CN104690423B - A kind of realize cone of nulls degree and back taper boring processing unit (plant) and method - Google Patents
A kind of realize cone of nulls degree and back taper boring processing unit (plant) and method Download PDFInfo
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- CN104690423B CN104690423B CN201510036975.4A CN201510036975A CN104690423B CN 104690423 B CN104690423 B CN 104690423B CN 201510036975 A CN201510036975 A CN 201510036975A CN 104690423 B CN104690423 B CN 104690423B
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Abstract
A kind of processing unit (plant) realizing cone of nulls degree and back taper boring, includes successively along laser direction of illumination circuit: a dynamic adjustable lens；One plane mirror or a galvanometer, a condenser lens；One first wedge-shaped optical glass substrate；One second wedge-shaped optical glass substrate；Wherein, laser passes sequentially through described dynamic adjustable lens, condenser lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate and acts on workpiece to be added, and, the first described wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate controlled rotation device, thus change laser and irradiate circuit, thus realize Drilling operation.Wherein it is possible to realize dynamic zoom by dynamic adjustable lens means, it is ensured that light is not out of focus when surface deflections, motion.The processing unit (plant) of the present invention, modular structure is simple, can be with conventional laser process, it is easy to making, low cost, optical path adjusting becomes easy.Can quickly realize cone of nulls degree and the processing of back taper boring.
Description
Technical field
The present invention relates to laser processing device technical field, particularly relate to one and can realize cone of nulls degree and back taper
The processing unit (plant) of boring and method.
Background technology
The ultimate principle of Laser Processing is exactly at material surface by laser focusing, makes the mutual of laser and material
Effect, the Gauss distribution of laser beam and laser and the mechanism of object interaction, laser is made with material
On object, positive taper laser drill is formed after with.
In prior art, use Gaussian beam processing, cone of nulls degree to be realized or back taper groove processing, laser
Light beam wants oblique incidence to sample surfaces.There are two kinds of basic ways: one is to tilt sample, additionally
One is oblique laser light beam.Tilt sample and can bring the biggest inconvenience to processing.Therefore oblique laser
The side of light beam sends out and is widely adopted.There are two kinds of method of operating at present to realize the inclination of laser beam:
Method 1: use completely reflecting mirror, by rotating reflecting mirror, changes laser and reflecting mirror angle changes
Become laser beam and incide the angle on sample nominal value surface.
Method 2: use prism, changes the angle of incident sample by the angle changing laser light incident prism
Degree.
Process technology based on both principles has grown up and commercialization forms special optical mode
Group.But, both approaches has its weak point.First, price is high, because special optical mode
Group is difficult to integrated with conventional laser-processing system, it is necessary to be used alone.Its two, system complex, use
Multiple optics, will reach the requirement of processing, need two sets to two axle piezo-galvanometer or Gavo-galvanometers.
Its three, regulation difficulty is big, owing to the position of this special optical module is before lens, the most any deviation
The deviation gone out in focus can be caused.
Summary of the invention
It is an object of the invention to provide a kind of laser processing device realizing cone of nulls degree and back taper groove,
For solving the integrated inconvenience of cone of nulls degree laser processing device in prior art, the problem that the course of processing is complicated.
For reaching above-mentioned purpose, technical scheme proposed by the invention is:
A kind of processing unit (plant) realizing cone of nulls degree and back taper boring of the present invention, along laser direction of illumination line
Road includes successively: one controls the dynamic adjustable lens of the dynamic zoom of the course of processing；One condenser lens；One
First wedge-shaped optical glass substrate；One second wedge-shaped optical glass substrate；Wherein, laser passes sequentially through institute
State dynamic adjustable lens, condenser lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass
Substrate acts on workpiece to be added, and, the first described wedge-shaped optical glass substrate and the second wedge-shaped optical
Glass substrate controlled rotation device, thus change laser and irradiate circuit, thus realize Drilling operation.
Wherein, a laser-bounce device it is additionally provided with between described dynamic adjustable lens and condenser lens.
Wherein, described laser-bounce device is a plane mirror.
Wherein, described laser-bounce device is made up of the first galvanometer and the second galvanometer.
Wherein, the first described wedge-shaped optical glass substrate and the thickness of the second wedge-shaped optical glass substrate are
1 millimeter to 10 millimeters.
Wherein, in the course of processing, make lens in dynamic adjustable lens means movable sharp with regulation
Light is in the focus of sample surfaces.
Preferably, described tumbler is a galvanometer motor.
