CN103056519B - Taper-controllable laser micropore machining light beam scanning device and control method thereof - Google Patents

Taper-controllable laser micropore machining light beam scanning device and control method thereof Download PDF

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Publication number
CN103056519B
CN103056519B CN201210573983.9A CN201210573983A CN103056519B CN 103056519 B CN103056519 B CN 103056519B CN 201210573983 A CN201210573983 A CN 201210573983A CN 103056519 B CN103056519 B CN 103056519B
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wedge
angle
largest
little
laser
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CN103056519A (en
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李朋
杨小君
李明
赵华龙
赵卫
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Zhongke Sino Laser Equipment (fujian) Ltd By Share Ltd
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Zhongke Sino Laser Equipment (fujian) Ltd By Share Ltd
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Abstract

The invention relates to a taper-controllable laser micropore machining light beam scanning device. The device comprises a laser device and a sample piece to be machined, wherein a beam expander is arranged on the emergent surface of the laser device; a 45-degree reflecting mirror is arranged on the emergent surface of the beam expander; a non-parallel double optical wedge group and a small-angle optical wedge are vertically distributed below the 45-degree reflecting mirror in sequence; a focusing mirror and the sample piece to be machined are vertically distributed below the small-angle optical wedge in sequence; and a laser beam is expanded and collimated by the beam expander, is emitted to the 45-degree reflecting mirror, is reflected by the 45-degree reflecting mirror, is vertically emitted to the non-parallel double optical wedge group below the 45-degree reflecting mirror and is translated and deflected to a certain degree through the non-parallel double optical wedge group, and the deflected beam is refracted to the focusing mirror through the small-angle optical wedge, and is focused on the sample piece to be machined by the focusing mirror. Compared with a galvanometric scanning micropore machining device, the device is high in accuracy; the number of the optical wedges is reduced by one, so that the device is convenient to mount; the number of driving motors and wedge mirrors is reduced by one, so that the device is easy to control; and the loss of laser energy is reduced, and cost is greatly reduced.

