CN112828474B - Oblique cutting compensation method and system for transparent brittle material - Google Patents
Oblique cutting compensation method and system for transparent brittle material Download PDFInfo
- Publication number
- CN112828474B CN112828474B CN202011626223.0A CN202011626223A CN112828474B CN 112828474 B CN112828474 B CN 112828474B CN 202011626223 A CN202011626223 A CN 202011626223A CN 112828474 B CN112828474 B CN 112828474B
- Authority
- CN
- China
- Prior art keywords
- brittle material
- transparent brittle
- cutting
- laser
- compensation unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The invention relates to an oblique cutting compensation method and system for a transparent brittle material, which comprises the following steps: arranging a processing jig, and inclining the transparent brittle material to ensure that the lower surface of the transparent brittle material is attached to the inclined surface of the jig; an optical path compensation unit is arranged and used for compensating aberration caused when the laser beam enters the inclined transparent brittle material; the laser beam sequentially passes through the light path compensation unit, the air in the gap between the light path compensation unit and the transparent brittle material, is refracted and focused inside the inclined transparent brittle material, and finishes the inclined cutting of the inclined transparent brittle material along the inclined cutting track. According to the invention, the optical path compensation unit is added to compensate aberration caused when laser is injected into the inclined transparent brittle material, so that laser energy focused in the transparent brittle material can be effectively concentrated, and a focal depth section formed in the transparent brittle material is ensured to be enough to perform inclined cutting on the inclined transparent brittle material along an inclined cutting track.
Description
Technical Field
The invention relates to the field of material processing, in particular to a method and a system for compensating oblique cutting of a transparent brittle material.
Background
At present, for cutting and processing transparent and brittle materials such as glass, the following cutting methods exist:
1. the mechanical method comprises the following steps: mechanical cutting is carried out by tools such as a cutter, the cutting effect is extremely poor, and the cutting tool cannot be suitable for high-precision cutting;
2. laser cutting: if a common laser cutting head is used for cutting, the laser cutting head needs to be perpendicular to the glass 100, as shown in fig. 1a, a laser beam L1 longitudinally forms a focal depth section S1 in the glass 100 to form a perpendicular cutting surface, if the cutting surface needs to be an inclined surface, as shown in fig. 1b, the glass 100 needs to be inclined, at this time, the laser beam L1 is refracted, and in the formed focal depth section S1, laser energy cannot be concentrated in the glass 100, so that the inclined cutting effect is poor;
if the galvanometer scanning cutting is adopted, scanning type cutting is required to be performed step by step in all directions along the three-dimensional profile of the glass by a laser scanning method, the operation is complex, and the cutting efficiency is low.
Disclosure of Invention
The invention aims to provide a method and a system for obliquely cutting a transparent brittle material, which can effectively concentrate laser energy focused in the transparent brittle material by adding an optical path compensation unit to compensate aberration caused when laser is injected into the oblique transparent brittle material, and ensure that a focal depth section formed in the transparent brittle material is enough to obliquely cut the oblique transparent brittle material along an oblique cutting track.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, a diagonal cutting compensation method for a transparent brittle material is provided, which includes the following steps:
arranging a processing jig, wherein the processing jig is provided with a jig inclined plane, and inclines the transparent brittle material to ensure that the lower surface of the transparent brittle material is attached to the jig inclined plane;
setting a light path compensation unit, wherein a gap exists between the light path compensation unit and the upper surface of the inclined transparent brittle material, and the light path compensation unit is used for compensating aberration caused when laser beams enter the inclined transparent brittle material, so that the laser energy focused in the transparent brittle material is enough to perform inclined cutting on the inclined transparent brittle material along an inclined cutting track;
the laser beam sequentially passes through the light path compensation unit, the light path compensation unit and the air in the gap between the transparent brittle materials, is refracted and focused inside the inclined transparent brittle materials, and finishes the inclined cutting of the inclined transparent brittle materials along the inclined cutting track.
Preferably, the transparent brittle material has a lower surface and an upper surface that are parallel to each other.
Preferably, the transparent brittle material comprises glass or sapphire.
Preferably, an included angle between the inclined plane of the jig and the horizontal plane is α, an included angle between the inclined cutting track and the upper surface of the inclined transparent brittle material is β, and α and β are complementary angles.
Preferably, the refractive index of the optical path compensation unit is the same as that of the transparent brittle material.
