CN116690199A - Method and device for processing resonant structure of micro hemispherical gyroscope with skirt teeth - Google Patents
Method and device for processing resonant structure of micro hemispherical gyroscope with skirt teeth Download PDFInfo
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- CN116690199A CN116690199A CN202310980037.4A CN202310980037A CN116690199A CN 116690199 A CN116690199 A CN 116690199A CN 202310980037 A CN202310980037 A CN 202310980037A CN 116690199 A CN116690199 A CN 116690199A
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
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- 238000005520 cutting process Methods 0.000 abstract description 7
- 238000003698 laser cutting Methods 0.000 abstract description 4
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
- G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
Abstract
The invention discloses a processing method and a device for a resonant structure of a micro hemispherical gyroscope with skirt teeth, wherein the processing method comprises the steps of utilizing femtosecond laser to click and process a contour point array of the skirt teeth according to a given interval on the resonant structure; carrying out ultrasonic chemical etching on the resonant structure in the corrosion groove to completely release the structure of the skirt teeth; the device comprises a laser processing unit and a jig assembly for fixing the resonant structure, wherein the jig assembly comprises a surface mounting fixture for laser processing the resonant structure and a corrosion fixture for corrosion operation. The invention can effectively avoid the surface damage problems such as microcracks and the like generated by the traditional laser direct cutting, and improve the Q value and damping uniformity of the micro hemispherical gyroscope; the micro hemispherical gyroscope has the advantages of better processing symmetry of the whole structure and batch processing, can effectively solve the problem of difficult vertical processing of laser cutting, realizes vertical forming processing, can further reduce processing gaps, increases the working capacitance area of devices, and improves the sensitivity of the micro hemispherical gyroscope.
Description
Technical Field
The invention relates to the technical field of processing of micro-hemispherical gyroscopes, in particular to a method and a device for processing a resonant structure of a micro-hemispherical gyroscope with skirt teeth.
Background
The micro hemispherical gyroscope is a vibrating gyroscope based on the Coriolis effect, is mainly formed by burning oxyhydrogen or propane and adopting a fused quartz material to rotate and blow at a high temperature and a high speed in a negative pressure environment, and has the advantages of high structural symmetry, high quality factor, low cost, batch processing and the like; has obvious advantages in the application field of small guided weapons. The micro hemispherical gyroscope with the skirt tooth resonant structure can increase the capacitance area and the modal mass by using the skirt tooth, and meanwhile, the skirt tooth can be added and subtracted by using a rear end processing technology to realize the rigidity adjustment of the resonant structure. The traditional skirt tooth processing adopts a femtosecond laser direct cutting mode to process, but the processing mode utilizes laser high-density energy to act on the surface of a material, completes cutting through the processes of temperature rising, melting, vaporization, sputtering, recondensing and the like, is easy to form micro defects in a structural processing area, can cause secondary damage under vibration or overload impact environment, increases the damage degree of a resonant structure, and even breaks edges and breaks, thereby causing the performance of a product to be reduced or failed. In addition, laser cutting processing is limited in focusing positioning accuracy, vertical processing cannot be achieved, so that the skirt teeth are required to be cut for multiple times along the thickness direction, the side surfaces of the skirt teeth are formed by multiple times of processing, and after the processing is finished, the end surfaces of the skirt teeth are in an inverted trapezoid shape, so that processing errors are increased, and symmetry deviation of a resonant structure is caused.
Disclosure of Invention
The invention aims to solve the technical problems: aiming at the problems in the prior art, the invention provides the method and the device for processing the resonant structure of the micro-hemispherical gyroscope with the skirt teeth, which can effectively avoid the surface damage problems such as microcracks and the like generated by the traditional laser direct cutting, and the side surface of the skirt teeth is formed by one-step processing, so that the processing quality of the side surface of the skirt teeth is good, the method has the advantages of better processing symmetry of the whole structure and batch processing, and meanwhile, the processing mode can effectively solve the problem that the vertical processing of the laser cutting is difficult, realize the vertical forming processing, further reduce the processing gap and increase the working capacitance area of devices.