Description

Laser micropore machining beams scanning means and control method thereof that a kind of tapering is controlled
Technical field
The invention belongs to field of laser processing, be specifically related to a kind of light-beam scanner of the adjustable control that can realize capillary processing and tapering.
Background technology
Capillary processing is one of important application of field of laser processing, and in capillary processing, hole shape usually has certain tapering requirement, and even requiring is reverse taper holes.For example, in atomizer capillary processing, in order to improve the atomizing effect of atomizer aperture oil spout, not only require aperture little, and require hole shape to there is certain back draught; And in aircraft blade processing, in order to improve the cooling effect of micropore, require Kong Weizheng taper.
The method of existing Laser microdrilling has: fixed beam pulse or multiple-pulse machining cell micropore, vibration mirror scanning, workpiece rotation punching and rotating double-optical wedge scanning.For the tapering of control hole, need in light path, add some pattern displacement modules, such as parallel flat, parallel double wedge etc.Modal combining form has vibration mirror scanning+parallel flat, vibration mirror scanning+parallel double wedge, rotating double-optical wedge scanning+parallel flat, rotating double-optical wedge scanning+parallel double wedge etc.
But all there is certain defect in above-mentioned prior art:
1. fixed beam pulse or multiple-pulse processing micropore, can obtain the minimum micro-pore diameter that Laser Processing optical system is limit, and can not realize the multiple aperture processing of light beam, can not realize reverse taper holes.
2. vibration mirror scanning processing micropore, has higher response speed, and locating speed is very fast, coordinates parallel flat or parallel double wedge, can realize the hole processing of different pore size and different taperings.But vibration mirror scanning is lower in local tiny area positioning precision, is not suitable for micro hole machining.In addition in processing when reverse taper holes, vibration mirror scanning need to parallel flat or the very high synchronous rotary precision of parallel double wedge, otherwise affect the circularity in hole.
Rotating double-optical wedge can be realized by controlling two relative positions between wedge the processing of different pore size, and as long as the angle of wedge is identical, can process the minimum micro-pore diameter that optical system is limit, and be directly proportional to two wedge folder cosine of an angles from two wedge outgoing beam deviation angles, even if therefore two wedge synchronization accuracies are not high, deviation angle changes can be very not greatly yet, and therefore aperture uniformity is better.Itself and parallel flat combine, and can realize reverse taper holes processing, but because parallel flat light beam translation amount is fixed, the reverse taper holes tapering of getting are non-adjustable.Parallel double wedge can overcome the shortcoming of parallel flat, but rotating double-optical wedge+parallel double wedge combination needs 4 Electric Machine Control, and not only cost is high, and alignment is better while needing four wedges rotations, and installation accuracy is had relatively high expectations.And light beam is by four wedges, energy loss is large.
Summary of the invention
The object of this invention is to provide the controlled laser beam scanning means of a kind of tapering based on three wedges, adopt three wedge structure light-beam scanners.
The object of the invention is to realize by following technical proposals, specific as follows:
The laser micropore machining beams scanning means that a kind of tapering is controlled, comprise: laser instrument, 45 ° of speculums, first angle of wedge wedge, second largest angle of wedge wedge, little angle of wedge wedge, focus lamp, exemplar to be processed, the angle of wedge of the angle of wedge of described first angle of wedge wedge and second largest angle of wedge wedge is unequal.
Further, laser beam is successively through described first angle of wedge wedge, second largest angle of wedge wedge and little angle of wedge wedge.
Further, the angle of wedge of described first angle of wedge wedge is less than the angle of wedge of second largest angle of wedge wedge.
Further, the angle of wedge of little angle of wedge wedge is
m = arcsin { n × sin [ b - arcsin sin [ arcsin ( n × sin ( a ) ) + b - a ] n ] }
Wherein, a is the angle of wedge of first wedge, and b is the angle of wedge of second largest wedge, and the refractive index of three wedges equates, is n.
Further, laser beam is successively through described little angle of wedge wedge, first angle of wedge wedge and second largest angle of wedge wedge.
Further, the angle of wedge of described first angle of wedge wedge is greater than the angle of wedge of second largest angle of wedge wedge.
Further, first synchronous first angle of wedge wedge, second largest angle of wedge wedge, the little angle of wedge wedge of driving rotates; Judge whether to change the lateral displacement amount of light beam, as needs, change the spacing of first angle of wedge wedge, second largest angle of wedge wedge; Judge whether to change the deflection angle of the light velocity, as needs, change the rotary speed of little angle of wedge wedge, the relative position of itself and first wedge angle wedge, second largest wedge angle wedge is changed, until deflection angle reaches, threshold value is set.
Further, if when little angle of wedge wedge rotates taking optical axis as axle, the angle α of the directrix of described relative position, can try to achieve the angle β=2mcos (α/2) from little angle of wedge wedge outgoing beam and optical axis, line focus mirror is f × tg β in the annular radii drawing through plane, wherein, f is the focal length of focus lamp; In the time of α=0, can draw greatest circle radius f × tg (2m); In the time of=π, can draw smallest circle radius 0.
The invention has the beneficial effects as follows:
The invention provides the controlled laser beam scanning means of a kind of tapering based on three wedges, adopt three wedge structure light-beam scanners, higher than vibration mirror scanning capillary processing scanning means precision, and fewer one than four wedge wedge numbers, not only install more conveniently, simultaneously also lacked a drive motors and wedge mirror, control simpler, the loss of laser energy reduces, and cost also reduces greatly.
