CN109175729A - A kind of laser cutting system and method for epoxy resin case chip - Google Patents
A kind of laser cutting system and method for epoxy resin case chip Download PDFInfo
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- CN109175729A CN109175729A CN201811161990.1A CN201811161990A CN109175729A CN 109175729 A CN109175729 A CN 109175729A CN 201811161990 A CN201811161990 A CN 201811161990A CN 109175729 A CN109175729 A CN 109175729A
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- Prior art keywords
- laser
- epoxy resin
- spot shaping
- spot
- resin case
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention belongs to be cut by laser field, and in particular to a kind of laser cutting system and method for epoxy resin case chip.The laser cutting system includes laser, beam expanding lens, spot shaping system, amasthenic lens, for fixing the X-Y motion microscope carrier of workpiece to be cut, the spot shaping system includes interchangeable parallel six luminous points DOE spot shaping system and vertical three luminous points DOE spot shaping system, wherein, after laser issues beam Propagation to beam expanding lens, light beam is converted into collimated light beam, then it vertically injects in hot spot orthopedic systems, it obtains being suitble to welding hot spot after shaping, light beam after shaping focuses on epoxy resin samples surface via focus lamp, transient evaporation material, separate basis material, complete the cutting of epoxy resin case chip, incident beam can be subjected to shaping by spot shaping system, it obtains being suitble to the incisory hot spot of different-thickness epoxy resin case chip, cutting speed can effectively be improved, and it cuts Quality is cut, working efficiency is improved.
Description
Technical field
The invention belongs to be cut by laser field, and in particular to a kind of laser cutting system for epoxy resin case chip and
Method.
Background technique
LED is mainly made of substrate, chip, lead, phosphor powder layer, encapsulating material etc., and wherein encapsulating material mainly plays guarantor
The effect of shield and sealing chip, avoids it by the influence of the temperature and humidity of ambient enviroment, and improve device to external shock
Resistance, slow down mechanical oscillation, ensure its normal work.LED outer layer lens material generally uses polycarbonate, poly- methyl-prop
The thermosetting materials encapsulating molding such as the transparent thermoplastic resins such as olefin(e) acid ester injection moulding and epoxy resin, organosilicon.In recent years
With popularizing for power-type LED, it is based especially on the development of ultraviolet white light LEDs, it is desirable that encapsulating material has ultraviolet light higher
While absorption, it is able to maintain in visible region high transparency, and these thermoplastic resins are in discoloration-resistant, light transmittance, resistance to
Hot and impact resistance etc. has been unable to meet requirement.Modified epoxy resin has high refractive index, higher simultaneously
The encapsulation such as toughness, high thermal conductivity and ultraviolet-resistant aging requirement, can significantly improve the reliability of device.With light
Also urgent need is miniaturized in the fast development of electrical part micromation, LED component, cuts fragment as resin-encapsulated material technology system
Important step in journey proposes higher and higher processing request to cutting accuracy.
Currently, conventional epoxy resin encapsulating material chopper and slicer is using traditional blade (grinding wheel) cutting method,
Such cutting technique is mature, but the size for being limited by blade or grinding wheel itself influences, and cutting accuracy is poor, is unable to satisfy Micro-ring
The cutting demand of oxygen resin-encapsulated piece；Due to mechanical stress biggish between blade and sample, can be generated in cutting process few
Chipping is measured, the trimming quality of resin sheet is influenced；Simultaneously because cutting speed is lower, efficiency is caused also to be unable to get promotion.
Laser processing is used as a kind of noncontact procession, can be obviously improved cut quality and precision, while can meet micro-
The cutting demand of type ring oxygen resin-encapsulated piece；Traditional laser processing hot spot is in Gaussian Profile, and central light strength is higher, surrounding light intensity
It gradually decreases, under the conditions of such, it is larger that sample cuts taper, while there is also biggish heat-affected zone, influencing cutting efficiency
And cut quality.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of for asphalt mixtures modified by epoxy resin
The laser cutting system and method for rouge case chip, hot spot leads to sample cutting cone in Gaussian Profile when solving existing laser processing
Spend it is larger, while there is also biggish heat-affected zone, the problem of influencing cutting efficiency and cut quality.
