CN201076969Y - Precisely positioning system for ultraviolet laser micromachining - Google Patents
Precisely positioning system for ultraviolet laser micromachining Download PDFInfo
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- CN201076969Y CN201076969Y CN 200720173411 CN200720173411U CN201076969Y CN 201076969 Y CN201076969 Y CN 201076969Y CN 200720173411 CN200720173411 CN 200720173411 CN 200720173411 U CN200720173411 U CN 200720173411U CN 201076969 Y CN201076969 Y CN 201076969Y
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Abstract
The utility model discloses an ultraviolet laser micro-machining and accurately positioning system, belonging to laser micro-machining field, which comprises an ultraviolet laser, an expanding light path system, a 45-degree reflector, a focusing lens, a coaxial CCD micro-monitoring system, a cross hair positioner, a holding frame, a three-dimensional mobile platform, a precision rotating disc and other parts. The utility model is characterized in that: a laser beam from the laser passes through an expanding system before horizontally introduced to the 45-degree reflector in the holding frame; vertically downward laser beam reflected from the 45-degree reflector passes through the focusing lens and is convergent on a work piece arranged on the three-dimensional mobile platform and the precision rotating disc when micro-monitoring observation is realized upon the processed work piece by the coaxial CCD micro-monitoring system and the cross hair positioner at the upper part of the reflector; then the three-dimensional mobile platform is moved and the precision rotating disc is rotated to realized accurately positioning and high-precision laser micro machining upon processed work piece.
Description
Technical field:
The utility model relates to the little precision machining navigation system of a kind of Ultra-Violet Laser, belongs to the Laser Micro-Machining field.
Background technology:
The general indication processing dimension of Laser Micro-Machining is in several technical process to the hundreds of micron.A branch as Laser Processing, Laser Micro-Machining in the past 10 years by extensive concern, it mainly is to utilize the laser beam of high-energy-density that material is carried out direct laser ablation processing, the energy that the solid material of tiny area absorbs laser makes and material fusing or gasification and eject from finished surface reaches processing purpose.The basic characteristics of laser micro-machining technology comprise: the energy density height of laser beam, advantage such as process velocity is fast, the heat affected area is little, noncontact, efficient height, cost are low, easily be automated.
Along with the progressively raising of scientific and technological level, the little punching of Laser Micro-Machining such as laser, laser microdissection cut, laser marking, laser cleaning etc. are also more and more wider in the application of aspects such as electronics, communication, chemical industry, food, biologic medical; And for ultraviolet laser, because its wavelength is short, focussed laser beam can obtain littler spot size, is widely adopted in the Laser Micro-Machining field; Simultaneously because the requirement of machining accuracy is more and more higher, for example in the processing of MEMS device, the machining accuracy of workpiece is all come in micron even sub-micron, and the many costlinesses that all compare of rapidoprint, yield rate all requires also than higher, and the accurate location to processing work seems particularly important like this.
But all lack coaxial surveillance and navigation system in the laser accurate processing at present, positioning accuracy is not high, and carrying out the periodic structure machining accuracy for the very high workpiece of required precision can not meet the demands.This just needs design one cover to be applicable to that the Precision Position Location System of Laser Micro-Machining satisfies processing request.
The utility model content:
The purpose of this utility model is a kind of micro-machined Precision Position Location System of Ultra-Violet Laser that is suitable for of design, improves for the pinpoint demand of Laser Micro-Machining.
To achieve these goals, the utility model has been taked following technical scheme.Comprise ultraviolet laser 1, expand beam optical path system 2,45 ° of speculums 3, condenser lens 4, bracing frame 7, three-dimensional mobile platform 8 and computers 10; It is characterized in that: also include accurate rotating disk 9, the micro-surveillance 5 of coaxial CCD, crosshair locator 6; Wherein, 45 ° of speculums 3 and condenser lens 4 are installed on the bracing frame 7, and accurate rotating disk 9 is arranged on the triple motion moving platform 8; Laser beam that ultraviolet laser 1 sends 11 is through on 45 ° of speculums 3 of beam-expanding systems 2 back glancing incidences in the bracing frame 7, and, focus a laser beam on the processing work 12 that is placed on above the accurate rotating disk 9 through condenser lens 4 again through the laser beam vertically downward that reflection obtains; The micro-surveillance 5 of coaxial CCD and the crosshair locator 6 that are used for processing work 12 is monitored observation are installed above 45 ° of speculums 3, move with accurate rotating disk 9 by the three-dimensional mobile platform 8 of computer 10 controls and rotate the location of realizing processing work 12.
