CN111116033A - Laser filamentation drilling and ultrasonic wave splitting device and method for ultrathin glass - Google Patents
Laser filamentation drilling and ultrasonic wave splitting device and method for ultrathin glass Download PDFInfo
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- CN111116033A CN111116033A CN202010021355.4A CN202010021355A CN111116033A CN 111116033 A CN111116033 A CN 111116033A CN 202010021355 A CN202010021355 A CN 202010021355A CN 111116033 A CN111116033 A CN 111116033A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Health & Medical Sciences (AREA)
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to a laser filamentation drilling and ultrasonic wave splitting device and a method for ultrathin glass, which comprises an infrared picosecond laser used for providing Gaussian beams, an X-Y axis motion platform used for driving the ultrathin glass to move and an ultrasonic wave splitting device, wherein a beam expander used for reducing divergence angles and expanding light spots and a light path reflection unit used for reflecting laser beams and changing the propagation direction of the light beams are arranged on an output light path of the infrared picosecond laser; the ultrasonic wave lobe splitting device comprises an ultrasonic wave transducer for generating ultrasonic waves and a transmission medium for transmitting the ultrasonic waves to the ultra-thin glass, and the ultrasonic wave transducer is arranged above the motion track of the ultra-thin glass. Based on the filamentation cutting technology and controlling the light emission, the phenomenon of filaments is formed, and the separation of the defective materials and the ultrathin glass is realized by ultrasonic waves.
Description
Technical Field
The invention relates to a laser filamentation drilling and ultrasonic wave splitting device and a method thereof for ultrathin glass.
Background
At present, with the gradual development of electronic products such as tablet computers, smart phones, smart televisions and the like towards intellectualization, lightness, thinness and high performance, the demand for ultrathin glass is increasing, the requirement for processing is increasing at a rate of about 15% per year, the processing requirement for the ultrathin glass is increasing, and the processing patterns are increasing.
The main application fields of the ultrathin glass are ① electronic information fields, most display devices are ultrathin glass substrates, ② industrial camera holographic plate-making glass, camera cover plate glass, instrument and automobile instrument glass, ③ solar cell protective cover plate glass, solar power generation substrate glass, ④ medical glass, microscopes and the like, and the ultrathin glass is also very important in the field of national defense science and technology, and the cockpit display screen of Jian-20 is the ultrathin glass, an ultra-large area display screen, an ultra-sensitive touch screen and light weight, so that a pilot can better control a fighter plane.
When ultra-thin glass is used, it is often necessary to work it, and to drill it in addition to cutting it to the desired shape. At present, the common glass drilling process includes: laser drilling, hydrofluoric acid etch drilling, and mechanical tool drilling. However, glass is a brittle material, which is easily broken and chipped by using a conventional drill bit, and has low yield and low efficiency.
The laser drilling usually uses a vibrating mirror, and is matched with infrared laser or green laser to change the propagation direction of light beams, so that focused light spots move along a specific track on the surface and inside of glass, and finally the purpose of through holes is achieved.
With the development of times, glass is thinner and thinner, the processing precision, requirements and efficiency are higher and higher, and drilling and splitting equipment specially aiming at ultrathin glass is necessary and tends to be brought forward.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a laser filamentation drilling and ultrasonic splintering device and a method thereof for ultrathin glass.
The purpose of the invention is realized by the following technical scheme:
the laser filamentation drilling and ultrasonic wave lobe of a leaf device of ultra-thin glass, the characteristic is: the device comprises an infrared picosecond laser used for providing Gaussian beams, an X-Y axis motion platform used for driving ultrathin glass to move and an ultrasonic splitting device, wherein a beam expander used for reducing a divergence angle and expanding light spots and a light path reflection unit used for reflecting laser beams and changing the propagation direction of the light beams are sequentially arranged on an output light path of the infrared picosecond laser, a diffraction mirror, a focusing mirror and an objective lens are sequentially arranged on the output light path of the light path reflection unit, the focusing mirror is arranged on a Z axial linear motion unit, and the objective lens is right opposite to the ultrathin glass on the X-Y axis motion platform;
the ultrasonic wave lobe of a leaf device contains the transmission medium that is used for producing the ultrasonic wave transducer of ultrasonic wave and is used for transmitting the ultrasonic wave to ultra-thin glass, and ultrasonic wave transducer locates ultra-thin glass's motion orbit top.
