CN112824003A - Laser cutting method and device, computer equipment and storage medium - Google Patents
Laser cutting method and device, computer equipment and storage medium Download PDFInfo
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- CN112824003A CN112824003A CN201911150806.8A CN201911150806A CN112824003A CN 112824003 A CN112824003 A CN 112824003A CN 201911150806 A CN201911150806 A CN 201911150806A CN 112824003 A CN112824003 A CN 112824003A
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000003860 storage Methods 0.000 title claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 92
- 239000004973 liquid crystal related substance Substances 0.000 claims description 50
- 238000010587 phase diagram Methods 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 17
- 230000004888 barrier function Effects 0.000 claims description 14
- 238000004590 computer program Methods 0.000 claims description 13
- 230000010287 polarization Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005459 micromachining Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 19
- 239000013078 crystal Substances 0.000 description 14
- 229910052594 sapphire Inorganic materials 0.000 description 12
- 239000010980 sapphire Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- 230000006870 function Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
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- 238000012986 modification Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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Abstract
The invention relates to the field of laser micromachining, and discloses a laser cutting method, a laser cutting device, computer equipment and a storage medium, wherein the method comprises the following steps: modulating the phase of the p-polarized laser beam by a phase type spatial light modulator; focusing the p-polarized laser beam after phase modulation through a preset focusing light path to generate a cutting beam with a plurality of coaxial focuses; and cutting the cut object with the specified thickness by using a cutting beam, wherein all coaxial focuses of the cutting beam fall within the specified thickness. When the method provided by the invention is used for cutting the wafer, the oblique fracture angle of the wafer in the CH2 direction can be effectively reduced, and the yield of the Mini LED wafer in mass production is improved.
Description
Technical Field
The present invention relates to the field of laser micromachining, and in particular, to a laser cutting method and apparatus, a computer device, and a storage medium.
Background
In the field of LED wafer cutting, the cutting mode comprises invisible cutting and cutter wheel cutting. With the improvement of the cutting quality requirement, the invisible cutting gradually occupies the mainstream position of the cutting of the LED wafer.
The Mini LED is a display technology based on tiny LED crystal particles as pixel luminous points, and has the advantages of high efficiency, high brightness, high reliability, high response speed and the like. The Mini LED uses sapphire as a substrate. Sapphire is a crystal belonging to a trigonal system and having a hexagonal structure, and as shown in fig. 5, commonly used facets include a-Plane (a crystal Plane having a crystal Plane index of (1120) in the sapphire crystal structure), C-Plane (a crystal Plane having a crystal Plane index of (0001) in the sapphire crystal structure, which is parallel to the surface of the sapphire substrate) and R-Plane (a crystal Plane having a crystal Plane index of (1012) in the sapphire crystal structure). Wherein the A-Plane is perpendicular to the C-Plane, i.e., the substrate surface, and the R-Plane is not perpendicular to the C-Plane, i.e., the substrate surface.
As one of the stealth cuts, the single focus cut has the following characteristics: when the sapphire substrate is cut along the CH1 direction (the shape of the complete LED wafer has a flat edge, the CH1 direction is parallel to the flat edge and the A-Plane), the sapphire substrate does not generate oblique cracking in the direction (the substrate is cracked along the A-Plane); when the sapphire substrate is cut along the CH2 direction (the CH2 direction is perpendicular to the CH1 direction and parallel to the R-Plane), the sapphire substrate is very prone to oblique fracture in this direction (the substrate is fractured along the R-Plane) and the magnitude of the oblique fracture angle is difficult to control.
Because the Mini LED has a small size and a thin thickness, the quality requirement for wafer dicing is also high (the requirement for the bevel angle in the CH2 direction is less than 2 °), and thus, the requirement for the Mini LED dicing cannot be met by using the existing single focus dicing.
Disclosure of Invention
In view of the above, it is desirable to provide a laser dicing method, apparatus, computer device and storage medium for reducing the bevel angle of wafer dicing.
A laser cutting method, comprising:
modulating the phase of the p-polarized laser beam by a phase type spatial light modulator;
focusing the p-polarized laser beam after phase modulation through a preset focusing light path to generate a cutting beam with a plurality of coaxial focuses;
and cutting the cut object with the specified thickness by using the cutting beam, wherein all the coaxial focuses of the cutting beam fall within the specified thickness.
