CN201295822Y - Thin-walled tube laser micro-cutting device - Google Patents
Thin-walled tube laser micro-cutting device Download PDFInfo
- Publication number
- CN201295822Y CN201295822Y CN 200820153979 CN200820153979U CN201295822Y CN 201295822 Y CN201295822 Y CN 201295822Y CN 200820153979 CN200820153979 CN 200820153979 CN 200820153979 U CN200820153979 U CN 200820153979U CN 201295822 Y CN201295822 Y CN 201295822Y
- Authority
- CN
- China
- Prior art keywords
- laser
- light
- scanning
- utility
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a thin-walled tube laser micro-cutting device which comprises a solid laser, a collimating and beam-expanding system, a shutter, an XY beam positioning and scanning device, a telecentric scanning mirror, a CCD, a computer control system, a rotating motor and a workpiece holder. A laser beam emitted from the laser passes through the collimating and beam-expanding system and then is positioned through the scanning device; the laser beam focuses on the surface of a workpiece after passing through the scanning device and the telecentric scanning mirror; and the computer controls the workpiece to rotate along the axis at a high speed and the thin-walled tube cutting is completed in coordination with beam two-dimensional scanning. The utility model has the beneficial effects that the utility model utilizes the ultrashort pulse technology to improve the peak power of the laser and directly gasify the processed region; the utility model adopts the laser beam high speed scanning and telecentric scanning focusing mirror, instead of the traditional CNC displacement platform, so as to improve the processing efficiency; the utility model overcomes the difficulty that the prior laser thin-walled tube cutting system can not process non-metal materials, realizes the micro-cutting of various organic polymers, and opens up as a new application field for medical thin-wall tube bracket.
Description
Technical field
The utility model relates to a kind of light-wall pipe device for micro cutting, and particularly a kind of high-peak power laser scan-type light-wall conduit laser micro cutting device belongs to laser retrofit technical field.
Background technology
Medical light-wall pipe support is mainly used in plants people's human body coronary stricture position support blood vessels wall, keep the interior blood flow of blood vessel unimpeded, and can be used for other human organs such as tracheae, along with the increase of similar disease and the progress of medical technology, the production efficiency and the quality of medical light-wall pipe support are had higher requirement.Most of in the market light-wall pipe supports all adopt the mode of laser cutting to process, the main continuous or pulse laser of infrared band that adopts of traditional laser light-wall pipe cutting is as light source, the fuel factor of dependence laser beam produces melt and dissolved district and cuts in the commissure, its joint-cutting edge fuel factor obviously and need auxiliary equipment such as air blowing, and can only the processing metal light-wall pipe, can't be processed with the light-wall pipe of organic polymer material; Owing to adopt the processing mode of mechanical displacement, its process velocity is relatively slow simultaneously.
Summary of the invention
Conventional medical light-wall pipe cutter sweep process velocity is slow in order to overcome for the utility model, the heat affected area is big, need blowning installation, can't be used for defective such as nonmetallic materials processing, and a kind of light-wall conduit laser micro cutting device that adopts the cutting processing mode of high-peak power solid state laser, light beam focusing scanning is provided.
The technical solution of the utility model is: a kind of light-wall conduit laser micro cutting device, be characterized in that it comprises high-peak power solid state laser, collimating and beam expanding system, shutter, XY beam position scanning means, telecentric scanning lens, CCD surveillance, computer control system, electric rotating machine, work piece holder; The laser beam that laser instrument sends positions by XY beam position scanning means after by collimating and beam expanding system, the shutter that is used for the adjusting of laser energy places between collimating and beam expanding system and the XY beam position scanning means, after laser beam passes through XY beam position scanning means and telecentric scan lens, mode with vertical incidence directly focuses on the surface of the work, described workpiece is fixed on the electric rotating machine by work piece holder, do rotation at a high speed by the control lower edge axis of computer control system, cooperate the scanning motion of light beam bidimensional to finish cutting; Carry out complete monitoring by CCD.