To solve this technical problem, the present invention provides a kind of laser cutting system for epoxy resin case chip, including
Laser, beam expanding lens, spot shaping system, amasthenic lens, the X-Y motion microscope carrier for fixing workpiece to be cut, the laser
Device goes out light, and light beam reaches spot shaping system through beam expanding lens, after carrying out spot shaping to light beam by spot shaping system, line focus
Camera lens cuts the workpiece to be cut on X-Y motion microscope carrier；The spot shaping system includes interchangeable parallel six light
Point DOE spot shaping system and vertical three luminous points DOE spot shaping system；Wherein, the parallel six luminous points DOE spot shaping system
It unites for being the distribution of parallel six luminous point by the spot shaping of incident light, the vertical three luminous points DOE spot shaping system is used for
It is the distribution of vertical three luminous point by the spot shaping of incident light.
Still more preferably scheme of the invention is: the laser cutting system further includes for accurately judging cutting position
CCD monitoring position device, and the CCD quality detection device for detecting cut quality.
Still more preferably scheme of the invention is: the laser cutting system further includes that setting is whole with hot spot in laser
It is multiple for connecting the reflecting mirror of optical path between shape system.
Still more preferably scheme of the invention is: the amasthenic lens is short focus amasthenic lens.
Still more preferably scheme of the invention is: the laser cutting system further includes being arranged in X-Y motion microscope carrier one
The pumping dirt system of side.
Still more preferably scheme of the invention is: described to take out the pumping dirt device that dirt system includes multiple and different suction, root
According to the Dust distribution amount in machining area when cutting, the difference of machining area is arranged in the pumping dirt device of the multiple difference suction
Position.
Still more preferably scheme of the invention is: the laser is the ultraviolet nanosecond laser of 355nm.
Still more preferably scheme of the invention is: vacuum absorption device, the X- are provided on the X-Y motion microscope carrier
The rotating mechanism for driving X-Y motion microscope carrier to rotate is provided with below Y motion microscope carrier.
Still more preferably scheme of the invention is: being equipped between the reflecting mirror and beam expanding lens for preventing laser beam from leaking
The optical gate of light.
The present invention also provides a kind of laser cutting methods for epoxy resin case chip, comprising steps of
A, laser goes out light, projects the first light beam and reaches beam expanding lens；
B, the first light beam reaches spot shaping system after beam expanding lens collimates；
C, it treats cutting workpiece to be judged, as thickness of workpiece≤300um to be cut, in the spot shaping system
The spot shaping of incident light is the distribution of parallel six luminous point by parallel six luminous points DOE spot shaping system；When thickness of workpiece to be cut
In 300um~700um, vertical three luminous points DOE spot shaping system in the spot shaping system is by the hot spot of incident light
It is shaped as vertical three luminous points distribution；
D, directive amasthenic lens after the light beam after spot shaping system shaping；
E, the potsherd on X-Y stage is cut after being focused by amasthenic lens.
The beneficial effects of the present invention are, after laser issues beam Propagation to beam expanding lens, light beam is converted into collimated light beam,
Then it vertically injects in hot spot orthopedic systems, according to the thickness of welded workpiece, selects parallel six luminous points DOE spot shaping system
Or vertical three luminous points DOE spot shaping system carries out shaping to the hot spot of incident light, the light beam after shaping is focused via focus lamp
To epoxy resin samples surface, transient evaporation material separates basis material, completes the cutting of epoxy resin case chip, leads to
Incident beam can be carried out shaping to get incisory to the epoxy resin case chip of suitable different-thickness by crossing spot shaping system
Hot spot can effectively improve cutting speed and cut quality, improve working efficiency.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the schematic diagram of the laser cutting system for epoxy resin case chip of the invention；
Fig. 2 is the light-out effect figure of the parallel six luminous points DOE spot shaping system of the present invention；
Fig. 3 is the light-out effect figure of the vertical three luminous points DOE spot shaping system of the present invention；
Fig. 4 is cutting effect figure of the present invention for the laser cutting system of epoxy resin case chip；
Fig. 5 is method flow diagram of the present invention for the laser cutting method of epoxy resin case chip.
Specific embodiment
The present invention provides a kind of laser cutting system for epoxy resin case chip, to make the purpose of the present invention, technology
Scheme and effect are clearer, clear, and the present invention is described in more detail referring to the drawings.It should be appreciated that this place is retouched
The specific embodiment stated is only used to explain the present invention, is not intended to limit the present invention.
Referring to Figure 1, Fig. 2 Fig. 3, Fig. 1 are the laser for epoxy resin case chip that present pre-ferred embodiments provide
The schematic diagram of diced system.A kind of laser cutting system for epoxy resin case chip shown in FIG. 1, including laser 1, expansion
Beam mirror 2, spot shaping system 3, amasthenic lens 4, the X-Y motion microscope carrier 5 for fixing workpiece to be cut, the spot shaping system
System 3 includes interchangeable parallel six luminous points DOE spot shaping system 31 and vertical three luminous points DOE spot shaping system 32；Wherein,
The parallel six luminous points DOE spot shaping system 31 is used to be the distribution of parallel six luminous point by the spot shaping of incident light, described
Vertical three luminous points DOE spot shaping system 32 is used to the spot shaping of incident light be the distribution of vertical three luminous point.
