CN111352310A - Automatic focusing device and automatic focusing method for optical projection lithography machine - Google Patents
Automatic focusing device and automatic focusing method for optical projection lithography machine Download PDFInfo
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- CN111352310A CN111352310A CN202010242592.3A CN202010242592A CN111352310A CN 111352310 A CN111352310 A CN 111352310A CN 202010242592 A CN202010242592 A CN 202010242592A CN 111352310 A CN111352310 A CN 111352310A
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- 238000001459 lithography Methods 0.000 title claims abstract description 48
- 230000003287 optical effect Effects 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000012544 monitoring process Methods 0.000 claims abstract description 46
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000003384 imaging method Methods 0.000 claims abstract description 23
- 238000001259 photo etching Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 6
- 238000004458 analytical method Methods 0.000 claims description 4
- 238000010191 image analysis Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 230000004044 response Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010405 anode material Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70183—Zoom systems for adjusting beam diameter
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70641—Focus
Abstract
The invention provides an automatic focusing device for an optical projection lithography machine, which comprises a laser, a laser energy regulator, a beam expander, a collimating lens, a cross filament, an imaging lens, a beam splitter prism, a monitoring system lens, a monitoring system, a dichroic mirror, an electronic zoom lens, a projection micro lens, a photosensitive material and a lithography platform, wherein the photosensitive material is positioned on the lithography platform. In addition, the invention also provides an automatic focusing method for the optical projection lithography machine.
Description
Technical Field
The invention relates to the technical field of focusing of photoetching machines, in particular to an automatic focusing device and an automatic focusing method for an optical projection photoetching machine.
Background
The photoetching machine is a key device for manufacturing holographic anti-counterfeiting, diffraction optical elements and micro-optical elements and integrated circuits and microelectronic elements, and the photoetching technology is a core power for promoting the development of micro-optics and microelectronic technologies and mainly plays a role in exposure. An optical projection lithography machine is the most common lithography machine, and a required image is reduced through a projection miniature lens to be imaged on a photosensitive material, and the photosensitive material is subjected to chemical reaction to retain the image on the photosensitive material. In the exposure process, when the photosensitive material and the substrate coated with the photosensitive material fluctuate and have different thicknesses, and the position of the focal plane of the projection lens has deviation, the quality of the finally generated image is seriously influenced, and a high-quality photoetching product cannot be produced. Therefore, the focus of the projection micro-lens must be controlled so that the surface of the photosensitive material is located on the imaging plane of the projection lens during the whole exposure process, and the image imaged on the surface of the photosensitive material is the clearest.
For an optical projection lithography system, a lithographic image is generally reduced to a very small image through a projection miniature lens, and the resolution of the whole focusing system is high when the image is used for automatic focusing, so that no matter the automatic focusing system is provided with an image pickup device, or whether focusing is performed by human eye observation, a microscope head is required to be introduced to amplify the image, and the miniature lens causes problems of distortion and the like, so that the judgment on the focusing definition is influenced.
Disclosure of Invention
In view of the above, there is a need to provide an auto-focusing device for an optical projection lithography machine, which can rapidly focus in the state of out-of-focus of the optical path, in view of the drawbacks of the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
an autofocus device for an optical projection lithography machine, comprising: laser instrument, laser energy regulator, beam expander, collimating lens, cross silk, imaging lens, beam splitting prism, monitoring system lens, monitoring system, dichroic mirror, electron zoom lens, projection miniature camera lens, photosensitive material and photoetching platform, photosensitive material is located photoetching platform, wherein:
the laser beam emitted by the laser sequentially passes through the laser energy regulator, the beam expander and the collimating lens to obtain parallel light, the parallel light irradiates on the cross filament, the parallel light carrying cross filament information after passing through the cross filament is imaged by the imaging lens, is projected by the beam splitting prism to reach the dichroic mirror, is reflected by the dichroic mirror to enter the electronic zoom lens, and is imaged on the surface of the photosensitive material by the projection miniature lens;
the cross-hair image imaged on the surface of the photosensitive material sequentially passes through the projection miniature lens and the electronic zoom lens to enter the dichroic mirror, and then enters the light splitting prism after being reflected by the dichroic mirror, and the light splitting prism reflects part of the light beam and leads the light beam into the monitoring system through the monitoring system lens;
the monitoring system transmits the acquired image to an external computer, the external computer analyzes the image received by the external computer to calculate the defocusing amount of the image, and the focal length of the electronic zoom lens is changed according to the defocusing amount to realize focusing.
