CN102944985A - Optical projection mask aligner - Google Patents
Optical projection mask aligner Download PDFInfo
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- CN102944985A CN102944985A CN2012105393116A CN201210539311A CN102944985A CN 102944985 A CN102944985 A CN 102944985A CN 2012105393116 A CN2012105393116 A CN 2012105393116A CN 201210539311 A CN201210539311 A CN 201210539311A CN 102944985 A CN102944985 A CN 102944985A
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Abstract
The invention discloses an optical projection mask aligner comprising a spatial light modulator, an optical splitting system, a projection reduction lens, a focusing regulating device and a photosensitive material supporting system, wherein the optical splitting system is composed of a one-half wave plate, a polarization splitting prism, a quarter wave plate, a baffle plate and a monitoring system; the spatial light modulator is used for modulating laser; the one-half wave plate is used for regulating the polarization direction of incident light; the incident light passes through the polarization splitting prism to obtain transmission light; the quarter wave plate is used for regulating the polarization direction of the transmission light; the incident light is imaged on a photosensitive material through the projection reduction lens, and meanwhile, reflected light is generated; and the reflected light passes through the quarter wave plate and the polarization splitting prism to generate third reflected light, the monitoring system is used for receiving the third reflected light and establishing an image, and the focusing regulating device is used for focusing the projection reduction lens. The optical projection mask aligner can be used for focusing the projection reduction lens in real time under the conditions that the photosensitive material and the substrate fluctuate and deviations exist on the focal plane of the projection reduction lens.
Description
Technical field
The present invention relates to litho machine focusing technical field, relate in particular to a kind of optical projection lithography machine.
Background technology
The optical projection lithography machine often is used to make diffraction optical element, micro optical element, integrated circuit and microelectronic element, and its Main Function is to expose.The optical projection lithography machine dwindles required image by projection micro camera lens, image in photosensitive material, so that photosensitive material generation chemical reaction, thereby required image is retained on the photosensitive material.In above-mentioned exposure process, the substrate of photosensitive material itself and coating photosensitive material exists fluctuating, thickness there are differences, also may there be deviation in the focal plane position of projection micro camera lens, therefore can have a strong impact on the picture quality of final generation, thereby can't produce high-quality photoetching product.To sum up, the focusing of controlling projection micro camera lens in exposure process is the necessary condition that guarantees to be imaged on the lip-deep clear picture of photosensitive material so that the photosensitive material surface is positioned on the imaging plane of projection micro camera lens.
Summary of the invention
The present invention is intended to solve above-mentioned problems of the prior art, proposes a kind of optical projection lithography machine.
The optical projection lithography machine that the present invention proposes is used for receiving the laser that laser instrument sends, and photosensitive material exposed, it comprises: spatial light modulator, beam splitting system, projection micro camera lens, focal adjustment device and photosensitive material support system, described beam splitting system is made of 1/2nd wave plates, polarization splitting prism, quarter-wave plate, shutter and surveillance.Wherein, described spatial light modulator is modulated described laser, obtains the first incident light; Described 1/2nd wave plates are regulated the polarization direction of described the first incident light, obtain the second incident light; Described the second incident light obtains transmitted light and the first reflected light by described polarization splitting prism; Described shutter absorbs described the first reflected light, and described quarter-wave plate is regulated the polarization direction of described transmitted light, obtains circularly polarized light; Described photosensitive material support system supports described photosensitive material, and described circularly polarized light in described photosensitive material, so that described photosensitive material exposes, produces the second reflected light by described projection micro lens imaging simultaneously; Described the second reflected light is by described projection micro camera lens, and the described quarter-wave plate of process becomes linearly polarized light, described linearly polarized light produces the 3rd reflected light through described polarization splitting prism, and described surveillance receives described the 3rd reflected light and sets up image; According to described image, can focus to described projection micro camera lens by described focal adjustment device.
There is fluctuating in the optical projection lithography machine that the present invention proposes in the substrate of photosensitive material itself and coating photosensitive material, thickness there are differences and the focal plane position of projection micro camera lens exists in the situation of deviation, can realize described projection micro camera lens is focused in real time by introducing described beam splitting system.
