CN114985942A - Method for achieving cross-scale mass leveling of hemispherical harmonic oscillator by reshaping femtosecond laser in airspace - Google Patents
Method for achieving cross-scale mass leveling of hemispherical harmonic oscillator by reshaping femtosecond laser in airspace Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
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Abstract
The invention discloses a method for realizing cross-scale quality leveling of a hemispherical harmonic oscillator by reshaping a femtosecond laser in an airspace, and belongs to the field of femtosecond laser application. According to the invention, the Gaussian femtosecond laser is shaped into the round flat top light, so that the light field energy is homogenized, the light field energy is used for removing the nano-gram, micro-gram and above masses on the surface of the hemispherical resonator, the problems of large bottom roughness and more edge burrs during the removal of the quality of the scanning surface of the traditional femtosecond laser can be avoided, and the surface trimming quality of the hemispherical resonator is improved; meanwhile, the mass removal is realized by adopting a femtosecond laser plano-convex lens or objective lens single-point processing mode, local micro-mass unbalance fine adjustment is carried out on the hemispherical harmonic oscillator after coarse adjustment, the precise mass leveling of the hemispherical harmonic oscillator spanning multiple scales such as milligram-microgram-nanogram-picogram is realized, and the leveling precision and efficiency are improved; the linear adjustment of the laser energy is realized by adjusting the angle position of the attenuation sheet in the optical path, the depth of the scanning processing and the volume of the single-point pit are controlled, and the removal of the preset mass is realized.
Description
Technical Field
The invention relates to a method for realizing cross-scale surface quality duplication removal of hemispherical harmonic oscillators by using an airspace shaping femtosecond laser and effectively reducing the roughness of a processed surface, belonging to the technical field of laser application.
Background
The hemispherical resonator gyroscope is a solid-state gyroscope for detecting angular velocity by utilizing the Goldfish effect of a hemispherical resonator, has the advantages of high precision, high reliability, high stability, simple structure and the like, and is widely applied to the fields of weapon guidance, naval vessel navigation and the like. The hemispherical harmonic oscillator is a core component of the hemispherical resonance gyroscope, and the quality of the hemispherical harmonic oscillator directly influences the overall performance of the gyroscope. The purpose of the de-weight leveling is to reduce the nonuniformity of the mass distribution of the hemispherical harmonic oscillator, thereby reducing the frequency difference of the harmonic oscillator and improving the overall performance of the gyroscope.
At present, the fine de-readjustment of the harmonic oscillator mainly comprises schemes such as ion beam leveling and laser leveling. Although the ion beam leveling has high precision, the problems of expensive ion beam equipment, complex leveling process, low efficiency in leveling large unbalanced mass and the like exist. The laser de-emphasis leveling can realize accurate positioning and quantitative mass elimination, and has the characteristics of high power density, high processing efficiency, non-contact and easy control. Compared with CO 2 The laser realizes the removal of the fused quartz material through the heat effect, and has the problems of poor quality of the processed surface, low processing precision and the like. And the femtosecond laser has very small heat affected zone to the material, can realize cold processing, and has great potential for obtaining high Q value and lower frequency cracking value of harmonic oscillator.
However, when the quality of nanogram, microgram and milligram levels is removed on the upper surface of a fused quartz material by a common femtosecond laser, the defects of more edge burrs, higher bottom roughness and the like exist in a processing area, so that the stability of the hemispherical harmonic oscillator is reduced, and the subsequent surface coating and gyro performance test are influenced. With the development and the improvement of the femtosecond laser space-time shaping technology, the method is widely applied to the field of precise structure manufacturing, can realize high-precision and high-surface-quality processing of difficult-to-process materials such as wide-bandgap materials and the like, and provides great help for realizing fine leveling on the hemispherical harmonic oscillator. And when the femtosecond laser single pulse is used for acting on the material, the ablation of the material in a very small area can be realized, and no obvious residual stress exists, so that the possibility of removing the extremely low quality of the hemispherical harmonic oscillator and leveling the quality with ultrahigh precision is provided.
Disclosure of Invention
In order to solve the problems of high surface roughness, rough boundary, poor leveling efficiency precision and low efficiency of the existing hemispherical resonator mass leveling method, the invention mainly aims to provide a method for realizing the cross-scale mass leveling of a hemispherical resonator by using an airspace-shaped femtosecond laser.
The purpose of the invention is realized by the following technical scheme.
