CN103030266B - Laser cutting method and device - Google Patents
Laser cutting method and device Download PDFInfo
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- CN103030266B CN103030266B CN201110328156.9A CN201110328156A CN103030266B CN 103030266 B CN103030266 B CN 103030266B CN 201110328156 A CN201110328156 A CN 201110328156A CN 103030266 B CN103030266 B CN 103030266B
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- 238000000034 method Methods 0.000 title claims abstract description 67
- 238000003698 laser cutting Methods 0.000 title claims abstract description 62
- 238000005520 cutting process Methods 0.000 claims abstract description 30
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- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a laser cutting method and a device, which are used for cutting a workpiece with a bottom surface and a top surface which are opposite to each other, the thickness of the workpiece is formed between the bottom surface and the top surface in parallel to one axial direction, laser light is emitted by a laser light source and is emitted to the workpiece, then the laser light is focused on the bottom surface of the workpiece by a lens, a first modified track is formed on the bottom surface of the workpiece by the laser light, the irradiation position of the laser light is changed at least once in parallel to the axial direction, at least one zoom focusing point is formed on the workpiece, the projection position of the zoom focusing point is located on the first modified track, then a zoom modified track is formed on the workpiece by the laser light at the zoom focusing point, the projection position of the zoom modified track is overlapped with the first modified track, and a continuous modified interface is formed between the first modified track and the zoom modified.
Description
Technical field
The present invention relates to a kind of laser cutting method and device, especially relate to one and be processed to form continuous upgrading interface by rising to top bottom workpiece, nondestructive processing is carried out to machined object, be applicable to non-linear laser cutting, and effectively can reduce laser cutting method and the device of Laser cutting time.
Background technology
Traditional glass cutting adopts flywheel knife cutting, but develop rapidly for each industry, especially for contact panel related industries, requirement for strength of glass is more and more higher, and this also causes traditional flywheel knife glass cutting difficulties, the chilled glass intensity that such as healthy and free from worry (Gorilla glass) produces too strong (> 120Kgf@1.1mm), than large six times of general chilled glass (such as Soda Lime chilled glass), when using traditional flywheel knife to carry out chilled glass cutting, have flywheel knife to wear and tear serious problem, therefore be badly in need of finding other replacement schemes.
Because laser glass cutting belongs to contactless cutting method, do not have the problem of flywheel knife wearing and tearing, can solve traditional flywheel knife and to wear and tear serious problem, be widely used in high strength glass cutting in recent years gradually.The laser cutting method that general industry is common is at present for using CO2 cutting glass by laser, but its cutting mode major part only can carry out straight line processing sliver, and be difficult to go out non-linear pattern to glass processing, such as, the combination of circle, arc or irregular arbitrary curve.In addition, use short-pulse laser, process although directly destructiveness can be carried out to glass, and directly process non-linear pattern, face problem too of a specified duration of spent time.
For known patent, as TaiWan, China patent announcement I270431 " laser processing ", it provides a kind of method cutting off machining object, its technical characteristic is the inside focusing on machining object, by changing the material behavior of processing district, make refraction index changing, machining object is easily cut off, and produce chip when can prevent from cutting off, but because this case focuses on the inside of machining object, therefore be applicable to straight cuts, be difficult to the non-linear cutting carrying out the combination of circle, arc or irregular arbitrary curve.
Secondly, as United States Patent (USP) 7605344 " Laser beam machining method, laser beammachining apparatus, and laser beam machining product ", it provides a kind of laser beam working method, utilize multiphoton absorption, directly carry out destructiveness processing in machining object inside and produce cavity, thus more easily target compound is cut off, its technical characteristic is to utilize multiphoton absorption (multi-photoabsorption), tiny holes (cavity) is formed in machining object inside, its processing district melting is solidified (melted and re-solidified) again, its state is changed or crystalline texture change (single crystallization, polycrystallization, amorphous), its spot separation (pitch) is 1 ~ 7um, but the working method that this case provides, ultra-short pulse laser must be adopted, LASER Light Source cost intensive.
