CN201529849U - Laser double-surface synchronous processing system - Google Patents
Laser double-surface synchronous processing system Download PDFInfo
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- CN201529849U CN201529849U CN 200920217916 CN200920217916U CN201529849U CN 201529849 U CN201529849 U CN 201529849U CN 200920217916 CN200920217916 CN 200920217916 CN 200920217916 U CN200920217916 U CN 200920217916U CN 201529849 U CN201529849 U CN 201529849U
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Abstract
A laser double-surface synchronous processing system comprises a laser, an intermediate displacement table and a processed workpiece. Two beams of laser are arranged on two sides of the processed workpiece and respectively act on two lateral surfaces of the processed work piece. The laser beams on two sides of the processed work piece are on the same straight line or are crossed inside the workpiece. The two laser beams can be respectively generated by two lasers or generated by a laser via a beam splitter. After cutting graphs are inputted into a computer, the intermediate displacement table is controlled to move according to a certain trace through software to complete cutting processing. Processing thickness through laser double-surface synchronous processing at one step can be twice of thickness processed through single-surface processing. Compared with traditional double-surface cutting, the laser double-surface synchronous processing system does not need to be turned to adjust a fixture and can complete processing after being clamped at one step, and heat action force exerted by double surfaces of a workpiece is balanced. In addition, the laser double-surface synchronous processing system is low in residue stress after cutting and low in heat deformation, increases cutting quality, and realizes double-surface synchronous cutting for various ultra-hard materials such as PDC, PCB, composite sheets, ceramics and the like.
Description
Technical field
The utility model relates to the two-sided synchronous processing of laser system.Belong to superhard material processing industry technical field.
Background technology
Present laser process equipment mostly as shown in Figure 1, the laser head vertically downward, processing mode all is single-sided process or two-sided asynchronous processing.The machinable gross thickness of single-sided process is about half of two-sided processing.There is following defective in two-sided asynchronous processing with respect to two-sided synchronous processing:
Need twice clamping work piece, increase the clamping time, reduce overall working (machining) efficiency;
Twice clamping easily causes the clamping error, causes two-sided cutting dislocation;
The repetitive positioning accuracy of workbench is not enough, also can cause two-sided cutting dislocation when turn-over cuts;
If the material on workpiece to be machined two sides is different, may cause the working position damage excessive with same laser instrument.
Summary of the invention
In order to overcome the deficiency of prior art structure, improve working (machining) efficiency, and reduce the error that artificial origin and workbench repetitive positioning accuracy cause inadequately, the utility model proposes the two-sided synchronous processing of laser system.
The two-sided synchronous processing of a kind of laser system comprises laser instrument, middle displacement platform and workpiece to be machined.The workpiece to be machined both sides are two bundle laser, act on two sides of workpiece to be machined respectively.The laser beam of workpiece to be machined both sides is on same straight line or intersect in workpiece inside.Two laser beams can be produced respectively by two laser instruments, are perhaps produced through beam splitter by a laser instrument.
Middle displacement platform is made up of guide rail, leading screw, motor and control device.Middle displacement platform is made up of the transverse axis displacement platform and the longitudinal axis displacement platform that become T word structure, and wherein the integral installation of longitudinal axis displacement platform is on transverse axis displacement platform, and the anchor clamps that are installed are fixed on the longitudinal axis displacement platform, and workpiece to be machined is fixed on the anchor clamps that are installed.The control device of displacement platform is made up of computer, software, control card and motor driver etc.Behind the cutting pattern input computer, can be by displacement platform in the middle of the software control by certain orbiting motion.Under the situation that laser is opened, can finish by pattern cut.
The two-sided synchronous processing method of laser that the utility model is related can adopt the two-sided synchronous processing of previously described laser system, and one of its realization approach can comprise following steps:
The beneficial effects of the utility model:
1 by the two-sided synchronous processing of laser, and its thickness that once can process can increase more than 1 times than the thickness of single face time processing.
2 adopt the two-sided synchronous processing of laser, compare with the two-sided asynchronous cutting of tradition, adjust jig and resetting because of need not turn-over, once are installed and can finish processing, can improve cutting efficiency more than at least 1 times;
3 when adopting the two-sided synchronous cutting of laser than thin material, and cutting is compared with single face, and when laser parameter was identical, cutting efficiency can improve more than 6 times even can surpass 10 times (influenced by speed very big because of the degree of depth of laser cutting.Depth of cut reduces a half, and cutting speed can improve many times, sometimes in addition can be high more than 10 times);
4 when adopting the two-sided synchronous cutting of laser than thin material, and cutting is compared with single face, can adopt littler laser power, from but joint-cutting is narrower, fire damage is regional littler;
5 laser beams by adjusting both sides on same straight line, straight, the dislocation-free of joint-cutting when guaranteeing two-sided cutting.And two-sided asynchronous processing produces error inadequately owing to overturn workpiece or workbench repetitive positioning accuracy, often makes two-sided joint-cutting junction straight inadequately, and tiny inconsistent phenomenon is arranged.