A laser cutting device comprising:
the phase modulation module is used for modulating the phase of the p-polarized laser beam through the phase type spatial light modulator;
the focusing module is used for focusing the p-polarized laser beam after the phase modulation through a preset focusing light path to generate a cutting beam with a plurality of coaxial focuses;
and the cutting module is used for cutting the cut object with the specified thickness by using the cutting beam, and all the coaxial focuses of the cutting beam fall into the specified thickness.
A computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the laser cutting method when executing the computer program.
A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, implements the above-mentioned laser cutting method.
The laser cutting method, the laser cutting device, the computer equipment and the storage medium solve the problem that the inclined crack angle in the CH2 direction is difficult to control when the Mini LED wafer is cut, and ensure the yield of the Mini LED wafer in mass production; meanwhile, the adjustment range of the number of the focuses is large, the number of the focuses of the cutting beams can be changed according to requirements, compared with a single Diffractive Optical Element (DOE) (only the specific coaxial and vertical number of the focuses can be generated), the diffractive optical element DOEs not need to be replaced, and the production efficiency of wafer cutting is improved; and the focal point distance of the cutting light beam is also adjustable, so that the cutting requirements of the Mini LED wafers with different thicknesses can be met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic flow chart of a laser cutting method according to an embodiment of the present invention;
FIG. 2 is a schematic optical path diagram of a laser cutting method according to an embodiment of the present invention;
FIG. 3 is a schematic view of a laser cutting apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a computer device in one embodiment of the invention;
FIG. 5 is a schematic structural diagram of each crystal plane of the sapphire crystal of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In one embodiment, as shown in fig. 1, there is provided a laser cutting method, including the steps of:
s10, modulating the phase of the p-polarized laser beam through a phase type spatial light modulator;
s20, focusing the p-polarized laser beam after phase modulation through a preset focusing light path to generate a cutting beam with a plurality of coaxial focuses in the vertical direction;
and S30, cutting the cut object with the specified thickness by using the cutting beam, wherein all the coaxial focuses of the cutting beam fall into the specified thickness.
In this embodiment, the core component of the phase type spatial light modulator is its liquid crystal panel. When the phase type spatial light modulator performs phase modulation on a laser beam, the laser beam incident on the liquid crystal screen is required to be p-polarized light. The phase type spatial light modulator is connected with a cutting equipment computer through an HDMI line, control software matched with the phase type spatial light modulator is started on the cutting equipment computer, a phase diagram matched with the thickness of a currently processed wafer is loaded on the control software, corresponding phase modulation can be carried out on a laser beam incident on a liquid crystal screen of the phase type spatial light modulator, and the laser beam after phase modulation is reflected.
The liquid crystal panel of the phase type spatial light modulator is mainly composed of many minute, independent pixel units, and the inside of the pixel units is filled with liquid crystal molecules. The phase diagram is designed by a programming language, and each pixel point forming the phase diagram has a modulation function. The principle of modulating the phase of the phase type spatial light modulator is as follows: when the phase type spatial light modulator is connected with a cutting equipment computer through an HDMI wire, after control software matched with the phase type spatial light modulator is started in the cutting equipment computer and a phase diagram is loaded in the control software, each pixel point forming the phase diagram corresponds to a pixel unit in a liquid crystal screen of the phase type spatial light modulator one by one, and each pixel unit can independently receive an electrical control signal transmitted after the phase diagram is loaded by the computer and change the arrangement state of liquid crystal molecules in the pixel unit according to the received signal. Since the liquid crystal has the optical characteristic of birefringence, when the arrangement state of the liquid crystal molecules is changed, the refractive index of the liquid crystal is changed, so that the refractive indexes of the liquid crystal inside the pixel units are different. Therefore, in the process that laser light enters the liquid crystal screen and is reflected out, when the laser light passes through the liquid crystal with different refractive indexes, an optical path difference (optical path length is equal to the geometric path length of light travel multiplied by the medium refractive index) is generated, and further a phase difference (phase difference is equal to the optical path difference multiplied by 2 pi/lambda, and lambda is the laser wavelength) is caused, so that the phase modulation of the laser beam is realized.
In one embodiment, the predetermined focusing optical path may include two convex lenses, a focusing objective lens and several reflecting mirrors. The p-polarized laser beam after phase modulation can be focused into a plurality of coaxial focuses in the direction vertical to the horizontal plane (allowing certain deviation) after the action of the convex lens and the focusing objective lens in the preset focusing light path, so as to form a cutting beam. The number of focuses and the focus distance of the cutting beam can be adjusted by obtaining a new phase diagram by modifying the content of the programming language for designing the phase diagram. In some cases, the number of foci may be 1-6.
When the cutting beam is used for cutting the cut object, each focus is equivalent to a cutting point and corresponds to a modified layer on the cut section of the cut object. The object to be cut may be a wafer. The multi-focus is used for cutting the wafer, so that the inclined crack angle of the wafer in the CH2 direction can be effectively controlled within 2 degrees. In order to ensure that the cutting point of the cutting beam acts on the interior of the sapphire substrate, the positions of all coaxial focuses of the cutting beam are required to be adjusted by the cutting equipment so that all the coaxial focuses fall within the thickness range of the wafer. Because no oblique crack is generated in the CH1 direction, the number of focuses of the cutting light beams can be 1-3; the CH2 direction will generate oblique crack, which can be cut by 2-6 focus cutting beams. In the actual cutting process, the selection of the number of the focus points can be determined according to the thickness of the wafer, and the process parameters such as the laser frequency, the cutting power, the cutting depth and the cutting speed can be set by self.
The laser cutting method provided by the embodiment of the invention solves the problem that the inclined crack angle in the CH2 direction is difficult to control when the Mini LED wafer is cut, and ensures the yield of the Mini LED wafer in mass production; meanwhile, the adjustment range of the number of the focuses is large, the number of the focuses of the cutting beams can be changed according to requirements, compared with a single Diffractive Optical Element (DOE) (only the specific coaxial and vertical number of the focuses can be generated), the diffractive optical element DOEs not need to be replaced, and the production efficiency of wafer cutting is improved; and the focal point distance of the cutting light beam is also adjustable, so that the cutting requirements of the Mini LED wafers with different thicknesses can be met.
Optionally, step S10 includes:
and if the laser beam with the specified wavelength is the s-polarized laser beam, converting the s-polarized laser beam into the p-polarized laser beam through a half-wave plate.
In this embodiment, the phase-type spatial light modulator requires that the incident beam be a p-polarized laser beam. Therefore, when the laser beam generated by the laser light source is the S-polarized laser beam, the S-polarized laser beam needs to be converted into the p-polarized laser beam by using a half-wave plate, and the converted p-polarized laser beam is the p-polarized laser beam in step S10; if the laser beam generated by the laser light source is a p-polarized laser beam, the half-wave plate is not needed, and the laser beam is the p-polarized laser beam in step S10. The half-wave plate refers to a birefringent crystal having a thickness such that when normally incident light is transmitted, the phase difference between ordinary light (o-light) and extraordinary light (e-light) is equal to pi or an odd multiple thereof. The half-wave plate is also called a half-wave plate.
Optionally, if the laser beam with the specified wavelength is an s-polarized laser beam, the s-polarized laser beam is converted into the p-polarized laser beam by a half-wave plate, further comprising:
a polarization beam splitter prism and a light barrier are arranged on a light path behind the half-wave plate, and the light barrier is arranged in the reflection direction of the laser beam after passing through the half-wave plate and entering the polarization beam splitter prism;
and adjusting the rotation angle of the half-wave plate so that the brightness of the laser beam reflected on the light barrier by the half-wave plate is at the minimum value.
In this embodiment, a Polarization Beam Splitter (PBS) and a light barrier (baffle) may be disposed on the light path after the half-wave plate. As shown in fig. 2, when the half-wave plate is rotated, the brightness of the laser beam (p-polarized) in the transmission direction of the polarization beam splitter changes alternately, and the brightness of the laser beam (s-polarized) in the reflection direction changes alternately, but the changes are reversed. And adjusting the rotation angle of the half-wave plate, and reducing the brightness of the laser beam reflected on the light barrier after passing through the half-wave plate as much as possible so as to increase the proportion of the s-polarized laser beam converted into the p-polarized laser beam. After the adjustment is finished, the polarization beam splitter prism and the light barrier are kept in the light path, on one hand, the laser which is incident on the liquid crystal screen of the phase type spatial light modulator can be ensured to be p-polarized light, and on the other hand, the proportion of the s-polarized laser beam which is converted into the p-polarized laser beam cannot be ensured to be 100%, so that the light barrier is used for blocking possible weak laser in the reflection direction of the polarization beam splitter prism.