Wherein, after laser 1 issues beam Propagation to beam expanding lens 2, light beam is converted into collimated light beam, then vertical incident light
In spot orthopedic systems 3, according to the thickness of welded workpiece, parallel six luminous points DOE spot shaping system, 31 or vertical three light is selected
Point DOE spot shaping system 32 carries out shaping to the hot spot of incident light, and the light beam after shaping focuses to be welded via amasthenic lens 4
It connects on workpiece (epoxy resin samples) surface, transient evaporation material separates basis material, completes cutting for epoxy resin case chip
It cuts, incident beam can be carried out by spot shaping system 3 by shaping and cut to get to the epoxy resin case chip of suitable different-thickness
The hot spot cut can effectively improve cutting speed and cut quality, improve working efficiency.
Further, the spot shaping system 3 is by parallel six luminous points DOE spot shaping system 31 and vertical three luminous point
DOE spot shaping system 32 is constituted, and can meet the cutting of the epoxy resin case chip of different-thickness.When epoxy resin case chip is thick
(≤300um) can effectively elongate spot size using parallel six luminous points DOE spot shaping system 31 when spending smaller, keep sweeping
Speed and output frequency unanimous circumstances are retouched, increases laser beam overlap ratio, to increase laser cutting-in；Unit hot spot is reduced simultaneously
Energy density optimizes spot energy distribution gradient, to reduce heat affecting of the laser to material.It is thick when cutting epoxy resin case chip
When spending larger (300um~700um), using vertical three luminous points DOE spot shaping system 32, Gaussian spot can be converted to vertically
Three identical small light spots of distribution effectively increase the distribution length of hot spot in vertical direction, cut to significantly increase laser
It is deep, improve cutting effect；And two kinds of DOE systems are arranged in parallel, it can be achieved that being switched fast use.
Further, the laser cutting system further includes for accurately judging that the CCD monitoring position of cutting position fills
Set 61, and the CCD quality detection device 62 for detecting cut quality.When laser cutting system works, by being supervised with the position CCD
It controls device 61 to cooperate, accurately controls laser cutting position；After can be by 62 pairs of CCD quality detection device cuttings after the completion of cutting
Sample quality carries out in situ detection, can prevent defective products from reserving market, influence user experience.
Further, as shown in Figure 1, the laser cutting system further includes being arranged in laser 1 and spot shaping system
It is multiple for connecting the reflecting mirror of optical path between system 3.In the present embodiment, the laser 1 issues light beam and passes through beam expanding lens 2
Workpiece is cut after reaching spot shaping system 3 again afterwards, theoretically optical path can be achieved on.But when practical set, by
Limitation in space, laser 1, beam expanding lens 2, spot shaping system 3 are difficult to be arranged in specific position, and laser 1 and light
Position accuracy demand staggered relatively between spot orthopedic systems 3 is very high.Therefore it needs to increase reflecting mirror to remove adjustment laser 1, expand
The position of beam mirror 2, spot shaping system 3, to meet the assembly demand of actual production.In the present embodiment, described to be used for epoxy
The laser cutting system of resin-encapsulated piece is provided with the first reflecting mirror 71, the second reflecting mirror 72 and third reflecting mirror 73, described
First reflecting mirror 71 is arranged between laser 1, beam expanding lens 2, and second reflecting mirror 72, the setting of third reflecting mirror 73 are expanding
Between mirror 2, spot shaping system 3.The light that goes out of the laser 1 is connected to beam expanding lens 2 via the first reflecting mirror 71, beam expanding lens 2
Lens combination light path output is equipped with the second reflecting mirror 72, and the lens combination light path output of the second reflecting mirror 72 connects spot shaping system 3.Certainly, originally
Invention is not defined the use number of reflecting mirror, and the use number of reflecting mirror can be modified according to actual needs.
Further, the amasthenic lens 4 is short focus amasthenic lens.It is poly- that short focus is set as by amasthenic lens 4
Zoom lens can guarantee that laser focal beam spot diameter is smaller, can suitably reduce laser for the heat-affected zone of resin material,
Be conducive to depth cutting.