Preferably, the process that the laser beam passes through the air in the gap among the optical path compensation unit, the optical path compensation unit and the transparent brittle material in sequence, is refracted and focused inside the inclined transparent brittle material, and completes the inclined cutting of the inclined transparent brittle material along the inclined cutting track comprises the following steps:
controlling the processing jig and the inclined transparent brittle material to synchronously move to a preset position along the Z direction;
generating and outputting a laser beam, wherein the laser beam is emitted from a laser cutting head after being expanded, then is refracted to the interior of the inclined transparent brittle material through air in gaps among the optical path compensation unit, the optical path compensation unit and the transparent brittle material in sequence, and is focused on an inclined cutting track; and meanwhile, controlling the inclined transparent brittle material to move along the direction vertical to the plane of the inclined cutting track so as to form a surface cutting track on the upper surface of the inclined transparent brittle material, and finally finishing the inclined cutting of the inclined transparent brittle material along the inclined cutting track.
Preferably, the optical path compensation unit is a triangular prism having a first inclined surface parallel to the upper surface of the inclined transparent brittle material, a second inclined surface parallel to the horizontal plane, and a third inclined surface connected to the first inclined surface and the second inclined surface, respectively.
Preferably, a gap is formed between the first inclined surface and the upper surface of the inclined transparent brittle material, and the width of the gap is 1-2 mm.
Also provided is a diagonal cutting compensation system for implementing the diagonal cutting compensation method, which is characterized by comprising:
the processing jig is provided with a jig inclined plane, the included angle between the jig inclined plane and the horizontal plane is alpha, and the lower surface of the inclined transparent brittle material is attached to the jig inclined plane;
a laser for generating and outputting a laser beam;
the beam expander is used for adjusting the laser spot size and the divergence angle;
the laser cutting head is used for carrying out beam shaping on the laser beam output by the beam expander;
the optical path compensation unit is provided with a gap with the upper surface of the inclined transparent brittle material and is used for compensating aberration caused when a laser beam emitted by the laser cutting head enters the inclined transparent brittle material, so that the laser energy focused in the transparent brittle material is enough to perform inclined cutting on the inclined transparent brittle material along an inclined cutting track;
the moving platform is used for driving the processing jig and the inclined transparent brittle material to synchronously move to a preset position along the Z direction before the laser emits light, and driving the processing jig and the inclined transparent brittle material to synchronously move along the direction vertical to the plane of the inclined cutting track after the laser emits light;
the control system is connected with the laser and the mobile platform and is used for controlling the laser to emit light; and controlling the movement of the mobile platform.
Preferably, the laser cutting head is a bessel cutting head.
The invention has at least the following beneficial effects:
the optical path compensation unit is additionally arranged, and the optical path compensation unit, the processing jig and the inclined transparent brittle material are arranged according to a unique position layout, so that aberration caused when laser is injected into the inclined transparent brittle material is compensated, laser energy focused in the transparent brittle material can be effectively concentrated, a focal depth section formed in the transparent brittle material is ensured to be sufficient for obliquely cutting the inclined transparent brittle material along an oblique cutting track, and the cutting work efficiency is greatly improved while the cutting quality is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1a is a schematic diagram of a laser beam for vertical cutting of a transparent brittle material in the prior art;
FIG. 1b is a schematic diagram of a laser beam for oblique cutting of an inclined transparent brittle material in the prior art;
FIG. 2 is a schematic diagram showing the positional relationship between the processing jig, the transparent brittle material and the optical path compensation unit according to the present invention;
FIG. 3 is a schematic diagram of oblique cutting of an inclined transparent brittle material by a laser beam according to the present invention;
FIG. 4 is a diagram of the optical path of the laser beam refracted into the transparent brittle material by the optical path compensation unit according to the present invention;
FIG. 5 is a schematic diagram of a cutting track formed when a laser beam cuts an inclined transparent brittle material obliquely according to the present invention;
fig. 6 is a schematic structural diagram of the oblique cutting compensation system according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1:
as shown in fig. 2-3, the present embodiment provides a method for compensating for oblique cutting of a transparent brittle material, which includes the following steps:
s1, arranging a processing jig 1, wherein the processing jig 1 is provided with a jig inclined plane 101, and the included angle between the jig inclined plane and the horizontal plane S is alpha; the transparent brittle material 2 is inclined, so that the lower surface 201 of the transparent brittle material 2 is attached to the jig inclined plane 101, therefore, the processing jig 1 can be used for bearing the transparent brittle material 2, and the included angle between the lower surface 201 of the transparent brittle material 2 and the horizontal plane S is also alpha; wherein the transparent brittle material 2 comprises glass or sapphire, and the transparent brittle material has a lower surface 201 and an upper surface 202 which are parallel to each other;
and an optical path compensation unit 3 is arranged above the inclined cutting track P which is expected to be formed on the inclined transparent brittle material 2, and a gap 203 exists between the optical path compensation unit and the upper surface 202 of the inclined transparent brittle material 2, and is used for compensating the aberration caused when the laser beam enters the inclined transparent brittle material 2, so that the laser energy focused in the transparent brittle material 2 is enough to perform inclined cutting on the inclined transparent brittle material 2 along the inclined cutting track P; an included angle between the oblique cutting track P and the upper surface 202 of the oblique transparent brittle material 2 is beta, meanwhile, the oblique cutting track P is perpendicular to the horizontal plane S and the laser cutting head 4, and alpha and beta are complementary angles;
in this embodiment, the refractive index of the optical path compensation unit 3 is the same as that of the transparent brittle material 2, and the optical path compensation unit 3 is preferably a triangular prism having a first inclined surface 301 parallel to the inclined upper surface 202 of the transparent brittle material 2, a second inclined surface 302 parallel to the horizontal plane S, and a third inclined surface 303 connected to the first inclined surface 301 and the second inclined surface 302, respectively; a gap 203 is formed between the first inclined surface 301 and the upper surface 202 of the inclined transparent brittle material 2, and the width of the gap 203 is 1-2mm, so that the cutting effect is ensured on the premise of avoiding the position interference of the component;
s2, starting a laser, generating and outputting a laser beam L, wherein the laser beam L is emitted from the laser cutting head 4 after being expanded, then sequentially passes through the light path compensation unit 3, the light path compensation unit 3 and the air in the gap 203 between the transparent brittle material 2, is refracted and focused inside the inclined transparent brittle material 2 to form a focal depth section S', and finishes the inclined cutting of the inclined transparent brittle material 2 along an inclined cutting track P; in this embodiment, the laser cutting head 4 may be a bessel cutting head;
specifically, as shown in fig. 4, taking the optical path compensation unit 3 as a triangular prism as an example, the laser beam L is emitted by the beam expander and the laser cutting head 4 and then enters the optical path compensation unit 3, and is refracted by the first inclined surface 301 into the gap 203 between the optical path compensation unit 3 and the upper surface 202 of the inclined transparent brittle material 2, and is refracted by the upper surface 202 of the inclined transparent brittle material 2 and focused inside the inclined transparent brittle material 2, so as to realize the inclined cutting of the inclined transparent brittle material 2;
specifically, as shown in fig. 3 and 5, the step S2 includes:
s21, controlling the processing jig 1 and the inclined transparent brittle material 2 to synchronously move to a preset position along the Z direction, and keeping the positions of the optical path compensation unit 3 and the laser cutting head 4 unchanged when the processing jig 1 and the inclined transparent brittle material 2 move;
s22, starting a laser, generating and outputting a laser beam L, wherein the laser beam L is emitted from the laser cutting head 4 after being expanded, then is refracted into the inclined transparent brittle material 2 through the air in the gap 203 among the optical path compensation unit 3, the optical path compensation unit 3 and the transparent brittle material 2 in sequence, and is focused on the inclined cutting track P; and meanwhile, controlling the inclined transparent brittle material 2 to move along a direction perpendicular to the plane of the inclined cutting track P, for example, if the inclined cutting track P is formed on the XZ plane, controlling the inclined transparent brittle material 2 to move along the Y direction to form a surface cutting track P' on the upper surface of the inclined transparent brittle material 2, and finally performing inclined cutting on the inclined transparent brittle material 2 along the inclined cutting track P.
As shown in fig. 3, compared to fig. 1b, in the present embodiment, the optical path compensation unit 3 is added, and the processing fixture 1 and the inclined transparent brittle material 2 are arranged according to a unique position layout, so as to compensate the aberration caused when the laser enters the inclined transparent brittle material 2, so that the laser energy focused in the transparent brittle material 2 can be effectively concentrated, and the focal depth section S' formed in the transparent brittle material 2 is sufficient to perform the oblique cutting on the inclined transparent brittle material 2 along the oblique cutting track P.