The wavelength of described ultraviolet laser 1 is 157nm～390nm.
3 one plated films of described 45 ° of speculums, one side plated film not in addition, plated film regards to laser beam 11 total reflections, and speculum 3 sees through for some wave bands in natural daylight or the natural daylight scope.
The micro-surveillance 5 of described coaxial CCD comprises coaxial ccd detector 13 and monitor 14; Wherein, the multiplication factor of the micro-detector 13 of coaxial CCD is 5～200 times, the micro-detector 13 of coaxial CCD be in 45 ° of speculums 3 directly over, can be by adjusting the optical module in the micro-detector 13 of coaxial CCD, make from the light of processing work 12 surface reflections, received by the micro-detector 13 of coaxial CCD at last through condenser lens 4 and 45 ° of speculums 3, and on monitor 14, obtain clearly as.
The crosshair of described crosshair locator 6 is built in the micro-detector 13 of coaxial CCD, and and monitor 14 be connected on the micro-detector 13 of coaxial CCD by data wire together, crosshair and processing work 12 planes are all through micro-detector 13 amplification imagings of CCD and be presented on the monitor 14, and can make the crosshair intersection point be positioned at a certain position, processing work surface by two knobs 15 regulating crosshair locator 6.When laser beam 11 acts on that certain is some on the processing work 12, adjust the crosshair intersection point, and be located at the Laser Processing facula position, just can realize the accurate location of Laser Micro-Machining.
Described accurate rotating disk 9 includes index plate 24, inserts axle core 25 and dividing arm 26 in the index plate 24, dividing arm 26 includes the standing part 30 and the rotating part 31 of coaxial connection, and standing part 30 is interlocked with vertical gear and index plate 24 by horizontal gear with rotating part 31; Also can be by the rotation of step motor control index plate 24.
Described axle core 25 tops are equipped with triangle pawl 28.
Advantage of the present utility model is: the little precision machining navigation system of a kind of Ultra-Violet Laser, precision with the micro-detector of coaxial CCD, monitor, crosshair locator, accurate triple motion moving platform and accurate rotating disk formation Ultra-Violet Laser moves, rotates and accurately locatees, surveillance, the precision of Laser Micro-Machining can be improved, present processing can be satisfied for the high accuracy micro devices.
Description of drawings
Fig. 1 is the little precision machining position system device of a Ultra-Violet Laser sketch;
Fig. 2 is the support frame micro-surveillance structure diagram of coaxial CCD of unifying;
Fig. 3 is accurate turntable structure sketch;
Wherein: 1, ultraviolet laser; 2, expand the beam optical path system; 3,45 ° of speculums; 4, condenser lens; 5, the micro-surveillance of coaxial CCD; 6, crosshair locator; 7, bracing frame; 8, three-dimensional mobile platform; 9, accurate rotating disk; 10 and computer; 11, laser beam; 12, processing work; 13, the micro-detector of coaxial CCD; 14, monitor; 15, knob; 16, fixed head; 17, link rod sleeve; 18, base; 19, aluminium block; 20, screw; 21,45 degree inclined-planes; 22, aluminum hull; 23, bung flange; 24, index plate; 25, axle core; 26, dividing arm; 27, rotary base; 28, triangle pawl; 29, knob; 30, standing part; 31, rotating part.
The specific embodiment
Describe present embodiment in detail below in conjunction with Fig. 1, Fig. 2 and Fig. 3.
As shown in Figure 1, present embodiment comprises that wavelength is the parts such as ultraviolet laser 1,2,45 ° of speculums 3 of expansion beam optical path system, condenser lens 4, the micro-surveillance 5 of coaxial CCD, crosshair locator 6, bracing frame 7, three-dimensional mobile platform 8, accurate rotating disk 9 and computer 10 of 355nm.Wherein, laser beam that ultraviolet laser 1 sends 11 through beam-expanding systems 2 after on 45 ° of speculums 3 of glancing incidences in the bracing frame 7, and the laser beam vertically downward 11 that obtains through reflection, pass through condenser lens 4 again, laser beam 11 is focused on the processing work 12 that is placed on above three-dimensional mobile platform 8 and the accurate rotating disk 9; Be installed in the micro-surveillance 5 of coaxial CCD of 45 ° of speculum 3 tops and crosshair locator 6 simultaneously and realize, move by the three-dimensional mobile platform 8 of computer 10 controls then and accurate rotating disk 9 rotates the accurate location of realizing processing work 12, realizes the little processing of high accuracy Ultra-Violet Laser processing work 12 micro-supervision observations.
