CN102615425A - Processing system of laser special-shaped micropores based on refractive scanning system - Google Patents
Processing system of laser special-shaped micropores based on refractive scanning system Download PDFInfo
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- CN102615425A CN102615425A CN2012101172862A CN201210117286A CN102615425A CN 102615425 A CN102615425 A CN 102615425A CN 2012101172862 A CN2012101172862 A CN 2012101172862A CN 201210117286 A CN201210117286 A CN 201210117286A CN 102615425 A CN102615425 A CN 102615425A
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Abstract
The invention discloses a processing system of laser special-shaped micropores based on a refractive scanning system. The processing system comprises a ,high-beam-quality laser output system, a focusing lens group, a light beam scanning system, a focusing system, a processing element absorption and positioning displacement system and a computer control system. The processing system is characterized in that the light beam scanning system is a refractive scanning system, the light beam scanning system comprises two parallel flat plates with the same thickness, and the two flat plates are mutually parallel, are vertical to a laser light path and are respectively arranged on two lens vibration motors. The lens vibration motors drive the parallel flat plates to do deflection scanning relative to the laser light beams, so the laser light beams have a tiny displacement relative to the original transmission light path after passing through the two parallel flat plates. The displacement value is determined by an included angle between the parallel flat plates and the transmission light path, the included angle is fast changed through the refractive scanning system, and the forming and the processing of micropores in any shapes on workpieces by laser beams can be realized.
Description
Technical field
The present invention relates to a kind of system of processing and method of the laser special-shaped micropore based on the refraction type scanning system, belong to laser retrofit technical applications.
Background technology
The laser micropore process technology is to utilize the characteristic of laser beam and matter interaction that material (comprising metal and nonmetal) is carried out micro-drilling processing; Relate to multidisciplinary synthesis technology such as light, mechanical, electrical, computer control, material behavior and detection; Be widely used in new high-tech industry fields such as automobile, microelectronics, optical communication, space flight and aviation, biomedicine, solar energy and fuel cell new forms of energy, improve or replaced some traditional processing mode.The semiconductor integrated circuit industry development is swift and violent in the world at present, and computer, circuit board of mobile phone, portable consumer electronic product adopt high-density multi-layered PCB, and volume compact also develops to miniaturization; Semiconductor chip fabrication, test and encapsulation require to improve constantly, and its structure is compact more, overall volume constantly dwindles.The main application of current special-shaped micro molding technology has: jet engine or blade of gas turbine cooling holes; The lubrication hole of power assembly parts, weaving spinneret, various substrate material surface micro-structurals; The various irregularly-shaped holes of automobile oil nozzle; Chemical industry and bio-pharmaceuticals be with screen pack, sieve, Wicresoft's medical implant, new industries such as solar cell, semiconductor lighting.According to different application, these micropores have the geometric shape of various tracks, from the cylinder to the cone, flute profile or given configuration.Processing modes such as traditional mechanical punching or punching can't satisfy the demands.
At present, the laser micropore forming technique mainly contains three kinds: fixed beam pulse machining cell micropore, vibration mirror scanning and the boring of precision spin shape.One, fixed beam pulse machining cell micropore is to be accomplished by fixed focal length laser condensing lens and travelling workpiece, and high accuracy and high accuracy are provided, and can obtain the minimum micro-pore diameter that the Laser Processing optical system is limit.But this mode can only be processed circular hole, and as expecting different micro-pore diameters, can only realize by changing the amasthenic lens focal length.Two, the vibration mirror scanning locating speed is fast, because the high-speed response of galvanometer, the array boring ratio of beating One's name is legion is more suitable.And the size in hole can control with software easily, walks out the various tracks that configure in advance, so can process various irregularly-shaped holes; Such as square hole, tri-angle-holed, star-shaped aperture etc.; But because the problem that galvanometer motor exists angular resolution and temperature to float, not only profile is bad when capillary processing, and can not obtain high duplication; Therefore lack the high position precision in large-scale local zonule, should not adopt this scheme during less than 250 microns at hole diameter.Three, the boring of precision spin shape is meant through various
The laser processing beam that makes optical component departs from the aperture center; Again by the high-speed electric expreess locomotive driven rotary; It is minimum to make that the fuel factor of little bore edges drops to, and the tapering in pore size and hole can be controlled by software, and can realize the processing of through hole and blind hole; But can only process circular hole, can't be as the processing profiled hole of vibration mirror scanning.
Summary of the invention
The present invention is in order to overcome the shortcoming of existing laser micropore forming technique, and a kind of system of processing of the laser special-shaped micropore based on the refraction type scanning system is provided.
