CN106994562A - The laser cutting method and laser cutting machine of hard brittle material - Google Patents
The laser cutting method and laser cutting machine of hard brittle material Download PDFInfo
- Publication number
- CN106994562A CN106994562A CN201610047990.3A CN201610047990A CN106994562A CN 106994562 A CN106994562 A CN 106994562A CN 201610047990 A CN201610047990 A CN 201610047990A CN 106994562 A CN106994562 A CN 106994562A
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- CN
- China
- Prior art keywords
- laser
- laser beam
- polarization
- laser cutting
- lens
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
Abstract
The present invention is on a kind of laser cutting method of hard brittle material, it is particularly a kind of to reduce the laser cutting method that chipping phenomenon occurs for hard brittle material, light beam integer modification is carried out to LASER Light Source using a polarization optical element mainly in the optical system of laser cutting machine, the laser beam of Gaussian Profile is retrofit into by the laser beam that a shellfish rope is distributed by light beam integer method for modifying, its effect can reduce temperature difference of the machined material between focus point and its periphery caused by the distribution of laser beam energy concentrations, to reduce because of chipping phenomenon produced by thermal stress.
Description
Technical field
The present invention is a kind of laser cutting method of hard brittle material, and chipping phenomenon occurs for particularly a kind of reduction hard brittle material
Laser cutting method.
Background technology
What laser cutting technique was universal in recent years is used to cutting light-emitting diodes structure base board, sapphire substrate or reinforcing
Glass is from grade hard transparent material.
Laser cutting technique is that the hot melt destruction for producing part is focused on machined material by laser light, is processed material
Material produces successional destruction score after the linear scan by laser light, then is cut machined material in mechanical sliver mode
Cut separation.
Laser cutting machine, mainly includes a LASER Light Source, a laser optical system and a linear scanning movement mechanism.
Wherein LASER Light Source mainly provides a High energy laser beam, and LASER Light Source can be the superlaser light of different wave length
Source device (such as picosecond laser, femtosecond laser etc.), laser cutting machine generally need also use an energy controller, to regulate and control
The energy size of laser beam.
Wherein laser optical system is mainly regulation and control laser beam into machinable superlaser luminous point, and it passes through including multiple
The laser beam regulation and control module of number optical lens or element etc., which regulates and controls into the laser beam of LASER Light Source to focus on, to be added
The superlaser luminous point on work thing surface, wherein laser beam regulation and control module would generally include beam expanding lens, speculum group, curved mirror
And object optical element etc., wherein the laser beam of LASER Light Source is expanded into larger-diameter laser beam by beam expanding lens, reflection
Microscope group is then used for the optical path for changing laser beam, and then focus and its depth of field of adjustment laser beam etc. are poly- for curved mirror and object lens combination
Burnt effect.
Wherein linear scanning movement mechanism, which is mainly, enables the laser beam linear operation of high-energy focusing in machined object
The device on surface, can be object lens position in fixed laser optical system everywhere, and move the machined object in X-Y table,
Machined object either on stationary work-table, and object lens position in laser optical system is moved, the method for mobile object lens is usual
Position and the angle of speculum group in module can be regulated and controled by adjustment laser beam and reached.
The light distribution of general LASER Light Source is a Gaussian Profile, it is characterized in that the luminous intensity of laser light central point is far high
Excessively its periphery, the small range for concentrating on central point of the energy extreme of LASER Light Source.
For the metal material with high thermal conductivity, ductility, the laser of Gaussian Profile during Laser cutting is carried out
Beam energy concentrates material that can't be on focus point on the machined object of metal material to be produced excessively with its periphery material
Temperature difference, thus will not occur the phenomenon of bursting apart of rapidoprint, therefore it is sharp to improve the energy quickening of LASER Light Source as far as possible
The processing efficiency of light cutting.
For the low heat conductivities such as ceramics, glass or monocrystalline and the nonmetallic materials of hard, the distribution of energy concentrations
Laser light produces suitable thermal stress then in the focus point material temperature difference suitable with its periphery material generation, wherein hot
Stress then and then produces chipping phenomenon, and chipping phenomenon then causes cut surface out-of-flatness or cut surface to rupture, and out-of-flatness or rupture are cut
Face is to commonly use laser cutting technique to apply to the reason for processing quality is inferior or unstable during hard crisp nonmetallic materials.
