CN101976020A - Photoetching device and photoetching method - Google Patents

Photoetching device and photoetching method Download PDF

Info

Publication number
CN101976020A
CN101976020A CN 201010503788 CN201010503788A CN101976020A CN 101976020 A CN101976020 A CN 101976020A CN 201010503788 CN201010503788 CN 201010503788 CN 201010503788 A CN201010503788 A CN 201010503788A CN 101976020 A CN101976020 A CN 101976020A
Authority
CN
China
Prior art keywords
object surface
pick
unit
optical head
carve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 201010503788
Other languages
Chinese (zh)
Other versions
CN101976020B (en
Inventor
浦东林
胡进
张月雨
唐灵
魏国军
周小红
陈林森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou University
Suzhou Sudavig Science and Technology Group Co Ltd
Original Assignee
Suzhou University
SVG Optronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou University, SVG Optronics Co Ltd filed Critical Suzhou University
Priority to CN201010503788XA priority Critical patent/CN101976020B/en
Publication of CN101976020A publication Critical patent/CN101976020A/en
Application granted granted Critical
Publication of CN101976020B publication Critical patent/CN101976020B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention relates to a photoetching device and a photoetching method. The photoetching device is characterized in that a detection device is arranged in the conjugation position of a diaphragm according to the reversibility principle of a light path; the detection device can detect the convergence and imaging information of light rays on the surface of an object to be photoetched; and the quality of photoetching light points is enhanced. At the same time, the photoetching method can realize that automatic focusing can be instantaneously and accurately carried out either the defocusing phenomenon resulted from the unevenness condition of the surface of the object to be photoetched or the defocusing phenomenon resulted from the refractive index change because of filling solution heating appearing in the etching course by utilizing the photoetching device so that the photoetching quality of movable type exposure can be ensured.