Described high-peak power solid state laser adopts the ultrashort pulse diode pumped solid state laser of 532nm, 355nm wavelength, and the energy density of peak power reaches 10
8W/cm
2
Described telecentric scan lens is the set of lenses of being made up of 3 or above optical mirror slip, be positioned between beam position scanning means and the workpiece to be machined, be coated with the anti-reflection film of 532nm or 355nm at its optical lens surface, its main feature is to keep all laser to focus on the chief ray of outgoing beams perpendicular to machined surface.It has following advantage: one, incide machined surface to the chief ray near vertical, and be mainly used in laser boring and laser cutting, overcome the shortcoming that forms bellmouth and scarf with non-telecentric scanning object lens handling ease.Its two, avoid when light beam sees through the such material of similar crystal with bigger incidence angle, may cause that light beam is reflected out the surface and causes seeing through the phenomenon of failure.Its three, focal beam spot will can not elongate, and non-telecentric scanning object lens can not occur and make hot spot become ellipse owing to scanning angle increases, machining area increases and causes the more and more lower phenomenon of light spot energy density.
The beneficial effects of the utility model are that the utility model adopts 532nm, 355nm solid state laser, utilizes the ultrashort pulse technology, significantly improves the peak power in the laser processing procedure, thereby reaches the purpose that the direct gasification area to be machined reduces the heat affected area; And adopt technology such as laser beam high-velocity scanning and telecentric scanning focus lamp to replace traditional CNC displacement platform simultaneously, can improve working (machining) efficiency greatly.Further broken through the difficulty that existing laser light-wall pipe diced system can't machining of non-metallic material, can realize little cutting of all kinds of organic polymers, therefore the utility model can be the new application of medical light-wall pipe support developing, reduce use cost, aspect medical science, have broad application prospects.
Description of drawings
Fig. 1 is the light-wall conduit laser micro cutting device structure principle chart;
Fig. 2 is the telecentric scan lens fundamental diagram;
Fig. 3 is for scanning the diced system structure chart that declines;
Fig. 4 is the utility model application example figure.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further described.
As shown in Figure 1, light-wall conduit laser micro cutting device of the present utility model comprises high-peak power solid state laser 1, collimating and beam expanding system 3, shutter 4, XY beam position scanning means 5, telecentric scan lens 6, CCD surveillance 7, computer control system 8, electric rotating machine 9, work piece holder 10.The laser beam 2 that laser instrument 1 sends positions by XY beam position scanning means 5 by collimating and beam expanding system 3 backs, and the shutter 4 that is used for the adjusting of laser energy places between collimator and extender 3 and the scanning means 5.After laser beam 2 passes through scanning means 5 and telecentric scan lens 6, will directly focus on workpiece 11 surfaces, and under the control of computer control system 8, do accurate bidimensional scanning cutting in the mode of vertical incidence; Workpiece 11 (light-wall pipe of metal or organic polymer material) is fixed on the electric rotating machine 9 by work piece holder 10, and do high speed by the control lower edge axis of computer control system 8 and rotate, thereby cooperate the scanning motion of light beam bidimensional to finish the cutting of example shown in Figure 4 and the medical light-wall pipe of other shapes.This process can be carried out complete monitoring by CCD surveillance surveillance, guarantees crudy.By shown in Figure 2, telecentric scanning object lens 6 can keep all laser to focus on the chief ray of outgoing beam perpendicular to machined surface.Therefore light beam can remain vertically with processing plane in workpiece 11 rotation process, improves crudy.By shown in Figure 3, laser beam is by after scanning positioner deflection, and the surface of the work that focuses on rotation through telecentric scan lens is finished processing.Fig. 4 is the expanded view and the pictorial diagram of processing back workpiece for the utility model application example figure, and both the mode that adds scanning by rotation showed the shape that cuts out rule at the workpiece of column type, finished processing.
Described high-peak power solid state laser 1 adopts the ultrashort pulse diode pumped solid state laser of 532nm, 355nm wavelength, and the energy density of peak power reaches 10
8W/cm
2Mode by direct gasification is cut, and the little blowning installation that need not simultaneously in heat affected area cuts by the mode of direct gasification, the little blowning installation that need not simultaneously in heat affected area.
The utility model is by the cutting mode of high-peak power laser and beam flying, can promote traditional laser light-wall pipe cutting technique at aspects such as process velocity, crudy, device structures, can be used for comprising the cutting of all kinds of medical light-wall pipe support of metal and organic polymer material.For the process technology that promotes light-wall pipe and open up other applications a kind of new device and method is provided.