Secondly, as Chinese patent CN101663125 " radium-shine working method and cutting method and there is the dividing method of structure of multilager base plate ", it forms cavity while when scanning radium-shine, owing to forming machined surface, and thus thereafter can with less stress in bending cutting processing thing.The method that this case provides is applicable to the situation of two pieces of real estate opposite configurations, can be used for the glass substrate segmentation of liquid crystal panel, the ultra-short pulse laser (< 100ps) that it is transparent wavelength that its technical characteristic is for machining object carries out optically focused, from surface to the back side illuminaton of machining object, bottom machining object, carry out destructiveness processing and produce hole, making the back side of the laser beam waist position after optically focused and machining object spaced apart.Material in this passage is discharged by radium-shine decomposition and from the back side of machining object, thus forms cavity in above-mentioned passage.But the working method that this case provides, must adopt ultra-short pulse laser, LASER Light Source cost intensive, and the long processing time expended.
Other, as TaiWan, China patent announcement I250060 " utilize the method for cutting processing target of laser, predetermined cut off line forming method and predetermined cutting line forming apparatus ", Japanese Patent JP2007130675 " Laserscribing method ", Japanese Patent JP2009190069 " Machining method and device fortransparent substrate by laser ", TaiWan, China patent announcement I330170 " method of processing crisp and hard material ", all propose laser cutting correlation technique.
For open source literature, if publication " Proc.of SPIE " is open source literature on October 25th, 2000 " Laser cutting of glass " (author Christoph Hermanns), wherein 219th ~ 226 pages of exposure, it uses CO2 cutting glass by laser, and point out as laser cutting degree of depth < 100um (Microcrack), the STRESS VARIATION caused after collocation cooling carries out sliver, very fast cutting speed in feet per minute can be reached, and have preferably edge quality.But although utilize the mode (Full body crack) of entirely cutting without sliver, need expend longer process period, and produce larger crackle, quality is very poor.
Secondly, if publication " Journal Of Laser Applications " is in open source literature " Thermal stress analysis on laser scribing of glass " (author Koji Yamamoto on October 10th, 2008, Noboru Hasaka and Hideki Morita and Etsuji Ohmura), wherein 193rd ~ 200 pages of exposure utilize CO2 LASER Light Source to irradiate and produce thermal stresses, and water coolant of arranging in pairs or groups sprays, carry out sliver cutting, and analyze LASER Light Source from cooling source apart from different, cause the change of fracture edges.
Secondly, if publication " Optics and Lasers in Engineering " was on 03 25th, 2009 open source literatures " Cutting glass substrates with dual-laser beams " (author Junke Jiao andXinbing Wang), wherein 860th ~ 864 pages disclose with the out of focus CO2 laser radiation glass material of low power density, glass can not be made to melt or evaporation, but the thermal stresses be elevated rapidly can be produced.And utilize focusing CO2 laser by the place producing thermal stresses change, glass is cracked along with laser streaks place.
Secondly, if publication " mechanical industry magazine " was on 02 13rd, 2009 open source literatures " PD glass substrate laser cutting technique overview " (author Lin Yuzhong, Cai Wei's logical sequence), wherein the different cutting glass by laser technology of tens companies is compared in 43rd ~ 55 pages of exposure, current most of laser glass cutting technique can be found out, still with CO2 laser (short-pulse laser cost is higher) collocation pre-embossed slight crack and cooling system, carry out sliver and be cut into master, the advantage such as have the fast and section of speed smooth.