The invention discloses a method for realizing cross-scale quality leveling of a hemispherical resonator by reshaping a femtosecond laser in an airspace, which is characterized in that a spatial light modulator reshapes a Gaussian femtosecond laser into a round flat top light to realize uniform distribution of light field energy, and the method is used for removing the quality of nanogram, microgram and above of the surface of the hemispherical resonator, can avoid large bottom roughness and more edge burrs when the quality of the surface of the hemispherical resonator is removed by the traditional femtosecond laser, further ensures that the quality factor of the hemispherical resonator is not greatly reduced (the quality factor of the hemispherical resonator is greatly reduced due to the large bottom roughness and more edge burrs), and improves the surface trimming quality of the hemispherical resonator. Meanwhile, the femtosecond laser plano-convex lens or objective lens single-point processing mode is adopted to remove the mass of hundreds of picograms, several picograms or higher precision, local micro-mass unbalance fine adjustment is carried out on the hemispherical harmonic oscillator after coarse adjustment, the precise mass leveling of the hemispherical harmonic oscillator of milligram-microgram-nanogram-picogram and the like spanning multiple scales is realized, and the leveling precision and efficiency are improved. The linear adjustment of the laser energy is realized by adjusting the angle position of the attenuation sheet in the optical path, the depth of the scanning processing and the volume of the single-point pit are controlled, and the removal of the preset mass is realized.
The invention discloses a method for realizing cross-scale quality leveling of a hemispherical resonator by using an airspace shaping femtosecond laser, which is realized by using a cross-scale quality leveling system of the hemispherical resonator based on the airspace shaping femtosecond laser.
The femtosecond laser processing subsystem comprises a femtosecond laser, an electric control shutter, an attenuation sheet and a coating reflecting mirror, wherein the femtosecond laser generates pulse laser and sequentially transmits the pulse laser along the device.
The femtosecond laser spatial shaping subsystem comprises a Spatial Light Modulator (SLM) for generating circular flat-top light and a plano-convex lens group for beam shrinking. The traditional femtosecond laser processing has the defects of single processing light field and difficulty in reaching higher precision. According to the principle that a Spatial Light Modulator (SLM) controls the orientation of birefringent crystal molecules by voltage pairs to achieve light control, the spatial distribution of laser pulses can be changed by controlling the amplitude, phase or polarization of the optical field. And obtaining the circular flat top light with uniformly distributed energy in the laser irradiation range by loading the phase diagram and using a 4f beam-shrinking system.
The objective lens processing subsystem comprises an objective lens frame, a 10X/20X objective lens and a plano-convex lens with the focal length f being 100mm, and is used for achieving the precision requirement of removing processing with different-magnitude quality.
And the imaging subsystem is used for realizing the real-time observation of the surface appearance during the de-duplication processing of the hemispherical harmonic oscillator.
The computer control system is used for controlling the femtosecond laser pulse triggering, the electric control shutter switch, the three-dimensional translation stage motion, the Spatial Light Modulator (SLM) and the Charge Coupled Device (CCD) imaging in real time.
The debris cleaning system comprises an air pump and an air blowing needle pipe and is used for cleaning splashes such as debris on the surface of a sample during processing.
The high-precision three-dimensional translation table is used for placing the clamp and the hemispherical harmonic oscillator and realizing high-precision three-dimensional motion.
The connection relationship among the above-mentioned component systems is:
the femtosecond laser and the electric control shutter in the femtosecond laser processing subsystem are connected with the computer control system.
The femtosecond laser Spatial Light Modulator (SLM) is connected with a computer control system.
After entering the space-domain shaping subsystem, the femtosecond laser downwards propagates to the surface of the hemispherical resonator through the objective lens/plano-convex lens.
In the quality removing process, white light generated by the hemispherical resonator surface under the irradiation of the illumination light source is reflected upwards, carries processing morphology information and enters the CCD to realize the real-time observation of the processing result.
The method for realizing the cross-scale quality leveling of the hemispherical harmonic oscillator by the space-domain shaping femtosecond laser comprises the following steps:
step one, adjusting light path collimation of a femtosecond laser processing subsystem, and determining the propagation direction of femtosecond laser;
secondly, mounting a Spatial Light Modulator (SLM) on a three-dimensional manual translation stage, and adjusting the X, Y and Z directions of the translation stage to enable incident light to vertically enter a liquid crystal screen of the SLM, so as to ensure the airspace shaping homogenization degree;
loading the information of the manufactured phase diagram on a control computer by using special software, and transmitting the information to a spatial light modulator;
step four, a 4f system consisting of 2 plano-convex lenses with consistent focal length is additionally arranged on a light path behind the spatial light modulator, and the distance between the 2 lenses is 2 times of the focal length;
step five, vertically introducing the laser subjected to the airspace shaping into an objective lens/plano-convex lens, and adjusting the processing laser focus to coincide with the imaging focus;
fixing the hemispherical harmonic oscillator on a three-dimensional electric control translation table through a special fixture, and adjusting the position of the fixture and the three-dimensional electric control translation table to enable the position of the de-weight mark to be displayed at the uppermost end of the hemispherical harmonic oscillator sample, so that the image is adjusted clearly;
fixing an air blowing needle tube of an air pump on the optical platform, wherein the air outlet position of the needle tube is aligned with the area to be processed;
and step eight, according to the de-weighting requirement, adopting an airspace shaping femtosecond laser scanning surface or an objective lens/plano-convex lens single-point processing mode, and simultaneously opening an air pump to blow in real time to realize de-weighting of the calibration position.
Step nine: the pulse overlapping rate can be controlled by controlling the repetition frequency, the scanning speed and the line spacing, and the processing depth can be greatly adjusted by adjusting the laser energy through the attenuation sheet, so that the removal of different magnitudes of mass such as milligram, microgram, nanogram, picogram and the like is realized.
Has the advantages that:
1. the invention discloses a method for realizing cross-scale mass leveling of a hemispherical harmonic oscillator by using an airspace shaping femtosecond laser, wherein the mass of the hemispherical harmonic oscillator is removed by using the airspace shaping femtosecond laser, and the removal of the masses of nanograms, microgrammes and above can be realized by detecting and processing square surfaces with different sizes and depths; the circular flat top light with uniform intensity distribution on the cross section of the light beam is obtained through airspace shaping, and then the air pump is used for blowing air, so that the surface roughness of a processing area is effectively reduced, the surface roughness reaches Ra of 0.045 mu m at the lowest by third-party detection, and the edge of a processed square groove is also obviously improved.
2. The invention discloses a method for realizing cross-scale quality leveling of a hemispherical harmonic oscillator by airspace shaping femtosecond laser, which adopts the femtosecond laser f as 100mm plano-convex lens single-point hemispherical harmonic oscillator surface to realize hundred picogram-level quality removal, adopts a 10X/20X objective lens single-point processing mode to realize several picogram-level quality removal, and has smooth bottom profile of a single-point pit and high precision; therefore, the milligram-microgram-nanogram-picogram grade cross-scale mass de-weighting can be realized, and the leveling precision and the leveling efficiency of the hemispherical harmonic oscillator are improved.
Drawings
Fig. 1 is a schematic diagram of a system for realizing cross-scale mass leveling of a hemispherical harmonic oscillator by using an airspace shaping femtosecond laser.
FIG. 2 shows a hemispherical resonator of a hemispherical resonator gyro, which is a processing object and has fused silica as a component;
FIG. 3(a) is a schematic diagram of a spatial light Shaper (SLM) architecture; FIG. 3(b) is a phase diagram with loading and a schematic diagram of a rounded flat top.
Fig. 4 is a graph of processing results.
The system comprises a 1-femtosecond laser, a 2-coating reflecting mirror 1, 3-attenuation sheet, a 4-electric control shutter, a 5-coating reflecting mirror 2, 6-dichroic mirror 1, 7-Spatial Light Modulator (SLM), an 8-three-dimensional manual platform, a 9-planoconvex lens 1, 10-planoconvex lens 2, 11-coating reflecting mirror 3, 12-dichroic mirror 2, 13-planoconvex lens/objective lens, a 14-air pump and air blowing needle tube, a 15-hemispherical harmonic oscillator, a 16-special clamp, a 17-three-dimensional electric control translation platform, an 18-dichroic mirror 3, 19-illuminating lamp, a 20-planoconvex lens 3, 21-Charge Coupled Device (CCD) and a 22-computer control system.
9 and 10 form a femtosecond laser spatial shaping beam-shrinking lens group. 13. 14, 15, 16, 17, 22 constitute a hemispherical mass leveling subsystem. 18. 19, 20 constitute a femtosecond laser processing imaging subsystem.
Detailed Description
In order to better understand the method of the present invention, the following detailed description will be made on the technical solution of the present invention with reference to specific examples.