In order to solve the technical problems, the invention adopts the following technical scheme:
a processing method of a resonant structure of a micro-hemispherical gyroscope with skirt teeth comprises the following steps:
s101, clicking and processing a profile point array of the skirt teeth on the resonant structure by using femtosecond laser according to a given interval, wherein the clicking and processing of the profile point array of the skirt teeth according to the given interval refers to processing of the profile points along the profile line of the skirt teeth according to the given interval, and each profile point is processed by adopting the femtosecond laser with focal length exceeding the thickness of the resonant structure in a one-time penetrating way, and adjacent profile points are arranged in a clearance without overlapping way, so that the resonant structure on the inner side of the profile line is connected with the redundant part on the outer side of the profile line through a connecting part between the adjacent profile points;
s102, carrying out ultrasonic chemical etching on the resonant structure in the etching groove to remove the connecting part between the resonant structure on the inner side of the contour line and the redundant part on the outer side of the contour line, so that the resonant structure and the skirt tooth structure thereof are completely released.
Alternatively, the given pitch in step S101 is in the μm scale.
Optionally, clicking the profile point array of the skirt teeth with the laser at a given pitch in step S101 includes elongating the focal point of the laser to a level of hundred μm to achieve vertical machining with high depth of field.
Optionally, in step S101, when the profile point array of the skirt teeth is machined by using a femto-second laser according to a given pitch, the wavelength of the laser is 1030nm, and the laser process parameters include: pulse width is 290fs, repetition frequency is 100kHz, single pulse energy is 60uJ, and defocus distance is-280 um.
Alternatively, when the sonochemical etching is performed in step S102, the ultrasonic power is in the order of hundred watts, and hydrofluoric acid of 10% by mass concentration is used.
The processing device for applying the processing method of the micro hemispherical gyroscope resonant structure with the skirt teeth comprises a laser processing unit and a jig assembly for fixing the resonant structure, wherein the laser processing unit comprises:
a laser for generating laser light;
the first wave plate and the polaroid are used for combining and adjusting the power of the laser;
a shutter for switching an optical path;
the beam expander is used for expanding the beam diameter of the light beam;
the second wave plate is used for adjusting the polarization direction of the laser to achieve different processing effects, and the light beams transmitted through the second wave plate (16) form Gaussian light beams;
the conical lens is used for forming the Gaussian beam into an annular beam;
a plano-convex lens for forming the annular beam into a Bessel beam;
a focusing lens for focusing the reduced spot to form a cone beam on the processed resonant structure;
the first wave plate, the polaroid, the optical gate, the beam expander, the second wave plate, the conical lens, the plano-convex lens and the focusing lens are sequentially arranged on an optical path of laser output.
Optionally, one or more reflectors for turning the light beam are further arranged on the light path of the laser output.
Optionally, the tool assembly is including being used for the paster frock to resonant structure laser beam machining, the paster frock is including positive panel and the backplate of range upon range of arrangement, be equipped with a plurality of mounting groove that are used for placing resonant structure on the surface of positive panel, the middle part of mounting groove is equipped with the first central reference column that is used for fixed resonant structure, the bottom of mounting groove is equipped with the vacuum absorption hole that runs through, be equipped with the air tank cavity with each mounting groove's vacuum absorption hole intercommunication between positive panel and the backplate, be equipped with the air exhaust channel with air tank cavity intercommunication on the backplate.
Optionally, the tool subassembly still includes the corrosion fixture, the corrosion fixture includes swing joint's base and apron, be equipped with a plurality of recess that hold that are used for placing resonant structure on the base, the middle part that holds the recess is equipped with the second center reference column that is used for fixed resonant structure, the bottom that holds the recess is equipped with a plurality of lower through-holes that run through, be located the position that holds the recess and correspond on the apron and be equipped with a plurality of last through-holes that run through, be equipped with the pivot on the base, the apron cover is located in the pivot.