Example 2:
the present embodiment provides an oblique cutting compensation system for implementing the oblique cutting compensation method according to embodiment 1, which is suitable for cutting a transparent brittle material, as shown in fig. 2-3 and fig. 6, and includes:
the processing jig 1 is provided with a jig inclined plane 101, and the included angle between the jig inclined plane 101 and the horizontal plane S is alpha; meanwhile, the lower surface 201 of the inclined transparent brittle material 2 is attached to the inclined surface 101 of the jig;
a laser 6 for generating and outputting a laser beam L;
a beam expander 5 for adjusting the laser spot size and the divergence angle;
a laser cutting head 4 for beam shaping the laser beam L output by the beam expander 5 into a beam distribution form required for cutting; preferably, the laser cutting head 4 is a bessel cutting head which can shape the laser beam L output by the beam expander 5 into a bessel beam with a focal depth of 0.1-6 mm;
an optical path compensation unit 3, which is located above an oblique cutting track P expected to be formed on the inclined transparent brittle material 2 and has a gap 203 with an upper surface 202 of the inclined transparent brittle material 2, wherein the optical path compensation unit 3 is used for compensating aberration caused when a laser beam L emitted by a laser cutting head 4 enters the inclined transparent brittle material 2, so that laser energy focused in the transparent brittle material 2 is enough to perform oblique cutting on the inclined transparent brittle material 2 along the oblique cutting track P;
the moving platform 8 is used for driving the processing jig 1 and the inclined transparent brittle material 2 to synchronously move to a preset position along the Z direction before the laser 1 emits light, and driving the processing jig 1 and the inclined transparent brittle material 2 to synchronously move along the direction vertical to the plane of the inclined cutting track P after the laser 1 emits light;
the control system 7 is connected with the laser 6 and the mobile platform 8 and is used for controlling the laser 6 to emit light; and controlling the moving platform 8 to enable the moving platform 8 to drive the processing jig 1 and the inclined transparent brittle material 2 to synchronously move to a preset position along the Z direction before the laser 1 emits light, and to drive the processing jig 1 and the inclined transparent brittle material 2 to synchronously move along the direction perpendicular to the plane where the inclined cutting track P is located after the laser 1 emits light.
Other technical features, such as the positional relationship between the transparent brittle material 2, the optical path compensation unit 3 and the processing fixture 1, and the types of the laser cutting head 4 and the optical path compensation unit 3, are the same as those in embodiment 1, and are not described herein again.
In summary, the cutting compensation device of the present invention has a reasonable structural design and is simple to operate, and is suitable for oblique cutting of an oblique transparent brittle material, specifically, the optical path compensation unit is added, and the optical path compensation unit, the processing fixture and the oblique transparent brittle material are arranged according to a unique position layout, so as to compensate aberration caused by laser light incident into the oblique transparent brittle material, so that laser energy focused in the transparent brittle material can be effectively concentrated, and it is ensured that a focal depth section formed in the transparent brittle material is sufficient to perform oblique cutting of the oblique transparent brittle material along an oblique cutting track.
The technical features of the above embodiments 1-2 can be combined arbitrarily, and the combined technical solutions all belong to the scope of protection of the present application.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A slant cutting compensation method for a transparent brittle material is characterized by comprising the following steps:
arranging a processing jig, wherein the processing jig is provided with a jig inclined plane, and inclines the transparent brittle material to ensure that the lower surface of the transparent brittle material is attached to the jig inclined plane;
setting a light path compensation unit, wherein a gap exists between the light path compensation unit and the upper surface of the inclined transparent brittle material, and the light path compensation unit is used for compensating aberration caused when laser beams enter the inclined transparent brittle material, so that the laser energy focused in the transparent brittle material is enough to perform inclined cutting on the inclined transparent brittle material along an inclined cutting track;
the laser beam sequentially passes through the air in the gaps among the light path compensation unit, the light path compensation unit and the transparent brittle material, is refracted and focused inside the inclined transparent brittle material, and finishes the inclined cutting of the inclined transparent brittle material along the inclined cutting track.
2. The diagonal cut compensation method of claim 1, wherein the transparent brittle material has a lower surface and an upper surface parallel to each other.
3. The diagonal cut compensation method of claim 1, wherein the transparent brittle material comprises glass or sapphire.
4. The oblique cutting compensation method according to claim 2, wherein an included angle between the inclined surface of the jig and the horizontal plane is α, an included angle between the oblique cutting trajectory and the upper surface of the inclined transparent brittle material is β, and α and β are complementary angles.