As shown in Figure 2,3 one plated films of 45 ° of speculums in the present embodiment, one side plated film not in addition, plated film regards to laser beam 11 total reflections, and the entire emission mirror sees through for some wave bands in natural daylight or the natural daylight scope.45 ° of speculums 3 are fixed on the bracing frame 7, and the laser beam 11 of horizontal transport is through the plated film face total reflection of 45 ° of speculums 3, and transmission direction becomes straight down.
The micro-surveillance 5 of coaxial CCD comprises coaxial ccd detector 13 and monitor 14, and the multiplication factor of the micro-detector 13 of wherein coaxial CCD is 5～200 times.The micro-detector 13 of coaxial CCD be in 45 ° of speculums 3 directly over, can be by adjusting the optical module in the micro-detector 13 of coaxial CCD, make from the light of processing work 12 surface reflections, received by the micro-detector 13 of coaxial CCD at last through condenser lens 4 and 45 ° of speculums 3, and on monitor 14, obtain clearly as.
The crosshair of crosshair locator 6 is built in the micro-detector 13 of coaxial CCD, and and monitor 14 be connected on the micro-detector 13 of coaxial CCD by data wire together, crosshair and processing work 12 planes are all through micro-detector 13 amplification imagings of CCD and be presented on the monitor 14, and can make the crosshair intersection point be positioned at a certain position, processing work surface by two knobs 15 regulating crosshair locator 6.When laser beam 11 acts on that certain is some on the processing work 12, adjust the crosshair intersection point, and be located at the Laser Processing facula position, just can realize the accurate location of Laser Micro-Machining.
Bracing frame 7 is made up of fixed head 16, link rod sleeve 17 and base 18 three parts.Fixed head 16 is corrosion resistant plates, is used for fixing parts such as 45 ° of speculums 3, condenser lens 4, the micro-detector 5 of coaxial CCD; On the aluminium block 19 that it is an open circles that 45 ° of speculums 3 are fixed on a middle part, aluminium block 19 is fixed on one the 45 degree inclined-plane pillar 21 on the fixed head 16 by screw 20 again; The micro-detector 13 of coaxial CCD that is in directly over 45 ° of speculums 3 is fixed on the column aluminum hull 22, aluminum hull 22 1 sides leave a big hole so that the laser beam of horizontal transport 11 can incide on 45 ° of speculums 3 by circular hole, and aluminum hull is fixed on the fixed station 16 by screw 20 again; Fixed head 16 connects together by connecting rod 17 with base 18, can regulate the height of fixed head 16 by the bung flange on the lifting linking member sleeve 17 23, reenters and is mapped on 45 ° of speculums 3 so that make the laser beam 11 of horizontal transport just in time pass big hole in the aluminum hull 2.
Show that as Fig. 3 the accurate rotating disk 9 in the present embodiment is made up of index plate 24, axle core 25, dividing arm 26 and rotary base 27, can also can control by software control by rotating dividing arm 26.
Wherein the latter half of index plate 24 places rotary base 28, and by precision gear with rotated by step motor control, 24 1 weeks of index plate are divided into 360 five equilibriums, one is divided into 1 °; The center of index plate 24 has a coaxial hollow space to be used for inserting axle core 25;
Axle core 25 is divided into two kinds: when a kind of core inserts in the index plate, better make index plate 24 surfaces form a plane, so that make processing work flatly be placed on the shaft core position of index plate 25; A triangle pawl 28 is arranged at another kind of axle core 25 tops, can make triangle pawl 28 open by the knob 29 at regulating shaft core 25 middle parts or promptly, so that the coaxial workpiece to be machined 12 of clamping;
Present embodiment can be realized the accurate location to Ultra-Violet Laser, has improved the precision of Laser Micro-Machining.