In some preferred embodiments, the image monitoring system is an image acquisition and processing device for acquiring the image extracted by the beam splitter prism and transmitting the image to an external computer for image analysis.
In some preferred embodiments, the image monitoring system is an image receiving display screen that can present the received image to a viewer.
In addition, the invention also provides a focusing method of the automatic focusing device for the optical projection lithography machine, which comprises the following steps:
building a light path according to the automatic focusing device;
adjusting the electronic zoom lens to the value of the initial focal length, and adjusting the photoetching image to be clearly recognizable on the photosensitive material;
adjusting the positions of the imaging lens and the monitoring system lens to make the imaging of the cross hair on the monitoring system clear;
and (2) operating the photoetching machine, monitoring the imaging condition of the cross thread in real time by the monitoring system, acquiring the image of the cross thread 5 once by the monitoring system when printing one line or n points, carrying out in-focus analysis, continuously printing the next line or the next n points by the photoetching machine if the image is still in focus, adjusting the focal length of the electronic zoom lens to focus the image of the cross thread and the photoetching image if the image is out of focus, continuously carrying out photoetching printing, and repeating the process until the printing is finished, wherein n is more than 1.
The invention adopts the technical scheme that the method has the advantages that:
the invention provides an automatic focusing device and a focusing method for an optical projection lithography machine, which are characterized in that a light path is built according to the automatic focusing device, an electronic zoom lens is adjusted to the value of an initial focal length, a lithography image is adjusted to be clear and recognizable on a photosensitive material, the positions of an imaging lens and a monitoring system lens are adjusted to enable the imaging of a cross wire in a monitoring system to be clear, the lithography machine is operated, the monitoring system monitors the imaging condition of the cross wire in real time, the monitoring system acquires an image of the cross wire 5 once every line or n points are printed to perform in-focus analysis, if the image is still in focus, the lithography machine continues to print the next line or the last n points, if the image is out of focus, the image of the cross wire and the lithography image are in focus by adjusting the focal length of the electronic zoom lens, then the lithography printing is continued, and the process is repeated until the printing is completed, the automatic focusing device and the focusing method for the optical projection lithography machine provided by the invention have the advantages that the focusing is realized by changing the focal length of the electronic zoom lens, the response speed of the adjustment is high, the lithography image of the lithography machine can be quickly aligned to the focus again compared with the mechanical focusing, and the automatic focusing device and the focusing method for the optical projection lithography machine are suitable for the requirement that the lithography machine needs to work quickly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an auto-focusing device for an optical projection lithography machine according to embodiment 1 of the present invention.
FIG. 2 is a flowchart illustrating steps of an auto-focusing method for an optical projection lithography machine according to embodiment 2 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, a schematic structural diagram of an auto-focusing device for an optical projection lithography machine according to the present invention includes: the laser device comprises a laser 110, a laser energy adjuster 120, a beam expander 130, a collimating lens 140, a cross filament 150, an imaging lens 160, a beam splitter prism 170, a monitoring system lens 180, a monitoring system 190, a dichroic mirror 210, an electronic zoom lens 220, a projection micro-lens 230, a photosensitive material 240 and a photoetching platform 250, wherein the photosensitive material 240 is positioned on the photoetching platform 250.
The automatic focusing device for the optical projection lithography machine works as follows:
the laser beam emitted by the laser 110 sequentially passes through the laser energy adjuster 120, the beam expander 130 and the collimating lens 140 to obtain parallel light, the parallel light irradiates on the cross filament 150, the parallel light carrying cross filament information after passing through the cross filament 150 is imaged by the imaging lens 160, is projected by the beam splitter prism 170 to reach the dichroic mirror 210, is reflected by the dichroic mirror 210 to enter the electronic zoom lens 220, and is imaged on the surface of the photosensitive material 240 by the projection miniature lens 230.
The cross-hair image imaged on the surface of the photosensitive material 240 sequentially passes through the projection micro lens 230 and the electronic zoom lens 220 to enter the dichroic mirror 210, and then enters the beam splitter prism 170 after being reflected by the dichroic mirror 210, and the beam splitter prism 170 reflects a part of the light beam and introduces the light beam into the monitoring system 190 through the monitoring system lens 180.
The monitoring system 190 transmits the acquired image to an external computer, and the external computer analyzes the image received by the external computer to calculate the defocus amount of the image, and changes the focal length of the electronic zoom lens 220 according to the defocus amount to realize focusing.