5. The oblique cutting compensation method of claim 2, wherein the refractive index of the optical path compensation unit is the same as that of the transparent brittle material.
6. The oblique cutting compensation method according to claim 1, wherein the process of focusing the laser beam inside the inclined transparent brittle material through the optical path compensation unit and the refraction of the air in the gap between the optical path compensation unit and the transparent brittle material in sequence and performing the oblique cutting of the inclined transparent brittle material along the oblique cutting trajectory comprises the following steps:
controlling the processing jig and the inclined transparent brittle material to synchronously move to a preset position along the Z direction;
generating and outputting a laser beam, wherein the laser beam is emitted from a laser cutting head after being expanded, then is refracted into the inclined transparent brittle material through air in gaps among the optical path compensation unit, the optical path compensation unit and the transparent brittle material in sequence, and is focused on an inclined cutting track; and simultaneously controlling the inclined transparent brittle material to move along the direction vertical to the plane of the inclined cutting track so as to form a surface cutting track on the upper surface of the inclined transparent brittle material, and finally finishing the inclined cutting of the inclined transparent brittle material along the inclined cutting track.
7. The oblique cutting compensation method of claim 2, wherein the optical path compensation unit is a triangular prism having a first inclined surface parallel to the upper surface of the inclined transparent brittle material, a second inclined surface parallel to the horizontal plane, and a third inclined surface connected to the first inclined surface and the second inclined surface, respectively.
8. The diagonal cut compensation method of claim 7, wherein a gap is formed between the first inclined surface and the upper surface of the inclined transparent brittle material, and the width of the gap is 1-2 mm.
9. An oblique cutting compensation system for implementing the oblique cutting compensation method according to any one of claims 1 to 8, comprising:
the processing jig is provided with a jig inclined plane, the included angle between the jig inclined plane and the horizontal plane is alpha, and the lower surface of the inclined transparent brittle material is attached to the jig inclined plane;
a laser for generating and outputting a laser beam;
the beam expander is used for adjusting the laser spot size and the divergence angle;
the laser cutting head is used for carrying out beam shaping on the laser beam output by the beam expanding lens;
the optical path compensation unit is provided with a gap with the upper surface of the inclined transparent brittle material and is used for compensating aberration caused when a laser beam emitted by the laser cutting head enters the inclined transparent brittle material, so that the laser energy focused in the transparent brittle material is enough to perform inclined cutting on the inclined transparent brittle material along an inclined cutting track;
the moving platform is used for driving the processing jig and the inclined transparent brittle material to synchronously move to a preset position along the Z direction before the laser emits light, and driving the processing jig and the inclined transparent brittle material to synchronously move along the direction vertical to the plane of the inclined cutting track after the laser emits light;
the control system is connected with the laser and the mobile platform and is used for controlling the laser to emit light; and controlling the movement of the mobile platform.
10. The diagonal cut compensation system of claim 9, wherein the laser cutting head is a bessel cutting head.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011626223.0A CN112828474B (en) | 2020-12-31 | 2020-12-31 | Oblique cutting compensation method and system for transparent brittle material |
PCT/CN2021/108527 WO2022142296A1 (en) | 2020-12-31 | 2021-07-27 | Oblique cutting compensation method and system for transparent brittle material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011626223.0A CN112828474B (en) | 2020-12-31 | 2020-12-31 | Oblique cutting compensation method and system for transparent brittle material |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112828474A CN112828474A (en) | 2021-05-25 |
CN112828474B true CN112828474B (en) | 2022-07-05 |
Family
ID=75924555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011626223.0A Active CN112828474B (en) | 2020-12-31 | 2020-12-31 | Oblique cutting compensation method and system for transparent brittle material |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN112828474B (en) |