6 by the laser instrument of the two-sided synchronous processing of adjustment laser system and the parameter of light path, obtains two bundle laser of different working abilities and processing characteristics in the both sides of workpiece to be machined, can process two kinds of different materials simultaneously, improves working (machining) efficiency and crudy.This method is applicable to most of complex of being made up of different materials, as efficient, the high-quality cutting processing of PDC, PCBN composite sheet, CVD diamond compact etc.Single-sided process or two-sided asynchronous processing are because laser parameter inconvenience adjustment, same laser parameter can't carry out the while optimization at the different material in complex work piece both sides, thereby single-sided process or two-sided asynchronous processing is with respect to two-sided synchronous cutting, and its cut quality and efficient are much lower.
The two-sided synchronous cutting of 7 laser makes the two-sided hotwork that is subjected to of workpiece firmly than balance, and cutting back residual stress is little, thermal deformation is little, and cut quality is improved.
8 when two bundle laser pulses when synchronous, and two bundle laser can intersect at material internal after cutting material at opposite sides respectively, make material internal form laser " passage ", can make that cut surface is more straight, tapering is littler.
The utility model realized various superhard materials such as PCD, PDC, PCBN composite sheet, and the two-sided synchronous cutting of pottery, carbide alloy, greatly improved cut quality and cutting efficiency.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the simple structure schematic diagram of present conventional laser process equipment;
Fig. 2 is the utility model device structure schematic diagram;
The installation diagram schematic diagram of Fig. 3 the utility model laser work head and displacement platform;
Fig. 4 is divided into two bundle schematic diagrames for utilizing Amici prism with beam of laser;
Fig. 5 is this laser-processing system overall structure schematic diagram;
Fig. 6 is 45 ° of eyeglass reflect focalizations of this laser-processing system system architecture schematic diagram;
Fig. 7 is this laser-processing system CCD monitoring system structural representation;
Fig. 8 is this laser-processing system Optical Fiber Transmission focusing system structural representation.
Institute's target 1,2,3 is the laser head among the figure, and 4 is processed material, and 5,6 is displacement work table in the middle of the bidimensional (or more than three-dimensional).
The specific embodiment
Embodiment 1: as shown in Figure 5, the two-sided synchronous processing of a kind of laser system, middle displacement work table 5 is arranged, left side laser machine 7, right laser machine 8, middle displacement work table 5,6 is X, two orthogonal travelling tables of Y, X travelling table and Y travelling table are respectively by guide rail, leading screw, motor and control device connect and compose X, the Y location mobile device, the X travelling table becomes T word structure with the Y travelling table, on the Y travelling table that is positioned on the X travelling table, be fixed with the anchor clamps that are installed, the left side of workbench 5 in the middle of left side laser machine 7 is installed in, the right side of workbench 5 in the middle of right laser machine 8 is installed in, a left side, right laser machine 7, workbench in the middle of 8 laser beam output is all pointed to, the laser beam axis of the laser instrument of left laser machine 7 and right laser machine 8 is located along the same line.Its structure as shown in Figure 2.The two bundle laser that sent by two laser heads 2,3 are in opposite directions and on same straight line.
The application of this invention can be avoided the turn-over clamping sum of errors travelling table platform resetting error that exists in the two-sided asynchronous processing, and with respect to single-sided process or the two-sided asynchronous higher working (machining) efficiency that is processed with, the damage at the processed position of material also reduces.
The structural representation of laser machine is seen Fig. 5.
Left and right laser machine 7,8 cools to the uniform temperature interval to left and right laser machine 7,8 by Laser Power Devices 10 power supplies respectively with cooling-water machine 11, guarantees the continous-stable work of laser instrument 2,3; The leaded light focusing system directly is connected with the laser output of laser instrument by the light path transition apparatus, and the real-time monitoring system coaxial with laser optical path is installed on the leaded light focusing system;
Left and right laser machine 7,8 is fixed on the integral support.