Description

A kind of lithographic equipment and photoetching method
Technical field
The present invention relates to a kind of lithographic equipment and photoetching method, especially a kind of liquid immersion lithography device and photoetching method.
Background technology
The development of semiconductor industry be unable to do without photoetching technique, and almost the appearance of integrated circuit newly of each generation all realizes that with photoetching process littler characteristic dimension is a sign.So the exposure wavelength of people by constantly reducing litho machine, increase the numerical aperture of projection objective or with both in conjunction with obtaining littler characteristic dimension.At present, the exposure wavelength of litho machine has been reduced to 193nm from 436nm, 365nm, 248nm, and liquid-immersed technology has also increased to the numerical aperture of projection objective more than 1.3 from 0.93 simultaneously.The IC industry generally believes that the 193nm immersed photoetching machine has become the main flow equipment of photoetching process of future generation.But, there are following two problems for present immersion lithographic apparatus:
First: wait to carve the object surface photoresist of coating usually, its flatness is with respect to lithographic accuracy, and it is excessive to rise and fall.In exposure of tiling stroboscopic or step printing, the accurately focusing of often having no idea in concavo-convex place makes the resolution of imaging descend, and has influenced the etching quality greatly;
Second: immersion liquid makes liquid refractive index change owing to the long-time heating that is subjected to exposure light source heats up.When larger-size object carries out etching to some, tend to variation along with the time, the precision of etching is worse and worse.
At above-mentioned first problem, the someone has proposed to utilize a checkout equipment that Real Time Observation is carried out in the etching position, as shown in Figure 1.Fig. 1 is a kind of existing liquid immersion lithography device.In this liquid immersion lithography device 100, be provided with the extra checkout equipment 110 of a cover, the flatness of waiting to carve object surface in order to inspection.But usually for the detection under the micro/nano-scale, need be by means of very high utility appliance, this in addition checkout equipment can only detect the fluctuating situation on surface, but can not provide concrete regulated value.
At second kind of situation, the someone proposes by the accounting temperature time relationship, sets the adjusting program, makes interferometric optical head adjusting position automatically in whole etching process.But this pre-set program is easy to produce error when practical operation, do not possess instantaneity.
Therefore, solve the subject matter that above-mentioned two kinds of situations have become the liquid immersion lithography device.
Summary of the invention
At above problem, the present invention proposes a kind of lithographic equipment and photoetching method, this lithographic equipment need not extra utility appliance, but the light channel structure of utilization itself just can be realized immediately, the accurate detection, the out of focus phenomenon that causes by the concavo-convex situation of waiting to carve object surface no matter of this photoetching method simultaneously, still the variations in refractive index that causes by the filling liquid heating and the out of focus phenomenon that causes can both immediately, accurately be carried out automatic focusing, thereby guaranteed the photoetching quality of portable exposure.
A kind of lithographic equipment according to purpose proposition of the present invention, comprise light source, optical system and automatic focusing system, this optical system comprises diaphragm, the partial reflection optical device, imaging lens group and interferometric optical head, wherein said imaging lens group comprises first lens combination and second lens combination, described diaphragm is positioned at the front focal plane of this first lens combination, object surface described to be carved is positioned at the back focal plane of this second lens combination, described interferometric optical head comprises beam splitting device and beam cementing prism, and second lens combination total with this imaging lens group, this beam splitting device is divided into multi beam light with the light that this second lens combination spreads out of, and after this beam cementing prism converges, wait to carve object surface at this and form interference image;
This automatic focusing system comprises pick-up unit, the control device and first drive unit, wherein said pick-up unit is by this partial reflection optical device, be positioned at the front focal plane of this first lens combination with this diaphragm conjugation ground, and by the light path reversible relation, reception is from the image-forming information of waiting to carve object surface, described control device connects this pick-up unit, and the image-forming information that receives according to this pick-up unit, generate a conditioning signal, described first drive unit receives above-mentioned conditioning signal, and drives this interferometric optical head and move on the Z axle.
According to a kind of lithographic equipment that purpose of the present invention proposes, wherein said diaphragm is digital micromirror elements or spatial light modulator.
According to a kind of lithographic equipment that purpose of the present invention proposes, wherein said pick-up unit is charge coupled cell or photodetector.
A kind of lithographic equipment according to purpose of the present invention proposes also comprises the objective table and second drive unit, and this objective table is in order to place object described to be carved, and this second drive unit drives this objective table and moves in the XY plane of vertical this Z axle.
According to a kind of lithographic equipment that purpose of the present invention proposes, wherein this lithographic equipment is an immersion interference lithography device, at described interferometric optical head with wait to carve between the object surface, is provided with filling liquid.
According to another object of the present invention propose a kind of photoetching method, this method is used aforesaid lithographic equipment, the steps include:
(1) regulate this optical system, the pattern imaging that makes the diaphragm demonstration is in object surface to be carved;
(2) start this automatic focusing system, this pick-up unit is received wait to carve the image-forming information of object surface from this;
(3) control device is controlled this first drive unit, regulate this interferometric optical head with Z axle first direction, and the image-forming information in record pick-up unit this moment, control this first drive unit according to the situation of change of image-forming information and continue to adjust this interferometric optical head in such a way:
One. as if interference fringe and striped in pick-up unit, occurring from sparse to dense, then stop this interferometric optical head in this first direction motion, and this interferometric optical head is moved upward with the second party of opposite and first direction, the interval between striped disappearance or striped reaches maximal value;
Two. as if interference fringe and striped occurring from dense to sparse in pick-up unit, then continue to regulate this interferometric optical head with first direction, the interval between striped disappearance or striped reaches maximal value;
