CN112719635A - Method and device for cutting transparent brittle material - Google Patents
Method and device for cutting transparent brittle material Download PDFInfo
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- CN112719635A CN112719635A CN202011580836.5A CN202011580836A CN112719635A CN 112719635 A CN112719635 A CN 112719635A CN 202011580836 A CN202011580836 A CN 202011580836A CN 112719635 A CN112719635 A CN 112719635A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention relates to a device and a method for cutting a transparent brittle material, which comprises the following steps: s1, generating and outputting a laser beam by a laser; s2, beam shaping is carried out after the laser beam is expanded and reflected in sequence; and S3, adjusting the reflection angle of the laser beam after the beam shaping is finished, and focusing the reflected laser beam to ensure that the laser beam is focused inside the transparent brittle material so as to realize the cutting of the transparent brittle material. The laser beam shaping, reflection angle adjustment and focusing are carried out on the laser beam, so that scanning type cutting of the transparent brittle material with the preset thickness can be realized, the processing efficiency is greatly improved, and meanwhile, the performance requirement and the use cost of a laser light source are reduced.
Description
Technical Field
The invention relates to the field of optical material processing, in particular to a method and a device for cutting a transparent brittle material.
Background
At present, the processing of the transparent brittle material can be realized by various ways, such as cutting according to the preset pattern requirement by a linear motor and a laser cutting head. In the processing mode, the light-emitting signal of the laser can be processed efficiently only by matching with the movement speed of the linear motor. However, in high-requirement cutting, the laser light emission is usually a high-frequency signal, in order to match the frequency of the laser light emission, the requirement on the linear motor is usually high, for example, the motor needs to be matched with a cutting track to accurately control laser pulses, correspondingly, the speed and the precision of the motor also need to match the frequency of the laser light emission, usually due to the hardware limitation of the linear motor, the high-precision process cutting requirement cannot be met, and the cutting efficiency is not high; secondly, the linear motor is usually large in size, and the problems of structural layout and use cost need to be considered when the linear motor is used.
Meanwhile, in the prior art, a scheme for realizing material cutting by forming two-dimensional movement of laser scanning through a galvanometer and a scanning field lens has been provided, for example, CN 107030390A-a solar cell cutting device mainly utilizes the scanning field lens to focus laser energy for scanning type cutting, but the laser cutting mode is removal type cutting, which requires repeated cutting many times, and can realize cutting with a predetermined thickness only by removing one layer by one layer, and the laser cutting device has low spot energy density, a cutting line width and a short focal depth, and cannot be focused inside a material, and is not suitable for cutting and processing transparent brittle materials such as glass.
Disclosure of Invention
The invention aims to provide a method and a device for cutting a transparent brittle material, which can realize scanning type cutting of the transparent brittle material with preset thickness by shaping, adjusting and focusing the reflection angle of a laser beam, greatly improve the processing efficiency and simultaneously reduce the performance requirement and the use cost of a laser light source.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, a method of cutting a transparent brittle material is provided, which includes the steps of:
s1, generating and outputting a laser beam by a laser;
s2, beam shaping is carried out after the laser beam is expanded and reflected in sequence;
and S3, adjusting the reflection angle of the laser beam after the beam shaping is finished, and focusing the reflected laser beam to ensure that the laser beam is focused inside the transparent brittle material so as to realize the cutting of the transparent brittle material.
Preferably, the transparent brittle material comprises glass or sapphire.
Preferably, the step S3 includes:
s31, stopping the laser from emitting light after the laser spot is processed at the previous position on the transparent brittle material;
s32, controlling the reflector to deflect, and enabling the laser to continuously emit light to change the reflection angle of the laser beam after the beam shaping is finished, so that the laser spot moves to the next position on the transparent brittle material and the processing is finished on the position;
and repeating the steps S31 and S32 to form two-dimensional movement of laser scanning, and forming a cutting track on the transparent brittle material so as to realize scanning type cutting of the transparent brittle material.