Claims (7)
1. the little precision machining navigation system of Ultra-Violet Laser comprises ultraviolet laser (1), expands beam optical path system (2), 45 ° of speculums (3), condenser lens (4), bracing frame (7), three-dimensional mobile platform (8) and computer (10); It is characterized in that: also include accurate rotating disk (9), the micro-surveillance of coaxial CCD (5), crosshair locator (6); Wherein, 45 ° of speculums (3) and condenser lens (4) are installed on the bracing frame (7), and rotating disk (9) is arranged on the triple motion moving platform (8); Laser beam (11) that ultraviolet laser (1) sends is through on 45 ° of speculums (3) of beam-expanding system (2) back glancing incidence in the bracing frame (7), and, pass through condenser lens (4) again and focus a laser beam on the processing work (12) that is placed on above the rotating disk (9) through the laser beam vertically downward that reflection obtains; Micro-surveillance of coaxial CCD (5) and the crosshair locator (6) that is used for processing work (12) is monitored observation is installed in the top of 45 ° of speculums (3), controls three-dimensional mobile platform (8) by computer (10) and move and the location of accurate rotating disk (9) rotation realization processing work (12).
2. the little precision machining navigation system of Ultra-Violet Laser according to claim 1 is characterized in that: the wavelength of described ultraviolet laser (1) is 157nm～390nm.
3. the little precision machining navigation system of Ultra-Violet Laser according to claim 1, it is characterized in that: (3) plated films of described 45 ° of speculums, one side plated film not in addition, plated film regards to laser beam (11) total reflection, and speculum (3) sees through for some wave bands in natural daylight or the natural daylight scope.
4. the little precision machining navigation system of Ultra-Violet Laser according to claim 1 is characterized in that: the micro-surveillance of described coaxial CCD (5) comprises coaxial ccd detector (13) and monitor (14); Wherein, the multiplication factor of the micro-detector of coaxial CCD (13) is 5～200 times, the micro-detector of coaxial CCD (13) be in 45 ° of speculums (3) directly over, can be by adjusting the optical module in the micro-detector of coaxial CCD (13), make from the light of processing work (12) surface reflection, through condenser lens (4) and 45 ° of speculums (3) at last by the micro-detector of coaxial CCD (13) reception, and on monitor (14), obtain clearly as.
5. the little precision machining navigation system of Ultra-Violet Laser according to claim 1, it is characterized in that: the crosshair of described crosshair locator (6) is built in the micro-detector of coaxial CCD (13), and and monitor (14) be connected on the micro-detector of coaxial CCD (13) by data wire together, crosshair and processing work (12) plane is all through the micro-detector of CCD (13) amplification imaging and be presented on the monitor (14), and can make the crosshair intersection point be positioned at a certain position, processing work surface by two knobs (15) of regulating crosshair locator (6).
6. the little precision machining navigation system of Ultra-Violet Laser according to claim 1, it is characterized in that: described accurate rotating disk (9) includes index plate (24), inserts axle core (25) and dividing arm (26) in the index plate (24), dividing arm (26) includes the standing part (30) and the rotating part (31) of coaxial connection, and standing part (30) is interlocked with vertical gear and index plate (24) by horizontal gear with rotating part (31); Also can be by the rotation of step motor control index plate (24).
7. the little precision machining navigation system of Ultra-Violet Laser according to claim 1 is characterized in that: described axle core (25) top is equipped with triangle pawl (28).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720173411 CN201076969Y (en) | 2007-09-28 | 2007-09-28 | Precisely positioning system for ultraviolet laser micromachining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720173411 CN201076969Y (en) | 2007-09-28 | 2007-09-28 | Precisely positioning system for ultraviolet laser micromachining |
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| CN201076969Y true CN201076969Y (en) | 2008-06-25 |