For cutting non-metal material, some laser cutting methods are sharp to reduce by reducing the energy of LASER Light Source
Photo damage scope, or avoid cut surface out-of-flatness or rupture in the way of repeatedly processing back and forth, although it can reduce processing material
Material produces hard crisp chipping result, but thus but can substantially reduce cutting processing efficiency.
The content of the invention
In order to improve the original that processing quality that the laser cutting nonmetallic materials of prior art occur is inferior or unstable
Cause, the present invention provides a kind of laser cutting method, particularly a kind of to reduce the laser cutting side that chipping phenomenon occurs for hard brittle material
Method, mainly carries out light beam integer modification to LASER Light Source in the optical system of laser cutting machine, is modified by light beam integer
The laser beam of Gaussian Profile is retrofit into the laser beam of shellfish rope distribution by method, and its effect can reduce laser beam energy
Temperature difference of the machined material between focus point and its periphery material caused by concentrations distribution, is reduced because of thermal stress institute
Produce chipping phenomenon.
The present invention provides a kind of laser cutting machine, including a LASER Light Source, a laser beam regulation and control module and one linearly sweeps
Motion is retouched, wherein a polarization optical element is used in laser beam regulation and control module, is swashed this by the polarization element
Light light beam one polarization laser beam of formation, wherein the polarization optical element are to be selected from a polarization axicon lens, pass through the polar biased
Change axicon lens and the laser beam of Gaussian Profile is converted into the more uniform polarization shellfish rope light beam of luminous intensity, reduce laser beam energy
Concentrations are distributed in central point, thus cause factory interface of the rapidoprint on focus point Yu its periphery to produce temperature difference mistake
The problem of big, thus the phenomenon of chipping produced by thermal stress can be reduced, its obvious interests is need not to reduce the effect of cutting processing
Rate can improve the quality of cutting processing again.
Brief description of the drawings
Fig. 1 is the schematic diagram of the optical system of laser cutting machine of the present invention.
Description of reference numerals
11 laser light-source devices
12 energy controllers
13 laser beams
21 beam expanding lens
211 laser beams
22 polarization axicon lens
221 polarization laser beams
23 speculum groups
24 curved mirrors
25 object lens
251 Laser Focusing light beams
3 are processed object.
Embodiment
In the embodiment of the present invention, the present invention provides a kind of laser cutting method, and it is swashed using including following devices
Light cutting process：
One LASER Light Source is provided, and its light beam energy controller；
A laser optical system is provided, its light beam for including the optical elements such as beam expanding lens, speculum group, curved mirror and object lens is adjusted
Control module；And
There is provided and linear scanning movement mechanism is utilized in a linear scanning movement mechanism, laser cutting program, by the optical system institute
The focused laser beam P-SCAN of generation is focused on machined object surface；
An at least polarization axicon lens wherein is used in light beam regulation and control module, by the polarization axicon lens by the laser light of Gaussian Profile
Beam is retrofit into the laser beam of shellfish rope distribution, while by the laser beam polarization.
In embodiment, the present invention provides a kind of optical system of laser cutting machine, and it includes a LASER Light Source and a laser
Light beam regulates and controls module；
Wherein LASER Light Source include laser light-source device, and its laser beam energy controller；
Wherein laser beam regulation and control module at least includes：
One beam expanding lens, it is the diameter for expanding the laser beam；
One polarization axicon lens, its be by polarization axicon lens by the laser beam formation one polarization laser beam；
One speculum group, it includes number speculums, its path to regulate and control laser beam；
One curved mirror, its focusing depth of field to adjust laser beam；And
One object lens, it is used to focus on the laser beam, by laser beam focusing on the surface of processed object.
Being used in embodiment, when carrying out laser cutting program includes following devices：
One LASER Light Source, it is adaptable to cut light-emitting diodes structure base boards, sapphire substrate or reinforcing glass from etc. hard transparent material
LASER Light Source includes picosecond laser or femtosecond laser etc., and the wavelength of prior art is the laser light between 266nm and 2000nm
Source can all be applied to cut a nonmetallic materials for cutting hard transparent, and the present embodiment uses the femtosecond laser that wavelength is 1064nm；
One energy controller, its energy size to regulate and control laser beam, the energy size of laser beam is then by cutting process
Processing conditions determine；
One laser optical system, it includes the optical elements such as beam expanding lens, speculum group, polarization axicon lens, curved mirror and object lens
Light beam regulation and control module；
Wherein beam expanding lens, it is expanded into the laser beam of LASER Light Source in several times increase mode using one or plural lens combination
Larger-diameter laser beam, the energy of larger diameter laser beam more disperses, and can avoid injuring light beam regulation and control thereafter
Optical element；
Wherein speculum group, is the path that laser beam is adjusted in response to the effective Utilizing question requirement in space of laser cutting machine,
LASER Light Source is guided to the object lens of output beam using a plurality of speculums.In addition, laser beam can be coupled into light
Fibre, is transmitted using optical fiber to laser beam, therefore the speculum group can also change by using optic module.