Further, according to the laser filamentation drilling and ultrasonic wave splitting device for the ultrathin glass, the infrared picosecond laser is an infrared picosecond laser with the wavelength of 1064nm and the pulse width of 10-30 ps.
Further, in the above laser filamentation drilling and ultrasonic splitting device for ultra-thin glass, the optical path reflection unit includes a first 45 ° reflector, a second 45 ° reflector and a third 45 ° reflector, which are successively arranged.
Further, in the laser filamentation drilling and ultrasonic splintering device for the ultrathin glass, the X-Y axis motion platform comprises an X axis motion unit and a Y axis motion unit, the X axis motion unit comprises an X axis marble base, an X axis linear guide rail, an X axis connecting plate and an X axis linear motor for controlling the X axis connecting plate to move, the X axis linear guide rail and the X axis linear motor are installed on the X axis marble base, the X axis connecting plate is arranged on the X axis linear guide rail, and the X axis linear motor is in driving connection with the X axis connecting plate so as to control the X axis connecting plate to move along the X axis linear guide rail; the Y-axis motion unit comprises a Y-axis marble base, a Y-axis linear guide rail, a Y-axis connecting plate and a Y-axis linear motor for controlling the motion of the Y-axis connecting plate, the Y-axis linear guide rail and the Y-axis linear motor are arranged on the Y-axis marble base, the Y-axis connecting plate is arranged on the Y-axis linear guide rail, and the Y-axis linear motor is in driving connection with the Y-axis connecting plate so as to control the Y-axis connecting plate to move along the Y-axis linear guide rail; the Y-axis marble base is connected to the X-axis connecting plate.
Further, according to the laser filamentation drilling and ultrasonic wave splitting device for the ultrathin glass, the Z-axis linear motion unit comprises a Z-axis slide rail, a Z-axis motion block and a Z-axis drive unit for controlling the Z-axis motion block to move, the Z-axis motion block is arranged on the Z-axis slide rail, and the Z-axis drive unit is in driving connection with the Z-axis motion block so as to control the Z-axis motion block to move along the Z-axis slide rail.
Further, the laser filamentation drilling and ultrasonic wave lobe of the ultra-thin glass device, wherein, the ultrasonic wave lobe of the blade device contains ultrasonic transducer for producing ultrasonic wave, is used for transmitting the ultrasonic wave to the transmission medium of the ultra-thin glass after the laser filamentation drilling, and ultrasonic transducer locates above the movement track of the ultra-thin glass after the laser filamentation drilling.
The invention relates to a laser filamentation drilling and ultrasonic wave splitting method of ultrathin glass, an infrared picosecond laser outputs a Gaussian beam with the wavelength of 1064nm and the pulse width of 10-30 ps, a beam expander reduces the divergence angle and expands light spots, a light path reflecting device reflects the laser beam and changes the propagation direction of the beam, a diffraction mirror and a focusing mirror focus the light spots, the light spots with the diameter of 1-2 um are focused on the surface of the ultrathin glass and penetrate through the glass, and the ultrathin glass emits light once every fixed distance so as to form a point, and a crack is formed between the point and the point due to the self stress of the glass; the ultra-thin glass after the laser filamentation drilling is translated to be opposite to the position under the ultrasonic wave splitting device, the ultrasonic wave splitting device transmits ultrasonic waves to the ultra-thin glass after the laser filamentation drilling, and under the vibration action of the ultrasonic waves, the residual materials are separated from the ultra-thin glass, and through holes are naturally formed.