(4) stop to regulate, treat by a laser pulse light source and carve object surface and carry out etching.
A kind of photoetching method according to the another object of the present invention proposition, wherein before in step (1), also be included in the interferometric optical head and wait to carve and inject filling liquid between the object surface, simultaneously in the process of step (4), if this filling liquid is heated and its refractive index changes, when causing the light out of focus, this automatic focusing system continues to focus according to step (3), makes the best operational position that object surface to be carved can be arranged at optical system before the etching of exposing each time.
According to another object of the present invention propose a kind of photoetching method, wherein afterwards in step (3), also comprise and start second drive unit, controlling objective table in the mode of continuous or stepping moves in the XY plane of vertical Z axle, simultaneously in the process that this moves, this automatic focusing system continues to focus according to step (3), makes can will wait to carve the best operational position of object surface setting and optical system before the exposure etching.
According to another object of the present invention propose a kind of photoetching method, wherein reconcile the geometric shape of this diaphragm output pattern, make objective table when mobile, the light source figure that institute's etching is come out under each recurrence interval has continuity.
According to another object of the present invention propose a kind of photoetching method, wherein reconcile continuous speed or the dead time of stepping when moving when mobile of this objective table, make objective table when mobile, the exposure of light source under a recurrence interval satisfies at this waits to carve the threshold quantity that object surface forms etching pattern.
Above-mentioned immersion interference device is provided with pick-up unit by the principle of reversibility of light path at the conjugate position place of diaphragm, make that need not extra pick-up unit just can clearly detect the image-forming information of waiting to carve object surface, greatly reduce and detect cost and promoted the detection quality.
Above-mentioned photoetching method is used above-mentioned lithographic equipment and no matter is implemented in the etching process out of focus phenomenon that is caused by the concavo-convex situation of waiting to carve object surface, still heat the variations in refractive index that causes and the out of focus phenomenon that causes by filling liquid, can both immediately, accurately carry out automatic focusing, thereby guarantee the photoetching quality of portable exposure.
The present invention is elaborated with specific embodiment below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is existing a kind of lithographic equipment synoptic diagram.
Fig. 2 is the structural representation of lithographic equipment of the present invention.
Fig. 3 A-3B is respectively that object surface to be carved forms the light path synoptic diagram when recessed and protruding.
Fig. 4 is the schematic flow sheet of photoetching method of the present invention.
Fig. 5 A-5B is the striped synoptic diagram in the pick-up unit.
Embodiment
See also Fig. 2, Fig. 2 is the structural representation of lithographic equipment of the present invention.As shown in the figure, in lithographic equipment 20, comprise and carve light source 21, optical system 22 and automatic focusing system 23.This optical system 21 comprises diaphragm 221, partial reflection optical device 222, imaging lens group 223 and interferometric optical head 224.Wherein, diaphragm 221 is digital micromirror elements or spatial light modulator, has adjustable generation corrosion figure at a moment case.Imaging lens group 223 comprises first lens combination 2231 and second lens combination 2232, diaphragm 221 is positioned at the front focal plane of this first lens combination 223, to wait to carve the back focal plane that object surface 240 is arranged at this second lens combination 2232, wait to carve on the surface 240 of object to realize formed pattern on the diaphragm 221 is imaged onto with the resolution of the best.
This interferometric optical head 224 comprises beam splitting device 2241 and beam cementing prism 2242, and second lens combination 2232 total with this imaging lens group 223.This beam splitting device 2241 for example is that beam-splitting optical grating or other have the optical device of beam split function, this beam cementing prism 2242 is Dove prism or hexahedron prism for example, by this beam-splitting optical grating 2241 light that this second lens combination 2232 spreads out of is divided into multi beam light, and after this beam cementing prism 2242 converges, wait to carve object surface 240 at this and form interference image;
This automatic focusing system 23 comprises pick-up unit 231, the control device 232 and first drive unit 233.Wherein, this pick-up unit 231 is by this partial reflection optical device 222, is positioned at the front focal plane of this first lens combination 2231 with this diaphragm 221 conjugation ground.This pick-up unit 231 is charge coupled cell or Photoelectric Detection equipment.It is to be noted, though this diaphragm 221 is positioned at the reflecting surface of this partial reflection optical device 222 as shown in FIG., this pick-up unit 231 is positioned at the transmission plane of this partial reflection optical device 222, but also can be with both location swaps, as long as satisfy conjugate relation.By the reversible relation of light path as can be known, the light path of being made up of pick-up unit 231, partial reflection optical device 222, first lens combination 2231 and interferometric optical head 224 this moment becomes the backlight road of the light path that optical system 21 forms, therefore the light that sends from diaphragm 221 is after waiting to carve object surface 240 reflections, can reversibly enter in the pick-up unit 231, make this pick-up unit 231 clearly accept from the image-forming information of waiting to carve object surface.
This control device 232 is an external computer system, and it connects this pick-up unit 231, and according to the image-forming information that this pick-up unit 231 receives, generates a conditioning signal.
The conditioning signal that this first drive unit 233 receives from this control device 232, and drive this interferometric optical head 224 and on the Z axle, move.
Further, this lithographic equipment 20 also comprises the objective table and the second drive unit (not shown), and this objective table is in order to place object described to be carved, and this second drive unit drives this objective table and moves in the XY plane of vertical this Z axle.
Further, at this interferometric optical head 224 with wait to carve between the object surface 240, also be provided with filling liquid 260.This filling liquid 260 is water or other transparency liquids for example, in order to improve the spatial frequency that laser interference forms microstructure.
Interfere the cycle d that forms microstructure to calculate with formula
d=λ/(2×n×sin(θ))
Wherein, n is a liquid refractive index, and θ is the angle of two light beams, and λ is the wavelength of light source.
To introduce the automatic focusing principle of this lithographic equipment below in detail.