The method step of using this light-wall conduit laser micro cutting device cutting light-wall pipe is:
The first step obtains the LASER Light Source be used to cut, adopts the ultrashort pulse diode pumped solid state laser of 532nm or 355nm wavelength, and the laser beam that laser instrument sends is gone into the light beam scanning means by optical lens collimator and extender integer is laggard.
Second step was finished the processing of surface of the work by beam flying deflection: laser beam by scanning means and beam condenser after, finish accurate bidimensional scanning cutting.Light-beam scanner can be XY beam position scanning means, its by two can be under computer control at a high speed, the speculum of high accuracy rotation forms, play the effect of beam deflection scanning, described beam condenser is a telecentric scan lens, can obviously improve crudy.
The fixedly rotation and the location of the 3rd step workpiece, workpiece (light-wall pipe of metal or organic polymer material) is fixed on the rotating shaft of electric rotating machine by work piece holder, and do high speed by the control lower edge axis of computer control system and rotate, thereby cooperate the scanning motion of light beam bidimensional to finish the cutting of the medical light-wall pipe of different shape.The adjusting of trace is carried out by the method that the CCD visual identity adds the software correction again in the position of location by the integrally-regulated workpiece of mechanical means, and this process can be carried out complete monitoring by the CCD surveillance, guarantees crudy.
Claims (3)
1. light-wall conduit laser micro cutting device, it is characterized in that it comprises high-peak power solid state laser, collimating and beam expanding system, shutter, XY beam position scanning means, telecentric scan lens, CCD surveillance, computer control system, electric rotating machine, work piece holder; The laser beam that laser instrument sends positions by XY beam position scanning means after by collimating and beam expanding system, the shutter that is used for the adjusting of laser energy places between collimating and beam expanding system and the XY beam position scanning means, after laser beam passes through XY beam position scanning means and telecentric scan lens, mode with vertical incidence directly focuses on the surface of the work, described workpiece is fixed on the electric rotating machine by work piece holder, do rotation at a high speed by the control lower edge axis of computer control system, cooperate the scanning of light beam bidimensional to finish the light-wall pipe cutting; Carry out complete monitoring by CCD.
2. light-wall conduit laser micro cutting device according to claim 1 is characterized in that, described high-peak power solid state laser adopts the ultrashort pulse diode pumped solid state laser of 532nm, 355nm wavelength, and the energy density of peak power reaches 10
8W/cm.
3. light-wall conduit laser micro cutting device according to claim 1, it is characterized in that, described telecentric scanning lens are the set of lenses of being made up of 3 or above optical mirror slip, be positioned between beam position scanning means and the workpiece to be machined, be coated with the anti-reflection film of 532nm or 355nm at its optical lens surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820153979 CN201295822Y (en) | 2008-10-14 | 2008-10-14 | Thin-walled tube laser micro-cutting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820153979 CN201295822Y (en) | 2008-10-14 | 2008-10-14 | Thin-walled tube laser micro-cutting device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201295822Y true CN201295822Y (en) | 2009-08-26 |
Family
ID=41041783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200820153979 Expired - Fee Related CN201295822Y (en) | 2008-10-14 | 2008-10-14 | Thin-walled tube laser micro-cutting device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201295822Y (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102830639A (en) * | 2012-08-24 | 2012-12-19 | 上海交通大学 | Device for controlling motor rotating speed and shutter |
DE102013212652A1 (en) * | 2013-06-28 | 2014-12-31 | Continental Automotive Gmbh | Device for operating a machine tool and machine tool |