Basic principle of the present invention: parallel flat is the optical element that is constituted certain thickness D by two plane of refraction that are parallel to each other, and is no a focal power device, can not make the object amplification or dwindles, and in system, focal power is not had contribution; Incident ray exit direction behind parallel flat is constant, but optical axis has a displacement L relatively.Suppose that the parallel flat refractive index is n; The angle of its relative laser beam optical axis is
(Fig. 1), according to the light refraction law (snell law) and the trigonometric function derivation of equation:
So have:
Obtain:
This shows that pattern displacement amount L is different and different with parallel flat and laser beam optical axis included angle
.In practical application; Parallel flat is installed on the galvanometer motor, has substituted original reflecting optics, and the incidence surface of parallel flat and exiting surface all are coated with the anti-reflection film of corresponding optical maser wavelength; To reduce the reflection loss of laser beam on these two faces, laser beam is through parallel flat refraction transmission.Galvanometer motor drives the quick deflection scanning of the relative incident ray of parallel flat, and deflection angle has determined the axial displacement value of light.Two relative incident ray deflection scanning directions of parallel flat are orthogonal, thereby on surface of the work, can be combined into the Laser Processing track of arbitrary shape.
Based on above-mentioned basic principle, technical scheme of the present invention is, a kind of system of processing of the laser special-shaped micropore based on the refraction type scanning system comprises high light beam quality laser output system, focus lamp group, beam flying system
System, focus adjusting mechanism, workpiece absorption location displacement system and computer control system; It is characterized in that; Said optical beam scanning system is a refraction type scanning system, and it comprises two parallel flats, two galvanometer motors and control corresponding module, and two parallel flats have same thickness; Its incidence surface and exiting surface all are coated with the anti-reflection film of corresponding optical maser wavelength; Two galvanometer motors drive the quick deflection scanning of the relative incident beam of parallel flat, and two parallel flat deflection scanning directions are orthogonal, and their aggregate motion makes laser beam walk out the machining locus of arbitrary shape at surface of the work; Through the control module of galvanometer motor, according to the quick deflection scanning of optical axis of two relative incident beams of parallel flat of special-shaped micropore Laser Processing TRAJECTORY CONTROL.
Said high light beam quality laser output system; Comprise laser instrument, beam expander and transmission laser system; Adopt the output nanosecond or the complete solid state pulse laser instrument of short pulse duration more; Adopt the switching signal of computer control laser and the power output and the repetition rate of regulating laser instrument, transfer to focus lamp group place via what beam expanding lens expanded bundle and transmission laser system.
Said focus lamp group is to make collimted laser beam line focus mirror group focus on that the hot spot of back on processing work reaches or near diffraction limit, and its operating distance is reached hold the refraction type scanning system in the light path that can make between laser condensing lens group and the workpiece.
Said focus adjusting mechanism, focus lamp group and refraction type scanning system by the distance between focus adjusting mechanism adjusting and the processing work, are positioned on the focal plane of laser condensing lens group machined surface as a whole.
Said workpiece absorption location displacement system comprises workpiece installing mechanism and two-dimension displacement platform, and installing mechanism has location alignment function, and makes the surface level of workpiece and smooth; The center of capillary processing is to realize that by high-precision two-dimentional work shift platform its positioning accuracy and repetitive positioning accuracy all are superior to 5 microns.
Said computer control system comprises hardware system and software systems; Install motion control card in the computer system additional; The Synchronization Control laser switch, regulate laser output power and repetition rate, the relative incident light axis of control parallel flat respectively to the motion and the location alignment of deflection scanning, laser focusing and the two-dimentional work shift platform of two vertical direction, described computer software mainly comprises:
(1) laser instrument control module: running parameters such as the switch of control laser, adjusting laser output power and repetition rate;
(2) vibration mirror scanning control module: control galvanometer motor drive parallel flat two vertical direction of relative laser beam axis is respectively made deflection scanning;
(3) focusing module: the control focus adjusting mechanism is regulated the distance between laser condensing lens group and the processing work, guarantees that machined surface is positioned on the focal plane of laser condensing lens group;
(4) displacement control module: control high-precision two-dimensional work shift platform fixed point moves, and realizes confirming of micropore array center position.
The invention has the beneficial effects as follows that it is fast both to have kept the vibration mirror scanning locating speed, machining locus control is easy, can realize the advantage of various irregularly-shaped hole processing; Through the refraction type optical elements sets that tens millimeters the range of work of conventional reflective galvanometer scanning system is accurately miniature to the hundreds of micron again; The miniature system of the optics of this hundred times of levels has reduced the influence that angular resolution, thermal drift, the null offset of high-speed vibrating mirror motor bring significantly, thereby has guaranteed the hi-Fix and the repeatability of Laser Processing.