Please in conjunction with Fig. 2 referring to Fig. 3 A-3B, Fig. 3 A-3B is respectively that object surface to be carved forms the light path synoptic diagram when recessed and protruding.As shown in the figure, with beam splitting device 2231 light being divided into 2 bundles is example, waiting to carve under the smooth situation of object surface 240, because this waits to carve the imaging relations of the coincidence imaging lens combination 223 of object surface 240 and diaphragm 221 strictnesses, therefore the two-beam line is after waiting to carve object surface 240 reflections, still merge into 1 bundle and be back in the pick-up unit 231, this moment, this pick-up unit 231 was restrainted light owing to only receive 1, so there is not interference fringe in it.
Occur recessed or protruding the time when waiting to carve object surface 240, then the out of focus phenomenon then appears in the light of focusing originally, such as in Fig. 3 A, pit occurs owing to wait to carve object surface 240, the reflection spot of light 271 is darker than originally, makes light 271 reflections retrodeviate from original route.Same light 272 has also departed from original route, and this two-beam line just can not synthesize 1 and restrainted light and be back in the pick-up unit 231 this moment.Thereby make pick-up unit 231 receive the two-beam line and form interference fringe.Carve the situation that projection appears in object 240 for waiting, similar with the situation of pit, so repeat no more.
Control device judges that according to pick-up unit 231 detected interference fringes this moment, optical system was not to be in optimum exposure resolution, then produces conditioning signal to the first drive unit 233.This first drive unit 233 drives this interferometric optical head and moves on the Z axle, thereby finish automatic focusing process according to this conditioning signal.
Introduce the method for carrying out photoetching below again with this above-mentioned lithographic equipment.See also Fig. 4, Fig. 4 is the schematic flow sheet of photoetching method of the present invention.As shown in the figure, at first regulate this optical system, the pattern imaging that makes the diaphragm demonstration is in object surface to be carved.Adjusting herein is a kind of coarse adjustment, thereby object surface to be carved not is the back focal plane that is positioned at second lens combination accurately, and promptly light the out of focus phenomenon can occur this moment.
Start this automatic focusing system then, this pick-up unit is received wait to carve the image-forming information of object surface from this, because above-mentioned light has the out of focus phenomenon, thereby detected figure must have interference fringe in this moment pick-up unit;
Then control device is according to the image-forming information of this pick-up unit reception, control this first drive unit, at first regulate this interferometric optical head with Z axle first direction, and the image-forming information in record pick-up unit this moment, control this first drive unit according to the situation of change of image-forming information and continue to adjust this interferometric optical head in such a way:
One. shown in Fig. 5 A, if interference fringe and striped in pick-up unit, occur from sparse to dense, the first direction that means this moment is the opposite way round, the defocusing amount of light is increasing, then stop this interferometric optical head in this first direction motion, and this interferometric optical head is moved upward with the second party of opposite and first direction, disappear until striped.
Two. shown in Fig. 5 B,, mean that this first direction is a correct direction, then continue to regulate this interferometric optical head, disappear until striped with first direction as if interference fringe and striped in pick-up unit, occurring from dense to sparse.
It should be noted that herein, in actual applications, because must there be error in machine itself, so might not reach optimum condition without stripes in the pick-up unit, some interference fringes of existence more or less, therefore when regulating, reaching maximal value with the interval between the striped in the pick-up unit is optimum condition.In addition, under the situation that adopts 4 light beams or 6 beam interference photoetching, interference fringe then is transformed into light and dark quadrature lattice-like or honeycomb lattice-like by light and dark strip, and still the change of interference fringes situation that is produced by the focusing action all is the variation between the density.
Stop at last regulating, treat by a laser pulse light source and carve object surface and carry out etching.
In a kind of application of the present invention, before regulating optical system, also need and wait to carve and inject filling liquid between the object surface, so that the resolution of whole optical system improves at the interferometric optical head.Simultaneously in exposure process, if this filling liquid is heated and its refractive index changes, when causing the light out of focus, this automatic focusing system continues ceaselessly to focus according to this change of refractive situation according to the method for above-mentioned focusing, makes the best operational position place that object surface to be carved can be arranged at optical system before the etching of exposing each time.
In another kind of application the of the present invention, after finishing automatic focusing, start second drive unit, controlling objective table in the mode of continuous or stepping moves in the XY plane of vertical Z axle, simultaneously in the process that this moves, this automatic focusing system continues ceaselessly to wait that according to this fluctuating situation of carving object surface focuses according to the method for above-mentioned focusing, makes the best operational position place that object surface to be carved can be arranged at optical system before the etching of exposing each time.
In another kind of application the of the present invention, the geometric shape of this diaphragm output pattern can be regulated according to preestablishing, and makes objective table when mobile, and the light source figure that institute's etching is come out under each recurrence interval has continuity.
Simultaneously continuous speed or the dead time of stepping when moving when mobile of this objective table regulated, make objective table when mobile, the exposure of light source under a recurrence interval satisfies at this waits to carve the threshold quantity that object surface forms etching pattern, thereby guarantees that each exposure can both wait that carving object surface forms pattern.
In sum, the present invention proposes a kind of immersion interference lithography device and photoetching method with automatic focusing function, this immersion interference device is provided with pick-up unit by the principle of reversibility of light path at the conjugate position place of diaphragm, make that need not extra pick-up unit just can clearly detect the image-forming information of waiting to carve object surface, greatly reduce and detect cost and promoted the detection quality.This photoetching method is used above-mentioned lithographic equipment and no matter is implemented in the etching process out of focus phenomenon that is caused by the concavo-convex situation of waiting to carve object surface, still heat the variations in refractive index that causes and the out of focus phenomenon that causes by filling liquid, can both immediately, accurately carry out automatic focusing, thereby guarantee the photoetching quality of portable exposure.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and is not to come claim scope of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the scope of claim of being arranged in of various changes and tool equality institute of the present invention desire application.