WO (1) | WO2022142296A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112828474B (en) * | 2020-12-31 | 2022-07-05 | 武汉华工激光工程有限责任公司 | Oblique cutting compensation method and system for transparent brittle material |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3077462B2 (en) * | 1993-09-01 | 2000-08-14 | 日立電線株式会社 | How to cut glass |
ATE520495T1 (en) * | 2004-10-25 | 2011-09-15 | Mitsuboshi Diamond Ind Co Ltd | METHOD AND DEVICE FOR FORMING CRACKS |
JP5060880B2 (en) * | 2007-09-11 | 2012-10-31 | 三星ダイヤモンド工業株式会社 | Fragment material substrate cutting apparatus and method |
CN202062161U (en) * | 2011-03-28 | 2011-12-07 | 江苏金方圆数控机床有限公司 | Light path compensation system for laser cutting |
KR101519867B1 (en) * | 2011-06-28 | 2015-05-13 | 가부시키가이샤 아이에이치아이 | Device and method for cutting brittle member |
JP2015016998A (en) * | 2011-11-14 | 2015-01-29 | 旭硝子株式会社 | Method and apparatus for cutting glass plate |
CN102944931A (en) * | 2012-11-19 | 2013-02-27 | 中国电子科技集团公司第十一研究所 | Precise compensator for optical path |
US20150121960A1 (en) * | 2013-11-04 | 2015-05-07 | Rofin-Sinar Technologies Inc. | Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses |
EP3099640B1 (en) * | 2014-01-27 | 2022-01-12 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
US10131016B1 (en) * | 2014-08-14 | 2018-11-20 | Gentex Corporation | Laser system and process with buffer material |
JP6399568B2 (en) * | 2016-05-30 | 2018-10-03 | Biデザイン合同会社 | Manufacturing method of plate product and plate processing machine using the manufacturing method |
DE102016225602B3 (en) * | 2016-12-20 | 2018-05-09 | Sauer Gmbh | Method for processing a cutting plate and corresponding device for machining an insert |
CN206717293U (en) * | 2017-05-23 | 2017-12-08 | 深圳市众联智强科技有限公司 | A kind of glass-cutting Optical devices of new type auto change hot spot length and width |
US11401195B2 (en) * | 2018-03-29 | 2022-08-02 | Corning Incorporated | Selective laser processing of transparent workpiece stacks |
CN111151873A (en) * | 2018-11-06 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | Laser cutting device and method for brittle material |
CN209424743U (en) * | 2018-12-28 | 2019-09-24 | 武汉华工激光工程有限责任公司 | A kind of laser processing device |
CN112828474B (en) * | 2020-12-31 | 2022-07-05 | 武汉华工激光工程有限责任公司 | Oblique cutting compensation method and system for transparent brittle material |
-
2020
- 2020-12-31 CN CN202011626223.0A patent/CN112828474B/en active Active
-
2021
- 2021-07-27 WO PCT/CN2021/108527 patent/WO2022142296A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2022142296A1 (en) | 2022-07-07 |
CN112828474A (en) | 2021-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10201878B2 (en) | Laser cutting head with controllable collimator having movable lenses for controlling beam diameter and/or focal point location | |
KR100681390B1 (en) | A semiconductor wafer dicing and scribing system and appratus with a high speed laser beam focus positioning system to arbitrary 3D positions and laser beam diffraction system | |
CN101878088B (en) | Laser machining device | |
CN103030266B (en) | Laser cutting method and device | |
CN110681992B (en) | Adjustable broadband laser processing optical system and processing method | |
CN105149773B (en) | The processing method and device of a kind of clear glass | |
CN108788452A (en) | A kind of processing method and device of ultrafast ultraviolet laser transparent material | |
CN205733425U (en) | A kind of zoom laser scanning cutter sweep | |
CN102441739B (en) | The processing method of laser processing device, machined object and the dividing method of machined object | |
CN108788451A (en) | A kind of processing method and device of ultrafast laser transparent material | |
CN110977152A (en) | SLM double-laser combined machining system | |
CN206732372U (en) | A kind of ultrafast picosecond laser Precision Machining equipment of the more laser heads of large format | |
CN210967462U (en) | Adjustable broadband laser processing optical system | |
CN201529849U (en) | Laser double-surface synchronous processing system | |
CN112828474B (en) | Oblique cutting compensation method and system for transparent brittle material | |
CN109079348A (en) | A kind of processing method and device of ultrafast green laser transparent material | |
CN101497149A (en) | Laser flying focus scanning system | |
TW201343298A (en) | Laser processing device | |
TW201315556A (en) | Laser processing apparatus | |
US5194711A (en) | Cutting using high energy radiation | |
WO2022183668A1 (en) | Transversal cutting method and system for transparent brittle material | |
CN110900016B (en) | Complex micro-nano structure processing method based on laser separation | |
CN211554483U (en) | Three-dimensional dynamic focusing galvanometer device | |
CN209319014U (en) | A kind of multifocal laser processing device | |
CN214024057U (en) | Processing device for transparent material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |