CN209424743U - A kind of laser processing device - Google Patents
A kind of laser processing device Download PDFInfo
- Publication number
- CN209424743U CN209424743U CN201822240726.9U CN201822240726U CN209424743U CN 209424743 U CN209424743 U CN 209424743U CN 201822240726 U CN201822240726 U CN 201822240726U CN 209424743 U CN209424743 U CN 209424743U
- Authority
- CN
- China
- Prior art keywords
- laser
- adjustment mechanism
- personal computer
- industrial personal
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model relates to a kind of laser processing devices, including laser, total reflection mirror, beam expanding lens, adjustment mechanism, energy regulator and industrial personal computer.Laser can emit laser beam, total reflection mirror is for changing beam direction, beam expanding lens is used to expand and collimated laser beam, adjustment mechanism is used to adjust the polarization direction of laser beam, so that the polarization direction of laser beam is consistent with the machine direction of laser beam, energy regulator it is adjustable transmitted through laser power, can reach ideal power when being cut along different crystal orientations.Industrial personal computer and the laser, the adjustment mechanism and energy regulator connection control the adjustment mechanism adjustment laser polarization direction and the control energy regulator adjust the power of the laser beam for controlling the laser transmitting laser beam.
Description
Technical field
The utility model relates to laser processing device fields, in particular to a kind of smart phone camera sapphire
The abnormity cutting device of cover board.
Background technique
Sapphire crystal is aluminium oxide, belongs to trigonal system, and hexagonal structure, hardness is very high, has good translucency, heat
Conductibility and electric insulating quality, mechanics good mechanical property, and have the characteristics that wear-resisting and weather-proof, pure artificial sapphire
Clear, colorless is presented in crystal.The fusing point of sapphire crystal is very high, and chemical property is also highly stable, brilliant as a kind of important technology
Body has been widely used in many fields such as scientific and technical, national defence and civilian industry, electronic technology.
The camera cover of smart phone had begun generally using sapphire crystal in recent years, but sapphire crystal is good
Good physics and chemical property is also that its machine-shaping brings difficulty, sapphire crystal high quality, efficient processing side
Method has become research emphasis.At present using extensive processing method be using picosecond or altra-fast fs laser transparent crisp
Filament effect in property material, the transparent material hard and crisp to glass, sapphire etc. are cut, and zero draft, several may be implemented
The not processing effect of chipping.Sapphire crystal belongs to monocrystalline, there is different crystal orientation in a different direction, laser is not along
Same crystal orientation cutting has different effects, and by test, different laser linear polarizations and different laser energies all can
Influence the cutting effect of each crystal orientation.The sapphire wafer to be cut that factory provides is mostly rectangle, along rectangular length
Side is the M crystal orientation of sapphire crystal, is the A crystal orientation of sapphire crystal along short side.When laser linear polarization and cutting track are protected
Cutting effect is obviously improved when holding consistent；Bigger laser energy is needed compared with the cutting of M crystal orientation along the cutting of sapphire crystal A crystal orientation.
It is for example round when needing to cut special-shaped figure on sapphire crystal in traditional laser filament cutting method
When, cut direction is almost changing always, and the linear polarization of laser remains constant, so that along M crystal orientation and A
Effect is inconsistent when crystal orientation and crystal orientation between them are cut, and product after final sliver is caused to be easier to occur not
It is good.Using the processing unit (plant) and method of the application, it is ensured that cutting while make laser linear polarization always with cutting
Direction is consistent, and improves cut quality and cutting efficiency.When being cut along sapphire crystal different crystal orientations, due to sapphire
The intensity of different crystal orientations, to the absorption of laser and different from the reaction that laser mutually occurs, the laser energy needed is also different, adopts
With the processing unit (plant) and method of the application, laser energy can be changed while cutting sapphire different crystal orientations, it is whole to improve
Cut quality.
Utility model content
In view of the above problems, the utility model provides a kind of laser processing device, thus it is possible to vary final cutting sapphire
The laser energy of crystal is whole to improve cut quality to adapt to the cutting along different crystal orientations.