Description of drawings
Fig. 1 is parallel flat refraction principle figure;
Fig. 2 is a system principle diagram of the present invention;
Fig. 3 is a refraction type scanning system structural representation.
The specific embodiment
Used laser instrument employing DPSS laser instrument is a diode pumped solid state laser among the present invention; By Fig. 2 and shown in Figure 3; The high repetition frequency ultra-short pulse laser that DPSS laser instrument 1 is output-controlled; Conduct and reflect 3 entering focus lamp groups 4 through beam expanding lens 2 beam-expanding collimations and through light path, directional light line focus mirror group 4 is focused at workpiece 20 near surfaces; Two parallel placements of parallel flat 15a, 15b that same thickness arranged and vertical with the incident light optical axis; They are mounted respectively at two galvanometer motor 16a, 16b last; Galvanometer motor 16a, 16b drive parallel flat 15a, the quick deflection scanning of the relative incident laser light beam of 15b; The deflection scanning direction of two parallel flat 15a, 15b is orthogonal, and the machining locus of arbitrary shape is walked out in their aggregate motion on surface of the work.Parallel flat 15a, 15b and galvanometer motor 16a, 16b form refraction type scanning system 10; Refraction type scanning system 10 and focus lamp group 4 regulated the distance between they and the processing work through focus adjusting mechanism 5; Parallel laser beam is focused on form trickle, a high-energy-density focal spot near machined surface, with moment high temperature melting or vaporization workpiece 20.The deflection scanning motion of galvanometer control module 7 control refraction type scanning systems.Workpiece 20 is installed on the high-precision two-dimensional displacement platform 6, and the center of micropore is by displacement platform 6 motion decisions.
Embodiment
Adopt high light beam quality DPSS laser instrument, wavelength is 1.06 microns, and mean power output 10W repeats frequently
Rate 40KHz, pulse width is 8ns.Output beam expands 5 times of bundles, and the focus lens group focal length is 100mm, and the focal beam spot diameter is less than 10 microns.Adopt common optical glass fabrication of parallel dull and stereotyped, its refractive index is 1.5, and thickness is 2.6mm.When galvanometer motor scanning optical drift angle is ± 12
0The time, the translation of laser beam value partially is 0.185mm, that is through such refraction type scanning system, laser beam can be processed the special-shaped micropore of arbitrary shape in the scope interscan of 370 μ m * 370 μ m.
Claims (6)
1. system of processing based on the laser special-shaped micropore of refraction type scanning system; Comprise high light beam quality laser output system, focus lamp group, optical beam scanning system, focus adjusting mechanism, workpiece absorption location displacement system and computer control system; It is characterized in that; Said optical beam scanning system is a refraction type scanning system, and it comprises two parallel flats, two galvanometer motors and control corresponding module, and two parallel flats have same thickness; Its incidence surface and exiting surface all are coated with the anti-reflection film of corresponding optical maser wavelength; Two galvanometer motors drive the quick deflection scanning of the relative incident beam of parallel flat, and two parallel flat deflection scanning directions are orthogonal, and their aggregate motion makes laser beam walk out the machining locus of arbitrary shape at surface of the work; Through the control module of galvanometer motor, according to the quick deflection scanning of optical axis of two relative incident beams of parallel flat of special-shaped micropore Laser Processing TRAJECTORY CONTROL.
2. the system of processing of the laser special-shaped micropore based on the refraction type scanning system according to claim 1; It is characterized in that; Said high light beam quality laser output system comprises laser instrument, beam expander and transmission laser system, adopts the output nanosecond or the complete solid state pulse laser instrument of short pulse duration more; Adopt the switching signal of computer control laser and the power output and the repetition rate of regulating laser instrument, transfer to focus lamp group place via what beam expanding lens expanded bundle and transmission laser system.
3. the system of processing of the laser special-shaped micropore based on the refraction type scanning system according to claim 1; It is characterized in that; Said focus lamp group is to make collimted laser beam line focus mirror group focus on that the hot spot of back on processing work reaches or near diffraction limit, and its operating distance is reached hold the refraction type scanning system in the light path that can make between laser condensing lens group and the workpiece.
4. the system of processing of the laser special-shaped micropore based on the refraction type scanning system according to claim 1; It is characterized in that; Said focus adjusting mechanism; Focus lamp group and refraction type scanning system by the distance between focus adjusting mechanism adjusting and the processing work, are positioned on the focal plane of laser condensing lens group machined surface as a whole.