Comprehensive above-mentioned existing patent and open source literature known, although laser cutting technique has been applied to different technologies industry, but because most laser cutting method and framework are all adopt CO2 laser, pre-embossed of need arranging in pairs or groups slight crack, be difficult to be applied in non-rectilinear processing, if and to machined object carry out destructiveness processing, the spent time is relatively of a specified duration.When laser beam focuses on machined object inside in addition, the non-linear cutting being difficult to carry out the combination of circle, arc or irregular arbitrary curve can be caused, although focal position can be set in workpiece bottom surface by the existing patent of part, but still be machined to workpiece bottom surface with full butt formula downwards by the end face of workpiece, still belong to destructive processing.In addition, although small part laser cutting uses short-pulse laser, can non-linear cutting be carried out, but still belong to destructive processing, and very consuming time, such as, with the glass that 5W UV laser cutting thickness is 0.7mm, when processing length is 50mm, 400 times must be processed with the speed of 100mm/s, could by severing of glass, its process period expended at least needs 200 seconds.
Therefore, how having one to be applicable to non-linear laser cutting, and effectively can reduce method and the framework of Laser cutting time, is the important topic that laser cutting correlative technology field personage is badly in need of solving.
Summary of the invention
Because the disappearance of prior art, the object of the invention is to propose a kind of laser cutting method and device, it is processed to form continuous upgrading interface by rising to top bottom workpiece, nondestructive processing is carried out to machined object, be applicable to non-linear laser cutting, and can effectively reduce the Laser cutting time.
For achieving the above object, the present invention proposes a kind of laser cutting method, and in order to cut a workpiece, this workpiece has a relative bottom surface and an end face, the parallel one axial thickness forming this workpiece between this bottom surface with this end face, this laser cutting method comprises:
This workpiece of laser beam directive is sent by a LASER Light Source;
By lens, this laser beam is focused on this bottom surface of this workpiece; One first upgrading track is formed in this bottom surface of this workpiece by this laser beam;
Be parallel to the irradiation position that this axis at least changes once this laser beam, make this laser beam form at least one zoom focus point in this workpiece, the projected position of this at least one zoom focus point falls within this first upgrading track; And
By this laser beam with this at least one zoom focus point for benchmark, an at least one zoom upgrading track is formed in this workpiece, the projected position of this zoom upgrading track is overlapping with this first upgrading track, and this workpiece between this first upgrading track and this zoom upgrading track forms a continuous upgrading interface.
For achieving the above object, the present invention more proposes a kind of laser cutting device, and it comprises:
One LASER Light Source, in order to send a laser beam;
One lens; And
One bifocus light path system, is arranged between this LASER Light Source and this lens, and this bifocus light path system comprises:
One spectroscope, the laser beam providing this LASER Light Source to send is injected, and is one first laser beam and one second laser beam by this laser beam light splitting;
Angle mirror group is dispersed in one regulation and control, provides this first laser beam to inject, and changes the dispersion angle of this first laser beam;
One closes light microscopic, in order to change this first laser beam of dispersion angle by dispersing angle mirror group via these regulation and control, and after this second laser beam is integrated into one laser beam, then the end face of directive one workpiece.
For making your juror have further understanding and approval for structure object of the present invention and effect, diagram is hereby coordinated to be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the configuration diagram of the laser cutting device performing laser cutting method of the present invention;
Fig. 2 is the schema of laser cutting method of the present invention;
Fig. 3 is that laser cutting method of the present invention forms the schematic diagram of different upgrading track in workpiece;
Fig. 4 is the schematic diagram of workpiece by continuous upgrading interfacial fracture;
Fig. 5 and Fig. 6 is the configuration diagram of the different laser cutting devices performing laser cutting method of the present invention;
Fig. 7 to Figure 10 is laser cutting method of the present invention forms the different device embodiment of arranging in pairs or groups multiple focal position configuration diagram in workpiece.