To achieve the goals above, the utility model adopts the following technical solutions:
A kind of laser processing device, comprising:
Laser can emit laser beam；
Beam expanding lens so that the hot spot of the laser beam expands, while making the laser beam for expanding and collimating
Diverging reduces；
The adjustment mechanism being set on the emitting light path of the beam expanding lens makes for adjusting the polarization direction of laser beam
The laser linear polarization for obtaining most Zhongdao work top is consistent with cutting track always；
The energy regulator being set on the emitting light path of the adjustment mechanism, the energy regulator include polarization spectro
Prism (PBS) and driving device, the driving device are cylinder actuator, and PBS crystal is mounted on the cylinder actuator, institute
It states cylinder actuator to connect with the industrial personal computer, the industrial personal computer can control cylinder actuator to be when needed sent to PBS crystal
In laser optical path, not needing the used time be can be retracted back to except optical path；
The cutting head being set on the emitting light path of the energy regulator, for the hot spot after expanding to be focused into energy
The focal beam spot of very high density is finally reached into the purpose of silk cutting；And
Industrial personal computer, the industrial personal computer include master controller and DC power system, the master controller and the direct current
Source system, the adjustment mechanism, the laser and energy regulator connection, for controlling motor operation, control laser
Device shines, monitors motor control state, the DC power system and the master controller, the adjustment mechanism, the energy
Adjuster, laser connection, for being the master controller, the adjustment mechanism, the energy regulator, the laser
Device provides power supply.
In above-mentioned laser processing device, for laser by PBS crystal, the component of only specific linear polarization can be saturating
Penetrate over, component normal thereto can reflect, i.e., transmitted through the laser power of laser beam can be with incident laser light
The change of the polarization direction of beam and change, and then influence the laser power of final cutting sapphire crystal.
The adjustment mechanism includes rotating electric machine and the half-wave for being mounted on rotating electric machine one end in one of the embodiments,
Piece, the rotating electric machine is hollow rotating electric machine, and the half-wave plate can be driven to rotate, and the half-wave plate is in laser optical path
On, thus it is possible to vary the polarization direction of laser beam.
The adjustment mechanism further includes motor driver in one of the embodiments, the motor driver with it is described
Rotating electric machine and industrial personal computer connection, the industry control function calculates the change of motion profile angle by software, according to reflecting
The relationship of penetrating calculates the angle that half-wave plate should rotate, and issues instructions to the motor driver, and rotating electric machine is made to drive half-wave
Piece rotates suitable angle, so that the laser linear polarization of most Zhongdao work top is consistent with cutting track always.
The adjustment mechanism further includes linear motor and the motor driver and the work in one of the embodiments,
The connection of control machine, the linear motor control cutting movement track, and motion trace data is collected by the industrial personal computer.
The industrial personal computer includes electrical control division and Industry Control portion, the Industry Control in one of the embodiments,
Portion is connect with the electrical control division, electrical control division described in the Industry Control portion energy Detection & Controling, the electrical control
Portion can control the laser, the adjustment mechanism and the energy regulator and for the laser, the adjustment mechanism and
The energy regulator provides power supply, and the Industry Control portion has computer attribute and feature, can when processing special pattern,
The change that motion profile angle is calculated by software calculates the angle that half-wave plate should rotate according to mapping relations, and issues
It instructs to the electrical control division.
The laser is picosecond infrared laser, wavelength 1064nm, single pulse width in one of the embodiments,
Mean power is 30W, Laser output mouth hot spot 4mm under 10ps or so, 100kHz frequency.
It is 3X that the beam expanding lens, which expands multiplying power, in one of the embodiments, and the spot size after expanding and collimating is
12mm。
This application involves a kind of laser processing device is arrived, anyone skilled in the art is disclosed by the application
In technical scope, method, apparatus that any changes or substitutions that can be easily thought of and applied material etc. should all cover in the application
Protection scope within.
While laser, which scans shape on sapphire crystal, to be cut, industrial personal computer issues instructions to motor driver
Driving rotating electric machine is synchronized according to cutting track with mounted half-wave plate and is rotated, make laser linear polarization always with
Cutting track is consistent, and then completes the cutting of higher quality, higher efficiency.In laser optical path, put after rotating electric machine
Set a PBS, when the laser of linear polarization passes through PBS, can transmitted through laser energy can changing with polarization direction
Become and change, and then influence the laser energy of final cutting sapphire crystal, can be used when being cut along different crystal orientations
The laser energy being more suitable for.
To enable the above objects, features, and advantages of the utility model to be clearer and more comprehensible, preferred embodiment is cited below particularly, and
Cooperate appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to the scope of the utility model as.