Brief description of the drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is non-parallel double wedge group equivalent schematic.
Fig. 3 is non-parallel double wedge group angle schematic diagram.
Fig. 4 is rotating double-optical wedge beam flying figure.
In Fig. 1: 1-laser instrument; 2-beam expander; 3-45 ° of speculum; The first angle of wedge wedge of 4-; The second largest angle of wedge wedge of 5-; The little angle of wedge wedge of 6-; 7-focus lamp; 8-exemplar to be processed; 9-clamping platform; 10-computer; 11-drive motors; 12-drive motors; 13-drive motors;
In Fig. 2: 4 '-large angle of wedge wedge; 5 '-large angle of wedge wedge; 6 '-little angle of wedge wedge, angle of wedge c;
In Fig. 3: 1 "-incident beam axis; 2 "-incident beam; 3 "-wedge 6 ' and 6 Bisector of angle; 4 " outgoing beam track.
Detailed description of the invention
Experimental provision as shown in Figure 1, is made up of laser instrument 1,2,45 ° of speculums 3 of beam expander, first angle of wedge wedge 4, second largest angle of wedge wedge 5, little angle of wedge wedge 6, focus lamp 7, exemplar to be processed 8, the computer 10 that clamps the motion of platform 9 and control step wedge.When work, drive 3 wedges to rotate by drive motors 12,13, laser beam is in exemplar 8 surface punchings to be processed.
Laser beam collimates through beam expander, collimated light impinges perpendicularly on by 45 ° of speculums 3 the non-parallel wedge group being formed by first wedge angle 4 and second largest wedge angle 5 again, non-parallel wedge group can produce certain inclination and translation to light beam, it is equivalent to pair of parallel wedge group 4 ', 5 ' and a little angle of wedge wedge 6 ', as shown in Figure 2.The angle of wedge of supposing described first angle of wedge wedge 4, second largest angle of wedge wedge 5 is respectively a, b, wherein a<b, and it is equivalent to parallel wedge group and a little angle of wedge wedge that angle is m that a pair of angle of wedge is a.Light beam translation amount s is relevant apart from d to angle of wedge a and two wedges.
There is following relation in angle of wedge m and a, the b of little angle of wedge wedge 6 ':
m = arcsin { n &times; sin [ b - arcsin sin [ arcsin ( n &times; sin ( a ) ) + b - a ] n ] }
Wherein, n is three refractive indexes that wedge is identical.
Concrete computational process is as follows, as shown in Figure 3:
The first wedge angle of wedge is a, and the second largest wedge angle of wedge is b, and a<b, supposes that light beam is after the first wedge, and the angle of emergence is r, supposes that the refractive index of wedge is n, has
sinr=n×sina (1)
The second largest angle of wedge wedge of light beam incident, the angle of itself and wedge inclined-plane normal is: r+b-a, this is because the angle of first angle of wedge wedge inclined-plane normal and optical axis is a, the angle of second largest angle of wedge wedge inclined-plane normal and main shaft is b, and the angle that can try to achieve incident ray and second largest angle of wedge wedge inclined-plane normal is r+b-a.
According to the law of refraction, can try to achieve
n×sins=sin(r+b-a) (2)
S is the angle between second largest angle of wedge wedge inclined-plane normal and the emergent ray on this inclined-plane;
According to angular transition, can try to achieve the normal angle of the emergent ray on this inclined-plane and the horizontal plane of second largest angle of wedge wedge
t=b-s (3)
According to refractive index formula
sinm=n×sint (4)
Associating (1), (2), (3), (4) formula can be tried to achieve
m = arcsin { n &times; sin [ b - arcsin sin [ arcsin ( n &times; sin ( a ) ) + b - a ] n ] }
When non-parallel pair of wedge 4,5 and little angle of wedge wedge 6 are observed along optical axis direction, compared with initial phase, while producing angle, can be reduced between little angle of wedge wedge 6 and 6 ', generation phase place angle, 6 ' and 6 can be by rotating double-optical wedge analysis, as shown in Figure 4.
Spend in order to make the deflection angle of light can reach minimum angles 0, make c=m.
Be analyzed as follows:
If the relative position relation of three wedge mirrors exists so a kind of state, laser beam is from little angle of wedge wedge 6 penetrates, and deflection angle between optical axis is 0, and this state is called the initial position of wedge.As shown in Figure 4, little angle of wedge wedge starts to leave initial position rotation.
On the horizontal plane of little angle of wedge wedge, the straight line being connected taking the point of its thickness and thinnest part is benchmark (becoming datum line herein), if when little angle of wedge wedge rotates taking optical axis as axle, the angle of two positions 6 ' and 6 datum line is α, can try to achieve from the angle β=2mcos (α/2) of little angle of wedge wedge 6 outgoing beams and optical axis, line focus mirror is f × tg β (wherein, f is the focal length of focus lamp) in the annular radii drawing through plane.In the time of α=0, can draw greatest circle radius f × tg (2m); In the time of α=π, can draw smallest circle radius 0.
Require computer control drive motors 11 to drive first angle of wedge wedge 4 moving linearlies according to tapering, change the spacing of first angle of wedge wedge 4, second largest angle of wedge wedge 5, the variation of spacing causes the change of light beam transversal displacement, after the effect of focus lamp, the angle of focused beam changes, finally cause light beam with different incidence angle processing exemplars, the hole of getting required tapering.
First, controlling drive motors 12 and 13 synchronously rotates, after outgoing beam line focus mirror, track is an annulus, then drive two wedges with different speed rotations by drive motors 12 and 13, thereby change the relative position between two wedges, angle between light beam and optical axis is changed, therefore can get different apertures.
The present invention also can be by laser beam successively through little angle of wedge wedge, first angle of wedge wedge, second largest angle of wedge wedge; The angle of wedge of described first angle of wedge wedge is greater than the angle of wedge of second largest angle of wedge wedge.Require computer control drive motors 11 to change the spacing of first angle of wedge wedge, second largest angle of wedge wedge according to tapering, change light lateral displacement amount; Change the relative initial position between little angle of wedge wedge and first wedge angle, change light deflection angle.