A kind of method of processing realizing cone of nulls degree and back taper boring, it comprises the steps:
The first step, by dynamic adjustable lens, laser mirror, condenser lens, the first wedge-shaped optical glass
Glass substrate and the second wedge-shaped optical glass substrate irradiate circuit according to laser and fixedly mount successively；
Second step, on the board in the front that workpiece to be added is positioned over the second wedge-shaped optical glass substrate, and
Working position is placed under laser beam；
3rd step, opens tumbler, and the first wedge-shaped optical glass substrate turns about the Z axis along X-Z face,
Second wedge-shaped optical glass substrate turns about the Z axis along Y-Z face, and board at X-Y to movement, make
Laser scans on workpiece to be added, until machining.
Meanwhile, in the course of processing, dynamic adjustable lens devices by change laser beam the angle of divergence,
So that it is guaranteed that not out of focus in laser processing procedure.
A kind of method of processing realizing cone of nulls degree and back taper boring, it comprises the steps:
The first step, by dynamic adjustable lens, the first galvanometer, the second galvanometer, condenser lens, the first wedge
Shape optical glass substrate and the second wedge-shaped optical glass substrate irradiate circuit according to laser and fixedly mount successively；
Second step, is positioned over the board in the front of the second wedge-shaped optical glass substrate by workpiece to be added, and will
Working position is placed under laser beam；
3rd step, starts described dynamic adjustable lens, the first galvanometer, the second galvanometer, the first wedge shape light
Learn glass substrate and the second wedge-shaped optical glass substrate and board makes its rotation sweep workpiece to be added, until
Machine.
Wherein, in the 3rd step of said method, board not with dynamic adjustable lens, the first galvanometer,
Two galvanometers, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate synchronous axial system.
Compared with prior art, this invention solves the weak point of existing special optics module, concrete body
Present:
Owing to this optics module is placed on the rear of condenser lens, can be integrated with conventional laser-processing system,
Improve the suitability, thus be substantially reduced equipment preparation cost.Use the wedge-shaped optical that two millimeter magnitudes are thick
Sheet glass, does not occupy big space, the short operating distance especially allowed when using short focal length lens.
Owing to this wedge-shaped optical module is placed on the rear of condenser lens, the therefore tune of the light path of this wedge-shaped optical module
Joint does not interferes with the light path before condenser lens, and optics regulation becomes to be relatively easy.This wedge-shaped optical eyeglass
Can be placed on galvanometer motor to realize the regulation of quick incident angle.Two wedge-shaped optical eyeglasses are coordinated with each other can
To reach required machining shape and tapering.
Accompanying drawing explanation
Fig. 1 is the first embodiment structure that the present invention can realize the processing unit (plant) of cone of nulls degree and back taper boring
Figure；
Fig. 2 is the wedge-shaped optical glass substrate that the present invention can realize the processing unit (plant) of cone of nulls degree and back taper boring
Connect the structural representation of tumbler；
Fig. 3 is the structure that the present invention can realize the second embodiment of the processing unit (plant) of cone of nulls degree and back taper boring
Schematic diagram；
Fig. 4 is the cone of nulls degree structure chart that the present invention can realize the processing unit (plant) of cone of nulls degree and back taper boring；
Fig. 5 is the back taper groove structure figure that the present invention can realize the processing unit (plant) of cone of nulls degree and back taper boring.
Detailed description of the invention
Below with reference to accompanying drawing, the present invention is given elaboration further.
Refer to Fig. 1 to accompanying drawing 5, a kind of processing unit (plant) realizing cone of nulls degree and back taper boring of the present invention,
There is a laser beam emitting device, include successively along laser direction of illumination circuit: a dynamic adjustable lens 1；
One condenser lens 3；One first wedge-shaped optical glass substrate 41；One second wedge-shaped optical glass substrate 42；
Wherein, laser passes sequentially through described dynamic adjustable lens 1, condenser lens the 3, first wedge-shaped optical glass
Substrate 41 and the second wedge-shaped optical glass substrate 42 act on workpiece to be added, and, the first described wedge
Shape optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 controlled rotation device, thus change and swash
Light illuminated line road, thus realize Drilling operation.