Optionally, before modulating the phase of the p-polarized laser beam by the phase-type spatial light modulator, the method further includes:
and expanding the beam diameter of the p-polarized laser beam through a beam expander.
In this embodiment, the Beam diameter of the p-polarized laser Beam can be enlarged by a Beam Expander (Beam Expander), and the divergence angle of the Beam can be adjusted. Since the diameter of a laser beam incident on the liquid crystal panel of the phase type spatial light modulator is required to be as large as possible, it is necessary to enlarge the beam diameter of the p-polarized laser beam using a beam expander.
In one embodiment, a beam expander may be used to expand the diameter of the p-polarized laser beam by a factor of 2, and the expanded laser beam may be collimated (with a low divergence angle) as the original beam. After the beam expansion, the diameter of the laser beam is basically similar to the length of the short side of the liquid crystal screen of the phase type spatial light modulator.
Optionally, the expanding the beam diameter of the p-polarized laser beam by a beam expander comprises:
adjusting the expansion ratio of the beam expander so that the difference value between the diameter of the expanded p-polarized laser beam and the length of the short side of the liquid crystal screen of the phase type spatial light modulator is within a preset range;
and adjusting the position of a liquid crystal screen of the phase type spatial light modulator so as to enable the p-polarized laser beam projected on the liquid crystal screen to completely fall into the liquid crystal screen, wherein the center of the p-polarized laser beam is coincided with the center of the liquid crystal screen.
In this embodiment, when the phase type spatial light modulator is used, it is required that the diameter of the light beam incident on the liquid crystal panel of the phase type spatial light modulator should be as close as possible to the length of the short side of the liquid crystal panel (the liquid crystal panel is rectangular), so that the phase modulation accuracy of the phase type spatial light modulator can be improved. At this time, the difference between the diameter of the expanded p-polarized laser beam and the length of the short side of the liquid crystal panel of the phase type spatial light modulator is 0. The preset range can be set according to the requirement, such as 0-3 mm (here refers to the range of the absolute value of the difference).
In some embodiments, the liquid crystal panel of the phase type spatial light modulator may be fixed on a bracket, and the incident laser beam may be accurately emitted to the center of the liquid crystal panel by adjusting the height of the bracket up and down and adjusting the position of the bracket left and right, thereby ensuring that the spot pattern formed by the p-polarized laser beam after modulating the phase is uniform and circularly symmetric.
Optionally, step S10 includes:
connecting the phase type spatial light modulator with a cutting equipment computer through an HDMI line, starting control software adapted to the phase type spatial light modulator on the cutting equipment computer, and loading a preset phase diagram;
and the phase type spatial light modulator modulates the phase of the p-polarized laser beam through the phase diagram to obtain the p-polarized laser beam after the phase is modulated.
In this embodiment, the liquid crystal panel of the phase-type spatial light modulator is mainly composed of many tiny, independent pixel units, and the inside of these pixel units is filled with liquid crystal molecules; the phase diagram is designed by a programming language, and each pixel point forming the phase diagram has a modulation function. The principle of modulating the phase of the phase type spatial light modulator is as follows: when the spatial light modulator is connected with a cutting device computer through an HDMI wire, after control software adapted to the spatial light modulator is started in the cutting device computer and a phase diagram is loaded in the control software, each pixel point forming the phase diagram corresponds to a pixel unit in a liquid crystal screen of the spatial light modulator one by one, and each pixel unit can independently receive an electrical control signal transmitted after the phase diagram is loaded by the computer and change the arrangement state of liquid crystal molecules in the pixel unit according to the received signal. Since the liquid crystal has the optical characteristic of birefringence, when the arrangement state of the liquid crystal molecules is changed, the refractive index of the liquid crystal is changed, so that the refractive indexes of the liquid crystal inside the pixel units are different. Therefore, in the process that laser light enters the liquid crystal screen and is reflected out, when the laser light passes through the liquid crystal with different refractive indexes, an optical path difference (optical path length is equal to the geometric path length of light travel multiplied by the medium refractive index) is generated, and further a phase difference (phase difference is equal to the optical path difference multiplied by 2 pi/lambda, and lambda is the laser wavelength) is caused, so that the phase modulation of the laser beam is realized.