Fig. 1 is that polarization direction changes when a kind of linearly polarized light provided by the embodiment of the utility model passes through half-wave plate
Schematic diagram；
Fig. 2 is the laser that a kind of laser provided by the embodiment of the utility model passes through specific linear polarization when PBS crystal
Reflection and transmission case schematic diagram；
Fig. 3 is a kind of structural schematic diagram of sapphire laser processing unit (plant) provided by the embodiment of the utility model；
Fig. 4 is the module frame chart of sapphire laser processing unit (plant) partial structurtes shown in Fig. 3.
In figure: 300- adjustment mechanism；301- laser；302- total reflection mirror；303- beam expanding lens；304- rotating electric machine；
305- energy regulator；306- cutting head；307- job platform；308- linear motor；309- motor driver；400- industry control
Machine.
Specific embodiment
Below in conjunction with attached drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear
Chu is fully described by, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole realities
Apply example.The component of the utility model embodiment being usually described and illustrated herein in the accompanying drawings can be come with a variety of different configurations
Arrangement and design.Therefore, the detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit below
The range of claimed invention, but it is merely representative of the selected embodiment of the utility model.Based on the utility model
Embodiment, those skilled in the art's every other embodiment obtained without making creative work, all
Belong to the range of the utility model protection.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
Embodiment
Please also refer to Fig. 1 to Fig. 4.The laser processing device of the utility model embodiment includes 301,45 ° of laser complete
Reflecting mirror 302, beam expanding lens 303, adjustment mechanism 300, PBS crystal, cutting head 306, processing platform and control assembly, laser
301 for emitting laser, and laser beam injects beam expanding lens after 45 ° of two secondary reflections of total reflection mirror and is amplified and collimates, then
After being adjusted mechanism 300 and PBS crystal, it is focused to fall in the laser facula in work top via cutting head 306.
Laser 301 is picosecond infrared laser, and the laser beam launched is linearly polarized light, the pulse of laser 301
Wavelength is 1064nm, and single pulse width is 10ps or so, and mean power is 30W under 100kHz frequency, and Laser output mouth hot spot is straight
Diameter is 4mm.In other embodiments, laser 301 can be other types, such as carbon dioxide laser, laser 301
Pulse wavelength and power can according to actual processing product determine.
45 ° of total reflection mirrors 302 are set to laser emitting optical path, for changing beam direction, so that laser light incident arrives
Beam expanding lens.Specifically, when 45 ° of total reflection mirrors 302 are injected into optically thinner medium from optically denser medium using light, when incidence angle is greater than critical
When the C of angle, the phenomenon that reflection is without generating refraction is only generated, damage when light propagation is substantially reduced.
Beam expanding lens 303 is used to expand and collimation laser, and it is 3X, the hot spot after expanding and collimating that beam expanding lens 303, which expands multiplying power,
Size is 12mm.
Adjustment mechanism 300 is used to adjust the polarization direction of laser beam, so that the polarization direction of laser beam and laser light
The machine direction of beam is consistent.Specifically, adjustment mechanism 300 includes rotating electric machine 304, linear motor 308 and motor driver
309, motor driver 309 and rotating electric machine 304, linear motor 308 and industrial personal computer 400 are all connected with, and industrial personal computer 400 can be according to sharp
The machine direction of light light beam determines the umber of pulse of motor driver 309, and motor driver 309 is a kind of to convert angle for electric pulse
The executing agency of displacement, it can drive rotating electric machine 304 to rotate angle corresponding with umber of pulse, and drive linear motor 308
Linear motion.Motor driver 309 can external and motor, motor can also be built in, can also be dispensed, by industrial personal computer
400 directly control motor movement.
Rotating electric machine 304 is servo motor, and motor one end installs and fixes a piece of circular half-wave plate.Rotating electric machine 304
A set of control system is shared with the linear motor 308 of workbench, connects same motor driver 309 and industrial personal computer 400.Adding
When work special pattern, the change of motion profile angle is calculated by the software of industrial personal computer 400, calculates half according to mapping relations
The angle that wave plate should rotate, and issue instructions to motor driver 309 and arrive rotating electric machine 304 again, so that rotating electric machine 304 can
Half-wave plate is driven to rotate suitable angle, so that the laser linear polarization of most Zhongdao work top is kept with cutting track always
Unanimously.