Specifically, the monitoring system 190, the imaging lens 160, and the beam splitter prism 170 constitute a focus discrimination system. The imaging lens 160 passes through the dichroic mirror 210, the projection micro-lens 230 and the surface of the photosensitive material 240, and then is reflected back to the beam splitter prism 170 through the surface of the photosensitive material 240, and is introduced into the image monitoring system 190 by the beam splitter prism 170, at this time, the image of the cross filament on the surface of the photosensitive material 240 enters the imaging monitoring system 190, the cross filament 150 is in a clear state in the monitoring system 190 through the imaging lens 160, and at this time, the image of the lithography is also clear, so when the image of the cross filament is out of focus, the image of the lithography is out of focus.
It can be understood that the dichroic mirror 210 can realize the full transmission of the light beam of the original lithography machine, and reflect the light beam of the focus discrimination system.
In some preferred embodiments, the image monitoring system 190 is an image acquisition and processing device that acquires the imaged image extracted by the beam splitting prism 170 and transmits the image to an external computer for image analysis.
In some preferred embodiments, the image monitoring system 190 is an image receiving display screen that can present the received image to a viewer.
It can be understood that the electronic zoom lens 220 is located in front of the projection micro-lens 230, and the focus of the electronic zoom lens 220 can be changed by changing the current of the electronic zoom lens 220, changing the equivalent focus of the whole optical path, and adjusting the focus of the electronic zoom lens 220 according to the out-of-focus condition of the cross-hair image obtained by the image monitoring system 190, so that the image of the lithography machine and the cross-hair image are in focus again at the same time.
It can be understood that, in the present invention, the dichroic mirror 210 and the electronic zoom lens 220 are added in the existing optical projection lithography optical path, the dichroic mirror 210 can allow the lithography light beam to pass through, and reflect the light beam of the focusing discrimination system that needs to be introduced, and the electronic zoom lens 220 can change the overall equivalent focal length of the lithography system, thereby realizing rapid focusing in the state of optical path defocusing.
The automatic focusing device for the optical projection lithography machine provided by the invention can be used for focusing by changing the focal length of the electronic zoom lens, has high response speed in adjustment, can quickly realign the lithography image of the lithography machine to focus compared with mechanical focusing, and is suitable for the requirement that the lithography machine needs to work quickly.
Example 2
Referring to FIG. 2, a flowchart of steps of an auto-focusing method for an auto-focusing device of an optical projection lithography machine according to an embodiment of the present invention is provided, which includes the following steps:
step S110: building a light path according to the automatic focusing device; for a specific optical path structure, reference may be made to the autofocus device provided in embodiment 1, and details are not described here.
Step S120: adjusting the electronic zoom lens 220 to the value of the initial focal length and adjusting the lithographic image to be legible on the photosensitive material 240;
step S130: adjusting the positions of the imaging lens 160 and the monitoring system lens 180 to sharpen the image of the cross hair 150 on the monitoring system 190;
step S140: and (2) operating the photoetching machine, wherein the monitoring system 190 monitors the imaging condition of the cross filament 150 in real time, the monitoring system 190 acquires the image of the cross filament 150 once for each line or n points of printing to perform in-focus analysis, if the image is still in focus, the photoetching machine continues to print the next line or n points, if the image is out of focus, the image of the cross filament and the photoetching image are in focus by adjusting the focal length of the electronic zoom lens 220, and then the photoetching printing is continued, and the process is repeated until the printing is finished, wherein n is more than 1.
The automatic focusing method for the optical projection lithography machine provided by the invention can be used for focusing by changing the focal length of the electronic zoom lens, has high response speed in adjustment, can quickly realign the lithography image of the lithography machine to focus compared with mechanical focusing, and is suitable for the requirement that the lithography machine needs to work quickly.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
Of course, the anode material of the automatic focusing device for an optical projection lithography machine of the present invention may have various changes and modifications, and is not limited to the specific structure of the above embodiments. In conclusion, the scope of the present invention should include those changes or substitutions and modifications which are obvious to those of ordinary skill in the art.