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| CN 200720173411 Expired - Fee Related CN201076969Y (en) | 2007-09-28 | 2007-09-28 | Precisely positioning system for ultraviolet laser micromachining |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101318264B (en) * | 2008-07-07 | 2011-01-12 | 苏州德龙激光有限公司 | Ultraviolet laser machining apparatus for cutting wafer |
| CN101983825A (en) * | 2010-10-09 | 2011-03-09 | 苏州德龙激光有限公司 | Picosecond laser scribing device for light emitting diode (LED) wafer |
| CN101518855B (en) * | 2009-03-27 | 2011-08-24 | 华中科技大学 | Multifunctional laser processing device |
| CN102310285A (en) * | 2011-07-27 | 2012-01-11 | 苏州德龙激光有限公司 | Laser processing device of silicon glass bonding slice and method thereof |
| CN103079746A (en) * | 2010-09-01 | 2013-05-01 | 三菱电机株式会社 | Laser processing apparatus and substrate position detecting method |
| CN103358023A (en) * | 2013-07-18 | 2013-10-23 | 江苏和昊激光科技有限公司 | Automatic alignment laser tailor-welding system |
| CN103801823A (en) * | 2014-02-14 | 2014-05-21 | 中国电子科技集团公司第四十五研究所 | Wafer alignment locating device and method |
| CN103878478A (en) * | 2014-01-28 | 2014-06-25 | 华中科技大学 | Three-dimensional laser machining workpiece positioning measuring device and method implemented by same |
| CN104271307A (en) * | 2012-01-30 | 2015-01-07 | 通快机床两合公司 | Method for regulating a laser cutting process and laser cutting machine |
| CN106454048A (en) * | 2016-07-29 | 2017-02-22 | 大族激光科技产业集团股份有限公司 | Pseudo coaxial CCD shooting system and laser processing device employing the system |
| CN111168278A (en) * | 2019-12-31 | 2020-05-19 | 广东深泓智能科技有限公司 | Automatic welding machine |
| CN113458627A (en) * | 2021-08-05 | 2021-10-01 | 瑟福迪恩半导体设备技术(苏州)有限公司 | Light path dimming method of laser cutting equipment |
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2007
- 2007-09-28 CN CN 200720173411 patent/CN201076969Y/en not_active Expired - Fee Related
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101318264B (en) * | 2008-07-07 | 2011-01-12 | 苏州德龙激光有限公司 | Ultraviolet laser machining apparatus for cutting wafer |
| CN101518855B (en) * | 2009-03-27 | 2011-08-24 | 华中科技大学 | Multifunctional laser processing device |
| CN103079746A (en) * | 2010-09-01 | 2013-05-01 | 三菱电机株式会社 | Laser processing apparatus and substrate position detecting method |
| CN101983825A (en) * | 2010-10-09 | 2011-03-09 | 苏州德龙激光有限公司 | Picosecond laser scribing device for light emitting diode (LED) wafer |
| CN102310285A (en) * | 2011-07-27 | 2012-01-11 | 苏州德龙激光有限公司 | Laser processing device of silicon glass bonding slice and method thereof |
| CN102310285B (en) * | 2011-07-27 | 2014-05-14 | 苏州德龙激光股份有限公司 | Laser processing device of silicon glass bonding slice and method thereof |
| CN104271307A (en) * | 2012-01-30 | 2015-01-07 | 通快机床两合公司 | Method for regulating a laser cutting process and laser cutting machine |
| CN104271307B (en) * | 2012-01-30 | 2017-04-26 | 通快机床两合公司 | Method for regulating a laser cutting process and laser cutting machine |
| CN103358023A (en) * | 2013-07-18 | 2013-10-23 | 江苏和昊激光科技有限公司 | Automatic alignment laser tailor-welding system |
| CN103878478A (en) * | 2014-01-28 | 2014-06-25 | 华中科技大学 | Three-dimensional laser machining workpiece positioning measuring device and method implemented by same |
| CN103878478B (en) * | 2014-01-28 | 2015-11-18 | 华中科技大学 | A kind of three-dimensional laser processing Workpiece fixing measurement mechanism and method thereof |
| CN103801823B (en) * | 2014-02-14 | 2017-01-18 | 中国电子科技集团公司第四十五研究所 | Wafer alignment locating device and method |
| CN103801823A (en) * | 2014-02-14 | 2014-05-21 | 中国电子科技集团公司第四十五研究所 | Wafer alignment locating device and method |
| CN106454048A (en) * | 2016-07-29 | 2017-02-22 | 大族激光科技产业集团股份有限公司 | Pseudo coaxial CCD shooting system and laser processing device employing the system |
| CN106454048B (en) * | 2016-07-29 | 2019-12-24 | 大族激光科技产业集团股份有限公司 | Pseudo-coaxial CCD shooting system and laser processing device adopting same |
| CN111168278A (en) * | 2019-12-31 | 2020-05-19 | 广东深泓智能科技有限公司 | Automatic welding machine |
| CN113458627A (en) * | 2021-08-05 | 2021-10-01 | 瑟福迪恩半导体设备技术(苏州)有限公司 | Light path dimming method of laser cutting equipment |
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| CF01 | Termination of patent right due to non-payment of annual fee |