CN102249527A - Apparatus for cutting glass, and method thereof - Google Patents
Apparatus for cutting glass, and method thereof Download PDFInfo
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- CN102249527A CN102249527A CN2011100065159A CN201110006515A CN102249527A CN 102249527 A CN102249527 A CN 102249527A CN 2011100065159 A CN2011100065159 A CN 2011100065159A CN 201110006515 A CN201110006515 A CN 201110006515A CN 102249527 A CN102249527 A CN 102249527A
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Abstract
The invention relates to an apparatus for cutting glass, and a method thereof. The apparatus is characterized in that: an output end of a CO2 laser is provided with a beam expanding lens, an output end of the beam expanding lens is provided with a full reflection mirror disposed at an angle of 45 DEG, an output end of the full reflection mirror disposed at the angle of 45 DEG is provide with a focusing lens, which is arranged relative to a processing platform. The method is characterized in that: during cutting the glass, a spherical cutter wheel is adopted for firstly cutting on an initial end of the breaking position of the glass to obtain a stress source point; the focused laser beam forms a rupture zone on the glass surface, wherein the cut contour line is a cut street which is formed from a rectangular light spot along primary cutting points of the cutter wheel; a cooling medium is spraying along the direction of the laser scribing to enable the stress to developed along the cut street of the laser scribing; a piece breaking device is adopted for enabling the glass to be broken along the cut street of the laser scribing. With the present invention, the breaking processing for the right side of the glass is realized, the electronic glass product which meets high-precision processing requirements of size and has good edge quality and different thickness, is provided.
Description
Technical field
The present invention relates to a kind of laser cutting device, relate in particular to a kind of devices and methods therefor that is used for glass-cutting.
Background technology
Because the electronic product sustainable growth demand of IT industry (small-sized cell) and TV different purposes such as (large-scale cell), for glass substrate the above split requirement of large-scale specification 1500 * 1800mm has been arranged, following split requirement of glass-cutting thickness 0.6mm and cutting back strength of glass keep high-level split requirement.
Traditional glass cutting method is to use diamond or hard metal wheel line; then with the method glass that fractures of machinery; this method causes the waste of material easily; and often be accompanied by the cutting auxiliary in the cutting; liquid auxiliary stick problem and to having the influence of circuit structure ITO conductive glass short circuit; the cutting tangent plane is more coarse; there is fine crackle; exist local stress; can produce molecule in the cutting can be splashed on the base of conductive glass and cause the circuit mechanism collapse; also must clean after the cutting; aftertreatments such as polishing; machinery line cutting destroys the glass intrinsic becomes the important factor that causes indicating meter and touch-screen to lose efficacy, and these cutting defective productss all are near a kind of important waste of the electronic glass of finished product.
The laser cutting of glass can be avoided the appearance of these problems, and laser has noncontact, nonpollution environment, characteristic such as easy to control, makes its important application focus that becomes contemporary glass cutting, and can be widely used in industry gradually.At first, glass is a kind of fused inorganic product, and unique machinery and heat conductance are arranged, and these performances and temperature are closely related, and under the normal temperature, glass has non-ductility, is a kind of ideal hard brittle material.If glass is heated, along with the rising of temperature, glass intensity will descend, and ductility will increase, and when temperature was elevated to softening temperature, glass showed plasticity.Therefore, in the laser cutting of glass, controlled temperature is a processing parameter that cutting quality is had material impact.Glass has stronger absorption for Ultra-Violet Laser and far infrared laser, and generally more than 90%, so glass is fit to Ultra-Violet Laser and CO
2Laser is processed.Ultraviolet laser power is relatively low, but cost is higher; And CO
2The laser beam quality factor is better, and power can be accomplished high value, and price is lower.
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, a kind of devices and methods therefor that is used for glass-cutting is provided.
Purpose of the present invention is achieved through the following technical solutions:
Be used for the device of glass-cutting, characteristics are: CO
2The output terminal of laser apparatus is provided with beam expanding lens, and the output terminal of beam expanding lens is furnished with 45 degree completely reflecting mirrors, and the output terminal of 45 degree completely reflecting mirrors is furnished with condensing lens, and described condensing lens is right against processing platform.