Preferably, the laser scanning speed is 4-10 m/s.
Preferably, the laser beam focal depth is 0.1-6 mm.
There is also provided a transparent brittle material cutting apparatus for implementing the above method of cutting a transparent brittle material, comprising:
a laser for generating and outputting a laser beam;
the beam expander is used for adjusting the laser spot size and the divergence angle;
the laser beam after being expanded by the beam expander is reflected to the beam shaping system by the reflector group so as to shape the beam into required beam distribution by the beam shaping system;
a high-speed scanning system for forming a two-dimensional motion of laser scanning by adjusting a reflection angle of the laser beam output through the beam shaping system;
and the focusing system is used for focusing the laser beam output by the high-speed scanning system, so that the laser beam is focused inside the transparent brittle material to realize the cutting of the transparent brittle material.
Preferably, the beam shaping system comprises one or more of a conical mirror, a DOE and a spatial modulator.
Preferably, the mirror group includes: the laser beam expanded by the beam expander is reflected to the beam shaping system by the first reflector and the second reflector in sequence.
Preferably, the high speed scanning system comprises:
a reflector for reflecting the laser beam output by the beam shaping system;
the deflection driving device is connected with the reflecting mirror and is used for driving the reflecting mirror to deflect a preset angle;
the control system is connected with the laser and is used for controlling the laser to stop emitting light after the laser spot finishes processing at the previous point on the transparent brittle material; and after the deflection driving device drives the reflector to deflect a preset angle, controlling the laser to continuously emit light so as to change the reflection angle of the laser beam output by the beam shaping system, so that the laser spot moves to the next position point on the transparent brittle material, and finishing processing on the position point.
Preferably, the transparent brittle material cutting apparatus further comprises: and the Z-direction lifting device is used for driving the transparent brittle material to move in the Z direction so as to adjust the position of the focal plane.
The invention has at least the following beneficial effects:
according to the invention, a laser beam emitted by a laser enters a high-speed scanning system after being expanded, reflected and shaped, and reaches a laser processing position after being focused, and the laser beam can be shaped, the reflection angle of the laser beam can be adjusted and focused in the process, so that the laser energy density is high, the focal depth is long, the laser beam can be focused inside the transparent brittle material, the scanning type cutting of the transparent brittle material with the preset thickness can be further realized, the processing efficiency is greatly improved, and the performance requirement and the use cost of a laser light source are reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a flow chart of a method for cutting a transparent brittle material according to the present invention;
FIG. 2 is a schematic diagram of the invention showing the formation of a track after deflection of the mirror;
FIG. 3 is a schematic structural diagram of an apparatus for cutting a transparent brittle material according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1:
as shown in fig. 1, the present embodiment provides a method for cutting a transparent brittle material, which includes the following steps:
s1, generating and outputting a laser beam by a laser;
s2, beam shaping is carried out on the laser beams after beam expansion and reflection in sequence so as to shape the Gaussian beams into required beam distribution and meet the cutting requirements of different transparent brittle materials; in this embodiment, the transparent brittle material includes sapphire or the like, and the beam shaping may be implemented by one or more of a beam shaping system such as a conical mirror, a DOE (diffractive Optical Element), a spatial modulator, and the like;
and S3, adjusting the reflection angle of the laser beam after the beam shaping is finished, and further focusing the reflected laser beam to ensure that the laser beam is focused inside the transparent brittle material so as to realize the cutting of the transparent brittle material.
Specifically, as shown in fig. 2, the step S3 includes:
s31, stopping the laser from emitting light after the laser spot is processed at the previous point P on the transparent brittle material;
s32, after the reflector is controlled to deflect the angle theta, the laser continues to emit light to change the reflection angle of the laser beam after the beam shaping is finished, so that the laser spot moves to the next position P on the transparent brittle material, and the processing is finished on the position;
and repeating the steps S31 and S32 to form two-dimensional movement of laser scanning, so that cracks are formed between adjacent points P, and a cutting track is formed on the transparent brittle material to achieve a cutting effect, thereby realizing scanning type cutting of the transparent brittle material.