Description of drawings
Fig. 1 is the optical projection lithography machine structural drawing of one embodiment of the invention;
Fig. 2 is the optical projection lithography machine structural drawing of one embodiment of the present invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage more clear, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The optical projection lithography machine that the present invention proposes is used for receiving the laser that laser instrument sends, and photosensitive material is exposed.
Figure 1 shows that the optical projection lithography machine of one embodiment of the invention, it comprises: spatial light modulator 1, beam splitting system 2, projection micro camera lens 8, focal adjustment device 11 and photosensitive material support system 9, photosensitive material 10 is positioned on the described photosensitive material support system 9.Wherein, described beam splitting system 2 is made of 1/2nd wave plates 3, polarization splitting prism 4, quarter-wave plate 7, shutter 5 and surveillance 13.
The principle of work of described optical projection lithography machine is as follows: as shown in Figure 1, the laser that 1 pair of laser instrument of described spatial light modulator sends is modulated, and obtains the first incident light A.Described the first incident light A passes through described 1/2nd wave plates 3 again, and described 1/2nd wave plates 3 are used for regulating the polarization direction of described the first incident light A, obtain the second incident light B.Described the second incident light B obtains transmitted light C and the first reflected light D by described polarization splitting prism 4.In the present embodiment, the transmissivity of described polarization splitting prism 4 and reflectivity ratio are set to 9: 1, can realize that described the second incident light B is by behind the described polarization splitting prism 4, the energy Ratios of described transmitted light C and described the first reflected light D is 9: 1, also is that 90% energy of described the second incident light B has passed through described polarization splitting prism 4.Described the first reflected light D becomes the stray light of described optical projection lithography machine, and described shutter 5 absorbs described the first reflected light D, and described shutter 5 is black often.Described transmitted light C passes through described quarter-wave plate 7 again, and described quarter-wave plate 7 is used for regulating the polarization direction of described transmitted light C, obtains circularly polarized light E.Described circularly polarized light E images in described photosensitive material 10 by described projection micro camera lens 8, so that 10 exposures of described photosensitive material.In the present embodiment, described photosensitive material support system 9 can be electrically connected with external control system, and described external control system is used for controlling the movement of described photosensitive material support system 9, thereby so that described photosensitive material 10 exposed by pointwise.
After being radiated on the described photosensitive material 10, above-mentioned circularly polarized light E produces reflected light F.Described reflected light F is successively by described projection micro camera lens 8, quarter-wave plate 7, and described reflected light F becomes linearly polarized light through behind the described quarter-wave plate 7, phase change 90 degree, again through producing the 3rd reflected light G behind the described polarization splitting prism 4.In the present embodiment, the energy of described the 3rd reflected light G is 90% of described reflected light F.Described surveillance 13 receives described the 3rd reflected light G and sets up image.
In the present invention, optional usefulness is artificial focuses to described projection micro camera lens 8 with automatic two kinds of focusing modes.Particularly, when selecting artificial focusing mode, described surveillance 13 can be that normal image receives diffuser screen, and such as blank sheet of paper, frosted glass etc., the observer focuses by 11 pairs of described projection micro camera lenses 8 of described focal adjustment device by observing described image.When selecting the automatic focusing mode, as shown in Figure 2, described optical projection lithography machine also comprises external control system 12, described external control system 12 is electrically connected with described surveillance 13, focal adjustment device 11, photosensitive material support system 9 respectively, the image that described external control system 12 is set up according to described surveillance 13 is analyzed, and draws the focusing parameter, control described focal adjustment device 11 pairs of described projection micro camera lenses 8 are focused.Simultaneously, described external control system 12 also is used for controlling the movement of described photosensitive material support system 9, thereby so that described photosensitive material 10 exposed by pointwise.
In a preferred embodiment, described optical spatial modulator 1 equates with the distance of described polarization splitting prism 4 to described surveillance 13 to the distance of described polarization splitting prism 4, at this moment, image and the described laser instrument set up in described surveillance 13 send the original image equal and opposite in direction that laser comprises, and do not need additionally to introduce micro magnifier and come the image behind described projection micro camera lens 8 micros is amplified.
