present invention is also fairly simple, reduced the difficulty of maintenance of the equipment operation, and the parameter regulation of equipment is convenient, consumes energy lower.
Although described the application's preferred embodiment, once those skilled in the art obtain the basic creative concept of cicada, can make other change and modification to these embodiment.So claims are intended to all changes and the modification that are interpreted as comprising preferred embodiment and fall into the application's scope.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.
Claims (11)
1. a contactless breaking device, is characterized in that, comprising:
For the line of cut forming at upper surface after cut along array substrate, spray the first nozzle of the first temperature gas, and
For after the setting duration of first nozzle ejection the first temperature gas, along described line of cut, spray the second nozzle of the second temperature gas;
With described the first nozzle and second nozzle is connected respectively, for regulating the web member of distance between the pneumatic outlet of described the first nozzle and the pneumatic outlet of second nozzle;
Described web member, also for controlling the first nozzle ejection, go out that the first temperature gas projects to direction on line of cut and to spray direction of travel identical, and controlling second nozzle, to eject the direction that the second temperature gas projects on line of cut contrary with injection direction of travel;
Wherein, the first temperature is higher than the second temperature.
2. equipment as claimed in claim 1, is characterized in that, described web member also sprays along described line of cut with identical travelling speed for controlling the first nozzle and second nozzle.
3. equipment as claimed in claim 1, is characterized in that, on described the first nozzle and second nozzle, is also respectively arranged with pressure control valve, for regulating the air pressure of the gas that the first nozzle spray and second nozzle eject.
4. equipment as claimed in claim 1, is characterized in that, the pneumatic outlet of described the first nozzle and second nozzle is all respectively along major axis and short axisymmetric shape, and described major axis is parallel with line of cut, and described minor axis is vertical with line of cut.
5. utilize the arbitrary described equipment of claim 1～4 to carry out a method for contactless sliver, it is characterized in that, described method comprises:
Control the line of cut that the first nozzle forms at upper surface after cut along array substrate and spray the first temperature gas, the direction that the first temperature gas is projected on line of cut is identical with injection direction of travel;
After the setting duration of first nozzle ejection the first temperature gas, to control second nozzle and spray the second temperature gas along described line of cut, the direction that the second temperature gas is projected on line of cut is contrary with injection direction of travel.
6. method as claimed in claim 5, is characterized in that, controls the first nozzle and second nozzle and sprays along line of cut with identical travelling speed;
Described setting duration is distance between the pneumatic outlet of the first nozzle and the pneumatic outlet of second nozzle and the ratio of travelling speed along line of cut.
7. method as claimed in claim 5, it is characterized in that, described the first temperature gas and the second temperature gas meet: the difference that the first temperature gas arrives the temperature of array substrate upper surface and the temperature of the second temperature gas arrival array substrate upper surface is not less than 50 ℃.
8. method as claimed in claim 5, is characterized in that, the gas of the first nozzle ejection is air, and the gas that second nozzle sprays is air or nitrogen;
The first temperature of the first nozzle ejection gas is 150 ℃～180 ℃, and the second temperature of second nozzle jet flow stream is 0 ℃～5 ℃;
The air pressure of the first nozzle ejection gas and second nozzle jet flow stream is 0.2MPa～0.3MPa.
9. method as claimed in claim 8, is characterized in that, the thickness of described array substrate is 0.5mm～1.1mm;
Control in the process of the first nozzle ejection gas and second nozzle jet flow stream, specifically comprise:
The distance of controlling between the pneumatic outlet of the first nozzle and the pneumatic outlet of second nozzle is 20mm～50mm; And
The distance of controlling the pneumatic outlet of the first nozzle and the pneumatic outlet of second nozzle and array substrate upper surface is 50mm;
Controlling the first nozzle and second nozzle is 50mm/s～100mm/s along the travelling speed along line of cut.
10. cutting and a breaking device, is characterized in that, comprising:
For cutting the cutting wheel of array substrate;
Be connected with described cutting wheel as arbitrary in claim 1～4 as described in contactless breaking device.
11. 1 kinds are utilized equipment described in claim 10 to cut and the method for sliver, it is characterized in that, described method comprises:
Control described cutting wheel cutting array substrate; And
Control the line of cut that the first nozzle in described contactless breaking device forms at upper surface after cut along array substrate and spray the first temperature gas, the direction that the first temperature gas is projected on line of cut is identical with injection direction of travel;
After the setting duration of first nozzle ejection the first temperature gas, the second nozzle of controlling in described contactless breaking device sprays the second temperature gas along described line of cut, and the direction that the second temperature gas is projected on line of cut is contrary with injection direction of travel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110061013.6A CN102643017B (en) | 2011-03-14 | 2011-03-14 | Non-contact type breaking method and equipment and method and equipment for cutting and breaking |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110061013.6A CN102643017B (en) | 2011-03-14 | 2011-03-14 | Non-contact type breaking method and equipment and method and equipment for cutting and breaking |
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| CN102643017A CN102643017A (en) | 2012-08-22 |
| CN102643017B true CN102643017B (en) | 2014-09-10 |
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| CN108436297A (en) * | 2018-03-30 | 2018-08-24 | 中南民族大学 | One kind being directed to the contactless sliver segmenting device of sheet fragile material and dividing method |
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| CN100482398C (en) * | 2005-09-30 | 2009-04-29 | 富士迈半导体精密工业（上海）有限公司 | Laser cutting method and apparatus |
| TWI298280B (en) * | 2006-09-06 | 2008-07-01 | Nat Applied Res Laboratories | Method for cutting non-metal material |
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| JP2000233936A (en) * | 1999-02-10 | 2000-08-29 | Mitsuboshi Diamond Kogyo Kk | Glass cutting device |
| CN1638931A (en) * | 2002-08-09 | 2005-07-13 | 三星钻石工业股份有限公司 | Method and device for scribing fragile material substrate |
| CN1704213A (en) * | 2004-05-28 | 2005-12-07 | 宝丽科技集团有限公司 | Fragile work piece cutting equipment with double nozzle |
| CN101396771A (en) * | 2007-09-27 | 2009-04-01 | 三星钻石工业股份有限公司 | Processing method of brittle material substrate |
| JP2009242184A (en) * | 2008-03-31 | 2009-10-22 | Nippon Electric Glass Co Ltd | Cutting method and cutting device for brittle platy object |
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