Half-wave plate is a kind of with certain thickness birefringece crystal, can be revolved to the polarization direction of linearly polarized light
Turn, is still linearly polarized light by the light that half-wave plate transmits.If the vibration plane and half-wave platelet of laser beam when incident
Angle between body main cross section is θ, then swashing when appearing the vibration plane of the laser beam come after half-wave plate relative to incidence
The vibration plane of light light beam has rotated 2 θ angles.Principal section of crystal mentioned here refers to the direction of propagation of light and crystal in crystal
The plane that optical axis is constituted, when the angle θ is acute angle or is equal to 0 °, when incident between the vibration plane and principal section of crystal of laser beam
Angle when angle is equal to incident between the vibration plane and the optical axis of crystal of laser beam.It is noted that the optical axis of crystal is different
Optical axis in geometric optics, the optical axis of crystal are a directions in aeolotropic crystal, light beam when this direction is propagated not
It can occur birefringent.
Therefore, in the present embodiment, by rotatable halfwave plate, the polarization direction of laser beam just can be changed.In addition to this
Mode in other embodiments can also be sharp to change by the turner of two plane mirrors and the one of plane mirror of rotation
The polarization direction of light light beam.Or linearly polarized light is converted to by circular polarization using a quarter half-wave plate and phase delay mirror
Light.
Energy regulator 305, for adjust transmitted through laser power, to reach the effect cut with ideal power
Fruit.
In the utility model embodiment, energy regulator 305 includes PBS crystal and driving device, and PBS crystal passes through
Physical contact is fixed in driving device.PBS crystal is a kind of a branch of incident light to be divided into mutually perpendicular two beam in the direction of propagation
The optical element of light, the two-beam separated is all linearly polarized light, and polarization direction is orthogonal.PBS crystal, which is mounted on, passes through gas
In the driving device of cylinder driving, when needing driving device described in the used time that PBS crystal is sent in laser optical path, used time receipts are not needed
It returns to except optical path.Energy regulator 305 is connect with industrial personal computer 400, in laser optical path, when the laser of linear polarization passes through
When PBS, can transmitted through laser power can change with the change of polarization direction, and then it is brilliant to influence final cutting sapphire
The laser power of body.Track and driving electric rotating are calculated by the software of industrial personal computer 400 when being cut along different crystal orientation
Machine rotate it is adjustable transmitted through laser power, to achieve the effect that be cut with ideal power.
Cutting head 306, in the present embodiment, cutting head 306 are a focus lens group, are cut for transparent fragile material at silk
It cuts, Filament effect is exactly picosecond or femto-second laser pulse when transmitting in air medium, due to self-focusing effect and ionized air
The plasma bring defocusing effect collective effect that generates afterwards and reach a kind of dynamic equilibrium so that picosecond or altra-fast fs swash
Light pulse forms very long, relatively stable laser channeling in air.The cutting head 306, for by the 12mm after expanding
Hot spot is focused into the high focal beam spot of energy density, so that focal beam spot is in material internal by moving up and down Z axis, formed at
Silk effect, is finally reached into the purpose of silk cutting.
Job platform 307, at silk cutting target loading at, the job platform 307 is to be fixed on the straight of interconnection
Plane machining plate on line motor 308, when cutting, the industrial personal computer control linear motor 308 drives job platform 307 by cutting
Track is mobile, while industrial personal computer calculates the change of motion profile angle by software, calculates half-wave plate according to mapping relations and answers
The angle of rotation, and the instruction comprising umber of pulse information is issued to motor driver 309, motor driver 309 controls electric rotating
Machine 304 rotates corresponding with umber of pulse angle so that the laser linear polarization of most Zhongdao job platform 307 always with cutting
Track is consistent.
Motor driver 309 is connect, for receiving industry control with industrial personal computer 400 and rotating electric machine 304 with linear motor 308
The instruction of machine 400 drives rotating electric machine 304 and linear motor 308 to complete corresponding actions according to the instruction that industrial personal computer 400 issues.
Industrial personal computer 400, including master controller and DC power system, the master controller include processor, patrol on a large scale
Volume circuit, memory, computer and control panel part, the master controller and the DC power system, the adjustment mechanism,
The laser and energy regulator connection, for controlling motor operation, control laser shines, monitoring motor control shape
State, the DC power system are connect with the master controller, the adjustment mechanism, the energy regulator, the laser,
For providing power supply for the master controller, the adjustment mechanism, the energy regulator, the laser.
It is often had a problem that in linearly polarized light process；Metal material is inclined to the absorptivity of laser and laser
Vibration has a great impact.When the polarization direction of laser beam is consistent with the machine direction of laser beam, metal material is to laser
Absorptivity highest, when the polarization direction of laser beam is vertical with the machine direction of laser beam, metal material is to laser
Absorptivity is minimum.It shows as on product, when the polarization direction of laser beam is consistent with the machine direction of laser beam, processes
The wire casing come is deeper.