Claims (10)

1. a lithographic equipment is used for comprising light source, optical system and automatic focusing system waiting that carving object surface forms micro-nano structure, it is characterized in that:
This optical system comprises diaphragm, partial reflection optical device, imaging lens group and interferometric optical head, wherein
Described imaging lens group comprises first lens combination and second lens combination, and described diaphragm is positioned at the front focal plane of this first lens combination, and object surface described to be carved is positioned at the back focal plane of this second lens combination,
Described interferometric optical head comprises beam splitting device and beam cementing prism, and second lens combination total with this imaging lens group, this beam splitting device is divided into multi beam light with the light that this second lens combination spreads out of, and after this beam cementing prism converges, waits to carve object surface at this and form interference image;
This automatic focusing system comprises pick-up unit, the control device and first drive unit, wherein
Described pick-up unit is positioned at the front focal plane of this first lens combination with this diaphragm conjugation ground, and by the light path reversible relation, receives from the image-forming information of waiting to carve object surface by this partial reflection optical device,
Described control device connects this pick-up unit, and according to the image-forming information that this pick-up unit receives, generates a conditioning signal,
Described first drive unit receives above-mentioned conditioning signal, and drives this interferometric optical head and move on the Z axle.
2. lithographic equipment as claimed in claim 1 is characterized in that: described diaphragm is digital micromirror elements or spatial light modulator.
3. lithographic equipment as claimed in claim 1 is characterized in that: described pick-up unit is charge coupled cell or photodetector.
4. lithographic equipment as claimed in claim 1 is characterized in that: also comprise the objective table and second drive unit, this objective table is in order to place object described to be carved, and this second drive unit drives this objective table and moves in the XY plane of vertical this Z axle.
5. lithographic equipment as claimed in claim 1 is characterized in that: this lithographic equipment is an immersion interference lithography device, at described interferometric optical head with wait to carve between the object surface, is provided with filling liquid.
6. an object surface forms the photoetching method of micro-nano structure, and this method is used as any described lithographic equipment of claim 1 to 5, it is characterized in that:
(1) regulate this optical system, the pattern imaging that makes the diaphragm demonstration is in object surface to be carved;
(2) start this automatic focusing system, this pick-up unit is received wait to carve the image-forming information of object surface from this;
(3) control device is controlled this first drive unit, regulate this interferometric optical head with Z axle first direction, and the image-forming information in record pick-up unit this moment, control this first drive unit according to the situation of change of image-forming information and continue to adjust this interferometric optical head in such a way:
One. as if interference fringe and striped in pick-up unit, occurring from sparse to dense, then stop this interferometric optical head in this first direction motion, and this interferometric optical head is moved upward with the second party of opposite and first direction, the interval between striped disappearance or striped reaches maximal value;
Two. as if interference fringe and striped occurring from dense to sparse in pick-up unit, then continue to regulate this interferometric optical head with first direction, the interval between striped disappearance or striped reaches maximal value;
(4) stop to regulate, treat by a laser pulse light source and carve object surface and carry out etching.
7. photoetching method as claimed in claim 6, it is characterized in that: before in step (1), also be included in the interferometric optical head and wait to carve and inject filling liquid between the object surface, simultaneously in the process of step (4), if this filling liquid is heated and its refractive index changes, when causing the light out of focus, this automatic focusing system continues to focus according to step (3), makes the best operational position that object surface to be carved can be arranged at optical system before the etching of exposing each time.
8. photoetching method as claimed in claim 6, it is characterized in that: afterwards in step (3), also comprise and start second drive unit, controlling objective table in the mode of continuous or stepping moves in the XY plane of vertical Z axle, simultaneously in the process that this moves, this automatic focusing system continues to focus according to step (3), makes the best operational position that object surface to be carved can be arranged at optical system before the exposure etching.
9. photoetching method as claimed in claim 8 is characterized in that: reconcile the geometric shape of this diaphragm output pattern, make objective table when mobile, the light source figure that institute's etching is come out under each recurrence interval has continuity.
10. photoetching method as claimed in claim 8, it is characterized in that: reconcile continuous speed or the dead time of stepping when moving when mobile of this objective table, make objective table when mobile, the exposure of light source under a recurrence interval satisfies at this waits to carve the threshold quantity that object surface forms etching pattern.
CN201010503788XA 2010-10-12 2010-10-12 Photoetching device and photoetching method Active CN101976020B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010503788XA CN101976020B (en) 2010-10-12 2010-10-12 Photoetching device and photoetching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010503788XA CN101976020B (en) 2010-10-12 2010-10-12 Photoetching device and photoetching method