There is fluctuating in the optical projection lithography machine that the present invention proposes in the substrate of photosensitive material itself and coating photosensitive material, thickness there are differences and the focal plane position of projection micro camera lens exists in the situation of deviation, can realize described projection micro camera lens 8 is focused in real time by introducing described beam splitting system 2.
Although the present invention is described with reference to current better embodiment; but those skilled in the art will be understood that; above-mentioned better embodiment only is used for illustrating the present invention; be not to limit protection scope of the present invention; any within the spirit and principles in the present invention scope; any modification of doing, equivalence replacement, improvement etc. all should be included within the scope of the present invention.
Claims (3)
1. optical projection lithography machine, be used for receiving the laser that laser instrument sends, photosensitive material is exposed, it comprises: spatial light modulator, projection micro camera lens, focal adjustment device and photosensitive material support system, it is characterized in that, also comprise beam splitting system, described beam splitting system is made of 1/2nd wave plates, polarization splitting prism, quarter-wave plate, shutter and surveillance, wherein
Described spatial light modulator is modulated described laser, obtains the first incident light;
Described 1/2nd wave plates are regulated the polarization direction of described the first incident light, obtain the second incident light;
Described the second incident light obtains transmitted light and the first reflected light by described polarization splitting prism;
Described shutter absorbs described the first reflected light, and described quarter-wave plate is regulated the polarization direction of described transmitted light, obtains circularly polarized light;
Described photosensitive material support system supports described photosensitive material, and described circularly polarized light in described photosensitive material, so that described photosensitive material exposes, produces the second reflected light by described projection micro lens imaging simultaneously;
Described the second reflected light is by described projection micro camera lens, and the described quarter-wave plate of process becomes linearly polarized light, described linearly polarized light produces the 3rd reflected light through described polarization splitting prism, and described surveillance receives described the 3rd reflected light and sets up image;
According to described image, can focus to described projection micro camera lens by described focal adjustment device.
2. optical projection lithography machine according to claim 1 is characterized in that, described optical spatial modulator equates with the distance of described polarization splitting prism to described surveillance to the distance of described polarization splitting prism.
3. optical projection lithography machine according to claim 1, it is characterized in that, also comprise external control system, described external control system is electrically connected with described surveillance, focal adjustment device, photosensitive material support system respectively, the image that described external control system is set up according to described surveillance, controlling described focal adjustment device focuses to described projection micro camera lens, described external control system is also controlled the movement of described photosensitive material support system, so that described photosensitive material pointwise exposure.
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| CN2012105393116A CN102944985A (en) | 2012-12-12 | 2012-12-12 | Optical projection mask aligner |
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| CN2012105393116A CN102944985A (en) | 2012-12-12 | 2012-12-12 | Optical projection mask aligner |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257533A (en) * | 2013-05-17 | 2013-08-21 | 中国科学院长春光学精密机械与物理研究所 | Automatic focusing method of photoetching machine |
| CN104007559A (en) * | 2014-05-08 | 2014-08-27 | 北京理工大学 | Foveated imaging system with partial super-resolution scanning function |