The utility model adopts two two-sided synchronous cutting of laser head (Fig. 2, Fig. 3), once is installed and can cuts the superhard material that originally needs turn-over to cut, and has reduced the requirement to frock jig precision and operating personnel's technical ability, can effectively prevent dislocation; Two laser heads can adopt PDC, PCBN composite sheet, the CVDD compound tool bit of dissimilar laser instruments and the layering of technological parameter commute, easily chipping to process again, and working (machining) efficiency is improved more than 2 times, guarantee good cut quality simultaneously.
Embodiment 2:
Left and right laser machine 7,8 is powered respectively by the Laser Power Devices of two platform independent, respectively left and right laser machine 7,8 is cooled to the uniform temperature interval with two cooling-water machines simultaneously, guarantees the continous-stable work of laser instrument.
The leaded light focusing system directly is connected with the laser output of laser instrument by the light path transition apparatus, and the CCD monitoring system coaxial with laser optical path is installed on the leaded light focusing system;
CCD monitoring system structure such as Fig. 7 mainly comprise laser condensing lens 29, imaging and focusing mirror 22, graticle (groove sheet glass) 23, camera 22, display 21 etc., and monitor 21 is connected with camera 20 circuits.The monitored position of workpiece to be machined 4 is the center at the laser spot annex and with the laser spot generally.Its surperficial reflect visible light becomes directional light by laser condensing lens 29, images in graticle 23 surfaces and graduation mark stack by imaging and focusing mirror 22, and the focal position of laser imaging then overlaps with graticle 23 groove central points.The image on camera 20 picked-up graticles 23 surfaces also is transferred on the display 21, thereby realizes same shaft monitoring.
Left and right two laser instruments 7,8 are fixed on the integral support.
The leaded light focusing system mainly comprise light guide (turnover total reflective mirror or optical fiber), beam expanding lens and focus lamp three parts with and be connected, adjust the various devices of usefulness.Light guide makes laser beam derive from laser instrument, makes two bundle laser in opposite directions and coaxial.But beam expanding lens expansion of laser light beam diameter, thereby the size of compression focal beam spot.Focus lamp then makes laser beam focus on the near surface or the inside of work piece.
The leaded light focusing system as shown in Figure 6, parallel incident laser 16,17 forms parallel incident laser 18,19 more respectively by behind the condenser lens 12,13 through 45 ° of total reflective mirrors 14,15, focuses on workpiece to be machined 4.
Optical Fiber Transmission focusing system structure transmits with optical fiber 30,37 forming parallel incident laser 32,35 more respectively by behind the condenser lens 33,34 through beam expanding lens 31,36 as shown in Figure 8, focuses on workpiece to be machined 4.
Embodiment 3: the two-sided synchronous processing method of a kind of laser, by adopting two generating device of laser, or utilize Amici prism that same laser instrument laser beam is divided into two bundles, obtain two bundle laser, as shown in Figure 4, also can adjust the energy ratio of two-beam by using different Amici prisms.
Adopt necessary device, for example Optical Fiber Transmission or speculum turnover, and by the laser alignment adjustment makes two bundle laser in opposite directions and on same straight line;
On two bundle laser optical paths, condenser lens is installed respectively, guarantee that by two-dimentional adjustment part condenser lens is vertical with laser beam, and beam center is overlapped with the center of focus lamp;
The moving direction plane that makes two-dimension displacement platform diaxon by adjustment and the direction of laser beam are strict vertical or be the angle of inclination of a certain needs;
The frock jig is installed on the longitudinal axis displacement table top, and workpiece to be machined is installed on the frock jig;
By adjusting the frock jig, make surface of the work vertical with laser beam or be the angle of inclination of a certain needs;
By adjusting the distance of condenser lens, make focus behind two each self-aggregation of bundle laser be positioned at the near surface or the inside of work piece apart from workpiece;
Begin processing according to the technological parameter that configures.
The utility model adopts two laser heads to carry out two-sided synchronous cutting, by a series of adjustment means and methods at workbench, light path, the strict demand of high accuracy processing is satisfied in the relativeness and the locus that guarantee displacement platform system, workpiece to be machined, laser beam and focus, thereby can guarantee good cut quality.
Embodiment 4: the two-sided synchronous processing method of a kind of laser, by adopting two relatively independent generating device of laser, produce the relatively independent laser output of two bundles, wherein the generating device of laser of two platform independent can be made up of pulse or continuous wave laser, the pulse of two different sizes or the pulse and the continuous wave laser of continuous wave laser even two different size different technical parameters of the specification of the same race of two different technical parameters respectively according to the situation of workpiece to be machined.
Parameters such as the voltage by adjusting two laser power supplies, frequency, pulsewidth adopt modes such as the synchronous or asynchronous output of dual power supply, make man-hour two laser works at the optimum Cutting state of material separately carrying out adding of complex.