Furthermore, according to the laser filamentation drilling and ultrasonic wave splitting method for the ultrathin glass, the X-Y axis motion platform drives the ultrathin glass to translate, the Z-axis linear motion unit drives the focusing mirror to move up and down, and light spots are controlled to be focused on the ultrathin glass.
Furthermore, according to the laser filamentation drilling and ultrasonic wave splitting method for the ultrathin glass, the ultrasonic transducer is opposite to the ultrathin glass after the laser filamentation drilling to generate ultrasonic waves, the transmission medium transmits the ultrasonic waves to the ultrathin glass after the laser filamentation drilling, the ultrathin glass after the laser filamentation drilling is split under the action of the ultrasonic waves, and the residual materials are separated from the ultrathin glass to form the through hole.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and is embodied in the following aspects:
① the invention is based on filamentation cutting technology and scientifically controls light emission, the ultrafast ultrastrong laser pulse forms a filament phenomenon when passing through a transparent medium, when the focused infrared picosecond laser pulse acts on the ultrathin glass, a filament structure penetrating through the thickness of the glass is formed in the ultrathin glass, the original stress structure of the glass is broken, and then the separation of the residual material and the ultrathin glass is realized by an ultrasonic wave splinter device;
②, adopting PSO light emitting control mode, wherein the laser emits a pulse every time the workpiece moves a fixed distance, the fixed distance is point distance, the ultra-thin glass emits light every time the ultra-thin glass moves a fixed distance, thereby forming a point, and a crack is formed between the point and the point due to the self stress of the glass;
③ X-Y axis movement platform drives the ultra-thin glass to move horizontally, the ultra-thin glass after laser filamentation drilling is opposite to the ultrasonic transducer, the ultrasonic transducer generates ultrasonic wave, the transmission medium transmits the ultrasonic wave to the ultra-thin glass after laser filamentation drilling, the ultra-thin glass after laser filamentation drilling is cracked under the action of the ultrasonic wave, under the vibration action of the ultrasonic wave, the remnant is separated from the ultra-thin glass, and a through hole is formed naturally.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1: the laser light path schematic diagram of the device of the invention;
FIG. 2: the flow chart of ultrasonic wave lobe of a leaf is schematically shown.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms, etc. are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
The invention adopts an infrared picosecond laser, laser emitted from a laser port is reflected by a group of reflectors to reach a vertical cutting head, is focused to the surface of glass by a diffraction lens and a focusing lens and an objective lens to complete contour machining, and then is processed to a through hole by an ultrasonic wave splitting device.
As shown in fig. 1, the laser filamentation drilling and ultrasonic wave splitting device for ultra-thin glass comprises an infrared picosecond laser 8 for providing a gaussian beam, an X-Y axis motion platform 9 for driving a workpiece to move, and an ultrasonic wave splitting device 10, wherein a beam expander 1 for reducing a divergence angle and expanding a light spot, and a light path reflection unit for reflecting a laser beam and changing a propagation direction of the light beam are sequentially arranged on an output light path of the infrared picosecond laser 8, the light path reflection unit comprises a first 45-degree reflector 2, a second 45-degree reflector 3 and a third 45-degree reflector 4 which are sequentially connected, a diffraction mirror 5, a focusing mirror 6 and an objective lens 7 are sequentially arranged on the output light path of the light path reflection unit, the focusing mirror 6 is installed on a Z-axis linear motion unit, and the objective lens is right opposite to the workpiece on the X-Y axis motion platform 9; the ultrasonic wave lobe splitting device comprises an ultrasonic wave transducer for generating ultrasonic waves and a transmission medium for transmitting the ultrasonic waves to the ultra-thin glass, and the ultrasonic wave transducer is arranged above the motion track of the ultra-thin glass.
Wherein the infrared picosecond laser is an infrared picosecond laser with the wavelength of 1064nm and the pulse width of 10-30 ps.