| CN104849964A (en) * | 2014-02-14 | 2015-08-19 | 上海微电子装备有限公司 | Focal plane measurement device and measurement method |
| CN109407479A (en) * | 2017-08-18 | 2019-03-01 | 苏州苏大维格光电科技股份有限公司 | Laser direct-writing focusing mechanism and laser direct-writing focusing method |
| CN112241070A (en) * | 2019-07-16 | 2021-01-19 | 苏州大学 | Large-breadth optical polarization pattern generation device and generation method |
| CN112824003A (en) * | 2019-11-21 | 2021-05-21 | 大族激光科技产业集团股份有限公司 | Laser cutting method and device, computer equipment and storage medium |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10056561A1 (en) * | 1999-11-15 | 2001-06-07 | Gerhard Leuchs | Device for focusing light onto a photosensitive object, preferably having laminar region, e.g. for microscopy, lithography, optical or magneto-optical data storage such as CD and DVD |
| CN1570711A (en) * | 2003-07-16 | 2005-01-26 | 无锡湖光星源光电技术有限责任公司 | Three-plate type projection optical engine capable of improving chrominance uniformity |
| KR100847433B1 (en) * | 2008-04-04 | 2008-07-21 | 주식회사 엔씨비네트웍스 | Apparatus and method for astigmatism and phase shift auto focusing by dmd moire pattern generator |
| CN101349818A (en) * | 2007-07-20 | 2009-01-21 | 鸿富锦精密工业（深圳）有限公司 | Color management system |
| CN101807012A (en) * | 2010-04-07 | 2010-08-18 | 芯硕半导体（中国）有限公司 | Automatic focus light path structure of direct-write lithography machine |
| CN102096293A (en) * | 2011-01-30 | 2011-06-15 | 河南科技大学 | Optical engine for three-piece liquid crystal on silicon (LCOS) laser projection display |
| EP2343128A1 (en) * | 1999-09-17 | 2011-07-13 | BioArray Solutions Ltd. | Substrate and chip for conducting bioassays |
| TW201144945A (en) * | 2010-06-11 | 2011-12-16 | Ind Tech Res Inst | Exposure system and adjustment method thereof |
-
2012
- 2012-12-12 CN CN2012105393116A patent/CN102944985A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2343128A1 (en) * | 1999-09-17 | 2011-07-13 | BioArray Solutions Ltd. | Substrate and chip for conducting bioassays |
| DE10056561A1 (en) * | 1999-11-15 | 2001-06-07 | Gerhard Leuchs | Device for focusing light onto a photosensitive object, preferably having laminar region, e.g. for microscopy, lithography, optical or magneto-optical data storage such as CD and DVD |
| CN1570711A (en) * | 2003-07-16 | 2005-01-26 | 无锡湖光星源光电技术有限责任公司 | Three-plate type projection optical engine capable of improving chrominance uniformity |
| CN101349818A (en) * | 2007-07-20 | 2009-01-21 | 鸿富锦精密工业（深圳）有限公司 | Color management system |
| KR100847433B1 (en) * | 2008-04-04 | 2008-07-21 | 주식회사 엔씨비네트웍스 | Apparatus and method for astigmatism and phase shift auto focusing by dmd moire pattern generator |
| CN101807012A (en) * | 2010-04-07 | 2010-08-18 | 芯硕半导体（中国）有限公司 | Automatic focus light path structure of direct-write lithography machine |
| TW201144945A (en) * | 2010-06-11 | 2011-12-16 | Ind Tech Res Inst | Exposure system and adjustment method thereof |
| CN102096293A (en) * | 2011-01-30 | 2011-06-15 | 河南科技大学 | Optical engine for three-piece liquid crystal on silicon (LCOS) laser projection display |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257533A (en) * | 2013-05-17 | 2013-08-21 | 中国科学院长春光学精密机械与物理研究所 | Automatic focusing method of photoetching machine |
| CN104849964A (en) * | 2014-02-14 | 2015-08-19 | 上海微电子装备有限公司 | Focal plane measurement device and measurement method |
| CN104849964B (en) * | 2014-02-14 | 2017-08-25 | 上海微电子装备（集团）股份有限公司 | A kind of focal plane measurement apparatus and its measuring method |
| CN104007559A (en) * | 2014-05-08 | 2014-08-27 | 北京理工大学 | Foveated imaging system with partial super-resolution scanning function |
| CN109407479A (en) * | 2017-08-18 | 2019-03-01 | 苏州苏大维格光电科技股份有限公司 | Laser direct-writing focusing mechanism and laser direct-writing focusing method |
| CN112241070A (en) * | 2019-07-16 | 2021-01-19 | 苏州大学 | Large-breadth optical polarization pattern generation device and generation method |
| CN112241070B (en) * | 2019-07-16 | 2022-07-29 | 苏州大学 | Large-breadth optical polarization pattern generation device and generation method |
| CN112824003A (en) * | 2019-11-21 | 2021-05-21 | 大族激光科技产业集团股份有限公司 | Laser cutting method and device, computer equipment and storage medium |
| CN112824003B (en) * | 2019-11-21 | 2023-11-03 | 深圳市大族半导体装备科技有限公司 | Laser cutting method, laser cutting device, computer equipment and storage medium |
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Application publication date: 20130227 |