A polarization axicon lens is used in wherein polarization axicon lens, the present embodiment, its purpose system passes through the cone of polarization axicon lens
Mirror structure by the laser beam of Gaussian Profile be retrofit into a shellfish rope distribution laser beam to avoid energy integrated distribution central point,
And divided the laser beam one polarization laser beam of formation to regulate and control energy by the polarization optical effect of polarization axicon lens
The energy high point of the mode of cloth, wherein polarization laser beam around around optical focus and order transfers to form ring-type
Distribution, its effect is particularly useful to reduce the difference of the energy absorbing efficiency between the center of optical focus and surrounding, thus can
Effectively to reduce thermal stress therebetween；
Wherein curved mirror and object lens, are that may decide that the focusing depth of field of laser beam using combining for curved mirror and object lens, for
Different Laser cutting operating conditions must then use the design of the different focusing depth of field, then adjust between curved mirror and object lens
Distance is to adjust the focusing depth of field of laser beam, and object lens then utilize its focusing function by laser beam focusing in processed object
On surface；And
One linear scanning movement mechanism, it is sharp in X-coordinate and Building Y mark progress linear scan, laser cutting program by changing in proper order
Linear scanning movement mechanism is used, the laser beam P-SCAN produced by the optical system is focused on into machined object surface
On, the present embodiment is to use processed object being fixed on workbench, only the mobile focusing objective len of linear scan formula, by tune
The position of speculum group in whole laser beam regulation and control module and angle, allow the object lens of diverse location all can all be connected to Stimulated Light light
Beam, therefore moving object lens position in laser optical system in proper order can allow laser beam linear scanning focused in machined object surface
On.
Refer to shown in Fig. 1, the figure is the embodiment schematic diagram of the optical system of laser cutting machine of the present invention.
The optical system of laser cutting machine of the present invention is to include a LASER Light Source and laser beam regulation and control module, wherein swashing
Radiant includes a laser light-source device 11 and its energy controller 12, and the laser light-source device 11 of the present embodiment is using wavelength
1064 nm femtosecond laser, its LASER Light Source exports a laser beam 13 by energy controller 12.
Wherein laser beam regulation and control module is constituted using plural optical lens or optical element, and wherein laser beam is adjusted
Control module 2 at least includes：
One beam expanding lens 21, its diameter to expand the laser beam 13, laser beam 13 passes through the formation laser light of beam expanding lens 21
Beam 211, the beam diameter of laser beam 211 is relatively larger than laser beam 13；
One polarization axicon lens 22, it is that the laser beam 211 is formed into a polarization laser beam by polarization axicon lens 22
221；
One speculum group 23, it is the path that laser beam is adjusted in response to the space utilization requirement of laser cutting machine, using again
Several speculums guide polarization laser beam 221 to the object lens of output beam, in addition in response to the space of laser cutting machine
Design requirement, can also arrange speculum group 23 to change the path of laser beam between beam expanding lens 21 and polarization axicon lens 22；
And
One curved mirror 24 and an object lens 25, it is the focal length and the focusing depth of field for adjusting laser output beam, wherein thing that it, which is combined,
Polarization laser beam 221 is focused into Laser Focusing light beam 251 by mirror 25, and is focused on the surface of processed object 3.
Presently preferred embodiments of the present invention is these are only, this is not able to and limits the protection domain that the present invention is implemented, therefore all ginsengs
The simple equivalent changes and modifications that the description of the present invention is made is examined, still belongs to protection scope of the present invention.
Claims (4)
1. a kind of laser cutting machine, it is characterised in that including：One LASER Light Source, laser beam regulation and control module and a linear scan
A polarization optical element is used in motion, wherein laser beam regulation and control module, will be swashed by the polarization optical element
The laser beam of radiant makes the transition into a polarization laser beam, thus it is caused to reduce the distribution of laser beam energy concentrations
The phenomenon of chipping produced by the temperature difference of factory interface, thus reduction thermal stress.