An application method of the processing device comprises the following steps:
s201, adopting a double-sided polished and ground fused quartz plate, and performing primary molding on the resonant structure by using a high Wen Chuizhi molding processing method;
s202, adhering a front panel and a back panel of the patch tool together on a hot plate by adopting paraffin, forming an air groove cavity in the front panel and the back panel of the patch tool, and connecting an air suction channel of the back panel of the patch tool with a vacuum pump through an air pipe and a connector;
s203, clamping the middle part of the mounting groove of the front panel of the patch tool, which is mounted with the pre-formed micro hemispherical gyro sensitive structure, by using tweezers, and positioning by using a first center positioning column;
s203, a vacuum pump is started, and the preformed micro hemispherical gyro sensitive structure and the patch fixture are transferred to a laser processing unit;
s204, randomly selecting a circle center point processed by fitting the skirt teeth at three points on the cross circle of the spherical shell and the skirt teeth of the micro-hemispherical gyro sensitive structure through an optical lens of the laser processing unit; loading a processing drawing, setting technological parameters of femtosecond laser, and clicking and processing a profile point array of the skirt teeth by using the femtosecond laser according to a given interval;
s205, closing the vacuum pump, picking up the resonant structure by using tweezers, placing the resonant structure in an etching clamp, placing the resonant structure and the etching clamp together in an etching groove for ultrasonic chemical etching to remove the connecting part between the resonant structure on the inner side of the contour line and the redundant part on the outer side of the contour line so as to completely release the resonant structure and the skirt tooth structure thereof;
s206, cleaning the corroded resonant structure and the corrosion fixture together by adopting ultrapure water, purging water by using a nitrogen gun, and taking out the corrosion fixture to obtain the processed resonant structure.
Compared with the prior art, the invention has the following advantages:
1. clicking and processing a profile point array of the skirt teeth according to a given interval by using a femtosecond laser on a resonance structure, wherein clicking and processing the profile point array of the skirt teeth according to the given interval means that the profile points are processed according to the given interval along the profile line of the skirt teeth, and each profile point is processed by adopting the femtosecond laser with focal length exceeding the thickness of the resonance structure in a one-time penetrating way, and gaps between adjacent profile points are arranged without overlapping, so that the resonance structure on the inner side of the profile line and redundant parts on the outer side of the profile line are connected through connecting parts between the adjacent profile points; the invention can effectively avoid the surface damage problems such as microcracks and the like generated by the traditional laser direct cutting, the side surface of the skirt tooth is formed by one-step processing, so that the skirt tooth has the advantages of better processing symmetry of the integral structure and batch processing, can effectively solve the problem of difficult vertical processing of laser cutting, realize vertical forming processing, further reduce the processing gap and increase the working capacitance area of devices.
Drawings
Fig. 1 is a schematic perspective view of a resonant structure of a micro hemispherical gyroscope with skirt teeth in the prior art.
FIG. 2 is a schematic cross-sectional view of a prior art skirt and gap distribution.
FIG. 3 is a schematic flow chart of the processing method according to the embodiment of the invention.
Fig. 4 is a schematic structural diagram of a laser processing unit according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of an optical principle of a laser processing unit according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a three-dimensional exploded structure of a patch tool according to an embodiment of the present invention.
Fig. 7 is a schematic front side perspective view of a front panel according to an embodiment of the invention.
Fig. 8 is a schematic view of a back side perspective structure of a front panel according to an embodiment of the present invention.
FIG. 9 is a schematic perspective view of an etching jig according to an embodiment of the present invention.
Fig. 10 is a schematic perspective view of a cover plate of a corrosion fixture according to an embodiment of the present invention.
Legend description: 11. a laser; 12. a first wave plate; 13. a polarizing plate; 14. a shutter; 15. a beam expander; 16. a second wave plate; 17. a conical lens; 18. a plano-convex lens; 19. a lens; 21. a front panel; 211. A mounting groove; 212. a first center positioning column; 213. vacuum adsorption holes; 214. an air groove cavity; 22. a back plate; 221. an air extraction channel; 31. a base; 32. a cover plate; 311. a holding groove; 312. a second center positioning column; 313. a lower through hole; 321. an upper through hole; 33. a rotating shaft.
Detailed Description
As shown in fig. 1 and 2, the resonant structure (harmonic oscillator) of the micro hemispherical gyroscope with the skirt teeth is a three-dimensional structure and mainly comprises a support column a, a spherical shell B and skirt teeth C, wherein the support column a, the spherical shell B and the skirt teeth C are distributed in a pairwise full-center symmetrical manner. The micro hemispherical gyroscope resonant structure with the skirt teeth is formed by adopting a fused quartz material and adopting a high-temperature blowing integrated forming method, the bottom of a support column A and the surface of the skirt teeth C are positioned on the same horizontal plane, the processing end surface of the skirt teeth C is a vertical end surface, and the size and the number of the skirt teeth C of the resonant structure can be adjusted by adjusting the size of a gap D between the skirt teeth.