Further, the above-mentioned device that is used for glass-cutting, described CO
2Laser apparatus is that wavelength is the far infrared CO of 10640nm
2Laser apparatus.
Said apparatus is used for the method for glass-cutting, comprises the steps:
1) by the spherical break bar stress source point of ingressing at top, glass breakage position; Spherical break bar is by electric machine control, and center 50mm falls from the horizontal throw laser facula, stays impression at cutting groove on glass top, as cutting groove upper stress source;
2) laser beam of Ju Jiaoing forms a stress rupture band at glass surface, and the skeletal lines of cutting is the cutting groove that a rectangular light spot is formed along the first point of contact of break bar; Form disciform focus point by focused light passages at glass surface, move laser spot relative to glass surface and form required line of cut;
3) heat-eliminating medium sprays along the direction of laser scribing, and stress is developed along the laser scribing cutting groove; The quenching gas-water tap is along with laser spot moves, and the quenching gas-water tap blows to glass surface with freezing air water, and heat affected zone is implemented rapid quenching, and glass produces fracture along the direction of stress maximum;
4) by sliver apparatus the cutting groove of glass along laser scribing ruptured.
Substantive distinguishing features and obvious improvement that technical solution of the present invention is outstanding are mainly reflected in:
When present device is used for processed glass, on the glass surface cutting groove, produce stress, and cool off along cutting groove by means of heat-eliminating medium, thereby the generation tensile stress, glass cracks along cutting groove, and expansion, cutter head was before ingressed at the top in glass cutting road owing to ingress, crackle on the cutting groove finally can be limited in along the cutter head of ingressing in the development of the impression place at glass top, thereby forms a complete crackle band, by manually breaking off with the fingers and thumb disconnected or mechanism is finished the final brisement of glass.By like this, moving repeatedly of platform, realize the positive breadth brisement processing of glass, thereby obtain meeting high precision processing request size, the edge quality goods of different thickness electronic glass preferably, and can guarantee higher working (machining) efficiency, less influences conductive layer ITO, and can cut the chilled glass that traditional cut mechanically can not be finished.
Description of drawings
Below in conjunction with accompanying drawing technical solution of the present invention is described further:
Fig. 1: light path system synoptic diagram of the present invention;
Fig. 2: mechanism synoptic diagram of the present invention.
The implication of each Reference numeral sees the following form among the figure:
Embodiment
The invention provides a kind of laser aid of glass-cutting, adopt CO
2Laser apparatus carries out glass cutting as laser source, to realize selecting lower CO by the material behavior by means of glass
2Under the laser power condition, unique focalizer, heat-eliminating medium uses and the cutter head cutting of ingressing is assisted, and realizes cutting glass by laser.
As shown in Figure 1, be used for the device of glass-cutting, CO
2Laser apparatus 10 is that wavelength is the far infrared CO of 10640nm
2Laser apparatus, CO
2The output terminal of laser apparatus 10 is provided with beam expanding lens 15, and the output terminal that the output terminal of beam expanding lens 15 is furnished with 45 degree completely reflecting mirrors, 11,45 degree completely reflecting mirrors 11 is furnished with condensing lens 12, and condensing lens 12 is right against processing platform 13.Wavelength is the CO of 10.6um
2Laser, laser spot focuses on the upper surface that is positioned at glass before the processing, the laser that laser apparatus 10 sends is through behind the beam expanding lens 15, arrive 45 degree completely reflecting mirrors 11, light path vertically alters course, and behind the arrival condensing lens 12, is focused into strip light spots 14, the strip light spots size is at 30mm*0.2mm, and the strip light spots after condensing lens focuses on guarantees that at the focus place laser energy is all even optimization cloth in the line of cut both sides.
Agent set as shown in Figure 2, after the identification and importing of Controlling System according to working diagram, according to the CCD alignment device, the cutting groove of beginning Locating Glass 26 on processing platform 13, and send instruction and allow and ingress cutter head 22 at the top in glass cutting road impression 23, formation of crack forms on the glass cutting road to reach, this moment, processing platform 13 moved according to direction as shown in Figure 2, strip light spots 14 after the focusing shows on cutting groove can stay bigger stress, this moment, Controlling System sent to refrigerating unit 24 instructions, cutting groove 25 coolings after making it to laser cutting, impel the cutting groove surface to form bigger thermograde and bigger tensile stress, tensile stress makes glass surface begin to break along the cutting groove direction of predetermined line, thereby realizes the cutting of glass
During glass-cutting, concrete processing step is:
1) cutter head of ingressing, the cooling point of laser facula and refrigerating unit guarantees on a sea line at the drop point on the platform, and cutter head is at the border circular areas of a 0.1mm of the top of every line of cut of glass cutting, so that laser cutting began cutting along this cutter head top afterwards, the position of cutter head cutting is as the crack propagation source;
2) laser beam passes through beam condenser, be focused into the even strip light spots of a 0.2mm * 30mm on the surface of glass, and cut the vestige direction along cutter head at glass surface and advance, move by the unidirectional of platform, laser beam forms a heating zone at glass surface, higher energy sharply raises this place's temperature, and the surface produces bigger stress, does not break but stress can not make glass produce;
3) heat-eliminating medium is along the pipeline ejection of 3mm, and with the zone cooling rapidly of LASER HEATING, rapid cooling makes glass surface produce bigger tensile stress, and tensile stress makes glass surface begin to break along the direction of predetermined line, realizes the straight cuts of glass; During glass-cutting, before the laser scribing cutting groove, pressurized gas is blown down along cutting groove, impurity on glass is blown away, to improve the process repeatability and the stability of cutting glass by laser;
4) by mechanism, along the laser cut line brisement, cutting error is in 0.03mm with glass.Usually be cut material and be glazed easily crisp, the mechanically resistant material of glass or class, two-sided strengthened glass and single face chilled glass.
It is the far infrared CO of 10640nm that the present invention adopts wavelength
2Laser apparatus, material processed are the glass-like materials higher to the far IR shielding effect rate, and glass strong absorption wavelength is the CO of 10.6um
2Laser, nearly all laser energy are all absorbed by glass surface 1-2um absorption layer, move relative to glass surface.Laser spot can form needed line of cut, and heat-eliminating medium makes glass along fixed cutting groove crack growth and expansion along the position control of the quenching and the cutter head of ingressing of cutting groove, finishes cutting until final employing brisement technology.
What need understand is: the above only is a preferred implementation of the present invention; for those skilled in the art; under the prerequisite that does not break away from the principle of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (3)
1. be used for the device of glass-cutting, it is characterized in that: CO
2The output terminal of laser apparatus (10) is provided with beam expanding lens (15), and the output terminal of beam expanding lens (15) is furnished with 45 degree completely reflecting mirrors (11), and the output terminal of 45 degree completely reflecting mirrors (11) is furnished with condensing lens (12), and described condensing lens (12) is right against processing platform (13).
2. the device that is used for glass-cutting according to claim 1 is characterized in that: described CO
2Laser apparatus (10) is that wavelength is the far infrared CO of 10640nm
2Laser apparatus.
3. utilize the described device of claim 1 to be used for the method for glass-cutting, it is characterized in that comprising the steps:
1) by the spherical break bar stress source point of ingressing at top, glass breakage position; Spherical break bar is by electric machine control, and center 50mm falls from the horizontal throw laser facula, stays impression at cutting groove on glass top, as cutting groove upper stress source;
2) laser beam of Ju Jiaoing forms a stress rupture band at glass surface, and the skeletal lines of cutting is the cutting groove that a rectangular light spot is formed along the first point of contact of break bar; Form disciform focus point by focused light passages at glass surface, move laser spot relative to glass surface and form required line of cut;
3) heat-eliminating medium sprays along the direction of laser scribing, and stress is developed along the laser scribing cutting groove; The quenching gas-water tap is along with laser spot moves, and the quenching gas-water tap blows to glass surface with freezing air water, and heat affected zone is implemented rapid quenching, and glass produces fracture along the direction of stress maximum;
4) by sliver apparatus the cutting groove of glass along laser scribing ruptured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100065159A CN102249527A (en) | 2011-01-13 | 2011-01-13 | Apparatus for cutting glass, and method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100065159A CN102249527A (en) | 2011-01-13 | 2011-01-13 | Apparatus for cutting glass, and method thereof |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102717190A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for pulse laser etching of conducting film on organic glass |
| CN103551735A (en) * | 2013-10-18 | 2014-02-05 | 昆山思拓机器有限公司 | Processing device and process for conductive rubber pad |
| CN109031743A (en) * | 2018-08-29 | 2018-12-18 | 厦门天马微电子有限公司 | Special-shaped display panel and its cutting method |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN110625267A (en) * | 2019-08-22 | 2019-12-31 | 大族激光科技产业集团股份有限公司 | Method for processing sapphire substrate LED wafer and laser device |
| CN110746104A (en) * | 2019-10-31 | 2020-02-04 | 南京赢羊光子科技有限公司 | Cutting and splitting method and system for laser precision processing glass |
| CN111302613A (en) * | 2020-04-13 | 2020-06-19 | 武汉吉事达科技股份有限公司 | Picosecond laser cutting method for ultra-thick glass |
| CN111922532A (en) * | 2020-08-13 | 2020-11-13 | 晶科能源有限公司 | Solar cell processing equipment and processing method |
| CN113649710A (en) * | 2021-08-17 | 2021-11-16 | 福建华清电子材料科技有限公司 | Laser cutting method for electronic ceramic substrate |
| CN114161000A (en) * | 2021-06-04 | 2022-03-11 | 浙江华工光润智能装备技术有限公司 | Splitting method and splitting device for laser cutting of glass |
| CN115043586A (en) * | 2022-07-27 | 2022-09-13 | 青岛融合光电科技有限公司 | Laser cutting method for improving quality of cut surface of glass carrier plate |
| CN116553815A (en) * | 2023-04-24 | 2023-08-08 | 深圳市联赢激光股份有限公司 | Glass processing integrated machine, method, equipment and computer readable storage medium |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102717190A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for pulse laser etching of conducting film on organic glass |
| CN103551735A (en) * | 2013-10-18 | 2014-02-05 | 昆山思拓机器有限公司 | Processing device and process for conductive rubber pad |
| CN109031743B (en) * | 2018-08-29 | 2021-07-09 | 厦门天马微电子有限公司 | Special-shaped display panel and cutting method thereof |
| CN109031743A (en) * | 2018-08-29 | 2018-12-18 | 厦门天马微电子有限公司 | Special-shaped display panel and its cutting method |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN110625267A (en) * | 2019-08-22 | 2019-12-31 | 大族激光科技产业集团股份有限公司 | Method for processing sapphire substrate LED wafer and laser device |
| CN110746104A (en) * | 2019-10-31 | 2020-02-04 | 南京赢羊光子科技有限公司 | Cutting and splitting method and system for laser precision processing glass |
| CN110746104B (en) * | 2019-10-31 | 2022-02-11 | 南京赢羊光子科技有限公司 | Cutting and splitting method and system for laser precision processing glass |
| CN111302613A (en) * | 2020-04-13 | 2020-06-19 | 武汉吉事达科技股份有限公司 | Picosecond laser cutting method for ultra-thick glass |
| CN111922532A (en) * | 2020-08-13 | 2020-11-13 | 晶科能源有限公司 | Solar cell processing equipment and processing method |
| CN114161000A (en) * | 2021-06-04 | 2022-03-11 | 浙江华工光润智能装备技术有限公司 | Splitting method and splitting device for laser cutting of glass |
| CN113649710A (en) * | 2021-08-17 | 2021-11-16 | 福建华清电子材料科技有限公司 | Laser cutting method for electronic ceramic substrate |
| CN115043586A (en) * | 2022-07-27 | 2022-09-13 | 青岛融合光电科技有限公司 | Laser cutting method for improving quality of cut surface of glass carrier plate |
| CN116553815A (en) * | 2023-04-24 | 2023-08-08 | 深圳市联赢激光股份有限公司 | Glass processing integrated machine, method, equipment and computer readable storage medium |
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Application publication date: 20111123 |