Referring to accompanying drawing 1, accompanying drawing 1 is the structural representation of first embodiment, it can be seen that this can
The processing unit (plant) realizing cone of nulls degree and back taper boring includes: a laser beam emitting device, fills from this Laser emission
Put going out of transmitting to be sequentially provided with on the circuit of laser beam: dynamic adjustable lens 1, a plane is anti-
Penetrating mirror 2, this plane mirror 2 is the one of which structure of laser-bounce device.Anti-through described plane
Laser beam after penetrating mirror 2 reflection changes straight line exit direction, and the laser beam after bending enters and sets
In a condenser lens 3 at described plane mirror 2 rear, the rear of described condenser lens 3 is provided with one
One wedge-shaped optical glass substrate 41, the side of described first wedge-shaped optical glass substrate 41 is by a connection
Part is connected to a tumbler, drives described first wedge-shaped optical glass substrate 41 by described tumbler
High-speed rotation about the z axis in X-Z plane, by the wedge shape of described first wedge-shaped optical glass substrate 41
Laser beam is reflected by structure, thus dynamically changes the engraving position of laser beam.Meanwhile, described
The dead astern of the first wedge-shaped optical glass substrate 41 be additionally provided with one second wedge-shaped optical glass substrate 42,
Further, the side of the second described wedge-shaped optical glass substrate 42 also connects has a tumbler, by this
The drive of tumbler makes the second wedge-shaped optical glass substrate 42 rotate, and changes laser light by wedge structure
The advance circuit of bundle, thus change the position of laser beam engraving.Laser beam is along with wedge-shaped optical glass
The motion of substrate 41,41 device, it is achieved thereby that process the hole (bag of arbitrary taper on workpiece the most to be added
Include the hole of zero draft and back draught), a workpiece 5 to be added is positioned at described second wedge-shaped optical glass substrate 42
Rear, by regulating the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate simultaneously
The rotation of 42, it is achieved the processing of the boring 50 on workpiece 5 to be added.Wherein, described the most adjustable
The lens 1 of joint, are used for regulating focus, it is ensured that laser beam not out of focus when the surface deflections of sample.Institute
The the first wedge-shaped optical glass substrate stated and the thickness of the second wedge-shaped optical glass substrate be 1 millimeter to 10
Millimeter.Preferably, described wedge-shaped optical glass substrate tumbler is a galvanometer motor.
Referring to accompanying drawing 2, it is the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate
42 last connections have the structural representation of a tumbler 411 and 421, and one of which laser beam
When described first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42, light beam
Anterior approach line chart.From accompanying drawing, the first described wedge-shaped optical glass substrate 41 is at tumbler
Turn about the Z axis along X-Z plane under drive, and the second wedge-shaped optical glass substrate 42 is at tumbler
Drive under turn about the Z axis along Y-Z plane, described X-Y-Z coordinate axes is cartesian coordinate axes,
Wherein said tumbler 411 and the straight line at the rotating shaft place of tumbler 421 mutually hang down in 90 degree
Directly.
Refer to accompanying drawing 3, its a kind of processing unit (plant) realizing cone of nulls degree and back taper boring being the present invention
The structural representation of another embodiment.It is with the difference of first embodiment, and described laser is anti-
Injection device (plane mirror 2 the most in the first embodiment) is made up of a galvanometer device, including first
Galvanometer 21 and the second galvanometer 22, wherein, the first described galvanometer turns about the Z axis in X-Y plane,
Turn about the X axis in the second described galvanometer Y-Z plane, in other words, the rotary shaft of the first galvanometer 21 and
The rotary shaft of the second galvanometer 22 is mutually perpendicular to.Wherein, described workpiece to be added 5 is positioned over a board 6
On, described board 6 can move along X-Y axle.Other structure divisions are identical with first embodiment, then
Secondary do not repeated.
Referring to accompanying drawing 4, it is realized cone of nulls degree and the processing of back taper boring using first embodiment
The processing method of device, it comprises the steps:
The first step, by dynamic adjustable lens 1, a plane mirror 2, a condenser lens 3, the first wedge
Shape optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 irradiate circuit according to laser to be fixed successively
Install, and workpiece 5 to be added is positioned on board 6；
Second step, is positioned over workpiece 5 to be added the front of the second wedge-shaped optical glass substrate 42, and will add
Ministry of worker position is under laser beam；
3rd step, open tumbler, the first wedge-shaped optical glass substrate 41 along X-Z face about the z axis
Rotating, the second wedge-shaped optical glass substrate 42 turns about the Z axis along Y-Z face, and board 6 is along X-Y side
To movement, until machining.
Meanwhile, in the course of processing, dynamic adjustable lens devices by change laser beam the angle of divergence,
So that it is guaranteed that not out of focus in laser processing procedure.
Referring to accompanying drawing 5, another kind can realize the method for the processing of cone of nulls degree and back taper boring, and it includes
Following steps:
The first step, by dynamic adjustable lens 1, the first galvanometer 21, the second galvanometer 22, focuses on 3,
First wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 irradiate circuit according to laser and depend on
Secondary fixed installation；
Second step, is positioned over the board 6 in the front of the second wedge-shaped optical glass substrate 42 by workpiece to be added
On, and working position is placed under laser beam；
3rd step, starts described dynamic adjustable lens the 1, first galvanometer 21, the second galvanometer 22, and first
Wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 and board 6 make it rotate, right
Workpiece 5 to be added is scanned until machining.
Meanwhile, in the course of processing, make lens in dynamic adjustable lens means movable sharp with regulation
Light is in the focus of sample surfaces.