As shown in fig. 3, the present embodiment provides a method for processing a resonant structure of a micro hemispherical gyroscope with skirt teeth, including:
s101, clicking and processing a profile point array of the skirt teeth on the resonant structure by using femtosecond laser according to a given interval, wherein clicking and processing the profile point array of the skirt teeth according to the given interval means that the profile points are processed along the profile line of the skirt teeth according to the given interval, and each profile point is processed by adopting the femtosecond laser with focal length exceeding the thickness of the resonant structure in a one-time penetrating way, and gaps between adjacent profile points are arranged without overlapping, so that the resonant structure on the inner side of the profile line and the redundant part on the outer side of the profile line are connected through a connecting part between the adjacent profile points;
s102, carrying out ultrasonic chemical etching on the resonant structure in the etching groove to remove the connecting part between the resonant structure on the inner side of the contour line and the redundant part on the outer side of the contour line, so that the resonant structure and the skirt tooth structure thereof are completely released.
The technical treatment avoids structural damage caused by femtosecond laser direct cutting, the processing structure has no edge breakage and fracture problem, the vibration resistance and impact property of the product are effectively improved, and the reliability and the service life of the product are greatly improved; meanwhile, vertical machining can be realized, symmetry of the micro-hemispherical resonant structure is further improved, comprehensive performance of products is improved, and meanwhile, the scheme can be used for batch treatment, machining efficiency is effectively improved, and production cost is reduced.
In this embodiment, the given pitch in step S101 is in the order of μm, specifically 3 μm in this embodiment.
In this embodiment, when the profile point array of the skirt teeth is processed by clicking the laser according to the given interval in step S101, the focal point of the laser is elongated to a hundred μm level to realize vertical processing with high depth of field, so that processing can be completed through one focal point parameter for processing each profile point, multiple times of focal point change in the processing process is not required, and processing efficiency of each profile point can be improved, and particularly, the processing surface of the profile point can be more flat. For example, as an alternative implementation, the focal point of the laser is elongated to 500um in this example.
In this embodiment, in step S101, when the profile point array of the skirt teeth is machined by using a femto-second laser according to a given pitch, the wavelength of the laser is 1030nm, and the laser process parameters include: pulse width is 290fs, repetition frequency is 100kHz, single pulse energy is 60uJ, and defocus distance is-280 um.
In this embodiment, when performing ultrasonic chemical etching in step S102, the ultrasonic power is in the level of hundred watts, and hydrofluoric acid with a mass concentration of 10% is used to process the profile of the skirt tooth structure by using femtosecond laser, and then 10% hydrofluoric acid and 300w ultrasonic power are combined in a special etching tool and a customized etching groove for the micro hemispherical resonator structure to complete wet etching release processing of the skirt tooth structure in the vertical direction, thereby forming the micro hemispherical gyro sensitive structure with the skirt tooth with a vertical end face.
The embodiment also provides a processing device for applying the processing method of the resonant structure of the micro hemispherical gyroscope with the skirt teeth, which comprises a laser processing unit and a jig assembly for fixing the resonant structure, as shown in fig. 4, wherein the laser processing unit comprises:
a laser 11 for generating laser light;
a first wave plate 12 and a polarizing plate 13 for adjusting the power of the laser beam in combination;
a shutter 14 for switching an optical path;
a beam expander 15 for expanding the beam diameter of the light beam;
the second wave plate 16 is used for adjusting the polarization direction of the laser to achieve different processing effects, and the light beams transmitted through the second wave plate 16 form Gaussian light beams;
a conic lens 17 for forming a gaussian beam into an annular beam;
a plano-convex lens 18 for forming a ring beam into a bessel beam;
a focusing lens 19 for focusing the reduced spot to form a cone beam on the resonant structure being processed;
the first wave plate 12, the polarizing plate 13, the shutter 14, the beam expander 15, the second wave plate 16, the axicon 17, the plano-convex lens 18, and the focusing lens 19 are arranged in this order on the optical path of the output of the laser 11. The focusing lens 19 may be of a desired lens type including, but not limited to, plano-convex lens, conical lens and objective lens as long as it is capable of focusing a reduced spot.