The method for realizing the cross-scale quality leveling of the hemispherical harmonic oscillator by the airspace shaping femtosecond laser specifically comprises the following steps:
the method comprises the following steps: the optical path system adopted in the present embodiment is shown in fig. 1. The laser at the laser light outlet of the femtosecond laser 1 is Gaussian laser with the pulse width of 50fs and the wavelength of 800nm, the polarization state is horizontal line polarization, and the repetition frequency is adjustable between 1 Hz and 1000 Hz. And adjusting the femtosecond processing subsystem to calibrate the light beam so that the light beam is vertical to the table top of the three-dimensional electric control translation table 17. Pulses generated by the femtosecond laser 1 are incident on the attenuation sheet 3 after passing through the coating reflecting mirror 2, the femtosecond laser energy is adjusted, and the passing of laser light is controlled by the electric control switch 4.
Step two: the Spatial Light Modulator (SLM)7 is mainly configured with core members such as a glass substrate, a transparent electrode, a liquid crystal layer, a pixelated electrode, and a silicon substrate, as shown in fig. 3 (a). The main principle of the spatial light modulator is based on the birefringence effect of liquid crystal, the orientation of liquid crystal molecules is controlled by changing the voltage on two sides of a liquid crystal layer, and the refractive index of an extraordinary axis of a birefringent crystal is controlled, so that the modulation of a laser light field is realized. In practice, the Spatial Light Modulator (SLM)7 is typically used to control the voltage of each pixel using a gray scale pattern. The pixel value of each pixel of the gray scale map corresponds to the voltage applied to the corresponding pixel on the Spatial Light Modulator (SLM) 7. The circular flat-top light phase diagram shown in fig. 3(b) is loaded to the Spatial Light Modulator (SLM)7 by the computer control system 22 to obtain a circular flat-top light field, and the beam cross-sectional intensity distribution is detected by the beam quality analyzer, as shown in fig. 3 (b).
Step three: by adjusting the X, Y, Z axis position of the three-dimensional manual platform 8, the femtosecond laser vertically enters the liquid crystal of the Spatial Light Modulator (SLM)7 through the dichroic mirror 6 and is reflected by a small angle, and the phase of the light spot is changed accordingly. And a 4f beam-shrinking lens group consisting of 2 plano-convex lenses 9 and 10 with consistent focal length is utilized to transmit light spots to the back focal plane of the objective lens without diffraction, so that the circular flat-top light beam after energy convergence is obtained.
Step four: the airspace shaping circular flat-top light is introduced into a plano-convex lens/objective lens 13 through a reflector 11 and a dichroic mirror 12, the lens or objective lens used for processing is determined by actual leveling requirements, and laser is focused on the surface of a hemispherical harmonic oscillator 15 sample by controlling the Z axis of a three-dimensional electric control translation stage 17. The white light source of the imaging system is provided by an illuminating lamp 19, and the sample surface reflected light enters a Charge Coupled Device (CCD)21 through a dichroic mirror 12, a dichroic mirror 18 and a plano-convex lens 20.
Step five: since focus searching on the hemispherical resonator 15 is not allowed, before the hemispherical resonator 15 is processed, the processing focus should be adjusted by the sample to coincide with the imaging focus.
Step six: the hemisphere harmonic oscillator 15 is fixed on the three-dimensional electric control translation table 17 through the special fixture 16, the position to be processed is located at the uppermost end of the surface of the hemisphere through adjustment of the special fixture 16, and the movement of the three-dimensional electric control translation table 17 and the opening and closing of the mechanical switch 3 are controlled through the computer control system 22, so that the quality removal on the surface of the hemisphere harmonic oscillator 15 is realized.
Step seven: FIG. 4(a) shows the processing result of the shaped circular flat-topped beam, wherein the side length of a square groove is 200 μm, the objective lens is 10X, the laser repetition frequency is 1000Hz, the scanning speed of the laser is 200 μm/s, the line spacing is 1.5 μm, the processing depth is 5 μm, the removal mass is 440ng, and it can be seen that the groove processed by the spatial shaping laser has no obvious burr at the boundary and a flat groove bottom, and the low roughness value Ra of 0.045 μm is achieved through measurement. By adjusting the size of the processing area and the laser energy, microgram and even milligram-level mass removal can be realized.