Optionally, step S20 includes:
the focusing objective lens, a plurality of convex lenses and a plurality of reflectors are arranged;
and the p-polarized laser beam after phase modulation is acted by the convex lens and the focusing objective lens to obtain the cutting beam with a plurality of coaxial focuses.
In one embodiment, as shown in FIG. 2, the laser source generates a laser beam with a wavelength of 1064nm, which is reflected by the mirror and enters the half-wave plate. Then, a polarization beam splitter prism and a light barrier are arranged to ensure that most laser beams are converted into p-polarized light from s-polarized light. The converted p-polarized laser beam is expanded by a beam expander and then enters the center of a liquid crystal screen of the phase type spatial light modulator. At this time, the phase type spatial light modulator has been connected to the cutting apparatus computer through the HDMI line, and the cutting apparatus computer has started the control software adapted to the phase type spatial light modulator and has loaded the preset phase map. Therefore, the laser beam reflected by the liquid crystal panel of the phase type spatial light modulator is a p-polarized laser beam whose phase is modulated. The beam is focused into a plurality of coaxial focuses in the direction vertical to the horizontal plane (allowing a certain deviation) through the convex lens and the focusing objective lens, so as to form a cutting beam.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
In an embodiment, a laser cutting apparatus is provided, and the laser cutting apparatus corresponds to the laser cutting method in the above embodiments one to one. As shown in fig. 3, the laser cutting apparatus includes a phase modulation module 10, a focusing module 20, and a cutting module 30. The functional modules are explained in detail as follows:
a phase modulation module 10 for modulating the phase of the p-polarized laser beam by a phase type spatial light modulator;
the focusing module 20 is configured to focus the p-polarized laser beam after phase modulation through a preset focusing optical path, and generate a cutting beam with a plurality of coaxial focuses;
and the cutting module 30 is used for cutting the cut object with the specified thickness by using the cutting beam, and all the coaxial focuses of the cutting beam fall into the specified thickness.
Optionally, the laser cutting device further includes:
and the laser polarization state conversion module is used for converting the s-polarized laser beam into the p-polarized laser beam through a half-wave plate if the laser beam with the specified wavelength is the s-polarized laser beam.
Optionally, the laser cutting device further includes:
and the p-polarized light conversion ratio adjusting module is used for arranging a polarization beam splitter prism and a light barrier on a light path behind the half-wave plate, the light barrier is arranged in the reflection direction of the laser beam passing through the half-wave plate after entering the polarization beam splitter prism, and the rotation angle of the half-wave plate is adjusted so that the brightness of the laser beam passing through the half-wave plate reflected on the light barrier is at the minimum value, thereby obtaining the maximum p-polarized light conversion ratio.
Optionally, the laser cutting device further includes:
and the beam expanding module is used for expanding the beam diameter of the p-polarized laser beam through a beam expanding lens.
Optionally, the laser cutting device further includes:
and the magnification adjusting module is used for adjusting the expansion magnification of the beam expander so as to enable the difference value between the diameter of the expanded beam of the p-polarized laser beam and the length of the short side of the liquid crystal screen of the phase type spatial light modulator to be within a preset range.
Optionally, the laser cutting device further includes:
and the liquid crystal screen adjusting module is used for adjusting the position of the liquid crystal screen of the phase type spatial light modulator so as to enable the p-polarized laser beam projected on the liquid crystal screen to completely fall into the liquid crystal screen, and the center of the p-polarized laser beam is coincided with the center of the liquid crystal screen.
Optionally, the phase modulation module 10 includes:
the phase diagram loading unit is used for connecting the phase type spatial light modulator with a cutting equipment computer through an HDMI line, starting control software adapted to the phase type spatial light modulator on the cutting equipment computer and loading a preset phase diagram on the control software;
and the phase modulation unit is used for modulating the phase of the p-polarized laser beam by the phase type spatial light modulator through the phase diagram to obtain the p-polarized laser beam after the phase modulation.
Optionally, the focusing module 20 includes:
an optical device setting unit for setting a focusing objective lens, a plurality of convex lenses and a plurality of reflectors;
and the cutting beam generating unit is used for obtaining the cutting beams with a plurality of coaxial focuses after the p-polarized laser beams after the phase modulation are acted by the convex lens and the focusing objective lens.
For the specific definition of the laser cutting device, reference may be made to the above definition of the laser cutting method, which is not described herein again. The modules in the laser cutting device can be wholly or partially realized by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 4. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external server through a network connection. The computer program is executed by a processor to implement a laser cutting method.