Further, as shown in Figure 1, the laser cutting system further includes the pumping that 5 side of X-Y motion microscope carrier is arranged in
Dirt system 8.By one pumping dirt system 8 of increase, the flue dust generated after process laser and sample effect can be eliminated, from
And can prevent flue dust on after the absorption of laser intensity influence Laser beam energy distribution uniformity, then can be with optimizing incision effect
And cutting efficiency.It is described to take out the pumping dirt device that dirt system 8 includes multiple and different suction, according to the powder in machining area when cutting
The different location of machining area is arranged in the pumping dirt device of dirt abundance, the multiple difference suction.It is cut by sunykatuib analysis
When machining area in Dust distribution amount, in machining area different location, the pumping dirt device of multiple and different suction, Ke Yiyou are set
The raising assimilation effect of effect is eliminated the flue dust that generates in process laser and sample effect to the absorption of laser intensity and is swashed
The uniformity of light energy distribution, to optimizing incision effect and cutting efficiency.
Further, the laser 1 is the ultraviolet nanosecond laser of 355nm.The ultraviolet nanosecond laser have compared with
Short pulse width, higher single pulse energy and the biggish repetition rate of adjustable range, especially make with epoxide resin material
Resin material direct gasification can be reduced heat-affected zone by high-peak power, lesser pulse width by the used time, be obtained preferable
Upper and lower surfaces and inner wall edge effect.
Further, it is provided with vacuum absorption device on the X-Y motion microscope carrier 5, is set below the X-Y motion microscope carrier
It is equipped with the rotating mechanism for driving X-Y motion microscope carrier to rotate.By vacuum absorption device can effective fixed placement in X-Y
Workpiece to be cut on motion stage, by increasing a rotating mechanism, the laser that can be used in epoxy resin case chip is cut
It cuts system and completes more complicated cutting track, improve the versatility of system.
Further, the optical gate for preventing laser beam light leakage is equipped between the reflecting mirror and beam expanding lens 2.Pass through increasing
Add one for preventing the optical gate of laser beam light leakage, can be used for preventing laser beam light leakage, improve the cutting efficiency of system.
As shown in figure 5, the present invention also provides a kind of laser cutting methods for epoxy resin case chip, comprising steps of
Step S100, laser goes out light, projects the first light beam and reaches beam expanding lens；
Step S200, the first light beam reaches spot shaping system after beam expanding lens collimates；
Step S300, cutting workpiece is treated to be judged, as thickness of workpiece≤300um to be cut, the spot shaping
The spot shaping of incident light is that parallel six luminous point is distributed by parallel six luminous points DOE spot shaping system in system；When to be cut
For thickness of workpiece in 300um~700um, the vertical three luminous points DOE spot shaping system in the spot shaping system will be incident
The spot shaping of light is the distribution of vertical three luminous point；
Step S400, directive amasthenic lens after the light beam after spot shaping system shaping；
Step S500, the workpiece to be cut on X-Y stage is cut after being focused by amasthenic lens.
Wherein, the step S500 comprising steps of
Step S501, when going out light cutting, cooperate CCD monitoring position device, accurately control laser cutting position.
Step S502, it when going out light cutting, takes out dirt system 8 and the dust in machining area is eliminated.
Further, it is further comprised the steps of: after the step S500
After the completion of S600, cutting, in situ detection is carried out to sample quality after cutting by lower CCD quality detection device.
Cutting effect of the invention can reduce because (blade) is processed in contact as shown in Fig. 2, laser processing is noncontact processing
Cause to align skew problem and additional artificial position aligning time；Cutting accuracy can down to 10um, higher than the cutting accuracy (> of blade
20um)；Cutting wire length is adjustable, is able to satisfy the demand of different line widths, the cutting of the miniaturization size of wire length；Cutting matter is being substantially improved
It measures (no chipping), can also keep higher cutting efficiency.
The invention patent is using the laser light path system of optimization, and integrated UV laser is in epoxy resin cutting material field
Advantage, traditional epoxy resin case chip cutting mode is improved, using ultraviolet nanosecond laser+spot shaping system+pumping dirt
The cutting mode of system can get the processing efficiency of 10min/piece or so, processing breadth is adjustable (maximum reachable 400mm ×
500mm), cutting accuracy can be positively retained at 99% or more down to 10um, yield；Micromation epoxy sheet can also be realized simultaneously
Cutting, be suitable for technical grade volume production, solve the efficiency and precision problem in epoxy resin case chip cutting process.It compares
In traditional blade or emery wheel cuts equipment, the invention patent cutting efficiency with higher, cutting accuracy and cut quality
The advantages that, it is suitable for LED encapsulation field.
