CN112264723A - Laser micropore machining equipment and machining method suitable for small-sized complex curved surface part - Google Patents
Laser micropore machining equipment and machining method suitable for small-sized complex curved surface part Download PDFInfo
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- CN112264723A CN112264723A CN202011109408.4A CN202011109408A CN112264723A CN 112264723 A CN112264723 A CN 112264723A CN 202011109408 A CN202011109408 A CN 202011109408A CN 112264723 A CN112264723 A CN 112264723A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The application provides laser micropore machining equipment and a machining method suitable for small-sized complex curved surface parts. The laser micropore machining method comprises the following steps: setting basic technological parameters of laser micropore machining equipment; inputting the hole-making coordinates of the workpiece into a machine tool; after the workpiece is fixed and clamped by the clamp, the clamp and the workpiece are fixed to the double-shaft cradle supporting seat by the special chuck; picking a plurality of characteristic points from a workpiece to obtain the shape of the workpiece, confirming the hole making position of the workpiece according to the matching of the theoretical model coordinate of the workpiece and the actual workpiece, and converting the hole making coordinate on the workpiece into the hole making coordinate of a machine tool; the distance measurement component is used for carrying out real-time fine adjustment on the hole making position of the workpiece so as to ensure that the focus position of the composite beam scanning head is arranged on the surface of the hole position of the workpiece; and carrying out laser micropore machining on the workpiece.
Description
Technical Field
The invention relates to the technical field of laser micropore machining, in particular to laser micropore machining equipment and a machining method suitable for small-sized complex curved surface parts.
Background
Compared with the traditional processing mode, the laser processing method for the micropores of the thin-wall parts mainly has the following advantages: no contact processing and no mechanical deformation; the laser beam has high energy density, high processing speed and small thermal deformation of the workpiece, and no recast layer can be realized; 3, high hardness, high brittleness, high melting point materials can be processed, such as high temperature alloy, stainless steel, titanium alloy, structural steel and the like; high production efficiency, stable and reliable processing quality and good economic benefit. The laser beam is used for processing the micropores of the thin-wall part, so that a brand new processing way is provided for the field of micropore processing.
Traditional laser micropore processing equipment is mainly to planar micropore processing, and traditional laser processing equipment is controlled in laser generator's selection on the one hand, and on the other hand is controlled in the application of light beam scanning device module technique, leads to the drilling efficiency not high, the drilling quality is relatively poor, and the pass is single.
For micropore machining of a workpiece with a complex profile, particularly for micropore machining of a curved surface, the traditional laser machining equipment has no advantages in positioning, and the machining is only carried out according to the position on a theoretical model, so that the final positioning precision is deviated.
Disclosure of Invention
The invention provides laser micropore machining equipment and a laser micropore machining method suitable for small-sized complex curved surface parts, and aims to solve the problems of low hole machining efficiency, poor hole machining quality, single hole pattern, poor positioning accuracy and the like of the small-sized complex curved surface parts.
The invention provides laser micropore machining equipment suitable for small-sized complex curved surface parts, which comprises an equipment bracket, a laser generating device, a composite beam scanning head, a workpiece supporting mechanism, a distance measuring component and a workpiece positioning mechanism,
a laser generating device for providing a light beam;
the equipment bracket is used for fixing the laser generating device and the composite beam scanning head;
the composite light beam scanning head comprises a light translation component, a galvanometer scanning component and a focusing mirror, wherein the focusing mirror is used for focusing the light beam which is converted by the parallel flat plate and the galvanometer scanning component;
the workpiece supporting mechanism at least comprises a double-shaft cradle supporting seat, and the double-shaft cradle supporting seat provides two mutually vertical rotational degrees of freedom for a workpiece fixed through the double-shaft cradle supporting seat;
the workpiece positioning mechanism is used for picking up a plurality of characteristic points from an actual workpiece to obtain the shape of the workpiece, confirming the hole making position of the workpiece according to the matching of the theoretical model coordinate of the workpiece and the actual workpiece, and converting the hole making coordinate on the workpiece into the hole making coordinate of a machine tool;
the distance measurement assembly is used for finely adjusting the hole making position of the workpiece in real time so as to ensure that the focus position of the composite beam scanning head is arranged on the surface of the hole position of the workpiece.
The light translation assembly at least comprises a parallel flat plate, the parallel flat plate can rotate around a first axial direction and is used for refracting and translating light beams emitted by the laser generating device, and the first axial direction is a vertical direction;
the galvanometer scanning assembly comprises a first deflection mirror and a second deflection mirror which are arranged oppositely, the first deflection mirror can rotate around a second axial direction and reflect a received light beam to the second deflection mirror, and the second deflection mirror can rotate around a third axial direction and reflect the received light beam.
The distance measuring assembly is a coaxial distance measuring assembly, the coaxial distance measuring assembly comprises a detection light source, a first detection light reflector and a first light splitting plate, a laser beam emitted by the detection light source is reflected to the first light splitting plate through the first detection light reflector and then coupled to enter a main light path, the laser beam is finally focused by a focusing mirror to form a focusing light spot, the focusing light spot is scattered on the surface of a workpiece, part of scattered light returns to the main light path through the focusing mirror and then enters the detection light source through the reflection of the first light splitting plate, interference fringes are generated through light beam conversion, and the position of the workpiece is judged by calculating the distance between the interference fringes.
The laser scanning device further comprises a coaxial detection assembly, wherein the coaxial detection assembly comprises a second light splitting plate, a second detection light reflector opposite to the second light splitting plate, a second lens module opposite to the second detection light reflector and a detection module opposite to the second lens module; the second light splitting plate is positioned on the light outgoing path of the parallel plate and used for transmitting laser beams and receiving and reflecting the beams reflected from a processing workpiece or a processing hole, the second detection light reflector is used for reflecting the reflected beams to the second lens module, and the second lens module is used for focusing the reflected beams; the detection module is used for imaging.
The laser micropore machining equipment further comprises a scanning control system, wherein the scanning control system comprises a controller, and an encoder and a driver which are respectively in one-to-one correspondence with the parallel flat plate, the first deflection mirror and the second deflection mirror, the controller controls the driver of the parallel flat plate after reading the encoder of the parallel flat plate, and after the rotating speed of the driver of the parallel flat plate is stabilized at a required value, the controller respectively reads the encoders of the first deflection mirror and the second deflection mirror so as to further respectively control the drivers which are respectively corresponding to the encoders, so that the incident direction of a light beam is matched with the position of the parallel flat plate.
The equipment support comprises a horizontal base and an upright post, a workpiece to be processed is arranged above the horizontal base, a vertical sliding rail is arranged on the upright post, and the composite light beam scanning head is arranged on the vertical sliding rail in a sliding mode.
The laser micropore machining equipment further comprises a workpiece adjusting mechanism, wherein the workpiece adjusting mechanism comprises a first horizontal moving seat and a second horizontal moving seat, a first horizontal sliding rail is arranged on the horizontal base, the first horizontal moving seat is arranged on the first horizontal sliding rail in a sliding mode, a second horizontal sliding rail perpendicular to the first horizontal sliding rail is arranged on the first horizontal moving seat, and the second horizontal moving seat is arranged on the first horizontal moving seat in a sliding mode; the workpiece supporting mechanism is arranged on the second horizontal moving seat.
The invention also provides a laser micropore processing method suitable for small-sized complex curved surface parts, which adopts the laser micropore processing equipment to process laser micropores, and the laser micropore processing method comprises the following steps:
setting basic technological parameters of laser micropore machining equipment;
inputting the hole-making coordinates of the workpiece into a machine tool;
after the workpiece is fixed and clamped by the clamp, the clamp and the workpiece are fixed to the double-shaft cradle supporting seat by the special chuck;
picking a plurality of characteristic points from a workpiece to obtain the shape of the workpiece, confirming the hole making position of the workpiece according to the matching of the theoretical model coordinate of the workpiece and the actual workpiece, and converting the hole making coordinate on the workpiece into the hole making coordinate of a machine tool;
the distance measurement component is used for carrying out real-time fine adjustment on the hole making position of the workpiece so as to ensure that the focus position of the composite beam scanning head is arranged on the surface of the hole position of the workpiece;
and carrying out laser micropore machining on the workpiece.
The step of fixedly clamping the workpiece by the clamp also comprises filling the workpiece.
Wherein, still include before the step of carrying out laser micropore processing to the work piece:
dotting the hole site of the workpiece by using a laser generating device;
and confirming the process parameters by using the test piece.
Wherein the step of laser micro-hole machining the workpiece comprises:
sending parameters to a lower computer by the upper computer, reading the encoder of the parallel flat plate by a controller, and controlling a driver of the encoder according to the parameters;
when the rotating speed of the driver of the parallel flat plate is stabilized at a required value, the controller respectively reads the encoders of the first deflection mirror and the second deflection mirror according to the hole-making shape so as to further respectively control the corresponding drivers, so that the incident direction of the light beam is matched with the position of the parallel flat plate.
The laser micropore machining equipment suitable for small-sized complex curved surface parts adopts a characteristic point self-adaptive mode to position a workpiece, actual positioning is carried out on an actual sample piece, hole making theoretical distribution is not carried out only by means of three-dimensional model hole sites, a plurality of characteristic points are picked up on a model and an actual workpiece according to the characteristic point self-adaptive positioning principle, the model and the actual workpiece are accurately matched through a self-adaptive function, and the positioning precision of the final hole making position is ensured.
Drawings
FIG. 1 is a three-dimensional structure diagram of a laser micropore machining device suitable for small complex curved surface parts according to the present invention;
FIG. 2 is an optical schematic of the laser micro-via machining apparatus of FIG. 1;
FIG. 3 is an optical schematic diagram of a first deflection mirror and a second deflection mirror of the laser scanning device shown in FIG. 2;
FIG. 4 is a schematic view of a small complex curved surface part;
FIG. 5 is an enlarged perspective view of the workpiece support structure shown in FIG. 1;
FIG. 6 is a system block diagram of a detection module;
FIG. 7 is a workpiece processing flow chart of the laser micro-hole processing method suitable for small complex curved surface parts.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1 to 6, the laser micro-hole machining apparatus for small complex curved surface parts according to the present invention includes an apparatus support, a laser generator 1, a light path transmission assembly 13, a composite beam scanning head 10, a coaxial distance measuring assembly, a coaxial detecting assembly, a workpiece supporting mechanism 9, a workpiece positioning mechanism, a scanning control system, and a workpiece adjusting mechanism. The laser generating device 1, the optical path transmission component 13, the composite beam scanning head 10 and the workpiece supporting mechanism 9 are arranged on the equipment support.
The laser generating device 1 is used to provide a light beam. The composite beam scanning head 10 comprises a light translation component, a galvanometer scanning component and a focusing mirror 28, wherein the focusing mirror 28 is used for focusing the beam which is converted by the parallel flat plate and the galvanometer scanning component; the workpiece support mechanism 9 at least comprises a double-shaft cradle support seat 43, and the double-shaft cradle support seat 43 provides two mutually perpendicular rotational degrees of freedom for a workpiece to be fixed by the double-shaft cradle support seat 43; the workpiece positioning mechanism is used for picking up a plurality of characteristic points from an actual workpiece to obtain the shape of the workpiece, confirming the hole making position of the workpiece according to the matching of the theoretical model coordinate of the workpiece and the actual workpiece, and converting the hole making coordinate on the workpiece into the hole making coordinate of a machine tool; the distance measurement assembly is used for finely adjusting the hole making position of the workpiece in real time so as to ensure that the focus position of the composite beam scanning head is arranged on the surface of the hole position of the workpiece.
The above technical solution will be specifically explained below.
The equipment rack comprises a horizontal base 5, a vertical column 2 and a top plate 12. The horizontal base 5 is arranged in parallel with the top plate 12, and the horizontal base 5 is vertically connected with the upright post 2. The upright column 2 is provided with a vertical slide rail 3 along the first axial direction Z, and the composite beam scanning head 10 is arranged on the vertical slide rail 3 in a sliding manner. Preferably, the vertical slide rails 3 are arranged in pairs at intervals, and the vertical slide rails 3 may be convex strips or sliding grooves. The composite beam scanning head 9 is slidably connected to a slide rail by a slider.
The laser generating device 1 and the optical path transmission assembly 13 are disposed on the top plate 13. The laser generating device 1 is used for emitting a light beam, the optical path transmission component 13 is used for shaping the light beam emitted by the laser generating device 1 and changing the direction of optical path transmission, and the light beam enters the composite beam scanning head 10 after passing through the composite beam scanning head 13. In this embodiment, the optical path transmission assembly 13 includes a beam expander 14, and reflection mirrors 15 and 16, which are sequentially arranged along the optical path transmission direction. The beam expander 14 expands the beam by zooming, and adjusts the beam expansion multiple according to the actual processing requirement to obtain different beam diameters. In practical applications, the arrangement of the optical path transmission component 13 is not limited by this embodiment, and the arrangement position and number of the reflecting mirrors are adjusted according to practical situations.
The optical translation assembly comprises at least one parallel plate which can rotate around a first axial direction and is used for refracting and translating the light beam emitted by the laser generating device 1, wherein the first axial direction is a vertical direction Z. In this embodiment, the optical translation module includes a first parallel plate 22 and a second parallel plate 23 sequentially arranged along the optical path direction, and the first parallel plate 22 and the second parallel plate 23 both form an included angle of 45 ° with the optical axis and can respectively rotate around the first axis in the same direction and be used for refracting and translating the light beam. The light beam entering the parallel flat plate can generate corresponding light beam translation amount after passing through the parallel flat plate, different light beam offset amounts can be generated by adopting the parallel flat plates with different thicknesses, and finally the light beam can be incident to different positions on the focusing mirror 9, so that the taper of the processed micropore is influenced. In this embodiment, the number of the parallel flat plates is 2, and when the number of the parallel flat plates 17 is two, the taper change of the machining hole in the machining process can be adjusted by respectively controlling the rotation speed of the two parallel flat plates, so as to meet the requirements of machining holes of more patterns. In other embodiments, the number of parallel plates may be only 1.
The galvanometer scanning assembly comprises a first deflection mirror 17 and a second deflection mirror 18 which are oppositely arranged, the first deflection mirror 17 can rotate around a second axial direction and reflect a received light beam to the second deflection mirror 18, and the second deflection mirror 18 can rotate around a third axial direction and reflect the received light beam. The focusing mirror 28 is used for focusing the light beam after being deflected by the light translation assembly and the galvanometer scanning assembly. The second axial direction is the horizontal direction Y.
Specifically, in this embodiment, the first deflecting mirror 17 is mounted on a first driving shaft (not shown) extending along the second axial direction Y, and the first driving shaft drives the first deflecting mirror 17 to swing within a first preset angle and reflects the light beam reflected by the reflecting mirror 16 to the second deflecting mirror 18. The second deflection mirror 18 is mounted on a second driving shaft (not shown) extending along the third axial direction, the second driving shaft drives the second deflection mirror 18 to swing within a second preset angle and reflect the light beam reflected by the first deflection mirror 17 to the first parallel plate 22, and the light beam is deflected by the first parallel plate 22 and then reaches the second parallel plate 23 to be deflected again to the focusing mirror 28; the focusing mirror 28 is used for focusing the light beam deflected by the second parallel plate 23. The starting vector direction of the galvanometer scanning component is the same as that of the parallel flat plate, and the two synchronously move.
In this embodiment, in an initial state, an included angle between the first deflecting mirror 17 and a horizontal direction (a plane direction perpendicular to the first axial direction Z) is 67.5 °, an included angle between the second deflecting mirror 18 and the horizontal direction is 22.5 °, an included angle between the first deflecting mirror 17 and the second deflecting mirror 18 is 45 °, the second axial direction Y is perpendicular to the first axial direction Z, the third axial direction is 22.5 ° with a horizontal direction X perpendicular to the first axial direction Z and the second axial direction Y, and the third axial direction is perpendicular to the second axial direction Y. X, Y, Z are three directions in a common three-dimensional coordinate system.
The above arrangement can minimize the occupied space of the optical elements, and at the same time, can reduce the distance between the first deflection mirror 17 and the second deflection mirror 18, reducing the processing error. In practical application, the included angle between the first deflecting mirror 17 and the second deflecting mirror 18 can be adjusted properly on the basis of a preferred scheme, for example, the included angle between the first deflecting mirror 17 and the horizontal direction can be 50-80 degrees, the included angle between the second deflecting mirror 18 and the horizontal direction is 10-40 degrees, and the requirement that the included angles between the first deflecting mirror 17 and the horizontal direction and the included angles between the second deflecting mirror 18 and the horizontal direction are complementary is met.
In practical applications, the first deflection mirror 17 and the second deflection mirror 18 can be arranged in other ways. For example, in the initial state, the included angle between the first deflecting mirror 17 and the horizontal direction is 45 °, the included angle between the second deflecting mirror 18 and the horizontal direction is 45 °, the first deflecting mirror 17 and the second deflecting mirror 18 are parallel to each other, the second axial direction Y is perpendicular to the third axial direction and both are located in the horizontal direction, and at this time, the third axial direction is the horizontal direction X; the starting vector direction of the galvanometer scanning component is opposite to the starting vector direction of the parallel flat plate 1 and the two move synchronously. Or, the included angle between the first deflecting mirror 7 and the second deflecting mirror 8 can be adjusted properly on the basis of the preferred scheme, for example, the included angle between the first deflecting mirror 7 and the horizontal direction can be between 50 to 80 degrees, the included angle between the second deflecting mirror and the horizontal direction is 10 to 40 degrees, and the like, and it is sufficient that the included angles between the first deflecting mirror and the horizontal direction are complementary.
In the technical scheme of the application, when the first deflection mirror 17 and the second deflection mirror 18 rotate to any position, the corresponding parallel flat plate component can determine the only position through rotation, and then the maximum machining taper is obtained. The rotating speed of the whole system is determined by the rotating speed of the parallel flat plate component, and in the moving process, the parallel flat plate component and the galvanometer scanning component rotate synchronously.
Preferably, the laser micropore machining device further comprises a scanning control system, wherein the scanning control system comprises a controller, and an encoder and a driver which are respectively in one-to-one correspondence with the parallel flat plate, the first deflection mirror and the second deflection mirror, the controller controls the driver after reading the encoder of the parallel flat plate, and after the rotating speed of the driver of the parallel flat plate is stabilized at a required value, the controller respectively reads the encoders of the first deflection mirror and the second deflection mirror to further respectively control the corresponding drivers, so that the incident direction of the light beam is matched with the position of the parallel flat plate.
Preferably, the ranging assembly is a coaxial ranging assembly. Specifically, the coaxial distance measuring assembly comprises a detection light source 21, a detection light reflector 20 and a light splitting plate 19, and the main principle is that laser beams are emitted by the detection light source 21, the laser beams are reflected by the detection light reflector 20 to the light splitting plate 19 to be coupled and enter a main light path, and are finally focused by a focusing mirror 28 to form a focusing light spot, the focusing light spot is scattered on the surface of a workpiece, part of scattered light enters the main light path through the focusing mirror, is separated by the light splitting plate 18 to enter the detection light source 21, interference fringes are generated through light beam conversion, and the position of the workpiece can be judged by calculating the distance between the interference.
The coaxial distance measurement can directly carry out focus compensation after the distance measurement, the single-hole single measurement is convenient and fast, the coordinate conversion between the paraxial distance measurement and the machining head in the machining process is avoided, the machining efficiency can be greatly increased, the volume of the machining head is reduced, and the machining range is enlarged.
The coaxial detection assembly mainly realizes real-time detection of the punching effect in the machining process and adjusts corresponding technological parameters according to the punching effect. Specifically, the coaxial detection assembly comprises a light splitting plate 24, a detection light reflector 25 opposite to the light splitting plate 24, a lens module 26 opposite to the detection light reflector 25, and a detection module 27 opposite to the lens module 26; the beam splitting plate 24 is located on the light outgoing path of the second parallel plate 23 and is used for transmitting laser beams and receiving and reflecting the beams reflected from a processing workpiece or a processing hole, the detection light reflector 25 is used for reflecting the reflected beams to the lens module 26, and the lens module 26 is used for focusing the reflected beams; the detection module 27 is used for imaging. In another view, the laser focusing lens 28 is an objective lens of the coaxial detection assembly, the lens 26 is an eyepiece lens of the coaxial detection assembly, and the beam splitter plate 24 separates the imaging beam from the laser beam, and the main principle is that the laser beam and the workpiece generate visible light under the action, the visible light enters the main light path through the objective lens, is separated by the beam splitter plate 24 and enters the eyepiece lens, and finally forms a clear image on the target surface of the coaxial camera.
Further, as shown in fig. 6, the detection module 27 includes an image detector 270 and a correction device 271, wherein the image detector 270 is used for imaging, and the correction device 271 is used for learning the offset of the laser beam spot relative to the target position and correcting the position of the spot in real time according to the learning result. The correction device 271 may be constituted by a computer having a processor and a storage section.
In order to learn the offset of the light spot relative to the target position, in the present embodiment, the laser micro-hole machining apparatus repeatedly executes a trial machining program to try laser micro-hole machining, and the correction device jointly learns the position of the light spot during the machining process and the change condition of the micro-hole during the laser machining process to obtain an initial learning result, where the initial learning result may be an initial sample of the offset of the light spot relative to the target position.
Further, the correction device 271 specifically includes a recording module 50 and an executing module 51. The recording module 50 is used for recording the position of the light spot in real time, and the executing module 51 is used for predicting the offset of the light spot at the t +1 moment relative to the target position according to the initial learning result and the position of the light spot at the t moment, and correcting the position of the light spot at the t +1 moment according to the predicted offset, so that the light spot correction efficiency and accuracy are improved, and the processing quality of the micropore is ensured.
The workpiece adjusting mechanism comprises a first horizontal moving seat 4 and a second horizontal moving seat 8, a first horizontal sliding rail 6 is arranged on the horizontal base 5, the first horizontal moving seat 4 is arranged on the first horizontal sliding rail 6 in a sliding mode, a second horizontal sliding rail 7 perpendicular to the first horizontal sliding rail 6 is arranged on the first horizontal moving seat 4, and the second horizontal moving seat 8 is arranged on the first horizontal moving seat 4 in a sliding mode. The workpiece support mechanism 9 is disposed on the second horizontal movement base 8.
Fig. 4 shows one of the parts that can be machined by the apparatus of the present invention (fig. 4 is not intended to be any actual part, but only to illustrate the complexity of the part), and it can be seen from the figure that the workpiece hole-making position is mainly curved, and the machining difficulty is large. Considering the positioning of the workpiece in conjunction with fig. 4 and 5, fig. 4 can find that the lower end of the workpiece is in a tenon tooth structure, so that the requirement of the workpiece on the fixture is strict during positioning, and the fixture is required to be meshed with the tenon tooth at the fixed position of the workpiece, so that the workpiece can be ensured not to have position deviation during rotating the workpiece; secondly, damage to the wall is taken into account, and the laser beam may damage the wall to be drilled during laser machining, so that it is necessary to fill the workpiece cavity with a special material in such a way that the damage to the wall is eliminated.
Referring to fig. 5, the workpiece support mechanism 9 includes a connecting portion 40 and a dual-axis cradle support base 43. The connecting part 40 connects the dual-axis cradle support base 43 and the second horizontal moving base 8. The dual-axis cradle support 43 has a first axis of rotation horizontally pivoted to the connecting portion 40 and a second axis of rotation perpendicular to the first axis of rotation. After the workpiece 41 is clamped and fixed by a jig (not shown), the jig is fixed to the biaxial cradle support base 43 together with the workpiece 41 by a special chuck 42. Due to the arrangement of the pair of mutually vertical rotating shafts of the double-shaft cradle supporting seat 43, the workpiece can be adjusted in multiple directions in the processing process.
The movement of the light beam composite light beam scanning head 10, the first horizontal moving seat 4 and the second horizontal moving seat 8 along the Z axis, the Y axis and the X axis in the plane rectangular coordinate system can adopt a servo motor to drive a lead screw through a coupler to control the movement of three linear axes. The three linear axes are combined with the two rotating axes in the double-axis cradle support seat 43 to complete the micro-hole processing on the complex curved surface.
Compared with the prior art, the laser micropore machining equipment suitable for small-sized complex curved surface parts adopts a characteristic point self-adaptive mode to position a workpiece, actual positioning is carried out on an actual sample piece, hole making theoretical distribution is not carried out only by means of three-dimensional model hole positions, a plurality of characteristic points are picked up on a model and an actual workpiece according to the characteristic point self-adaptive positioning principle, the model and the actual workpiece are accurately matched through the self-adaptive function, and the positioning precision of the final hole making position is ensured.
In addition, the invention also provides a laser micropore processing method suitable for small-sized complex curved surface parts, and the laser micropore processing equipment is adopted to process laser micropores.
As shown in fig. 7, the laser micro-hole processing method includes:
s10, setting basic technological parameters of the laser micropore machining equipment;
s20, inputting the hole-making coordinates of the workpiece into a machine tool;
s30, after the workpiece is fixed and clamped by the clamp, the clamp and the workpiece are fixed to the double-shaft cradle supporting seat by the special chuck;
s40, picking up a plurality of characteristic points from the workpiece to obtain the shape of the workpiece, confirming the hole making position of the workpiece according to the matching of the theoretical model coordinate of the workpiece and the actual workpiece, and converting the hole making coordinate on the workpiece into the hole making coordinate of the machine tool;
s50, utilizing the ranging component to finely adjust the hole making position of the workpiece in real time so as to ensure that the focus position of the composite beam scanning head is arranged on the hole position surface of the workpiece;
and S60, carrying out laser micropore machining on the workpiece.
In step S10, before processing the workpiece, it is necessary to ensure that the equipment operates normally and to set basic process parameters, and the basic process parameters are mainly ensured by punching holes on the flat plate sample.
Step S20 is preceded by entering a preparation stage of workpiece processing — filling the workpiece.
Step S60 is preceded by: dotting the hole site of the workpiece by using a laser generating device; and confirming the process parameters by using the test piece.
Specifically, for complex curved surface machining, generally, a workpiece hole position needs to be dotted before hole making, namely, a laser is adopted to emit light with low power, the number of process machining layers is less, and the like, hole making is performed.
After the positioning is completed, the workpiece processing stage is started, under the normal condition, under the condition of processing a batch of workpieces, a plurality of test pieces exist, and as the material of a sample plate used for process test and the material of the actually processed workpiece may change, corresponding process parameters need to be properly adjusted, final process parameter verification needs to be carried out on the test pieces, and the processed hole shape and other process parameters are ensured to meet the requirements of customers. All that is done at this stage is process parameter validation.
The machining of the workpiece is started after the dotting is finished, under the common condition, the inspection is needed after the machining of a plurality of holes in the early stage is finished, the parameters such as hole shapes and hole diameters are controlled within the required range, under the condition that the requirements of the holes in the early stage are met, the machining of the residual hole patterns is continued, and the hole making effect is detected through a coaxial detection module in the whole process.
Step S60 specifically includes:
s61, sending parameters to a lower computer by the upper computer, reading the encoder of the parallel flat plate by the controller and controlling the driver of the encoder according to the parameters;
and S62, when the rotation speed of the driver of the parallel flat plate is stabilized at the required value, the controller respectively reads the encoders of the first deflection mirror and the second deflection mirror according to the hole-making shape to further respectively control the corresponding drivers, so that the incident direction of the light beam is matched with the position of the parallel flat plate.
Therefore, the hole-making taper is optimized, the laser emits light, and the light beam finally passes through the focusing lens 28 and then is converged on the surface of the workpiece 41. The processing method is to set a plurality of layers for scanning, enter the next layer when the scanning of the current layer is finished, continue scanning if the scanning is not finished until the scanning of the light beam of the layer is finished, and so on.
In the processing process, the optical path protection is needed to be added to ensure the cleanness of the optical path in the processing process. Meanwhile, an auxiliary system is required to be added in the processing process, and the auxiliary system mainly comprises an auxiliary blowing and dust removing system. The laser acts on the surface of a workpiece to form metal residues, in order to ensure the punching effect, processing blowing is required to be added, and compressed air, nitrogen, argon and other gases are selected as common gas sources. The auxiliary system also comprises a dust removal device, and because a processing area can form large smoke in the processing process, in order to ensure the processing effect, the dust removal device is required to be arranged to remove the smoke in the processing area, so as to ensure the cleanness of the processing area.
And finally, checking and disassembling the workpiece or replacing the workpiece.
The above embodiments are merely illustrative of one or more embodiments of the present invention, and the description is specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A laser micropore machining device suitable for small-sized complex curved surface parts is characterized by comprising a device bracket, a laser generating device, a composite beam scanning head, a workpiece supporting mechanism, a distance measuring component and a workpiece positioning mechanism,
a laser generating device for providing a light beam;
the equipment bracket is used for fixing the laser generating device and the composite beam scanning head;
the composite light beam scanning head comprises a light translation component, a galvanometer scanning component and a focusing mirror, wherein the focusing mirror is used for focusing the light beam which is converted by the parallel flat plate and the galvanometer scanning component;
the workpiece supporting mechanism at least comprises a double-shaft cradle supporting seat, and the double-shaft cradle supporting seat provides two mutually vertical rotational degrees of freedom for a workpiece fixed through the double-shaft cradle supporting seat;
the workpiece positioning mechanism is used for picking up a plurality of characteristic points from an actual workpiece to obtain the shape of the workpiece, confirming the hole making position of the workpiece according to the matching of the theoretical model coordinate of the workpiece and the actual workpiece, and converting the hole making coordinate on the workpiece into the hole making coordinate of a machine tool;
the distance measurement assembly is used for finely adjusting the hole making position of the workpiece in real time so as to ensure that the focus position of the composite beam scanning head is arranged on the surface of the hole position of the workpiece.
2. The laser micropore machining apparatus of claim 1, wherein the light translation assembly comprises at least one parallel plate rotatable about a first axis for refracting and translating the light beam emitted by the laser generating device, the first axis being a vertical direction;
the galvanometer scanning assembly comprises a first deflection mirror and a second deflection mirror which are arranged oppositely, the first deflection mirror can rotate around a second axial direction and reflect a received light beam to the second deflection mirror, and the second deflection mirror can rotate around a third axial direction and reflect the received light beam.
3. The laser micropore machining device according to claim 1, wherein the distance measuring component is a coaxial distance measuring component, the coaxial distance measuring component comprises a detection light source, a first detection light reflector and a first light splitting plate, a laser beam emitted by the detection light source is reflected by the first detection light reflector to the first light splitting plate to be coupled into a main light path, and is finally focused by a focusing mirror to form a focusing light spot, the focusing light spot is scattered on the surface of the workpiece, part of the scattered light returns to the main light path through the focusing mirror, and is reflected by the first light splitting plate to enter the detection light source, interference fringes are generated through light beam transformation, and the position of the workpiece is judged by calculating the distance between the interference fringes.
4. The laser micropore machining apparatus of claim 3, wherein the laser scanning device further comprises a coaxial detection assembly, the coaxial detection assembly comprising a second beam splitting plate, a second detection light reflector opposite to the second beam splitting plate, a second lens module opposite to the second detection light reflector, and a detection module opposite to the second lens module; the second light splitting plate is positioned on the light outgoing path of the parallel plate and used for transmitting laser beams and receiving and reflecting the beams reflected from a processing workpiece or a processing hole, the second detection light reflector is used for reflecting the reflected beams to the second lens module, and the second lens module is used for focusing the reflected beams; the detection module is used for imaging.
5. The laser micropore machining device of claim 1, further comprising a scanning control system, wherein the scanning control system comprises a controller, and an encoder and a driver which are respectively in one-to-one correspondence with the parallel flat plate, the first deflection mirror and the second deflection mirror, the controller controls the driver of the parallel flat plate after reading the encoder of the parallel flat plate, and after the rotating speed of the driver of the parallel flat plate is stabilized at a required value, the controller respectively reads the encoders of the first deflection mirror and the second deflection mirror to further respectively control the respective corresponding drivers so that the incident direction of the light beam is matched with the position of the parallel flat plate.
6. The laser micropore machining device of claim 1, wherein the device support comprises a horizontal base and a column, the workpiece to be machined is arranged above the horizontal base, a vertical slide rail is arranged on the column, and the composite beam scanning head is slidably arranged on the vertical slide rail.
7. The laser micropore machining device of claim 4, wherein the laser micropore machining device further comprises a workpiece adjusting mechanism, wherein the workpiece adjusting mechanism comprises a first horizontal moving seat and a second horizontal moving seat, a first horizontal sliding rail is arranged on the horizontal base, the first horizontal moving seat is slidably arranged on the first horizontal sliding rail, a second horizontal sliding rail perpendicular to the first horizontal sliding rail is arranged on the first horizontal moving seat, and the second horizontal moving seat is slidably arranged on the first horizontal moving seat; the workpiece supporting mechanism is arranged on the second horizontal moving seat.
8. A laser micro-hole machining method suitable for small-sized complex curved surface parts, which machines laser micro-holes by using the laser micro-hole machining apparatus as claimed in any one of claims 1 to 6, wherein the laser micro-hole machining method comprises:
setting basic technological parameters of laser micropore machining equipment;
inputting the hole-making coordinates of the workpiece into a machine tool;
after the workpiece is fixed and clamped by the clamp, the clamp and the workpiece are fixed to the double-shaft cradle supporting seat by the special chuck;
picking a plurality of characteristic points from a workpiece to obtain the shape of the workpiece, confirming the hole making position of the workpiece according to the matching of the theoretical model coordinate of the workpiece and the actual workpiece, and converting the hole making coordinate on the workpiece into the hole making coordinate of a machine tool;
the distance measurement component is used for carrying out real-time fine adjustment on the hole making position of the workpiece so as to ensure that the focus position of the composite beam scanning head is arranged on the surface of the hole position of the workpiece;
and carrying out laser micropore machining on the workpiece.
9. The laser micro-via machining method of claim 8, wherein the step of laser micro-via machining the workpiece is preceded by the step of:
dotting the hole site of the workpiece by using a laser generating device;
and confirming the process parameters by using the test piece.
10. The laser micro-via machining method of claim 9, wherein the step of laser micro-via machining the workpiece comprises:
sending parameters to a lower computer by the upper computer, reading the encoder of the parallel flat plate by a controller, and controlling a driver of the encoder according to the parameters;
when the rotating speed of the driver of the parallel flat plate is stabilized at a required value, the controller respectively reads the encoders of the first deflection mirror and the second deflection mirror according to the hole-making shape so as to further respectively control the corresponding drivers, so that the incident direction of the light beam is matched with the position of the parallel flat plate.
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