In one embodiment, a computer device is provided, comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing the following steps when executing the computer program:
modulating the phase of the p-polarized laser beam by a phase type spatial light modulator;
focusing the p-polarized laser beam after phase modulation through a preset focusing light path to generate a cutting beam with a plurality of coaxial focuses;
and cutting the cut object with the specified thickness by using the cutting beam, wherein all the coaxial focuses of the cutting beam fall within the specified thickness.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of:
modulating the phase of the p-polarized laser beam by a phase type spatial light modulator;
focusing the p-polarized laser beam after phase modulation through a preset focusing light path to generate a cutting beam with a plurality of coaxial focuses;
and cutting the cut object with the specified thickness by using the cutting beam, wherein all the coaxial focuses of the cutting beam fall within the specified thickness.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A laser cutting method, comprising:
modulating the phase of the p-polarized laser beam by a phase type spatial light modulator;
focusing the p-polarized laser beam after phase modulation through a preset focusing light path to generate a cutting beam with a plurality of coaxial focuses;
and cutting the cut object with the specified thickness by using the cutting beam, wherein all the coaxial focuses of the cutting beam fall within the specified thickness.
2. The laser cutting method according to claim 1, wherein the modulating the phase of the p-polarized laser beam by the phase-type spatial light modulator before comprises:
and if the laser beam with the specified wavelength is the s-polarized laser beam, converting the s-polarized laser beam into the p-polarized laser beam through a half-wave plate.
3. The laser cutting method according to claim 2, wherein if the laser beam of the specified wavelength is an s-polarized laser beam, the s-polarized laser beam is converted into the p-polarized laser beam by a half-wave plate, further comprising:
a polarization beam splitter prism and a light barrier are arranged on a light path behind the half-wave plate, and the light barrier is arranged in the reflection direction of the laser beam after passing through the half-wave plate and entering the polarization beam splitter prism;
and adjusting the rotation angle of the half-wave plate so that the brightness of the laser beam reflected on the light barrier by the half-wave plate is at the minimum value.
4. The laser cutting method according to claim 1, wherein before modulating the phase of the p-polarized laser beam by the phase-type spatial light modulator, further comprising:
and expanding the beam diameter of the p-polarized laser beam through a beam expander.
5. The laser cutting method according to claim 4, wherein the expanding the beam diameter of the p-polarized laser beam by a beam expander comprises:
adjusting the expansion ratio of the beam expander so that the difference value between the diameter of the expanded p-polarized laser beam and the length of the short side of the liquid crystal screen of the phase type spatial light modulator is within a preset range;
and adjusting the position of a liquid crystal screen of the phase type spatial light modulator so as to enable the p-polarized laser beam projected on the liquid crystal screen to completely fall into the liquid crystal screen, wherein the center of the p-polarized laser beam is coincided with the center of the liquid crystal screen.
6. The laser cutting method according to claim 5, wherein the modulating the phase of the p-polarized laser beam by the phase-type spatial light modulator includes:
connecting the phase type spatial light modulator with a cutting equipment computer through an HDMI line, starting control software adapted to the phase type spatial light modulator on the cutting equipment computer, and loading a preset phase diagram;
and the phase type spatial light modulator modulates the phase of the p-polarized laser beam through the phase diagram to obtain the p-polarized laser beam after the phase is modulated.
7. The laser cutting method of claim 1, wherein focusing the phase-modulated p-polarized laser beam through a predetermined focusing optical path to generate a cutting beam having a plurality of coaxial focal points comprises:
the focusing objective lens, a plurality of convex lenses and a plurality of reflectors are arranged;
and the p-polarized laser beam after phase modulation is acted by the convex lens and the focusing objective lens to obtain the cutting beam with a plurality of coaxial focuses.
8. A laser cutting apparatus, comprising:
the phase modulation module is used for modulating the phase of the p-polarized laser beam through the phase type spatial light modulator;
the focusing module is used for focusing the p-polarized laser beam after the phase modulation through a preset focusing light path to generate a cutting beam with a plurality of coaxial focuses;
and the cutting module is used for cutting the cut object with the specified thickness by using the cutting beam, and all the coaxial focuses of the cutting beam fall into the specified thickness.
9. A computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the laser cutting method according to any one of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the laser cutting method according to any one of claims 1 to 7.
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