2. laser cutting machine as claimed in claim 1, wherein the polarization optical element are selected from a polarization axicon lens.
3. a kind of laser cutting method, it is characterised in that it carries out laser cutting program using following devices are included：
One LASER Light Source is provided, and its light beam energy controller；
A laser optical system is provided, it includes the light beam regulation and control of beam expanding lens, speculum group, curved mirror and object optical element
Module；And
There is provided and linear scanning movement mechanism is utilized in a linear scanning movement mechanism, laser cutting program, by the optical system institute
The focused laser beam P-SCAN of generation is on machined object surface；
An at least polarization axicon lens wherein is used in light beam regulation and control module, by the polarization axicon lens by the laser light of Gaussian Profile
Beam makes the transition into the laser beam of shellfish rope distribution, while the polarization laser beam.
4. a kind of optical system of laser cutting machine, it is characterised in that including a LASER Light Source and laser beam regulation and control module；
Wherein LASER Light Source include a laser light-source device, and its laser beam energy controller；
Wherein laser beam regulation and control module at least includes：
One beam expanding lens, its diameter to expand the laser beam；
One polarization axicon lens, the laser beam is formed a polarization laser beam by it by polarization axicon lens；
One speculum group, it includes number speculums, its path to regulate and control laser beam；
One curved mirror, its focusing depth of field to adjust laser beam；And
One object lens, it is used to focus on the laser beam, by laser beam focusing on processed object surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610047990.3A CN106994562A (en) | 2016-01-25 | 2016-01-25 | The laser cutting method and laser cutting machine of hard brittle material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610047990.3A CN106994562A (en) | 2016-01-25 | 2016-01-25 | The laser cutting method and laser cutting machine of hard brittle material |
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| Publication Number | Publication Date |
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| CN106994562A true CN106994562A (en) | 2017-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610047990.3A Pending CN106994562A (en) | 2016-01-25 | 2016-01-25 | The laser cutting method and laser cutting machine of hard brittle material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109834394A (en) * | 2018-12-10 | 2019-06-04 | 大族激光科技产业集团股份有限公司 | Without oblique segmentation corner LED chip cutting method, optical lens module and laser cutting device |
| CN112719635A (en) * | 2020-12-28 | 2021-04-30 | 武汉华工激光工程有限责任公司 | Method and device for cutting transparent brittle material |
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| DE69418248T2 (en) * | 1993-06-03 | 1999-10-14 | Hamamatsu Photonics Kk | Optical laser scanning system with Axikon |
| CN102476237A (en) * | 2010-11-23 | 2012-05-30 | 大连创达技术交易市场有限公司 | Coaxial positioning laser precise processing device |
| CN104148802A (en) * | 2014-08-04 | 2014-11-19 | 北京万恒镭特机电设备有限公司 | Beam forming device and method |
| CN105081586A (en) * | 2015-09-14 | 2015-11-25 | 郑州轻工业学院 | Laser processing method and device |
| CN204975690U (en) * | 2015-07-15 | 2016-01-20 | 武汉华工激光工程有限责任公司 | Produce device of bezier laser beam |
-
2016
- 2016-01-25 CN CN201610047990.3A patent/CN106994562A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69418248T2 (en) * | 1993-06-03 | 1999-10-14 | Hamamatsu Photonics Kk | Optical laser scanning system with Axikon |
| CN102476237A (en) * | 2010-11-23 | 2012-05-30 | 大连创达技术交易市场有限公司 | Coaxial positioning laser precise processing device |
| CN104148802A (en) * | 2014-08-04 | 2014-11-19 | 北京万恒镭特机电设备有限公司 | Beam forming device and method |
| CN204975690U (en) * | 2015-07-15 | 2016-01-20 | 武汉华工激光工程有限责任公司 | Produce device of bezier laser beam |
| CN105081586A (en) * | 2015-09-14 | 2015-11-25 | 郑州轻工业学院 | Laser processing method and device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109834394A (en) * | 2018-12-10 | 2019-06-04 | 大族激光科技产业集团股份有限公司 | Without oblique segmentation corner LED chip cutting method, optical lens module and laser cutting device |
| CN112719635A (en) * | 2020-12-28 | 2021-04-30 | 武汉华工激光工程有限责任公司 | Method and device for cutting transparent brittle material |
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