Main element nomenclature
10,50,60,70,80,90-laser cutting device
11,51,61,71,81,91-LASER Light Source
12,62-refractor
13,53,63,73,93A ~ 93C-lens
20-workpiece
20A-first part workpiece
20B-second section workpiece
21-bottom surface
22-end face
30-laser cutting method flow process
31 ~ 35-step
40-breaking machine
52-bifocus light path system
521,92A ~ 92C-spectroscope
Angle mirror group is dispersed in 522-regulation and control
523-closes light microscopic
64-refracting element
72-multiple beam light splitting diffractive optical elements (DOE)
74-scanning mirror
The gradual multifocal lens of 82-
A-axially
D1-distance
L-laser beam
L1-first laser beam
L2-second laser beam
L3, L4, L5, L6, L7A, L7B, L7C-laser beam
P1-focus point
P2-zoom focus point
P3, P4-focus
T1-first upgrading track
T2-zoom upgrading track
T-thickness
Embodiment
Hereinafter with reference to the accompanying drawing of enclosing to describe the present invention for the technique means reaching object and use and effect, and the embodiment cited by the following drawings is only aid illustration, in order to your juror understands, but the technique means of this case is not limited to cited accompanying drawing.
Refer to a laser cutting device 10 shown in Fig. 1, it comprises LASER Light Source 11, refractor 12, lens 13, LASER Light Source 11 is in order to launch a laser beam L, after laser beam L directive refractor 12, reflect towards and scioptics 13, the wavelength of laser beam L is less than 100000nm, and the energy density (fluence) of laser beam L is greater than 100J/cm2, lens 13 are the lens of a high numerical aperture (NA), and its numerical aperture is between 0.001 ~ 1.Laser cutting device 10 is in order to cut a workpiece 20, workpiece 20 can be the materials such as silica glass, borosilicate glass or various chilled glasses, workpiece 20 has relative bottom surface 21 and an end face 22, the thickness t that an axial A forms this workpiece 20 is parallel between bottom surface 21 and end face 22, when the bottom surface 21 of workpiece 20 is arranged at the plane that an X-axis and Y-axis form, this axial A is Z axis.The focusing depth of field (Depth of Focus) of laser beam L is less than the thickness t of workpiece 20.
Refer to shown in Fig. 1 to Fig. 4, illustrate that the laser cutting device 10 pairs of workpieces 20 by Fig. 1 carry out the method flow 30 of laser cutting, it comprises:
Step 31: send a laser beam L by LASER Light Source 11, after laser beam L directive refractor 12, reflects towards lens 13 and scioptics 13, to be parallel to the end face 22 of the direction directive workpiece 20 of axial A.
Step 32: the bottom surface 21 by lens 13, laser beam L being focused on workpiece 20, the focus point P1 as shown in first and third figure.
Step 33: form one first upgrading track T1 (as shown in Figure 3) in the bottom surface 21 of workpiece 20 by laser beam L, the form of the first upgrading track T1 designs according to the shape of actual required cutting, can be the non-linear of circle, arc or irregular arbitrary curve combination combination, such as Fig. 3 be shown in the first upgrading track T1 that workpiece 20 bottom surface 21 shape forms with circular arc in line.
Step 34: when completing steps 33 is after workpiece 20 bottom surface 21 forms the first upgrading track T1, again to be parallel to the direction of axial A, change the irradiation position of laser beam L, make laser beam L form a zoom focus point P2 in workpiece 20, the projected position that zoom focus point P2 is parallel to axial A falls within the first upgrading track; As shown in Figure 1, it is inner that zoom focus point P2 is positioned at workpiece 20, the level height of zoom focus point P2 is higher than focus point P1, and zoom focus point P2 Range Focusing point P1 mono-is apart from D1, by the relative position of adjustment LASER Light Source 11 with adjustment workpiece 20, reach the object changing laser beam L irradiation position and focal position, such as, workpiece 20 is fixed, then heightens the irradiation position of laser beam L in axial A to obtain zoom focus point P2.