Wherein, in above-mentioned second method, the 3rd step, board 6 not with described dynamic adjustable lens
1, the first galvanometer 21, the second galvanometer 22, the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass
Glass substrate 42 synchronous axial system, can realize processing equally.
It is controlled not that the requirement using above-mentioned a set of module or method can reach to control tapering realizes tapering
The boring of similar shape, such as circular hole, square hole, opposite sex hole etc..
Foregoing, only presently preferred embodiments of the present invention, be not intended to limit embodiment of the present invention,
Those of ordinary skill in the art, according to the central scope of the present invention and spirit, can carry out phase very easily
The accommodation answered or amendment, therefore protection scope of the present invention should be with the protection domain required by claims
Accurate.
Claims (4)
1. the processing unit (plant) that can realize cone of nulls degree and back taper boring, it is characterised in that shine along laser
Penetrate direction line to include successively: one realizes the dynamic adjustable lens of the dynamic zoom of the course of processing；One focuses on
Lens；One first wedge-shaped optical glass substrate；One second wedge-shaped optical glass substrate；Wherein, laser depends on
Secondary by described dynamic adjustable lens, condenser lens, the first wedge-shaped optical glass substrate and the second wedge shape
Optical glass substrate acts on workpiece to be added, between wherein said dynamic adjustable lens and condenser lens also
Being provided with a laser-bounce device, described laser-bounce device is plane mirror or by the first galvanometer and second
Galvanometer forms, and the thickness of described first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate is 1
Millimeter is to 10 millimeters, and the first described wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate are controlled
Galvanometer motor rotates, thus changes laser and irradiate circuit, it is achieved Drilling operation.
2. the method for the processing that can realize cone of nulls degree and back taper boring, it is characterised in that include as follows
Step:
The first step, by dynamic adjustable lens, laser mirror, condenser lens, the first wedge-shaped optical glass
Glass substrate and the second wedge-shaped optical glass substrate irradiate circuit according to laser and fixedly mount successively；
Second step, on the board in the front that workpiece to be added is positioned over the second wedge-shaped optical glass substrate, and
Working position is placed under laser beam；
3rd step, opens tumbler, and the first wedge-shaped optical glass substrate rotates around Y-axis along X-Z face,
Second wedge-shaped optical glass substrate turns about the X axis along Y-Z face, and board at X-Y to movement,
Laser is made to scan on workpiece to be added, until machining；
Meanwhile, in the course of processing, make lens in dynamic adjustable lens means movable sharp with regulation
Light is in the focus of sample surfaces.
3. the method for the processing that can realize cone of nulls degree and back taper boring, it is characterised in that include as follows
Step:
The first step, by dynamic adjustable lens, the first galvanometer, the second galvanometer, condenser lens, the first wedge
Shape optical glass substrate and the second wedge-shaped optical glass substrate irradiate circuit according to laser and fixedly mount successively；
Second step, is positioned over the board in the front of the second wedge-shaped optical glass substrate by workpiece to be added, and will
Working position is placed under laser beam；
3rd step, starts described dynamic adjustable lens, the first galvanometer, the second galvanometer, the first wedge shape light
Learn glass substrate and the second wedge-shaped optical glass substrate and board makes laser rotary scanning workpiece to be added, directly
To machining；
Meanwhile, in the course of processing, dynamic adjustable lens by change laser beam the angle of divergence, from
And guarantee not out of focus when laser deflection, motion.
The method that can realize the processing of cone of nulls degree and back taper boring the most as claimed in claim 3, its feature
Be, in the 3rd described step, board not with dynamic adjustable lens, the first galvanometer, the second galvanometer,
First wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate synchronous axial system.
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| CN201510036975.4A CN104690423B (en) | 2015-01-23 | 2015-01-23 | A kind of realize cone of nulls degree and back taper boring processing unit (plant) and method |
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| CN104690423B true CN104690423B (en) | 2016-08-24 |
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| CN108480841B (en) * | 2018-02-01 | 2023-10-20 | 西安中科微精光子科技股份有限公司 | Beam scanning system and beam scanning method for laser micropore machining |
| CN109604837B (en) * | 2018-12-12 | 2020-06-16 | 中国科学院西安光学精密机械研究所 | Non-taper laser processing method |
| CN111872579B (en) * | 2020-06-16 | 2022-07-29 | 江苏亚威艾欧斯激光科技有限公司 | Laser drilling equipment |
| CN114101900B (en) * | 2021-12-31 | 2023-03-10 | 华中科技大学 | Laser scanning optical system |
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Address after: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Patentee after: Innovo laser Polytron Technologies Inc Patentee after: Inno Machining Co., Ltd. Address before: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Patentee before: Shenzhen Inno Laser Technology Co., Ltd. Patentee before: Inno Machining Co., Ltd. |
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