Claims (4)
1. An automatic focusing device for an optical projection lithography machine is characterized by comprising a laser, a laser energy regulator, a beam expander, a collimating lens, a cross wire, an imaging lens, a beam splitter prism, a monitoring system lens, a monitoring system, a dichroic mirror, an electronic zoom lens, a projection miniature lens, a photosensitive material and a lithography platform, wherein the photosensitive material is positioned on the lithography platform, and the automatic focusing device is characterized in that:
the laser beam emitted by the laser sequentially passes through the laser energy regulator, the beam expander and the collimating lens to obtain parallel light, the parallel light irradiates on the cross filament, the parallel light carrying cross filament information after passing through the cross filament is imaged by the imaging lens, is projected by the beam splitting prism to reach the dichroic mirror, is reflected by the dichroic mirror to enter the electronic zoom lens, and is imaged on the surface of the photosensitive material by the projection miniature lens;
the cross-hair image imaged on the surface of the photosensitive material sequentially passes through the projection miniature lens and the electronic zoom lens to enter the dichroic mirror, and then enters the light splitting prism after being reflected by the dichroic mirror, and the light splitting prism reflects part of the light beam and leads the light beam into the monitoring system through the monitoring system lens;
the monitoring system transmits the acquired image to an external computer, the external computer analyzes the image received by the external computer to calculate the defocusing amount of the image, and the focal length of the electronic zoom lens is changed according to the defocusing amount to realize focusing.
2. The autofocus device of claim 1, wherein the image monitoring system is an image capture and processing device configured to capture the image extracted by the beam splitter prism and transmit the image to an external computer for image analysis.
3. The autofocus apparatus of claim 1, wherein the image monitoring system is an image receiving display screen configured to present the received image to a viewer.
4. A focusing method of an autofocus device for an optical projection lithography machine according to claim 1, comprising the steps of:
building a light path according to the automatic focusing device;
adjusting the electronic zoom lens to the value of the initial focal length, and adjusting the photoetching image to be clearly recognizable on the photosensitive material;
adjusting the positions of the imaging lens and the monitoring system lens to make the imaging of the cross hair on the monitoring system clear;
and (2) operating the photoetching machine, monitoring the imaging condition of the cross thread in real time by the monitoring system, acquiring the image of the cross thread 5 once by the monitoring system when printing one line or n points, carrying out in-focus analysis, continuously printing the next line or the next n points by the photoetching machine if the image is still in focus, adjusting the focal length of the electronic zoom lens to focus the image of the cross thread and the photoetching image if the image is out of focus, continuously carrying out photoetching printing, and repeating the process until the printing is finished, wherein n is more than 1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010242592.3A CN111352310A (en) | 2020-03-31 | 2020-03-31 | Automatic focusing device and automatic focusing method for optical projection lithography machine |
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| CN202010242592.3A CN111352310A (en) | 2020-03-31 | 2020-03-31 | Automatic focusing device and automatic focusing method for optical projection lithography machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113655693A (en) * | 2021-07-08 | 2021-11-16 | 湖南大学 | Planar and three-dimensional micro-nano processing device based on liquid crystal spatial light modulator |
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| US4512642A (en) * | 1981-09-18 | 1985-04-23 | Ashai Kogaku Kogyo Kabushiki Kaisha | Automatic focusing apparatus in optical drawing machine |
| JPH08181061A (en) * | 1994-12-20 | 1996-07-12 | Canon Inc | Focussing method and projection aligner using thereof |
| CN101976020A (en) * | 2010-10-12 | 2011-02-16 | 苏州苏大维格光电科技股份有限公司 | Photoetching device and photoetching method |
| CN109864716A (en) * | 2019-05-06 | 2019-06-11 | 南昌洋深电子科技有限公司 | A kind of miniature opto-acoustic microscopic imaging system and method for low-frequency range |
| CN211786585U (en) * | 2020-03-31 | 2020-10-27 | 深圳市深大极光科技有限公司 | Automatic focusing device for optical projection photoetching machine |
-
2020
- 2020-03-31 CN CN202010242592.3A patent/CN111352310A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4512642A (en) * | 1981-09-18 | 1985-04-23 | Ashai Kogaku Kogyo Kabushiki Kaisha | Automatic focusing apparatus in optical drawing machine |
| JPH08181061A (en) * | 1994-12-20 | 1996-07-12 | Canon Inc | Focussing method and projection aligner using thereof |
| CN101976020A (en) * | 2010-10-12 | 2011-02-16 | 苏州苏大维格光电科技股份有限公司 | Photoetching device and photoetching method |
| CN109864716A (en) * | 2019-05-06 | 2019-06-11 | 南昌洋深电子科技有限公司 | A kind of miniature opto-acoustic microscopic imaging system and method for low-frequency range |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113655693A (en) * | 2021-07-08 | 2021-11-16 | 湖南大学 | Planar and three-dimensional micro-nano processing device based on liquid crystal spatial light modulator |
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