Claims (5)

1. the laser micropore machining beams scanning means that tapering is controlled, comprise: laser instrument (1), 45 ° of speculums (3), first angle of wedge wedge (4), second largest angle of wedge wedge (5), little angle of wedge wedge (6), focus lamp (7), exemplar to be processed (8), is characterized in that: the angle of wedge of the angle of wedge of described first angle of wedge wedge (4) and second largest angle of wedge wedge (5) is unequal;
Laser beam is successively through described first angle of wedge wedge (4), second largest angle of wedge wedge (5) and little angle of wedge wedge (6);
The angle of wedge of described first angle of wedge wedge (4) is less than the angle of wedge of second largest angle of wedge wedge (5);
The angle of wedge of little angle of wedge wedge (6) is
m = arcsin { n &times; sin [ b - arcsin sin [ arcsin ( n &times; sin ( a ) ) + b - a ] n ] }
Wherein, a is the angle of wedge of first wedge, and b is the angle of wedge of second largest wedge, and the refractive index of three wedges equates, is n.
2. the controlled laser micropore machining beams scanning means of tapering as claimed in claim 1, is characterized in that: laser beam is successively through described little angle of wedge wedge (6), first angle of wedge wedge (4) and second largest angle of wedge wedge (5).
3. the controlled laser micropore machining beams scanning means of tapering as claimed in claim 2, is characterized in that: the angle of wedge of described first angle of wedge wedge (4) is greater than the angle of wedge of second largest angle of wedge wedge (5).
4. the control method of the controlled laser micropore machining beams scanning means of tapering as claimed in claim 1, is characterized in that: first synchronous first angle of wedge wedge (4), second largest angle of wedge wedge (5) and the little angle of wedge wedge (6) of driving rotates; Judge whether to change the lateral displacement amount of light beam, as needs, change the spacing of first angle of wedge wedge (4), second largest angle of wedge wedge (5); Judge whether to change the deflection angle of the light velocity, as needs, change the rotary speed of little angle of wedge wedge (6), the relative position of itself and first wedge angle wedge (4), second largest wedge angle wedge (5) is changed, until deflection angle reaches, threshold value is set.
5. the control method of the controlled laser micropore machining beams scanning means of tapering as claimed in claim 4, it is characterized in that: when establishing little angle of wedge wedge (6) and rotating taking optical axis as axle, the angle of the datum line of described relative position is α, try to achieve from the angle β=2mcos (α/2) of little angle of wedge wedge (6) outgoing beam and optical axis, line focus mirror is f × tg β in the annular radii drawing through plane, wherein, f is the focal length of focus lamp; In the time of α=0, draw greatest circle radius f × tg (2m); In the time of α=π, draw smallest circle radius 0.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2023217A (en) * 1933-05-11 1935-12-03 Gen Electric Television scanning apparatus
US2767629A (en) * 1953-04-21 1956-10-23 Paillard Sa Optical device for a stereoscopic camera with a horizontal movement of the film
GB2200223A (en) * 1986-01-31 1988-07-27 Ferranti Plc Apparatus for controlling the direction of a beam of optical radiation
CN1362310A (en) * 2001-01-05 2002-08-07 中国科学技术大学 Laser beam rotator for laser processing and its processing method
DE10105346A1 (en) * 2001-02-05 2002-08-29 Forschungsgesellschaft Fuer St Helical cutting of holes in workpieces, involves rotating pulsed laser beam plane of polarization during beam movement so it is always at same angle to linearly machined cut surface
US6473250B1 (en) * 1998-01-21 2002-10-29 Renishaw Plc Beam deflector
CN102218605A (en) * 2011-05-18 2011-10-19 苏州德龙激光有限公司 Laser rotary-cut drilling device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5391159B2 (en) * 2010-07-09 2014-01-15 三星ダイヤモンド工業株式会社 Glass substrate processing equipment using laser light

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2023217A (en) * 1933-05-11 1935-12-03 Gen Electric Television scanning apparatus
US2767629A (en) * 1953-04-21 1956-10-23 Paillard Sa Optical device for a stereoscopic camera with a horizontal movement of the film
GB2200223A (en) * 1986-01-31 1988-07-27 Ferranti Plc Apparatus for controlling the direction of a beam of optical radiation
US6473250B1 (en) * 1998-01-21 2002-10-29 Renishaw Plc Beam deflector
CN1362310A (en) * 2001-01-05 2002-08-07 中国科学技术大学 Laser beam rotator for laser processing and its processing method
DE10105346A1 (en) * 2001-02-05 2002-08-29 Forschungsgesellschaft Fuer St Helical cutting of holes in workpieces, involves rotating pulsed laser beam plane of polarization during beam movement so it is always at same angle to linearly machined cut surface
CN102218605A (en) * 2011-05-18 2011-10-19 苏州德龙激光有限公司 Laser rotary-cut drilling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3195041B1 (en) * 2015-08-14 2022-05-11 Laser Engineering Applications Machining device

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