The X-Y axis motion platform 9 comprises an X axis motion unit and a Y axis motion unit, the X axis motion unit comprises an X axis marble base, an X axis linear guide rail, an X axis connecting plate and an X axis linear motor for controlling the motion of the X axis connecting plate, the X axis linear guide rail and the X axis linear motor are arranged on the X axis marble base, the X axis connecting plate is arranged on the X axis linear guide rail, and the X axis linear motor is in driving connection with the X axis connecting plate so as to control the X axis connecting plate to move along the X axis linear guide rail; the Y-axis motion unit comprises a Y-axis marble base, a Y-axis linear guide rail, a Y-axis connecting plate and a Y-axis linear motor for controlling the motion of the Y-axis connecting plate, the Y-axis linear guide rail and the Y-axis linear motor are arranged on the Y-axis marble base, the Y-axis connecting plate is arranged on the Y-axis linear guide rail, and the Y-axis linear motor is in driving connection with the Y-axis connecting plate so as to control the Y-axis connecting plate to move along the Y-axis linear guide rail; the Y-axis marble base is connected to the X-axis connecting plate.
The Z-axial linear motion unit comprises a Z-axial sliding rail, a Z-axial motion block and a Z-axial driving unit for controlling the Z-axial motion block to move, the Z-axial motion block is arranged on the Z-axial sliding rail, the Z-axial driving unit is in driving connection with the Z-axial motion block so as to control the Z-axial motion block to move along the Z-axial sliding rail, and the focusing mirror is installed on the Z-axial motion block.
And a power meter is arranged in the optical path and used for detecting the output power of the laser.
The ultrasonic wave splitting device 10 is used for separating the residual material from the ultra-thin glass, and comprises an ultrasonic wave transducer for generating ultrasonic waves and a transmission medium for transmitting the ultrasonic waves to the ultra-thin glass after laser filamentation drilling, wherein the ultrasonic wave transducer is arranged above the motion track of the ultra-thin glass after the laser filamentation drilling; the transfer medium is methanol, ethylene glycol or acetone.
A laser filamentation drilling and ultrasonic wave splitting process of ultrathin glass is characterized in that an infrared picosecond laser 8 outputs Gaussian beams with the wavelength of 1064nm and the pulse width of 10-30 ps, a beam expander 1 reduces the divergence angle and expands light spots, a light path reflecting device reflects the laser beams and changes the propagation direction of the light beams, finally, a diffraction mirror 5 and a focusing mirror 6 perform filamentation and light spot focusing, the light spots with the diameter of 1-2 um are focused on the surface of the ultrathin glass, the power density is extremely high, the ultrathin glass penetrates through the ultrathin glass, the light emitting mode is controlled by PSO, and light is emitted once every time the ultrathin glass walks by a fixed distance, so that a point is formed, and a crack is formed between the point and the point due to the self stress of; the X-Y axis motion platform 9 drives the ultrathin glass to translate, and the Z axis linear motion unit drives the focusing mirror 6 to move up and down, so that light spots are controlled to be focused on the ultrathin glass.
The X-Y axis motion platform 9 drives the ultrathin glass to move horizontally, the ultrathin glass after laser filamentation drilling is opposite to the ultrasonic transducer, the ultrasonic transducer generates ultrasonic waves, the transmission medium transmits the ultrasonic waves to the ultrathin glass after laser filamentation drilling, the ultrathin glass after laser filamentation drilling is cracked under the action of the ultrasonic waves, under the vibration action of the ultrasonic waves, the residual materials are separated from the ultrathin glass, and through holes are formed naturally, as shown in figure 2, the holes are free of edge breakage, high in strength and high in precision.
In conclusion, the invention is based on the filamentation cutting technology and scientifically controls the light emission, the ultrafast and super-strong laser pulse forms a filament phenomenon when passing through a transparent medium, when the focused infrared picosecond laser pulse acts on the ultrathin glass, a filament structure penetrating through the thickness of the glass is formed in the ultrathin glass, the original stress structure of the glass is broken, and then the separation of the residual materials and the ultrathin glass is realized by the ultrasonic wave splinter device.