Publications (2)

Publication Number Publication Date
CN101976020A true CN101976020A (en) 2011-02-16
CN101976020B CN101976020B (en) 2012-08-22

Family

ID=43575914

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010503788XA Active CN101976020B (en) 2010-10-12 2010-10-12 Photoetching device and photoetching method

Country Status (1)

Country Link
CN (1) CN101976020B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102736427A (en) * 2011-04-07 2012-10-17 上海微电子装备有限公司 Exposure device and method of same
CN102880018A (en) * 2011-07-11 2013-01-16 上海微电子装备有限公司 Reference grating space image adjusting device used for alignment system and adjusting method
CN105182542A (en) * 2014-06-19 2015-12-23 斯克林集团公司 Light Irradiation Apparatus And Drawing Apparatus
US10054859B2 (en) 2016-01-06 2018-08-21 Soochow University Real-time variable parameter micro-nano optical field modulation system and interference lithography system
CN108941897A (en) * 2018-09-14 2018-12-07 北京工业大学 A kind of automatic focus searching method
CN111352310A (en) * 2020-03-31 2020-06-30 深圳市深大极光科技有限公司 Automatic focusing device and automatic focusing method for optical projection lithography machine
WO2020143294A1 (en) * 2019-01-10 2020-07-16 苏州苏大维格科技集团股份有限公司 Large-area nano-lithography system and method therefor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070033136A (en) * 2005-09-21 2007-03-26 삼성전자주식회사 Method for adjusting focal length of an exposure apparatus
JP2008286607A (en) * 2007-05-16 2008-11-27 Nikon Corp Position detection device, wafer stacking device, method of manufacturing three-dimensional laminated semiconductor device, exposure device, and method of manufacturing device
JP2009236654A (en) * 2008-03-27 2009-10-15 Nikon Corp Displacement detecting apparatus, exposure apparatus, and device manufacturing method
CN101846890A (en) * 2010-05-13 2010-09-29 苏州苏大维格光电科技股份有限公司 Parallel photoetching write-through system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070033136A (en) * 2005-09-21 2007-03-26 삼성전자주식회사 Method for adjusting focal length of an exposure apparatus
JP2008286607A (en) * 2007-05-16 2008-11-27 Nikon Corp Position detection device, wafer stacking device, method of manufacturing three-dimensional laminated semiconductor device, exposure device, and method of manufacturing device
JP2009236654A (en) * 2008-03-27 2009-10-15 Nikon Corp Displacement detecting apparatus, exposure apparatus, and device manufacturing method
CN101846890A (en) * 2010-05-13 2010-09-29 苏州苏大维格光电科技股份有限公司 Parallel photoetching write-through system