In the embodiment, the laser 11 adopts a Litsea LC laser, and through light path conversion, gaussian beam short focus is converted into diamond long focus, so as to realize single pulse modification processing of fused quartz with the thickness of 500um. By adjusting the distance of the optical elements in the laser processing unit, the modification laser focal length can be controlled.
In this embodiment, one or more mirrors for turning the beam are further disposed on the optical path of the output laser 11 for saving space, and the number of mirrors may be arranged according to need, for example, as an alternative embodiment, as shown in a in fig. 4, and this embodiment includes 3 mirrors.
As shown in fig. 5, the gaussian beam is adjusted to an annular beam by the axicon 17, and elongation of the optical focus (Z max ) Thereby realizing the vertical machining of the deep hole scale; the elongated focal point is reduced in equal proportion through the combination of the plano-convex lens 18 and the focusing lens 19, fine processing with smaller size can be realized when the light spot is smaller, damage can be reduced to be lower, and the Q value, damping uniformity and the like of the micro-hemispherical gyroscope can be improved; at the same time, the distance (f) between the plano-convex lens 18 and the focusing lens 19 combination can be adjusted 1 And f 2 ) The length (Zmax') of the elongated focal point can be adjusted, the focal point of the laser is elongated to the hundred mu m level to realize vertical machining with high depth of field, machining can be completed through one focal point parameter aiming at machining of each contour point, multiple times of focal point change in the machining process is not needed, machining efficiency of each contour point can be improved, and particularly the machining surface of the contour point can be more flat.
Because the micro hemispherical gyroscope resonance structure is a hemispherical three-dimensional structure, clamping processing is not good, in order to achieve plane accurate processing of the skirt teeth C, as shown in fig. 6, 7 and 8, the jig assembly in the embodiment comprises a surface mounting fixture for laser processing of the resonance structure, the surface mounting fixture comprises a front panel 21 and a back panel 22 which are arranged in a stacked mode, a plurality of mounting grooves 211 for placing the resonance structure are formed in the surface of the front panel 21, a first central positioning column 212 for fixing the resonance structure is arranged in the middle of the mounting grooves 211, penetrating vacuum adsorption holes 213 are formed in the bottoms of the mounting grooves 211, air groove cavities 214 communicated with the vacuum adsorption holes 213 of the mounting grooves 211 are formed between the front panel 21 and the back panel 22, and air extraction channels 221 communicated with the air groove cavities 214 are formed in the back panel 22. In this embodiment, the air groove cavities 214 are respectively formed by circular air grooves on the front panel 21 and the back panel 22. In the processing process, the three-dimensional micro-hemispherical gyroscope resonant structure is assembled and attached through the patch fixture, so that the conversion from the three-dimensional structure to the planar surface processing is realized, the processing is more convenient, meanwhile, the processing can be processed in batches, the processing consistency is also better, the profile of the skirt tooth structure is processed through femtosecond laser modification, and then 10% hydrofluoric acid is adopted, so that the wet corrosion processing of the skirt tooth structure is completed under the ultrasonic power of 300 w.
The jig assembly in this embodiment further includes a corrosion fixture made of a corrosion-resistant material, for example, polytetrafluoroethylene in this embodiment, which is resistant to corrosion by hydrofluoric acid. As shown in fig. 9 and 10, the corrosion fixture comprises a base 31 and a cover plate 32, which are movably connected, wherein a plurality of holding grooves 311 for holding the resonant structure are formed in the base 31, a second central positioning column 312 for fixing the resonant structure is arranged in the middle of each holding groove 311, a plurality of penetrating lower through holes 313 (used for hydrofluoric acid circulation) are formed in the bottoms of the holding grooves 311, a plurality of penetrating upper through holes 321 (used for hydrofluoric acid circulation) are formed in the positions, corresponding to the holding grooves 311, of the cover plate 32, a rotating shaft 33 is arranged on the base 31, and the cover plate 32 is sleeved on the rotating shaft 33, so that corrosion to batch resonant structures can be realized once, and the resonant structures are prevented from falling off in the corrosion process.
The embodiment also provides an application method of the processing device, which comprises the following steps:
s201, pre-forming a resonant structure by adopting a double-sided polished and ground fused quartz plate (a required specification can be adopted according to the requirement, for example, a circular fused quartz plate with the specification of 18mm diameter and 350um thickness in the embodiment) and adopting a high Wen Chuizhi forming method; s202, adhering a front plate 21 and a back plate 22 of the patch tool together on a hot plate (for heating paraffin) by paraffin, forming an air groove cavity 214 inside, and connecting an air suction channel 221 of the back plate 22 of the patch tool with a vacuum pump through an air pipe and a connector;
s203, using tweezers (made of corrosion-resistant materials, such as polytetrafluoroethylene in the embodiment), clamping the middle part of the mounting groove 211 of the front panel 21 of the pre-formed micro hemispherical gyro sensitive structure to be mounted on the surface mounting fixture and positioning by using the first center positioning column 212;
s203, a vacuum pump is started, and the preformed micro hemispherical gyro sensitive structure and the patch fixture are transferred to a laser processing unit; s204, randomly selecting a circle center point processed by fitting the skirt teeth at three points on the cross circle of the spherical shell and the skirt teeth of the micro-hemispherical gyro sensitive structure through an optical lens of the laser processing unit; loading a processing drawing, setting technological parameters of femtosecond laser, and clicking and processing a profile point array of the skirt teeth by using the femtosecond laser according to a given interval;
s205, turning off the vacuum pump, picking up the resonant structure by using tweezers (made of corrosion-resistant materials, such as polytetrafluoroethylene in the embodiment), placing the resonant structure in a corrosion clamp, placing the resonant structure in a corrosion groove together, and performing ultrasonic chemical etching to remove the connecting part between the resonant structure on the inner side of the contour line and the redundant part on the outer side of the contour line so as to completely release the resonant structure and the skirt tooth structure thereof;
s206, cleaning the corroded resonant structure and the corrosion fixture together by adopting ultrapure water, purging water by using a nitrogen gun, and taking out the corrosion fixture to obtain the processed resonant structure.
The method of the embodiment avoids structural damage caused by femtosecond laser direct cutting, the processing structure has no edge breakage and fracture problem, the vibration resistance and impact property of the product are effectively improved, and the reliability and the service life of the product are greatly improved; meanwhile, vertical machining can be realized, symmetry of the micro-hemispherical resonant structure is further improved, comprehensive performance of products is improved, and meanwhile, the scheme can be used for batch treatment, machining efficiency is effectively improved, and production cost is reduced.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.
Claims (10)
1. The processing method of the resonant structure of the micro hemispherical gyroscope with the skirt teeth is characterized by comprising the following steps of:
s101, clicking and processing a profile point array of the skirt teeth on the resonant structure by using femtosecond laser according to a given interval, wherein the clicking and processing of the profile point array of the skirt teeth according to the given interval refers to processing of the profile points along the profile line of the skirt teeth according to the given interval, and each profile point is processed by adopting the femtosecond laser with focal length exceeding the thickness of the resonant structure in a one-time penetrating way, and adjacent profile points are arranged in a clearance without overlapping way, so that the resonant structure on the inner side of the profile line is connected with the redundant part on the outer side of the profile line through a connecting part between the adjacent profile points;
s102, carrying out ultrasonic chemical etching on the resonant structure in the etching groove to remove the connecting part between the resonant structure on the inner side of the contour line and the redundant part on the outer side of the contour line, so that the resonant structure and the skirt tooth structure thereof are completely released.
2. The method of manufacturing a skirt-toothed micro-hemispherical gyroscope resonator structure according to claim 1, wherein the given pitch in step S101 is in the order of μm.
3. The method according to claim 1, wherein the step S101 of clicking the profile point array of the skirt teeth with the laser at a predetermined pitch comprises elongating the focal point of the laser to a level of hundred μm to achieve vertical processing with a high depth of field.
4. The method for processing the resonant structure of the micro-hemispherical gyroscope with the skirt teeth according to claim 3, wherein in the step S101, when the profile point array of the skirt teeth is processed by clicking with femto-second laser according to a given interval, the wavelength of the adopted laser is 1030nm, and the laser process parameters include: pulse width is 290fs, repetition frequency is 100kHz, single pulse energy is 60uJ, and defocus distance is-280 um.
5. The method for manufacturing the resonant structure of the skirt-toothed micro-hemispherical gyroscope according to claim 1, wherein the ultrasonic power is in the hundreds watt level and 10% of hydrofluoric acid is used in the ultrasonic chemical etching in the step S102.
6. A processing device for applying the method for processing a resonant structure of a micro hemispherical gyroscope with a skirt tooth according to any one of claims 1 to 5, characterized by comprising a laser processing unit and a jig assembly for fixing the resonant structure, the laser processing unit comprising:
a laser (11) for generating laser light;
a first wave plate (12) and a polarizing plate (13) for adjusting the power of the laser beam in a combined manner;
a shutter (14) for switching an optical path;
a beam expander (15) for expanding the beam diameter of the light beam;
the second wave plate (16) is used for adjusting the polarization direction of the laser to achieve different processing effects, and the light beams transmitted through the second wave plate (16) form Gaussian light beams;
a conical lens (17) for forming a gaussian beam into an annular beam;
a plano-convex lens (18) for forming a ring beam into a Bessel beam;
a focusing lens (19) for focusing the reduced spot to form a cone beam on the resonant structure being processed;
the first wave plate (12), the polaroid (13), the optical shutter (14), the beam expander (15), the second wave plate (16), the conical lens (17), the plano-convex lens (18) and the focusing lens (19) are sequentially arranged on an optical path output by the laser (11).
7. A processing device according to claim 6, characterized in that one or more mirrors for steering the beam are also provided on the beam path of the laser (11) output.
8. The processing device according to claim 6, wherein the jig assembly comprises a surface mounting fixture for laser processing of the resonant structure, the surface mounting fixture comprises a front plate (21) and a back plate (22) which are arranged in a stacked manner, a plurality of mounting grooves (211) for placing the resonant structure are formed in the surface of the front plate (21), a first central positioning column (212) for fixing the resonant structure is arranged in the middle of each mounting groove (211), a penetrating vacuum adsorption hole (213) is formed in the bottom of each mounting groove (211), an air groove cavity (214) communicated with the vacuum adsorption hole (213) of each mounting groove (211) is formed between the front plate (21) and the back plate (22), and an air suction channel (221) communicated with the air groove cavity (214) is formed in the back plate (22).
9. The processing device according to claim 8, wherein the jig assembly further comprises a corrosion fixture, the corrosion fixture comprises a base (31) and a cover plate (32) which are movably connected, a plurality of accommodating grooves (311) for accommodating the resonant structure are formed in the base (31), second center positioning columns (312) for fixing the resonant structure are arranged in the middle of the accommodating grooves (311), a plurality of penetrating lower through holes (313) are formed in the bottoms of the accommodating grooves (311), a plurality of penetrating upper through holes (321) are formed in the cover plate (32) at positions corresponding to the accommodating grooves (311), a rotating shaft (33) is arranged on the base (31), and the cover plate (32) is sleeved on the rotating shaft (33).