Step 35: driving laser light L with zoom focus point P2 for benchmark, a zoom upgrading track T2 is formed in workpiece 20, the projected position of zoom upgrading track T2 is overlapping with the first upgrading track T1, workpiece 20 inside between the first upgrading track T1 and zoom upgrading track T2 forms a continuous upgrading interface, as shown in Figure 3, the first upgrading track T1 and zoom upgrading track T2 forms two laminar upgrading tracks.Should be noted that, because laser beam L irradiates, there is a scope, therefore the laser repetition rate of the irradiation position of laser beam L can be adjusted according to the thickness of workpiece 20, such as setting laser repetition rate is equal to or less than 50%, makes continuous upgrading interface can contain bottom surface 21 and the end face 22 of workpiece 20.When workpiece 20 thickness t is thinner, bottom surface 21 and the end face 22 of workpiece 20 can be contained in the continuous upgrading interface formed by the first upgrading track T1 and the zoom upgrading track T2 of the present embodiment namely, if when workpiece 20 thickness t is thicker, as long as change the irradiation position of laser beam L again, laser beam L is made to form other zoom focus point in workpiece 20, such as, laser beam L can be changed in different the first zoom focus point of workpiece 20 height of formation and one second zoom focus point, it is inner that first zoom focus point is positioned at workpiece 20, second zoom focus point is positioned at the end face 22 of workpiece 20.
With Fig. 1 shown device framework, laser cutting method proposed by the invention is described, laser beam L wavelength is 355nm, pulse width is less than 30ns, collocation numerical aperture is the lens 13 of 0.28, with frequency 40KHz, speed 200mm/s, focus on depth of field 0.035mm, energy density 800J/cm2, workpiece 20 is the chilled glass of thickness 0.7mm, first workpiece 20 bottom surface 21 is focused on, laser beam L forms first time upgrading track with the speed of aforementioned 200mm/s in workpiece 20 bottom surface 21, then be parallel to the irradiation position five times that axial A adjusts upward laser beam L, each miles of relative movement is 133 μm, speed reduces and forms five upgrading tracks with the speed of 400mm/s in workpiece 20 inside, altogether process bottom surface 21 and the end face 22 that namely can contain workpiece 20 in the continuous upgrading interface formed for six times, because the intensity of workpiece 20 in continuous upgrading interface reduces, therefore a breaking machine 40 as shown in Figure 1 can be utilized to assist and to carry out sliver, as shown in Figure 4, workpiece 20 can be ruptured by the position at continuous upgrading interface, form a first part workpiece 20A and second section workpiece 20B.
Refer to the laser cutting device 50 shown in Fig. 5, it comprises a LASER Light Source 51, one lens 53 and a breaking machine 40, a bifocus light path system 52 is provided with between LASER Light Source 51 and lens 53, bifocus light path system 52 comprises a spectroscope 521, one regulation and control are dispersed angle mirror group 522 and and are closed light microscopic 523, the laser beam L that spectroscope 521 provides LASER Light Source 51 to send injects, and be one first laser beam L1 and one second laser beam L2 by laser beam L light splitting, angle mirror group 522 is dispersed in regulation and control provides the first laser beam L1 to inject, and change the dispersion angle of the first laser beam L1, close light microscopic 523 in order to disperse via regulation and control the first laser beam L1 that angle mirror group 522 changes dispersion angle, and second after laser beam L2 is integrated into one laser beam L3, again through the end face 22 of lens 53 directive workpiece 20, the feature of this laser cutting device 50 is, bifocus light path system 52 is utilized to transfer the single focus processing mode of script to two focus processing modes, process efficiency can be improved, as shown in Figure 5, can simultaneously in the bottom surface 21 of workpiece 20 and inner formation focus P3, P4.
Refer to the laser cutting device 60 shown in Fig. 6, it comprises a LASER Light Source 61, one refractor 62, one lens 63 and a breaking machine 40, the feature of laser cutting device 60 is to be provided with a refracting element 64 between lens 63 and workpiece 20, refracting element 64 can adopt silica glass, the material such as borosilicate glass or various chilled glasses, laser beam L is first by after refracting element 64, the end face 22 of directive workpiece 20 again, the feature of this laser cutting device 60 is, laser beam L is by refracting element 64, make air and refracting element 64 interface produce reflect after light angle diminish, can reach and change rapidly laser beam L focal position, another focus point can be formed fast in workpiece 20, improve process efficiency.