Step eight: for the residual micro-unbalanced mass of the hemispherical harmonic oscillator, a plano-convex lens with the focal length f being 100mm or a 10X/20X objective lens is adopted for single-point processing. At this time, the power of the Spatial Light Modulator (SLM)7, which corresponds to one mirror, is turned off. And adjusting the femtosecond laser 1 to be in a singleshot mode to realize single-pulse triggering. The single pulse energy adjustment is realized by adjusting the angular position of the attenuation sheet 3.
Step nine: FIG. 4(b) shows the single point mass de-weighting results for a 100mm plano-convex lens at 9.91J/cm 2 Under the laser flux of (2), the diameter of the pit is 34.85 μm, the depth is 0.268 μm, the removal mass is 362pg, and the hundred picogram-level mass removal can be realized by regulating and controlling the energy. FIG. 4(c) shows the single point mass deduplication result for a 10X objective at 8.7J/cm 2 Under the laser flux of (2), the diameter of a pit is 2.9 μm, the depth is 0.190 μm, the removal mass is 1.4pg, and the mass removal of several to dozens of picograms can be realized by regulating and controlling the energy. Thus, by controlling the energy, femtosecond laser plano-convex lens/objective single point processing can achieve quality leveling on the picogram scale.
Step ten: the pulse overlapping rate can be controlled by controlling the repetition frequency, the scanning speed and the line spacing, and the processing depth can be greatly adjusted by adjusting the laser energy through the attenuation sheet 3, so that the removal of the mass with different magnitudes such as milligram, microgram, nanogram, picogram and the like is realized, and the ultra-high precision leveling capability and the multi-scale leveling range of the femtosecond laser are shown.
The above detailed description is intended to illustrate the objects, aspects and advantages of the present invention, and it should be understood that the above detailed description is only exemplary of the present invention and is not intended to limit the scope of the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (2)
1. The method for realizing the cross-scale quality leveling of the hemispherical harmonic oscillator by the space-domain shaping femtosecond laser is characterized by comprising the following steps of: the Gaussian femtosecond laser is shaped into circular flat top light through the spatial light modulator, so that the uniform distribution of light field energy is realized, the surface nano-gram, micro-gram and above quality removal of the hemispherical resonator is realized, the large bottom roughness and more edge burrs in the traditional femtosecond laser scanning surface quality removal process can be avoided, the quality factor of the hemispherical resonator is further ensured not to be greatly reduced, and the surface trimming quality of the hemispherical resonator is improved; meanwhile, the femtosecond laser plano-convex lens or objective lens single-point processing mode is adopted to remove the mass with the magnitude of hundreds of picograms and picograms or higher precision, local micro-mass unbalance fine adjustment is carried out on the hemispherical harmonic oscillator after coarse adjustment, the precise mass leveling of the hemispherical harmonic oscillator with milligram-microgram-nanogram-picogram spanning multiple scales is realized, and the leveling precision and efficiency are improved; the linear adjustment of the laser energy is realized by adjusting the angle position of the attenuation sheet in the optical path, the depth of the scanning processing and the volume of the single-point pit are controlled, and the removal of the preset mass is realized.
2. The method for achieving cross-scale mass leveling of the hemispherical harmonic oscillator by the space-domain shaping femtosecond laser as claimed in claim 1, wherein the method comprises the following steps: the method comprises the steps that a hemispherical harmonic oscillator cross-scale quality leveling system is realized based on airspace shaping femtosecond laser, and the airspace shaping femtosecond laser realizes the hemispherical harmonic oscillator cross-scale quality leveling system and comprises a femtosecond laser processing subsystem, a femtosecond laser airspace shaping subsystem, an objective lens processing subsystem, an imaging subsystem, a computer control system, a debris cleaning system and a high-precision three-dimensional translation table;
the femtosecond laser processing subsystem comprises a femtosecond laser, an electric control shutter, an attenuation sheet and a coating reflecting mirror, wherein the femtosecond laser generates pulse laser and sequentially transmits the pulse laser along the device;
the femtosecond laser spatial shaping subsystem comprises a Spatial Light Modulator (SLM) for generating circular flat-top light and a plano-convex lens group for beam shrinking; the traditional femtosecond laser processing has the defects of single processing light field and difficulty in achieving higher precision; according to the principle that a Spatial Light Modulator (SLM) controls the molecular orientation of birefringent crystals through voltage pairs to realize light control, the spatial distribution of laser pulses can be changed by controlling the amplitude, the phase or the polarization of an optical field; obtaining circular flat top light with uniformly distributed energy in a laser irradiation range through a 4f beam-shrinking system by loading a phase diagram;
the objective lens processing subsystem comprises an objective lens frame, a 10X/20X objective lens and a plano-convex lens with the focal length f being 100mm, and is used for realizing the precision requirement in removing processing with different magnitude qualities;
the imaging subsystem is used for realizing the real-time observation of the surface appearance during the de-duplication processing of the hemispherical harmonic oscillator;
the computer control system is used for controlling the femtosecond laser pulse triggering, the electric control shutter switch, the three-dimensional translation stage motion, the Spatial Light Modulator (SLM) and the Charge Coupled Device (CCD) imaging in real time;
the debris cleaning system comprises an air pump and an air blowing needle pipe and is used for cleaning splashed objects such as debris on the surface of a sample during processing;
the high-precision three-dimensional translation table is used for placing the clamp and the hemispherical harmonic oscillator and realizing high-precision three-dimensional motion;
the femtosecond laser and the electric control shutter in the femtosecond laser processing subsystem are connected with the computer control system;
the femtosecond laser Spatial Light Modulator (SLM) is connected with the computer control system;
after entering the airspace shaping subsystem, the femtosecond laser downwards transmits to the surface of the hemispherical resonator through the objective lens/plano-convex lens;
in the quality removing process, white light generated on the surface of the hemispherical resonator under the irradiation of the illumination light source is reflected upwards, and enters the CCD to realize the real-time observation of the processing result by carrying the processing morphology information;
the method for realizing the cross-scale quality leveling of the hemispherical harmonic oscillator by the space-domain shaping femtosecond laser comprises the following steps:
step one, adjusting the light path collimation of a femtosecond laser processing subsystem, and determining the transmission direction of femtosecond laser;
step two, installing a Spatial Light Modulator (SLM) on a three-dimensional manual translation stage, and adjusting the X, Y and Z directions of the translation stage to enable incident light to vertically enter a liquid crystal screen of the SLM, so as to ensure the airspace shaping homogenization degree;
loading the information of the manufactured phase diagram on a control computer by using special software, and transmitting the information to a spatial light modulator;
step four, a 4f system consisting of 2 plano-convex lenses with consistent focal length is additionally arranged on a light path behind the spatial light modulator, and the distance between the 2 lenses is 2 times of the focal length;
step five, vertically introducing the laser subjected to airspace shaping into an objective lens/plano-convex lens, and adjusting the processing laser focus to coincide with the imaging focus;
fixing the hemispherical harmonic oscillator on a three-dimensional electric control translation table through a special fixture, and adjusting the position of the fixture and the three-dimensional electric control translation table to enable the position of the de-weight mark to be displayed at the uppermost end of the hemispherical harmonic oscillator sample, so that the image is adjusted clearly;
fixing an air-blowing needle tube of the air pump on the optical platform, wherein the air outlet position of the needle tube is aligned to the area to be processed;
eighthly, according to the weight removal requirement, adopting an airspace shaping femtosecond laser scanning surface or an objective lens/plano-convex lens single-point processing mode, and simultaneously opening an air pump to blow in real time to realize the weight removal of the calibration position;
step nine: the pulse overlapping rate can be controlled by controlling the repetition frequency, the scanning speed and the line spacing, and the processing depth can be greatly adjusted by adjusting the laser energy through the attenuation sheet, so that the mass removal of different magnitudes such as milligram, microgram, nanogram, picogram and the like is realized.
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| CN117206670A (en) * | 2023-10-27 | 2023-12-12 | 北京理工大学 | Integrated processing of dual-wavelength flat-top femtosecond laser three-dimensional galvanometer system in vacuum environment |
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| CN116372376A (en) * | 2023-05-29 | 2023-07-04 | 北京理工大学 | Method and device for repairing hemispherical harmonic oscillator by combination of femtosecond laser and ion beam etching |
| CN116372376B (en) * | 2023-05-29 | 2023-08-04 | 北京理工大学 | Method and device for repairing hemispherical harmonic oscillator by combination of femtosecond laser and ion beam etching |
| CN116690199A (en) * | 2023-08-07 | 2023-09-05 | 湖南天羿领航科技有限公司 | Method and device for processing resonant structure of micro hemispherical gyroscope with skirt teeth |
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| CN117206670A (en) * | 2023-10-27 | 2023-12-12 | 北京理工大学 | Integrated processing of dual-wavelength flat-top femtosecond laser three-dimensional galvanometer system in vacuum environment |
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