Adopting a PSO light emitting control mode, wherein when a workpiece moves a fixed distance, a laser emits a pulse, and the fixed distance is a point distance; the ultra-thin glass emits light once every certain distance, so that a point is formed, and a crack is formed between the point and the point due to the self stress of the glass.
The X-Y axis motion platform drives the ultrathin glass to move horizontally, the ultrathin glass after laser filamentation drilling is opposite to the ultrasonic transducer, the ultrasonic transducer generates ultrasonic waves, the transmission medium transmits the ultrasonic waves to the ultrathin glass after laser filamentation drilling, the ultrathin glass after laser filamentation drilling is cracked under the action of the ultrasonic waves, and under the vibration action of the ultrasonic waves, the residual materials are separated from the ultrathin glass, and through holes are formed naturally.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and shall be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (8)
1. Ultra-thin glass's laser filamentation drilling and ultrasonic wave lobe of a leaf device, its characterized in that: the device comprises an infrared picosecond laser used for providing Gaussian beams, an X-Y axis motion platform used for driving ultrathin glass to move and an ultrasonic splitting device, wherein a beam expander used for reducing a divergence angle and expanding light spots and a light path reflection unit used for reflecting laser beams and changing the propagation direction of the light beams are sequentially arranged on an output light path of the infrared picosecond laser, a diffraction mirror, a focusing mirror and an objective lens are sequentially arranged on the output light path of the light path reflection unit, the focusing mirror is arranged on a Z axial linear motion unit, and the objective lens is right opposite to the ultrathin glass on the X-Y axis motion platform;
the ultrasonic wave lobe of a leaf device contains the transmission medium that is used for producing the ultrasonic wave transducer of ultrasonic wave and is used for transmitting the ultrasonic wave to ultra-thin glass, and ultrasonic wave transducer locates ultra-thin glass's motion orbit top.
2. The laser filamentation drilling and ultrasonic splinter device of ultra-thin glass as claimed in claim 1, wherein: the infrared picosecond laser is an infrared picosecond laser with the wavelength of 1064nm and the pulse width of 10-30 ps.
3. The laser filamentation drilling and ultrasonic splinter device of ultra-thin glass as claimed in claim 1, wherein: the light path reflection unit comprises a first 45-degree reflector, a second 45-degree reflector and a third 45-degree reflector which are sequentially connected and arranged.
4. The laser filamentation drilling and ultrasonic splinter device of ultra-thin glass as claimed in claim 1, wherein: the X-Y axis motion platform comprises an X axis motion unit and a Y axis motion unit, the X axis motion unit comprises an X axis marble base, an X axis linear guide rail, an X axis connecting plate and an X axis linear motor for controlling the X axis connecting plate to move, the X axis linear guide rail and the X axis linear motor are installed on the X axis marble base, the X axis connecting plate is arranged on the X axis linear guide rail, and the X axis linear motor is in driving connection with the X axis connecting plate so as to control the X axis connecting plate to move along the X axis linear guide rail; the Y-axis motion unit comprises a Y-axis marble base, a Y-axis linear guide rail, a Y-axis connecting plate and a Y-axis linear motor for controlling the motion of the Y-axis connecting plate, the Y-axis linear guide rail and the Y-axis linear motor are arranged on the Y-axis marble base, the Y-axis connecting plate is arranged on the Y-axis linear guide rail, and the Y-axis linear motor is in driving connection with the Y-axis connecting plate so as to control the Y-axis connecting plate to move along the Y-axis linear guide rail; the Y-axis marble base is connected to the X-axis connecting plate.