10. A method of using the processing apparatus of claim 9, comprising:
s201, adopting a double-sided polished and ground fused quartz plate, and performing primary molding on the resonant structure by using a high Wen Chuizhi molding processing method;
s202, adhering a front plate (21) and a back plate (22) of the patch tool together on a hot plate by adopting paraffin, forming an air groove cavity (214) inside, and connecting an air suction channel (221) of the back plate (22) of the patch tool with a vacuum pump through an air pipe and a connector;
s203, clamping the middle part of a mounting groove (211) of a front panel (21) of the patch tool by using tweezers, and positioning by using a first center positioning column (212);
s203, a vacuum pump is started, and the preformed micro hemispherical gyro sensitive structure and the patch fixture are transferred to a laser processing unit;
s204, randomly selecting a circle center point processed by fitting the skirt teeth at three points on the cross circle of the spherical shell and the skirt teeth of the micro-hemispherical gyro sensitive structure through an optical lens of the laser processing unit; loading a processing drawing, setting technological parameters of femtosecond laser, and clicking and processing a profile point array of the skirt teeth by using the femtosecond laser according to a given interval;
s205, closing the vacuum pump, picking up the resonant structure by using tweezers, placing the resonant structure in an etching clamp, placing the resonant structure and the etching clamp together in an etching groove for ultrasonic chemical etching to remove the connecting part between the resonant structure on the inner side of the contour line and the redundant part on the outer side of the contour line so as to completely release the resonant structure and the skirt tooth structure thereof;
s206, cleaning the corroded resonant structure and the corrosion fixture together by adopting ultrapure water, purging water by using a nitrogen gun, and taking out the corrosion fixture to obtain the processed resonant structure.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050282319A1 (en) * | 2004-06-18 | 2005-12-22 | Bruland Kelly J | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
| JP2007130768A (en) * | 2005-11-08 | 2007-05-31 | Seiko Epson Corp | Cutting method of quartz substrate |
| JP2010042424A (en) * | 2008-08-11 | 2010-02-25 | Omron Corp | Laser processing method, laser processing apparatus, method of manufacturing optical element, and optical element |
| JP2021141100A (en) * | 2020-03-02 | 2021-09-16 | 株式会社東京精密 | Method of surface modification of silicon wafer after etching process |
| CN113547223A (en) * | 2021-07-21 | 2021-10-26 | 中国人民解放军国防科技大学 | Method for manufacturing planar wafer-level fused quartz MEMS gyroscope |
| CN114985942A (en) * | 2022-07-11 | 2022-09-02 | 北京理工大学 | Method for achieving cross-scale mass leveling of hemispherical harmonic oscillator by reshaping femtosecond laser in airspace |
| CN114985908A (en) * | 2022-07-13 | 2022-09-02 | 中南大学 | High-precision machining system and method for miniature rotary resonant structure |
| CN115178892A (en) * | 2022-07-13 | 2022-10-14 | 中南大学 | High-quality cutting method for millimeter-thickness quartz glass |
| CN116117331A (en) * | 2023-03-17 | 2023-05-16 | 华中科技大学 | Laser polishing method for hemispherical harmonic oscillator |
| CN116160121A (en) * | 2022-11-01 | 2023-05-26 | 北京理工大学 | Quartz vibration beam processing method based on frequency multiplication Bessel laser selective etching |
-
2023
- 2023-08-07 CN CN202310980037.4A patent/CN116690199B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050282319A1 (en) * | 2004-06-18 | 2005-12-22 | Bruland Kelly J | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
| JP2007130768A (en) * | 2005-11-08 | 2007-05-31 | Seiko Epson Corp | Cutting method of quartz substrate |
| JP2010042424A (en) * | 2008-08-11 | 2010-02-25 | Omron Corp | Laser processing method, laser processing apparatus, method of manufacturing optical element, and optical element |
| JP2021141100A (en) * | 2020-03-02 | 2021-09-16 | 株式会社東京精密 | Method of surface modification of silicon wafer after etching process |
| CN113547223A (en) * | 2021-07-21 | 2021-10-26 | 中国人民解放军国防科技大学 | Method for manufacturing planar wafer-level fused quartz MEMS gyroscope |
| CN114985942A (en) * | 2022-07-11 | 2022-09-02 | 北京理工大学 | Method for achieving cross-scale mass leveling of hemispherical harmonic oscillator by reshaping femtosecond laser in airspace |
| CN114985908A (en) * | 2022-07-13 | 2022-09-02 | 中南大学 | High-precision machining system and method for miniature rotary resonant structure |
| CN115178892A (en) * | 2022-07-13 | 2022-10-14 | 中南大学 | High-quality cutting method for millimeter-thickness quartz glass |
| CN116160121A (en) * | 2022-11-01 | 2023-05-26 | 北京理工大学 | Quartz vibration beam processing method based on frequency multiplication Bessel laser selective etching |
| CN116117331A (en) * | 2023-03-17 | 2023-05-16 | 华中科技大学 | Laser polishing method for hemispherical harmonic oscillator |
Non-Patent Citations (1)
| Title |
|---|
| 汪红兵;林丙涛;梅松;江黎;蒋春桥;: "微半球谐振陀螺技术研究进展", 微纳电子技术, no. 11, pages 47 - 55 * |
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