For the laser processing device of the present embodiment, adjustment mechanism 300 has the function of adjusting light beam polarization direction,
To which on different laser processing directions, adjustment mechanism 300 can make the polarization direction of laser beam and adding for laser beam
Work direction is consistent, and then can guarantee that the processing effect of all directions in laser processing is consistent, improves machining accuracy.And
And in the case where processing the wire casing of same depth, it is different from laser processing direction with the polarization direction of traditional laser beam
Device compare, energy needed for the laser processing device of the present embodiment is smaller, and processing efficiency is higher.
In the present embodiment, it is possible to which PBS crystal disengaging laser optical path can be driven by driving device by measuring adjuster 305.Sapphire
Crystal belongs to monocrystalline, there is different crystal orientation in a different direction, and laser has different effects along different crystal orientation cuttings,
By test, different laser linear polarizations and different laser powers can all influence the cutting effect of each crystal orientation, specifically
For, bigger laser power is needed compared with the cutting of M crystal orientation along the cutting of sapphire crystal A crystal orientation.It is cut along different crystal orientations
When, track is calculated by the software of industrial personal computer 400 and drive rotating electric machine rotate it is adjustable transmitted through power, to reach use
The effect that ideal power is cut.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model application range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the present utility model application.
Claims (10)
1. a kind of laser processing device characterized by comprising
Laser, for emitting laser beam；
Adjustment mechanism, for adjusting the polarization direction of laser beam so that the polarization direction of laser beam and laser beam plus
Work direction is consistent；
Energy regulator, for adjusting the power of the laser beam；
Cutting head, for focusing the laser beam Jing Guo the energy regulator regulation power；And
Industrial personal computer, with the laser, the adjustment mechanism and energy regulator connection, the industrial personal computer control is described to swash
Light device emits laser beam, controls described in the adjustment mechanism adjustment laser polarization direction and the control energy regulator adjusting
The power of laser beam.
2. laser processing device according to claim 1, which is characterized in that the adjustment mechanism includes rotating electric machine and half
Wave plate, the rotating electric machine connect with the half-wave plate and are used to that the half-wave plate to be driven to rotate, and the half-wave plate is fixed thick
The birefringece crystal of degree is rotated for the linearly polarized light to vertical incidence.
3. laser processing device according to claim 2, which is characterized in that the adjustment mechanism further includes motor driven
Device, the motor driver are connect with the rotating electric machine and the industrial personal computer, and the industrial personal computer is according to the processing of laser beam
Motor driver described in direction controlling drives the rotating electric machine rotation.
4. laser processing device according to claim 3, which is characterized in that the adjustment mechanism further includes and the motor
Driver and industrial personal computer connection, for installing the linear motor of object to be cut, the industrial personal computer controls the motor
Driver drives the linear motor that crystal to be cut is driven to move along cutting track.
5. laser processing device according to claim 1, which is characterized in that the energy regulator includes polarization spectro rib
Mirror and driving device, the driving device are connect with the polarization splitting prism and the industrial personal computer, and the industrial personal computer controls institute
State driving device and the polarization splitting prism moved in and out into laser optical path, the polarization splitting prism for adjust transmitted through
Laser power.
6. laser processing device according to claim 5, which is characterized in that the industrial personal computer includes master controller and direct current
Power-supply system, the master controller and the DC power system, the adjustment mechanism, the laser and the energy adjustment
Device connection, for controlling motor operation, control laser shines, monitoring motor control state, the DC power system and institute
Master controller, the adjustment mechanism, the energy regulator, laser connection are stated, for for the master controller, described
Adjustment mechanism, the energy regulator, the laser provide power supply.
7. laser processing device according to claim 1, which is characterized in that the laser is picosecond infrared laser,
The laser pulse wavelength is 1055-1075nm, and single pulse width is within 10ps.
8. laser processing device according to claim 6, which is characterized in that it further include beam expanding lens, the beam expanding lens setting
In on the emitting light path of the laser, for expanding and collimated laser beam.
9. laser processing device according to claim 8, which is characterized in that it further include total reflection mirror, the total reflection mirror
It is set to the laser optical path between the laser and the beam expanding lens and between the polarization splitting prism and the cutting head
In.