5. the system of processing of the laser special-shaped micropore based on the refraction type scanning system according to claim 1; It is characterized in that; Said workpiece absorption location displacement system; Comprise workpiece installing mechanism and two-dimension displacement platform, installing mechanism has location alignment function, and makes the surface level of workpiece and smooth; The center of capillary processing is to realize that by high-precision two-dimentional work shift platform its positioning accuracy and repetitive positioning accuracy all are superior to 5 microns.
6. the system of processing of a kind of laser special-shaped micropore based on the refraction type scanning system according to claim 1; It is characterized in that; Said computer control system comprises hardware system and software systems; Install motion control card in the computer system additional; Synchronization Control laser switch, laser output power and repetition rate are regulated, to the motion and the location alignment of deflection scanning, laser focusing and the two-dimentional work shift platform of two vertical direction, described computer software mainly comprises the relative incident light axis of control parallel flat respectively:
(1) laser instrument control module: the switch of control laser, adjusting laser output power and repetition rate running parameter;
(2) vibration mirror scanning control module: control galvanometer motor drive parallel flat two vertical direction of relative laser beam axis is respectively made deflection scanning;
(3) focusing module: the control focus adjusting mechanism is regulated the distance between laser condensing lens group and the processing work, guarantees that machined surface is positioned on the focal plane of laser condensing lens group;
(4) displacement control module: control high-precision two-dimensional work shift platform fixed point moves, and realizes confirming of micropore array center position.
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103203541A (en) * | 2013-02-04 | 2013-07-17 | 张立国 | Laser machining device |
| CN103676159A (en) * | 2013-12-03 | 2014-03-26 | 浙江温医雷赛医用激光科技有限公司 | Light path system capable of improving light spot patterns and automatically adjusting light spot size |
| CN104625437A (en) * | 2015-01-12 | 2015-05-20 | 李凯 | Scanning mechanism for precision processing of laser drilling and cutting of special-shaped hole |
| CN104762665A (en) * | 2015-03-27 | 2015-07-08 | 上海集成电路研发中心有限公司 | Laser processing device and system as well as wafer processing system |
| CN108890124A (en) * | 2018-09-19 | 2018-11-27 | 西安荷佐里机电科技有限公司 | A kind of galvanometer motor, laser galvanometer and laser processing apparatus |
| CN110662625A (en) * | 2017-05-29 | 2020-01-07 | Acs运动控制有限公司 | System and method for machining multiple larger workpieces |
| CN112264723A (en) * | 2020-10-16 | 2021-01-26 | 西安中科微精光子制造科技有限公司 | Laser micropore machining equipment and machining method suitable for small-sized complex curved surface part |
| CN112264721A (en) * | 2020-10-16 | 2021-01-26 | 西安中科微精光子制造科技有限公司 | Laser micropore machining device |
| CN113178767A (en) * | 2021-05-28 | 2021-07-27 | 北京同方华光系统科技有限公司 | Multi-beam multi-dimensional scanning laser disinfection and sterilization device and method |
| CN113446936A (en) * | 2021-06-23 | 2021-09-28 | 同济大学 | Active visual range-based variable visual axis stereo vision measurement system and method |
| CN115647619A (en) * | 2022-11-08 | 2023-01-31 | 广东丰鑫智能科技有限公司 | High-precision hole making system for laser composite cutting |
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| CN104762665A (en) * | 2015-03-27 | 2015-07-08 | 上海集成电路研发中心有限公司 | Laser processing device and system as well as wafer processing system |
| CN110662625A (en) * | 2017-05-29 | 2020-01-07 | Acs运动控制有限公司 | System and method for machining multiple larger workpieces |
| CN108890124A (en) * | 2018-09-19 | 2018-11-27 | 西安荷佐里机电科技有限公司 | A kind of galvanometer motor, laser galvanometer and laser processing apparatus |
| CN112264723A (en) * | 2020-10-16 | 2021-01-26 | 西安中科微精光子制造科技有限公司 | Laser micropore machining equipment and machining method suitable for small-sized complex curved surface part |
| CN112264721A (en) * | 2020-10-16 | 2021-01-26 | 西安中科微精光子制造科技有限公司 | Laser micropore machining device |
| CN113178767A (en) * | 2021-05-28 | 2021-07-27 | 北京同方华光系统科技有限公司 | Multi-beam multi-dimensional scanning laser disinfection and sterilization device and method |
| CN113446936A (en) * | 2021-06-23 | 2021-09-28 | 同济大学 | Active visual range-based variable visual axis stereo vision measurement system and method |
| CN115647619A (en) * | 2022-11-08 | 2023-01-31 | 广东丰鑫智能科技有限公司 | High-precision hole making system for laser composite cutting |
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Application publication date: 20120801 |