The utility model adopts two laser heads to carry out two-sided synchronous cutting, makes the parameter of two bundle laser be optimized adjusting with the two-sided material of workpiece to be machined by adjusting different parameters, has realized the high-quality processing of complex.
Embodiment 5: laser machine can be selected present commercially available prod, LCP30, LCP40, LCP80 type laser machine or LCM30, the LD05 that produces as Langfang Hao Bo Diamond Co., Ltd, LD10, LD30, LCQ40 type laser machine etc.;
X location mobile device and Y location mobile device can be selected present commercially available prod, as step-by motor driven displacement control device or driven by servomotor type displacement control device.
Claims (10)
1. the two-sided synchronous processing of a laser system comprises laser instrument, middle displacement platform and workpiece to be machined; It is characterized in that: the workpiece to be machined both sides are two bundle laser, act on two sides of workpiece to be machined respectively; The laser beam of workpiece to be machined both sides is on same straight line or intersect in workpiece inside; Two laser beams can be produced respectively by two laser instruments, are perhaps produced through beam splitter by a laser instrument;
Middle displacement platform is made up of guide rail, leading screw, motor and control device; Middle displacement platform is made up of the transverse axis displacement platform and the longitudinal axis displacement platform that become T word structure, and wherein the integral installation of longitudinal axis displacement platform is on transverse axis displacement platform, and the anchor clamps that are installed are fixed on the longitudinal axis displacement platform, and workpiece to be machined is fixed on the anchor clamps that are installed; The control device of displacement platform connects motor driver by computer, software, control card.
2. the two-sided synchronous processing of a kind of laser according to claim 1 system is characterized in that: the relative laser of two bundle directions is arranged, and two bundle laser are located along the same line.
3. the two-sided synchronous processing of a kind of laser according to claim 1 system is characterized in that: its laser beam place straight line is a level, also can be vertically, or becomes 0-90 degree inclination angle with level.
4. the two-sided synchronous processing of a kind of laser according to claim 1 system is characterized in that: laser instrument of the same type or same laser instrument that the laser of both sides can derive from two kinds of dissimilar laser instruments, be adjusted into identical or different parameter obtain through beam split.
5. the two-sided synchronous processing of a kind of laser according to claim 1 and 2 system, it is characterized in that: the longitudinal axis of T word workbench is installed whirligig or arrangement for deflecting, workpiece to be machined is installed on whirligig or the arrangement for deflecting, realizes rotatablely moving or a certain angle of deflection.
6. the two-sided synchronous processing of a kind of laser according to claim 1 and 2 system is characterized in that: the transverse axis of T word workbench is seated in another translation stage surface vertical with the transverse axis direction of motion, to realize stereo-motion.
7. the two-sided synchronous processing of a kind of laser according to claim 1 and 2 system, it is characterized in that: the leaded light focusing system directly is connected with the laser output of laser instrument by the light path transition apparatus, and the real-time monitoring system coaxial with laser optical path is installed on the leaded light focusing system; Left and right two laser instruments are fixed on the integral support or are separately fixed on the different supports.
8. the two-sided synchronous processing of laser system is characterized in that: the leaded light focusing system of left laser machine, right laser machine mainly comprise light guide turnover total reflective mirror or optical fiber, beam expanding lens and focus lamp three parts with and be connected, adjust the various devices of usefulness; Light guide makes laser derive from laser instrument, makes two-beam coaxial in opposite directions or intersect at workpiece inside at an angle; Beam expanding lens expansion of laser light beam diameter, thereby the size of compression focal beam spot; Near surface or inside that focus lamp then makes laser beam focus on work piece process with realization.
9. the two-sided synchronous processing of a kind of laser according to claim 8 system, it is characterized in that: the parallel incident laser of the leaded light focusing system of left laser machine, right laser machine forms parallel incident laser more respectively by behind the condenser lens through 45 ° of total reflective mirrors, focuses on the near surface or the inside of workpiece to be machined;
Or the transmission of leaded light focusing system forms parallel incident laser more respectively by behind the condenser lens with optical fiber through beam expanding lens, focuses on the near surface or the inside of workpiece to be machined.