In the method in the embodiment, the laser beam is shaped, the reflection angle is adjusted and focused, so that the laser energy density is high, the focal depth is long, the laser beam can be focused inside the transparent brittle material, and the optimization of the transparent brittle material with the preset thickness can be further realized. In particular, the above method is suitable for webs of only 10X 10mm2The cutting of the transparent brittle material is realized, the processing interval of the light spots is controlled by controlling the deflection angle of the reflector, the laser scanning speed can reach 4-10m/s, the high-speed scanning type cutting is realized, and the focal depth can reach 0.1-6mm when the diameter of the focused laser light spot is 2 micrometers, so that the cutting of the transparent brittle material with the thickness of 6mm can be realized, the light emitting frequency of the laser is only 2MHZ at the moment, and the high-performance requirement on the laser is not required.
Example 2:
the present embodiment provides a transparent brittle material cutting apparatus for implementing the method of embodiment 1, as shown in fig. 3, comprising:
a laser 1 for generating and outputting a laser beam L;
a beam expander 2 for adjusting the laser spot size and the divergence angle;
the laser beam L expanded by the beam expander 2 is reflected to the beam shaping system 5 by the reflector group and the beam shaping system 5, so that the Gaussian beam is shaped into required beam distribution by the beam shaping system 5, and the cutting requirements of different transparent brittle materials 8 are met; in this embodiment, the transparent brittle material 8 includes glass or sapphire, and the beam shaping system 5 includes one or more of a conical mirror, a DOE (diffractive Optical Element), a spatial modulator, and the like;
a high-speed scanning system 6 for forming a two-dimensional movement of laser scanning by adjusting a reflection angle of the laser beam L outputted through the beam shaping system 5 and forming a cutting track on the transparent brittle material;
and a focusing system 7 (including an objective lens) for focusing the laser beam L output by the high-speed scanning system 6, so that the laser beam L is focused inside the transparent brittle material 8 to realize the cutting of the transparent brittle material 8.
Specifically, the mirror group includes: the first reflector 3 and the second reflector 4 reflect the laser beam L expanded by the beam expander 2 to the beam shaping system 5 through the first reflector 3 and the second reflector 4 in sequence.
Meanwhile, the high-speed scanning system 6 includes:
a mirror 61 for reflecting the laser beam L output by the beam shaping system 5;
a deflection driving device (such as a motor, etc.) connected to the reflective mirror 61 for driving the reflective mirror 61 to deflect a predetermined angle;
the control system is connected with the laser 1 and is used for controlling the laser 1 to stop emitting light after the laser spot is processed at the previous point P on the transparent brittle material; and after the deflection driving device drives the reflector 61 to deflect a preset angle, controlling the laser 1 to continuously emit light so as to change the reflection angle of the laser beam L output by the beam shaping system 5, so that the laser spot moves to the next position P on the transparent brittle material 8, finishing processing on the position, further forming cracks between the adjacent positions P, and achieving the cutting effect,
example 3:
the present embodiment differs from embodiment 2 only in that the apparatus for cutting transparent brittle material in the present embodiment further includes:
and the Z-direction lifting device is used for driving the transparent brittle material 8 to move in the Z direction so as to adjust the position of the focal plane.
The transparent brittle material cutting device of the embodiment can adjust the distribution and the focal depth of the laser beam by adjusting the interval between the beam shaping system 5 and the focusing system 7, adapt different powers according to the light emitting frequency of the laser, and adjust the scanning speed and precision by combining the control of the deflection angle of the reflector, thereby meeting the requirements of the cutting process of different transparent brittle materials.
In conclusion, the laser beam shaping and reflecting device is particularly suitable for cutting and processing transparent brittle materials such as glass, sapphire and the like, laser beams emitted by a laser enter a high-speed scanning system after being expanded, reflected and shaped, and reach a laser processing position after being focused, and in the process, the laser beams can be focused inside the transparent brittle materials through shaping, reflection angle adjustment and focusing of the laser beams, so that the laser energy density is high, the focal depth is long, the laser beams can be focused inside the transparent brittle materials, the scanning and cutting of the transparent brittle materials with preset thickness can be further realized, the performance requirements on the laser light source and the use cost are reduced while the processing efficiency is greatly improved.
It should be noted that the technical features of the above embodiments 1 to 3 can be arbitrarily combined, and the technical solutions obtained by combining the technical features belong to the scope of the present application.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A method of cutting a transparent brittle material, comprising the steps of:
s1, generating and outputting a laser beam by a laser;
s2, beam shaping is carried out after the laser beam is expanded and reflected in sequence;
and S3, adjusting the reflection angle of the laser beam after the beam shaping is finished, and focusing the reflected laser beam to ensure that the laser beam is focused inside the transparent brittle material so as to realize the cutting of the transparent brittle material.
2. The method of claim 1, wherein the transparent brittle material comprises glass or sapphire.
3. The method of claim 1, wherein the step S3 includes:
s31, stopping the laser from emitting light after the laser spot is processed at the previous position on the transparent brittle material;
s32, controlling the reflector to deflect, and enabling the laser to continuously emit light to change the reflection angle of the laser beam after the beam shaping is finished, so that the laser spot moves to the next position on the transparent brittle material and the processing is finished on the position;
and repeating the steps S31 and S32 to form two-dimensional movement of laser scanning, and forming a cutting track on the transparent brittle material so as to realize scanning type cutting of the transparent brittle material.
4. The method of claim 3, wherein the laser scanning speed is 4-10 m/s.
5. The method of claim 3, wherein the laser beam has a focal depth of 0.1 mm to 6 mm.
6. A transparent brittle material cutting apparatus for carrying out the method for cutting a transparent brittle material according to any one of claims 1 to 5, characterized by comprising:
a laser for generating and outputting a laser beam;
the beam expander is used for adjusting the laser spot size and the divergence angle;
the laser beam after being expanded by the beam expander is reflected to the beam shaping system by the reflector group so as to shape the beam into required beam distribution by the beam shaping system;
a high-speed scanning system for forming a two-dimensional motion of laser scanning by adjusting a reflection angle of the laser beam output through the beam shaping system;
and the focusing system is used for focusing the laser beam output by the high-speed scanning system, so that the laser beam is focused inside the transparent brittle material to realize the cutting of the transparent brittle material.
7. The apparatus of claim 6, wherein the beam shaping system comprises one or more of a conical mirror, a DOE, and a spatial modulator.
8. The apparatus of claim 6, wherein the set of mirrors comprises: the laser beam expanded by the beam expander is reflected to the beam shaping system by the first reflector and the second reflector in sequence.
9. The apparatus of claim 6, wherein the high speed scanning system comprises:
a reflector for reflecting the laser beam output by the beam shaping system;
the deflection driving device is connected with the reflecting mirror and is used for driving the reflecting mirror to deflect a preset angle;
the control system is connected with the laser and is used for controlling the laser to stop emitting light after the laser spot finishes processing at the previous point on the transparent brittle material; and after the deflection driving device drives the reflector to deflect a preset angle, controlling the laser to continuously emit light so as to change the reflection angle of the laser beam output by the beam shaping system, so that the laser spot moves to the next position point on the transparent brittle material, and finishing processing on the position point.
10. The apparatus according to claim 6, wherein the transparent brittle material cutting apparatus further comprises:
and the Z-direction lifting device is used for driving the transparent brittle material to move in the Z direction so as to adjust the position of the focal plane.
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| CN202011580836.5A CN112719635A (en) | 2020-12-28 | 2020-12-28 | Method and device for cutting transparent brittle material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113620586A (en) * | 2021-09-08 | 2021-11-09 | 苏州捷兴激光设备有限公司 | Optical filter laser cutting method |
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Application publication date: 20210430 |