In addition, this case also can be arranged in pairs or groups different device architectures, forms multiple focal position, to improve process efficiency, refer to different embodiment shown in Fig. 7 to Figure 10 in workpiece.
Refer to the laser cutting device 70 shown in Fig. 7, it comprises a LASER Light Source 71, one multiple beam light splitting diffractive optical elements (DOE) 72, one lens 73 and one scan mirror 74, multiple beam light splitting diffractive optical elements (DOE) 72 can be set to monolithic or multi-disc, it is through the multiple beam light splitting diffractive optical elements (DOE) 72 of monolithic or multi-disc, laser beam L LASER Light Source 71 sent is divided into multiple tracks laser beam L4, after laser beam L4 acts on through lens 73 and scanning mirror 74, multiple tracks laser beam L5 can be formed on the single plane of workpiece 20, form multiple focus point.
Refer to the laser cutting device 80 shown in Fig. 8, it mainly comprises LASER Light Source 81 and a gradual multifocal lens 82.Refer to shown in Fig. 9, gradual multifocal lens 82 has different focal zones 821 ~ 824.Thus, through this gradual multifocal lens 82, the laser beam L that LASER Light Source 81 can be sent is divided into multiple tracks laser beam L6, therefore can form multiple focal position in workpiece (not shown).
Refer to the laser cutting device 90 shown in Figure 10, it mainly comprises a LASER Light Source 91, multiple spectroscope 92A ~ 92C and multiple lens 93A ~ 93C, through multiple spectroscope 92A ~ 92C and multiple lens 93A ~ 93C, the laser beam L that LASER Light Source 91 can be sent is divided into multiple tracks laser beam L7A ~ L7C, therefore can form multiple focal position in workpiece (not shown).
In sum, laser cutting method provided by the invention, it is processed to form continuous upgrading interface by rising to top bottom workpiece, nondestructive processing is carried out to workpiece, be not only applicable to non-linear laser cutting, and can effectively reduce the Laser cutting time, as above-mentioned be the glass of 0.7mm with cutting thickness, processing length is 50mm is example, method provided by the present invention and device is utilized to cut, to arrange in pairs or groups in 200mm/s with 5W UV laser the speed of five 400mm/s, altogether process six times, can by severing of glass, the spent time was less than one second, 400 times are processed with the speed of 5W UV laser and 100mm/s compared to tradition, at least needing 200 seconds consuming time could by severing of glass, process velocity can be promoted at least two hundred times by the present invention, be conducive to the industry that is applied to and manufacture procedure for processing, process period can be shortened, promote manufacturing speed.Additionally, laser cutting method provided by the invention, the laser beam needed for it and the specification of lens must set depending on cut workpiece material and thickness difference, according to experimental verification, if laser beam is with frequency 40KHz, speed is less than lmm/s, and energy density is greater than 2000J/cm
2during cutting processing part, easily make work piece surface be damaged, and upgrading district cannot be formed in machined surface bottom surface, in addition, if use the lens that F value (focal length) is 100mm, when the focusing depth of field is 0.886mm, also cannot form upgrading district in the workpiece bottom surface of thickness 0.7mm.
Above-describedly be only embodiments of the invention, when can not with the scope implemented of restriction the present invention.Namely the equalization change generally done according to the claims in the present invention with modify, all should still belong in scope that patent of the present invention contains, sincerely please your juror's explicit example for reference, and pray Hui Zhun, be to praying.