10. the two-sided synchronous processing of a kind of laser according to claim 8 system is characterized in that: the CCD monitoring system coaxial with laser optical path is installed on the leaded light focusing system of left laser machine, right laser machine; Monitor is connected with the camera circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920217916 CN201529849U (en) | 2009-10-09 | 2009-10-09 | Laser double-surface synchronous processing system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920217916 CN201529849U (en) | 2009-10-09 | 2009-10-09 | Laser double-surface synchronous processing system |
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| CN201529849U true CN201529849U (en) | 2010-07-21 |
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| CN103614850A (en) * | 2013-11-29 | 2014-03-05 | 淄博新力塑编有限公司 | Tube cloth middle single-layer sectioning device of circular weaving machine |
| CN105364318A (en) * | 2014-08-25 | 2016-03-02 | 深圳市韵腾激光科技有限公司 | Double-SD-card laser cutting method |
| CN106102982A (en) * | 2014-01-15 | 2016-11-09 | 弗劳恩霍夫应用研究促进协会 | Processing unit (plant) and method for laser-textured surface |
| CN106914706A (en) * | 2017-03-15 | 2017-07-04 | 无锡奥特维光学应用有限公司 | Pole piece cutter sweep, method and laser die cutting machine |
| CN109570150A (en) * | 2018-12-19 | 2019-04-05 | 江苏大学 | A kind of apparatus and method of the ultra-thin part of the two-sided cleaning of induced with laser vacuole |
| CN110039192A (en) * | 2019-04-16 | 2019-07-23 | 温州大学激光与光电智能制造研究院 | Revolving body glassware laser processing device |
| CN110834146A (en) * | 2019-11-26 | 2020-02-25 | 深圳市牧激科技有限公司 | Laser processing control method, laser processing apparatus, and computer-readable storage medium |
| CN110834151A (en) * | 2019-11-26 | 2020-02-25 | 深圳市牧激科技有限公司 | Laser processing control method, laser processing apparatus, and computer-readable storage medium |
| CN115246036A (en) * | 2022-08-11 | 2022-10-28 | 沈阳航远航空技术有限公司 | Double-beam laser auxiliary stamping method and device for brittle or high-strength material |
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- 2009-10-09 CN CN 200920217916 patent/CN201529849U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103614850A (en) * | 2013-11-29 | 2014-03-05 | 淄博新力塑编有限公司 | Tube cloth middle single-layer sectioning device of circular weaving machine |
| CN103614850B (en) * | 2013-11-29 | 2015-07-29 | 淄博新力塑编有限公司 | Circular loom cylinder cloth middle single-layer guillotine |
| CN106102982A (en) * | 2014-01-15 | 2016-11-09 | 弗劳恩霍夫应用研究促进协会 | Processing unit (plant) and method for laser-textured surface |
| CN105364318A (en) * | 2014-08-25 | 2016-03-02 | 深圳市韵腾激光科技有限公司 | Double-SD-card laser cutting method |
| CN106914706A (en) * | 2017-03-15 | 2017-07-04 | 无锡奥特维光学应用有限公司 | Pole piece cutter sweep, method and laser die cutting machine |
| CN109570150A (en) * | 2018-12-19 | 2019-04-05 | 江苏大学 | A kind of apparatus and method of the ultra-thin part of the two-sided cleaning of induced with laser vacuole |
| CN110039192A (en) * | 2019-04-16 | 2019-07-23 | 温州大学激光与光电智能制造研究院 | Revolving body glassware laser processing device |
| CN110039192B (en) * | 2019-04-16 | 2021-05-21 | 温州大学激光与光电智能制造研究院 | Laser processing device for revolving glass product |
| CN110834146A (en) * | 2019-11-26 | 2020-02-25 | 深圳市牧激科技有限公司 | Laser processing control method, laser processing apparatus, and computer-readable storage medium |
| CN110834151A (en) * | 2019-11-26 | 2020-02-25 | 深圳市牧激科技有限公司 | Laser processing control method, laser processing apparatus, and computer-readable storage medium |
| CN115246036A (en) * | 2022-08-11 | 2022-10-28 | 沈阳航远航空技术有限公司 | Double-beam laser auxiliary stamping method and device for brittle or high-strength material |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING LASERTECH CO., LTD. Free format text: FORMER OWNER: LANGFANG HAOBO DIAMOND CO., LTD. Effective date: 20130131 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 065300 LANGFANG, HEBEI PROVINCE TO: 101300 SHUNYI, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20130131 Address after: 101300, No. 1, building 2, building No. 1, Renhe Road, Renhe Town, Beijing, Shunyi District 1 Patentee after: Beijing Laser Technology Co., Ltd. Address before: 065300, Hebei, Langfang Dachang Hui Autonomous County, Qi Zhuang West Factory Road North Patentee before: Langfang Haobo Diamond Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100721 Termination date: 20161009 |
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| CF01 | Termination of patent right due to non-payment of annual fee |