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
《仪器仪表学报》 20091031 浦东林等 支持亚波长结构光刻的紫外干涉光学头 第30卷, 第10期 2 *
《光子学报》 20080930 吴智华等 高分辨率衍射图形的DMD并行激光干涉直写 第37卷, 第09期 2 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102736427A (en) * 2011-04-07 2012-10-17 上海微电子装备有限公司 Exposure device and method of same
CN102880018A (en) * 2011-07-11 2013-01-16 上海微电子装备有限公司 Reference grating space image adjusting device used for alignment system and adjusting method
CN105182542A (en) * 2014-06-19 2015-12-23 斯克林集团公司 Light Irradiation Apparatus And Drawing Apparatus
US10036958B2 (en) 2014-06-19 2018-07-31 SCREEN Holdings Co., Ltd. Light irradiation apparatus and drawing apparatus
US10054859B2 (en) 2016-01-06 2018-08-21 Soochow University Real-time variable parameter micro-nano optical field modulation system and interference lithography system
CN108941897A (en) * 2018-09-14 2018-12-07 北京工业大学 A kind of automatic focus searching method
WO2020143294A1 (en) * 2019-01-10 2020-07-16 苏州苏大维格科技集团股份有限公司 Large-area nano-lithography system and method therefor
CN111352310A (en) * 2020-03-31 2020-06-30 深圳市深大极光科技有限公司 Automatic focusing device and automatic focusing method for optical projection lithography machine

Also Published As

Publication number Publication date
CN101976020B (en) 2012-08-22

Similar Documents

Publication Publication Date Title
CN101976020B (en) Photoetching device and photoetching method
CN103309169B (en) The method of pick-up unit, exposure device and manufacture device
CN102540778B (en) Measuring system and photoetching device using same
CN101943865B (en) Alignment marks for photoetching equipment and alignment method
CN104155851A (en) Femtosecond-laser and two-photon polymerization micro-nano machining system and method
CN101446775B (en) Alignment light source apparatus
CN101790775A (en) Maskless exposure method
CN101807012B (en) Automatic focus light path structure of direct-write lithography machine
CN101165533A (en) High speed variable attenuator
CN106814546A (en) Focal plane detection device, focal plane scaling method and silicon wafer exposure method
JP2018139010A (en) Mobile device and exposure device
CN101609266A (en) A kind of field measurement apparatus of wave aberration of photo-etching machine projection objective
TW201137533A (en) Lithographic apparatus and patterning device
CN106933055B (en) A kind of alignment device and alignment methods
CN103838088B (en) A kind of focusing leveling device and focusing and leveling method
CN108073043A (en) A kind of optical uniformity compensation method of write-through screen printing system
CN104199258B (en) A kind of nanoscale focusing test method based on two-dimentional dual-frequency grating shear interference
KR101599577B1 (en) Exposure apparatus, method of controlling the same and method of manufacturing device
US7522323B2 (en) Method and apparatus for printing a pattern with improved focus correction and higher throughput
CN102207694A (en) Imaging adjustment unit and focusing and leveling control system using the unit
US8049865B2 (en) Lithographic system, device manufacturing method, and mask optimization method
CN108227407B (en) Digital light forming method based on coherent image feedback
CN101446767A (en) Method for measuring focus offsets of exposure tool
US8542345B2 (en) Measurement apparatus, exposure apparatus, and device manufacturing method to measure numerical aperture of the optical system using interference fringe
CN106462085B (en) Lithographic equipment and method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 215026 No. 478 South Street, Suzhou Industrial Park, Jiangsu, China

Co-patentee after: Suzhou University

Patentee after: SUZHOU SUDAVIG SCIENCE AND TECHNOLOGY GROUP Co.,Ltd.

Address before: 215026 No. 478 South Street, Suzhou Industrial Park, Jiangsu, China

Co-patentee before: Suzhou University

Patentee before: SVG OPTRONICS, Co.,Ltd.