Claims (10)
1. a laser cutting method, in order to cut a workpiece, this workpiece has relative bottom surface and end face, and this laser cutting method comprises:
This workpiece of laser beam directive is sent by a LASER Light Source;
By lens, this laser beam is focused on this bottom surface of this workpiece;
One first upgrading track is formed in this bottom surface of this workpiece by this laser beam; At least change once the irradiation position of this laser beam, make this laser beam form at least one zoom focus point at this workpiece, the projected position of this at least one zoom focus point falls within this first upgrading track;
By this laser beam with this at least one zoom focus point for benchmark, an at least one zoom upgrading track is formed in this workpiece, the projected position of this zoom upgrading track is overlapping with this first upgrading track, and this workpiece between this first upgrading track and this zoom upgrading track forms a continuous upgrading interface;
Wherein, through the multiple beam light splitting diffractive optical elements (DOE) of monolithic or multi-disc, the laser beam that this LASER Light Source sends is divided into multiple tracks laser beam, then on the single plane of this workpiece, forms multiple focus point through these lens.
2. laser cutting method as claimed in claim 1, wherein this laser beam has a focusing depth of field (Depth of Focus), and this focusing depth of field is less than the thickness of this workpiece.
3. laser cutting method as claimed in claim 1, wherein this laser beam has an energy density (fluence), and this energy density is greater than 100J/cm2.
4. laser cutting method as claimed in claim 1, wherein these lens are the lens of a high numerical aperture (NA), and its numerical aperture is between 0.001 ~ 1.
5. laser cutting method as claimed in claim 1, it changes once the irradiation position of this laser beam, make this laser beam form one first zoom focus point in this workpiece, this first zoom focus point this workpiece between this bottom surface and this end face of this workpiece is inner.
6. laser cutting method as claimed in claim 1, it changes the irradiation position of this laser beam of secondary, this laser beam is made to form one first zoom focus point and one second zoom focus point in this workpiece, it is inner that this first zoom focus point is positioned at this workpiece, and this second zoom focus point is positioned at this end face of this workpiece.
7. laser cutting method as claimed in claim 1, wherein the laser repetition rate of the irradiation position of this laser beam is equal to or less than 50 ﹪.
8. laser cutting method as claimed in claim 1, wherein the wavelength of this laser beam is less than 100000nm.
9. laser cutting method as claimed in claim 1, is wherein provided with a refracting element between these lens and this workpiece, and this laser beam is first by after this refracting element, then this end face of this workpiece of directive, to form another focus fast.
10., for a laser cutting device for cutting method as claimed in claim 1, comprise:
LASER Light Source, in order to send a laser beam;
Lens; And
Bifocus light path system, is arranged between this LASER Light Source and this lens, and this bifocus light path system comprises:
Spectroscope, this laser beam providing this LASER Light Source to send is injected, and is one first laser beam and one second laser beam by this laser beam light splitting;
Angle mirror group is dispersed in regulation and control, provides this first laser beam to inject, and changes the dispersion angle of this first laser beam;
Close light microscopic, in order to change this first laser beam of dispersion angle by dispersing angle mirror group via these regulation and control, and after this second laser beam is integrated into one laser beam, then the end face of directive one workpiece.
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| Application Number | Priority Date | Filing Date | Title |
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| TW100135907 | 2011-10-04 | ||
| TW100135907A TWI476063B (en) | 2011-10-04 | 2011-10-04 | Laser cutting method and apparatus |
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| CN103030266A CN103030266A (en) | 2013-04-10 |
| CN103030266B true CN103030266B (en) | 2015-04-15 |
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| JP6151557B2 (en) * | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | Laser processing method |
| CN103785947B (en) * | 2014-01-27 | 2018-01-23 | 英诺激光科技股份有限公司 | A kind of laser cutting machine that can improve LED chip splitting yield |
| TWI574767B (en) * | 2014-07-29 | 2017-03-21 | Improved laser structure | |
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| CN101386112A (en) * | 2007-09-13 | 2009-03-18 | 张立国 | Laser cutting method based on inner carving |
| RU2394780C1 (en) * | 2009-04-13 | 2010-07-20 | Государственное образовательное учреждение высшего профессионального образования "Тульский государственный университет" | Method of laser pulsed shaping of solid non-metal materials |
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| TWI476063B (en) | 2015-03-11 |
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