10. laser processing device according to claim 1, which is characterized in that the cutting head includes movably being used for
Hot spot after expanding is focused into the focus lens group of focal beam spot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822240726.9U CN209424743U (en) | 2018-12-28 | 2018-12-28 | A kind of laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822240726.9U CN209424743U (en) | 2018-12-28 | 2018-12-28 | A kind of laser processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209424743U true CN209424743U (en) | 2019-09-24 |
Family
ID=67974475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822240726.9U Active CN209424743U (en) | 2018-12-28 | 2018-12-28 | A kind of laser processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209424743U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110919174A (en) * | 2019-12-20 | 2020-03-27 | 武汉华工激光工程有限责任公司 | Rotary light path light beam device and rotary light path light beam system |
| CN112824003A (en) * | 2019-11-21 | 2021-05-21 | 大族激光科技产业集团股份有限公司 | Laser cutting method and device, computer equipment and storage medium |
| WO2022142296A1 (en) * | 2020-12-31 | 2022-07-07 | 武汉华工激光工程有限责任公司 | Oblique cutting compensation method and system for transparent brittle material |
| WO2023130873A1 (en) | 2022-01-04 | 2023-07-13 | 上海名古屋精密工具股份有限公司 | Laser processing method for superhard material, and apparatus and machine tool using same |
-
2018
- 2018-12-28 CN CN201822240726.9U patent/CN209424743U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112824003A (en) * | 2019-11-21 | 2021-05-21 | 大族激光科技产业集团股份有限公司 | Laser cutting method and device, computer equipment and storage medium |
| CN112824003B (en) * | 2019-11-21 | 2023-11-03 | 深圳市大族半导体装备科技有限公司 | Laser cutting method, laser cutting device, computer equipment and storage medium |
| CN110919174A (en) * | 2019-12-20 | 2020-03-27 | 武汉华工激光工程有限责任公司 | Rotary light path light beam device and rotary light path light beam system |
| CN110919174B (en) * | 2019-12-20 | 2021-06-25 | 武汉华工激光工程有限责任公司 | Rotary light path light beam device and rotary light path light beam system |
| WO2022142296A1 (en) * | 2020-12-31 | 2022-07-07 | 武汉华工激光工程有限责任公司 | Oblique cutting compensation method and system for transparent brittle material |
| WO2023130873A1 (en) | 2022-01-04 | 2023-07-13 | 上海名古屋精密工具股份有限公司 | Laser processing method for superhard material, and apparatus and machine tool using same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209424743U (en) | A kind of laser processing device | |
| CN106994557B (en) | A kind of laser-processing system and method that focal position of laser dynamic is controllable | |
| CN104380544B (en) | Carbon dioxide laser with fast power control | |
| CN107953027B (en) | A kind of femtosecond of pulse combined-nanosecond laser system of processing and processing method | |
| CN108581182A (en) | Laser processing device and method | |
| CN102810469B (en) | Splinter device and method of wafer | |
| CN103658993A (en) | Crystal silicon surface femtosecond laser selective ablation method based on electron dynamic control | |
| US11571767B2 (en) | Laser processing device and laser processing method | |
| KR101425492B1 (en) | Laser machining apparatus and method thereof | |
| CN211955982U (en) | High-precision continuously adjustable stable output laser power attenuation device | |
| US8422134B2 (en) | Dual pulsed light generation apparatus and method for dual pulsed lights generation thereof | |
| JP6817027B2 (en) | Laser processing equipment | |
| CN104503098A (en) | Laser beam combination system | |
| US10923873B2 (en) | Laser processing apparatus | |
| CN110253155A (en) | A kind of laser processing device of micro-crack control | |
| CN111116033A (en) | Laser filamentation drilling and ultrasonic wave splitting device and method for ultrathin glass | |
| CN104416284B (en) | A kind of laser-processing system | |
| US20070127029A1 (en) | Laser treatment apparatus | |
| CN115070201A (en) | Light splitting system and method capable of continuously distributing laser power | |
| CN202199930U (en) | Laser scanning device for processing micro-circular aperture based on electro-optical effect | |
| JP7146346B2 (en) | Laser processing equipment | |
| KR20210131510A (en) | Apparatus for forming line beam | |
| JP2021531507A (en) | Optical devices and methods for providing two offset laser beams | |
| CN211708419U (en) | Laser filamentation drilling and ultrasonic wave lobe of a leaf device of ultra-thin glass | |
| JPH11267873A (en) | Scan optical system of laser light and laser processing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |