CN101717187A - Laser cutting machine for glass substrate - Google Patents
Laser cutting machine for glass substrate Download PDFInfo
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- CN101717187A CN101717187A CN200910194334A CN200910194334A CN101717187A CN 101717187 A CN101717187 A CN 101717187A CN 200910194334 A CN200910194334 A CN 200910194334A CN 200910194334 A CN200910194334 A CN 200910194334A CN 101717187 A CN101717187 A CN 101717187A
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- glass substrate
- laser
- cutting machine
- generating device
- laser cutting
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Abstract
The invention relates to the field of laser processing equipment, in particular to a laser cutting machine for cutting a glass substrate, which comprises a working platform, a laser generating device and a cooling nozzle, wherein the working platform is used for carrying the glass substrate; the laser generating device is arranged on a slide rail above the working platform, the relative three-dimensional distance of the laser generating device and the working platform is controlled by a motor, and the laser generating device is used for generating shuttle laser spots; and the cooling nozzle is fixed relative to the laser generating device, moves following the laser generating device, and is used for spraying a cooling agent to cool the glass substrate heated by a laser beam. The laser cutting machine for the glass substrate improves the quality and the efficiency of cutting the glass substrate, solves the technical problem of cutting an ultra-thin glass substrate, and has important meaning to the improvement of a cutting process of the glass substrate.
Description
Technical field
The present invention relates to the laser process equipment field, a kind of laser cutting machine that is used for the glass-cutting substrate specifically is provided.
Background technology
The glass cutting equipment of traditional main flow is a cut mechanically equipment, adopts emery wheel class instrument to delineate on glass, produces the tangential tension along cut direction, thereby glass is split along cut.
Cut mechanically equipment glass-cutting: (1), inevitable meeting produce particle (fragment) at the indentation place, and friction scratch glass surface has a strong impact on product quality; (2), the edge of cutting is unsmooth, micro-fractures is arranged, remaining asymmetric rim stress causes the inefficacy of device easily on the material, therefore, must cut posterior border polishing and/or polishing after the product cutting, even need heat-treat, with accentuated edges; (3), the tiny crack that produces in the cut mechanically process can reduce the mechanical stress intensity of glass greatly, and higher risk of breakage is arranged; (4), need the auxiliary cutting of auxiliary in the cut mechanically processing, auxiliary can stick to product edge, needs clear water to clean or subsequent disposal operation such as ultrasonic cleaning.
Along with the thickness of glass substrate is more and more thinner, the difficulty of utility machine glass-cutting substrate is increasing.As the TFT-LCD glass substrate is a kind of special glass material of ultra-thin, large format, forms screen pixels and driving circuit through photoetching, is the basic critical material that constitutes the LCD panel, and it uses difficulty of cut mechanically processing very big.
Summary of the invention
The purpose of this invention is to provide a kind of laser cutting machine for glass substrate, improve the quality and the efficient of glass substrate cutting processing.
In order to realize above goal of the invention, laser cutting machine for glass substrate of the present invention comprises workplatform, is used for the bearing glass substrate; Comprise generating device of laser, be installed on the slide rail of workplatform top, by electric machine control its with the relative three-dimensional distance of workplatform, generation fusiformis laser spot; Comprise cooling spray,, follow generating device of laser motion, be used for the glass substrate that ejected coolant crosses laser beam heats and cool off with the generating device of laser relative fixed.
Preferably, described workplatform is installed on the slide rail, is connected with motor, realizes that horizontal direction moves.
Preferably, described workplatform is provided with vacuum pad, is used to adsorb glass substrate, ensures that glass substrate is fixing in the cutting processing process.
Preferably, described refrigerant is the liquid gas mixture of alcohol and nitrogen.
Preferably, also comprise CCD observation subsystem, be used for glass substrate is made a video recording, glass substrate is located automatically.
Preferably, also comprise the cut cutter, be used for before laser cutting, inscribe the starting position of cutting at the glass substrate edge.
Preferably, described generating device of laser comprises laser apparatus and high speed rotating facetted mirrors mirror; Described laser apparatus is CO
2Laser apparatus; Described high speed rotating facetted mirrors mirror is the polygonal mirror of five equilibrium on the circumference, is connected with motor, rotates with the rotating speed more than the 10000rpm around the center of circle; The laser beam that described laser apparatus takes place is through behind the condenser lens, by the specular reflectance of described high speed rotating facetted mirrors and focus on glass baseplate surface and form the fusiformis laser spot.
Preferably, described high speed rotating facetted mirrors mirror is the polygonal mirror of 36 five equilibriums on the circumference, and reflecting surface is gold-plated.
Preferably, the power of described laser apparatus is 100～400W, and it is 9～11 μ m that optical maser wavelength takes place.
Laser cutting machine for glass substrate of the present invention utilizes generating device of laser to form the fusiformis laser spot, with the glass substrate relative movement that is placed on the workplatform, forms line of cut at glass baseplate surface; Simultaneously, cooling spray is followed the generating device of laser motion, and the glass substrate that ejected coolant is crossed laser beam heats cools off, rapid quenching; The existence meeting of heating source and cooling source forms a stress field in glass substrate, glass will produce fracture along the direction of stress maximum, thereby realize the purpose of glass-cutting substrate.Use laser cutting machine for glass substrate glass-cutting substrate of the present invention, fracture is smoothly neat, can not produce granular debris, exempts follow-up edge polishing operation, can be used in the ultrathin glass substrate of processing.
Laser cutting machine for glass substrate of the present invention produces fusiformis laser spot glass-cutting substrate, and the two ends point of laser spot, middle part are wide.During glass substrate, the front end of laser spot elder generation is from the central glass substrate of line of cut; The laser spot middle part enlarges heating-surface area and energy then; At last, the tail end of laser spot continues to strengthen the heating of line of cut central authorities.Laser cutting machine for glass substrate fusiformis laser spot of the present invention meets heat passage principle to the heating of glass substrate, can prevent the explosion of line of cut edge glass; The fusiformis laser spot has enlarged the temperature contrast of line of cut central authorities with the line of cut edge, makes and cuts the more accurate middle position that is positioned laser spot of fracture.
The liquid gas mixture that cooling spray ejected coolant of the present invention is alcohol and nitrogen, pollution-free, under normal temperature, can volatilize voluntarily, exempted follow-up matting.
Laser cutting machine for glass substrate of the present invention has improved the quality and the efficient of glass substrate cutting processing, has solved the technical problem of ultrathin glass substrate cutting processing, and the improvement of glass substrate cutting technique is had significant meaning.
Further specify technical solution of the present invention below in conjunction with the drawings and the specific embodiments.
Description of drawings
Fig. 1 is the laser cutting machine for glass substrate structural representation of the embodiment of the invention;
Fig. 2 is the structure principle chart of the generating device of laser of the embodiment of the invention;
Fig. 3 is the structural representation of the generating device of laser of the embodiment of the invention;
Fig. 4 is the A-A sectional structure synoptic diagram of Fig. 3.
Embodiment
Further specify technical solution of the present invention below in conjunction with preferred embodiment, the technical characterictic to part among the embodiment carries out further refinement, is not considered as the constraint to technical solution of the present invention.
Laser cutting machine for glass substrate structure of the present invention comprises main body framework, Controlling System, CCD observation subsystem 5, workplatform 8, cooling jet 4 and generating device of laser as shown in Figure 1.Controlling System is used to coordinate the motion of each several part component.CCD observation subsystem 5 is connected with Controlling System, is used for glass substrate is made a video recording, and glass substrate is located automatically.
Generating device of laser is installed on the slide rail of workplatform top, by linear electric motors 9 controls its with the relative three-dimensional distance of workplatform, generation fusiformis laser spot; Comprise CO
2Laser apparatus 1, outside optical system 2, laser focusing system 3.CO
2The power of laser apparatus 1 is 100～400W, and power is adjustable according to the thickness of glass-cutting substrate, and it is 10.6 μ m that optical maser wavelength takes place.
Fig. 2 is the structure principle chart of generating device of laser of the present invention.CO
2Laser beam, lasing beam diameter 2mm take place in laser apparatus 1; Through the speculum group 22 of outside optical system 2, enter beam expanding telescope 23 lasing beam diameter is extended to 10mm; Enter laser focusing system 3, under the effect of lens 24 and lens 25, focus on; By refractor 26 laser beam is refracted to polygonal mirror 27 with 36 five equilibriums of rotating speed 12000～15000rpm high speed rotating.The about 74mm of polygonal mirror 27 diameters, circumference is divided into 36 faces.Because the angle interval of polygonal mirror 27 each plane of reflection and horizontal direction is 10 °, after reflection, can obtain illustrated arc focusing surface.Because in actual the use, glass substrate is a plane, therefore the laser spot that produces at glass baseplate surface is the wide fusiformis in centre pointed at both ends, and the energy of glass substrate upper surface can change by adjusting the focal length of lens.
Fig. 3 is the structural representation of generating device of laser of the present invention; Fig. 4 is the A-A sectional structure synoptic diagram of Fig. 3.Be labeled as light conducting cylinder 101, adjusting tube 102, adjusting tube 103, linear actuator 104, CCD observation subsystem 5, linear electric motors 106, rotating machine 107, cut cutter 108, cooling jet 4 among the figure.
Light conducting cylinder 101, adjusting tube 102, adjusting tube 103, linear actuator 104, CCD observation subsystem 5, linear electric motors 106, rotating machine 107, cut cutter 108, cooling jet 4 are installed on the mounting plate, and mounting plate is fixed on the slide block of being controlled by linear electric motors 9.Light conducting cylinder 101, regulate tube 102, regulate that tube 103 is used to adjust and glass substrate between fore-and-aft distance.Linear actuator 104, linear electric motors 106, rotating machine 107 are used to adjust CCD observation subsystem 5, cut cutter 108, cooling jet 4 three-dimensional distances.Cut cutter 108 is used for before laser cutting, inscribes the starting position of cutting at the glass substrate edge.Linear actuator 104 can be cylinder, perhaps linear electric motors.
Laser cutting machine for glass substrate of the present invention cooperates CCD observation subsystem 5 to realize the automatic adjustment of glass substrate is located by the vacuum pad of equipment itself, by the processing of uniting of laser and liquid gas mixture refrigerant, disposablely can finish cutting, the exsiccant course of processing; The edge is smooth neat, does not need extra cleaning and polishing; The sepn process that the fusiformis laser processing causes produces strength natural tempering edge, does not have micro-fractures, the edge strength height.Simultaneously, do not produce extra dust in the Laser cutting process, meet of the requirement of user's clean room, the improvement of glass substrate cutting technique is had significant meaning equipment.
Claims (9)
1. laser cutting machine for glass substrate is characterized in that, comprising:
Workplatform is used for the bearing glass substrate;
Generating device of laser is installed on the slide rail of workplatform top, by electric machine control its with the relative three-dimensional distance of workplatform, generation fusiformis laser spot;
Cooling spray with the generating device of laser relative fixed, is followed generating device of laser motion, is used for the glass substrate that ejected coolant crosses laser beam heats and cools off.
2. laser cutting machine for glass substrate according to claim 1 is characterized in that: described workplatform is installed on the slide rail, is connected with motor, realizes that horizontal direction moves.
3. laser cutting machine for glass substrate according to claim 1 and 2 is characterized in that: described workplatform is provided with vacuum pad, is used to adsorb glass substrate, ensures that glass substrate is fixing in the cutting processing process.
4. laser cutting machine for glass substrate according to claim 1 is characterized in that: described refrigerant is the liquid gas mixture of alcohol and nitrogen.
5. laser cutting machine for glass substrate according to claim 1 is characterized in that: also comprise CCD observation subsystem, be used for glass substrate is made a video recording, glass substrate is located automatically.
6. laser cutting machine for glass substrate according to claim 1 is characterized in that: also comprise the cut cutter, be used for before laser cutting, inscribe the starting position of cutting at the glass substrate edge.
7. laser cutting machine for glass substrate according to claim 1 is characterized in that: described generating device of laser comprises laser apparatus and high speed rotating facetted mirrors mirror; Described laser apparatus is CO
2Laser apparatus; Described high speed rotating facetted mirrors mirror is the polygonal mirror of five equilibrium on the circumference, is connected with motor, rotates with the rotating speed more than the 10000rpm around the center of circle; The laser beam that described laser apparatus takes place is through behind the condenser lens, by the specular reflectance of described high speed rotating facetted mirrors and focus on glass baseplate surface and form the fusiformis laser spot.
8. laser cutting machine for glass substrate according to claim 7 is characterized in that: described high speed rotating facetted mirrors mirror is the polygonal mirror of 36 five equilibriums on the circumference, and reflecting surface is gold-plated.
9. laser cutting machine for glass substrate according to claim 7 is characterized in that: the power of described laser apparatus is 100～400W, and it is 9～11 μ m that optical maser wavelength takes place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910194334A CN101717187A (en) | 2009-12-01 | 2009-12-01 | Laser cutting machine for glass substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910194334A CN101717187A (en) | 2009-12-01 | 2009-12-01 | Laser cutting machine for glass substrate |
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| Publication Number | Publication Date |
|---|---|
| CN101717187A true CN101717187A (en) | 2010-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910194334A Pending CN101717187A (en) | 2009-12-01 | 2009-12-01 | Laser cutting machine for glass substrate |
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| CN (1) | CN101717187A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106938884A (en) * | 2017-04-19 | 2017-07-11 | 重庆坤秀门窗有限公司 | A kind of glass cutting machine cut for glass door |
| CN110740979A (en) * | 2017-09-08 | 2020-01-31 | 日本电气硝子株式会社 | Method for producing glass film |
| CN114227021A (en) * | 2022-02-24 | 2022-03-25 | 深圳市圭华智能科技有限公司 | Full-automatic TFT glass-cutting integration equipment |
-
2009
- 2009-12-01 CN CN200910194334A patent/CN101717187A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106938884A (en) * | 2017-04-19 | 2017-07-11 | 重庆坤秀门窗有限公司 | A kind of glass cutting machine cut for glass door |
| CN106938884B (en) * | 2017-04-19 | 2019-04-26 | 重庆坤秀门窗有限公司 | A kind of glass cutting machine for glass door cutting |
| CN110740979A (en) * | 2017-09-08 | 2020-01-31 | 日本电气硝子株式会社 | Method for producing glass film |
| CN110740979B (en) * | 2017-09-08 | 2022-05-27 | 日本电气硝子株式会社 | Method for producing glass film |
| CN114227021A (en) * | 2022-02-24 | 2022-03-25 | 深圳市圭华智能科技有限公司 | Full-automatic TFT glass-cutting integration equipment |
| CN114227021B (en) * | 2022-02-24 | 2022-05-20 | 深圳市圭华智能科技有限公司 | Full-automatic TFT glass-cutting integration equipment |
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Application publication date: 20100602 |