CN104395034A (en) * | 2012-06-28 | 2015-03-04 | 罗芬-巴瑟尔激光技术有限责任两合公司 | Device and method for separating a longitudinally-extended cylindrical workpiece |
CN104690423A (en) * | 2015-01-23 | 2015-06-10 | 深圳英诺激光科技有限公司 | Machining device and method capable of realizing zero taper and reverse taper drilling |
CN110303700A (en) * | 2019-01-25 | 2019-10-08 | 北京理工大学 | A kind of resin lens manufacturing method |
CN111571004A (en) * | 2020-05-26 | 2020-08-25 | 山东理工大学 | Method and system for laser processing of composite micro-texture on surface of nodular cast iron material |
CN111774736A (en) * | 2020-05-27 | 2020-10-16 | 武汉翔明激光科技有限公司 | Laser non-penetrating cutting equipment and method for metal outer sleeve of outer cladding workpiece |
-
2008
- 2008-10-14 CN CN 200820153979 patent/CN201295822Y/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104395034A (en) * | 2012-06-28 | 2015-03-04 | 罗芬-巴瑟尔激光技术有限责任两合公司 | Device and method for separating a longitudinally-extended cylindrical workpiece |
CN104395034B (en) * | 2012-06-28 | 2016-09-14 | 罗芬-巴瑟尔激光技术有限责任两合公司 | Equipment and method for cylindrical work the most extendable in the longitudinal direction |
CN102830639A (en) * | 2012-08-24 | 2012-12-19 | 上海交通大学 | Device for controlling motor rotating speed and shutter |
DE102013212652A1 (en) * | 2013-06-28 | 2014-12-31 | Continental Automotive Gmbh | Device for operating a machine tool and machine tool |
DE102013212652B4 (en) * | 2013-06-28 | 2016-12-15 | Continental Automotive Gmbh | Device for operating a machine tool and machine tool |
CN104690423A (en) * | 2015-01-23 | 2015-06-10 | 深圳英诺激光科技有限公司 | Machining device and method capable of realizing zero taper and reverse taper drilling |
CN104690423B (en) * | 2015-01-23 | 2016-08-24 | 深圳英诺激光科技有限公司 | A kind of realize cone of nulls degree and back taper boring processing unit (plant) and method |
CN110303700A (en) * | 2019-01-25 | 2019-10-08 | 北京理工大学 | A kind of resin lens manufacturing method |
CN111571004A (en) * | 2020-05-26 | 2020-08-25 | 山东理工大学 | Method and system for laser processing of composite micro-texture on surface of nodular cast iron material |
CN111774736A (en) * | 2020-05-27 | 2020-10-16 | 武汉翔明激光科技有限公司 | Laser non-penetrating cutting equipment and method for metal outer sleeve of outer cladding workpiece |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201295822Y (en) | Thin-walled tube laser micro-cutting device | |
CN101380696A (en) | Light-wall conduit laser micro cutting device and method | |
CN101733556B (en) | Laser cutting machine | |
CN201783759U (en) | Optical fiber laser or disc laser dynamic focusing scanning spot trajectory processing system | |
CN1265931C (en) | Laser beam process method and appts. thereof | |
CN102773605B (en) | A kind of rotary light beam module group laser motion tracking control system | |
CN108950545B (en) | A kind of rotary light beam ultrahigh speed laser cladding method | |
CN201076969Y (en) | Precisely positioning system for ultraviolet laser micromachining | |
CN105798455B (en) | Laser-processing system and method | |
CN111872548A (en) | Laser processing device with controllable light beam incident angle and laser processing method | |
CN105301768B (en) | Lens vibrating type laser scanning system | |
CN203390386U (en) | Laser processing device | |
CN102950385A (en) | System and method for processing micro conical bore by rotation of laser beam | |
CN101856772A (en) | Light beam-rotating galvanometer-scanning focused processing system | |
CN108971775B (en) | Laser drilling method and device for metal | |
CN112475638B (en) | Laser micropore machining system and method based on axicon lens | |
CN102248303A (en) | Picosecond laser device for processing blood vessel stent | |
CN103170733A (en) | Coaxial laser processing mechanism | |
CN203221280U (en) | Ultraviolet-laser processing apparatus | |
CN103418911A (en) | Narrow-space laser marking method and marking machine thereof | |
CN205147590U (en) | Rotatory laser welder head | |
CN213318327U (en) | Laser processing device with controllable light beam incident angle | |
CN213998253U (en) | Femtosecond laser taper hole processing system | |
CN204565419U (en) | A kind of processing unit (plant) realizing cone of nulls degree and back taper boring | |
CN101497149A (en) | Laser flying focus scanning system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090826 Termination date: 20121014 |