In conclusion the above is merely preferred embodiments of the present invention, being not intended to limit the scope of the present invention.
Any modification made all within the spirits and principles of the present invention, equivalent replacement, improve etc., it should be included in guarantor of the invention
It protects in range.
Claims (10)
1. a kind of laser cutting system for epoxy resin case chip, which is characterized in that including laser, beam expanding lens, hot spot
Orthopedic systems, amasthenic lens, the X-Y motion microscope carrier for fixing workpiece to be cut, wherein the laser goes out light, light beam warp
Spot shaping system is reached after beam expanding lens collimation, spot shaping is carried out to light beam by spot shaping system, completes spot shaping
The workpiece to be cut on X-Y motion microscope carrier is cut after light beam line focus lens focus；The spot shaping system includes
Interchangeable parallel six luminous points DOE spot shaping system and vertical three luminous points DOE spot shaping system；Wherein, described parallel six
Luminous point DOE spot shaping system is used to be the distribution of parallel six luminous point, the vertical three luminous points DOE by the spot shaping of incident light
Spot shaping system is used to the spot shaping of incident light be the distribution of vertical three luminous point.
2. the laser cutting system according to claim 1 for epoxy resin case chip, it is characterised in that: the laser
Diced system further includes the CCD monitoring position device for accurately judging cutting position, and the CCD matter for detecting cut quality
Amount detecting device.
3. the laser cutting system according to claim 1 for epoxy resin case chip, it is characterised in that: the laser
Diced system further includes the multiple reflecting mirrors for being used to connect optical path being arranged between laser and spot shaping system.
4. the laser cutting system according to claim 1 for epoxy resin case chip, it is characterised in that: the focusing
Camera lens is short focus amasthenic lens.
5. the laser cutting system according to claim 1 for epoxy resin case chip, it is characterised in that: the laser
Diced system further includes the pumping dirt system that X-Y motion microscope carrier side is arranged in.
6. the laser cutting system according to claim 1 for epoxy resin case chip, it is characterised in that: the pumping dirt
System includes the pumping dirt device of multiple and different suction, according to the Dust distribution amount in machining area when cutting, the multiple difference
The different location of machining area is arranged in the pumping dirt device of suction.
7. the laser cutting system according to claim 1 for epoxy resin case chip, it is characterised in that: the laser
Device is the ultraviolet nanosecond laser of 355nm.
8. the laser cutting system according to claim 1 for epoxy resin case chip, it is characterised in that: the X-Y
It is provided with vacuum absorption device on motion stage, is provided with below the X-Y motion microscope carrier for driving X-Y motion microscope carrier to rotate
Rotating mechanism.
9. the laser cutting system according to claim 3 for epoxy resin case chip, it is characterised in that: the reflection
The optical gate for preventing laser beam light leakage is equipped between mirror and beam expanding lens.
10. a kind of laser based on any laser cutting system for epoxy resin case chip of claim 1~9 is cut
Segmentation method, which is characterized in that comprising steps of
A, laser goes out light, projects the first light beam and reaches beam expanding lens；
B, the first light beam reaches spot shaping system after beam expanding lens collimates；
C, cutting workpiece is treated to be judged, it is parallel in the spot shaping system as thickness of workpiece≤300um to be cut
The spot shaping of incident light is the distribution of parallel six luminous point by six luminous point DOE spot shaping systems；When thickness of workpiece to be cut exists
When 300um~700um, the vertical three luminous points DOE spot shaping system in the spot shaping system is whole by the hot spot of incident light
Shape is the distribution of vertical three luminous point；
D, directive amasthenic lens after the light beam after spot shaping system shaping；
E, the workpiece to be cut on X-Y stage is cut after being focused by amasthenic lens.
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| CN201811161990.1A CN109175729A (en) | 2018-09-30 | 2018-09-30 | A kind of laser cutting system and method for epoxy resin case chip |
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| CN201811161990.1A CN109175729A (en) | 2018-09-30 | 2018-09-30 | A kind of laser cutting system and method for epoxy resin case chip |
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| CN110977188A (en) * | 2019-11-03 | 2020-04-10 | 武汉光谷航天三江激光产业技术研究有限公司 | Multi-focus wafer internal cutting device based on spatial light modulator |
| CN111069764A (en) * | 2019-12-30 | 2020-04-28 | 广东利元亨智能装备股份有限公司 | Cutting and packaging integrated processing system and method |
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| CN112719635A (en) * | 2020-12-28 | 2021-04-30 | 武汉华工激光工程有限责任公司 | Method and device for cutting transparent brittle material |
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