5. The laser filamentation drilling and ultrasonic splinter device of ultra-thin glass as claimed in claim 1, wherein: the Z-axial linear motion unit comprises a Z-axial sliding rail, a Z-axial motion block and a Z-axial drive unit for controlling the Z-axial motion block to move, the Z-axial motion block is arranged on the Z-axial sliding rail, and the Z-axial drive unit is in driving connection with the Z-axial motion block so as to control the Z-axial motion block to move along the Z-axial sliding rail.
6. The method for realizing laser filamentation drilling and ultrasonic splintering of ultrathin glass by utilizing the device of claim 1 is characterized in that: the infrared picosecond laser outputs Gaussian beams with the wavelength of 1064nm and the pulse width of 10-30 ps, a beam expander reduces the divergence angle and expands light spots, a light path reflection device reflects the laser beams and changes the propagation direction of the light beams, then a diffraction mirror and a focusing mirror focus the light spots, the light spots with the diameter of 1-2 um are focused on the surface of the ultrathin glass and penetrate through the glass, light is emitted once every time the ultrathin glass moves a fixed distance, and therefore a point is formed, and a crack is formed between the point and the point due to the self stress of the glass; the ultra-thin glass after the laser filamentation drilling is translated to be opposite to the position under the ultrasonic wave splitting device, the ultrasonic wave splitting device transmits ultrasonic waves to the ultra-thin glass after the laser filamentation drilling, and under the vibration action of the ultrasonic waves, the residual materials are separated from the ultra-thin glass, and through holes are naturally formed.
7. The laser filamentation drilling and ultrasonic spalling method of ultra-thin glass as in claim 6, wherein: the X-Y axis motion platform drives the ultrathin glass to translate, and the Z-axis linear motion unit drives the focusing mirror to move up and down to control light spots to be focused on the ultrathin glass.
8. The laser filamentation drilling and ultrasonic spalling method of ultra-thin glass as in claim 6, wherein: the ultrasonic transducer is opposite to the ultra-thin glass drilled by the laser filamentation to generate ultrasonic waves, the transmission medium transmits the ultrasonic waves to the ultra-thin glass drilled by the laser filamentation to enable the ultra-thin glass drilled by the laser filamentation to crack under the action of the ultrasonic waves, and the residual materials are separated from the ultra-thin glass to form through holes.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111718113A (en) * | 2020-06-28 | 2020-09-29 | 深圳泰德激光科技有限公司 | Glass cutting equipment |
| CN114230163A (en) * | 2021-12-27 | 2022-03-25 | 无锡超通智能制造技术研究院有限公司 | Assembly line glass laser flight cutting equipment |
| CN115385578A (en) * | 2022-07-29 | 2022-11-25 | 惠州市清洋实业有限公司 | Chemical punching manufacturing process for camera lens |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103288340A (en) * | 2013-05-20 | 2013-09-11 | 深圳市华星光电技术有限公司 | Cutting and splintering device and method of glass substrate |
| WO2014041588A1 (en) * | 2012-09-14 | 2014-03-20 | オー・エム・シー株式会社 | Cutting method for electrode band for electronic component using laser beam and device for same |
| CN103964682A (en) * | 2013-01-28 | 2014-08-06 | 深圳市大族激光科技股份有限公司 | Method for cutting glass through laser |
| CN107953038A (en) * | 2017-12-27 | 2018-04-24 | 常州英诺激光科技有限公司 | Transparent fragile material process equipment |
| CN108127270A (en) * | 2017-12-29 | 2018-06-08 | 苏州德龙激光股份有限公司 | The laser-processing system and its method of glass screen body chamfering |
| CN211708419U (en) * | 2020-01-09 | 2020-10-20 | 苏州德龙激光股份有限公司 | Laser filamentation drilling and ultrasonic wave lobe of a leaf device of ultra-thin glass |
-
2020
- 2020-01-09 CN CN202010021355.4A patent/CN111116033A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014041588A1 (en) * | 2012-09-14 | 2014-03-20 | オー・エム・シー株式会社 | Cutting method for electrode band for electronic component using laser beam and device for same |
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