CN112264722A - Laser micropore machining equipment and machining method suitable for thin-wall parts - Google Patents
Laser micropore machining equipment and machining method suitable for thin-wall parts Download PDFInfo
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- CN112264722A CN112264722A CN202011109250.0A CN202011109250A CN112264722A CN 112264722 A CN112264722 A CN 112264722A CN 202011109250 A CN202011109250 A CN 202011109250A CN 112264722 A CN112264722 A CN 112264722A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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Abstract
The application provides laser micropore machining equipment and a machining method suitable for thin-wall parts. The laser micropore machining equipment comprises an equipment support, a laser generating device and a composite light beam scanning head, wherein the laser generating device and the composite light beam scanning head are arranged on the equipment support, and the composite light beam scanning head comprises a double-pendulum shaft connecting mechanism, and a light translation assembly, a galvanometer scanning assembly and a focusing mirror which are sequentially arranged on the double-pendulum shaft connecting mechanism along the propagation direction of a light path. The double-pendulum shaft connecting mechanism comprises a first pendulum shaft, a second pendulum shaft and a processing shaft which are vertically connected in sequence, the first pendulum shaft is used for driving the second pendulum shaft and the processing shaft to rotate around the first pendulum shaft, and the second pendulum shaft is used for driving the processing shaft to rotate around the second pendulum shaft.
Description
Technical Field
The invention relates to the technical field of laser micropore machining, in particular to laser micropore machining equipment suitable for thin-wall parts and a machining method thereof.
Background
Compared with the traditional processing mode, the laser processing method for the micropores of the thin-wall parts mainly has the following advantages: no contact processing and no mechanical deformation; the laser beam has high energy density, high processing speed and small thermal deformation of the workpiece, and no recast layer can be realized; can process high hardness, high brittleness, high melting point materials, such as high temperature alloy, stainless steel, titanium alloy, structural steel, etc.; high production efficiency, stable and reliable processing quality and good economic benefit. The laser beam is used for processing the micropores of the thin-wall part, so that a brand new processing way is provided for the field of micropore processing.
In the field of laser micropore machining of thin-wall parts at present, common laser micropore machining equipment mainly aims at round hole machining and cannot machine special-shaped holes, such as a runway hole, a dustpan hole and the like.
The traditional micropore processing equipment for the thin-wall parts is limited by the structure and the equipment stroke, and the thin-wall parts with larger sizes cannot be processed, such as large flame tube workpieces, and the traditional laser micropore processing equipment cannot be processed.
Disclosure of Invention
The invention provides laser micropore machining equipment and a laser micropore machining method suitable for thin-wall parts, and aims to solve the problems of difficult machining of large-size thin-wall parts and difficult machining of special-shaped holes.
The invention provides laser micropore machining equipment suitable for thin-wall parts, which comprises an equipment support, a laser generating device and a composite light beam scanning head, wherein the laser generating device and the composite light beam scanning head are arranged on the equipment support;
the light translation assembly at least comprises a parallel flat plate, the parallel flat plate can rotate around a first axial direction and is used for refracting and translating light beams emitted by the laser generating device, and the first axial direction is a vertical direction;
the galvanometer scanning assembly comprises a first deflection mirror and a second deflection mirror which are arranged oppositely, the first deflection mirror can rotate around a second axial direction and reflect a received light beam to the second deflection mirror, and the second deflection mirror can rotate around a third axial direction and reflect the received light beam;
the focusing mirror is used for focusing the light beam which is converted by the parallel flat plate and the galvanometer scanning component;
the double-pendulum shaft connecting mechanism comprises a first pendulum shaft, a second pendulum shaft and a processing shaft which are sequentially connected, the first pendulum shaft is arranged along the vertical direction, the second pendulum shaft is arranged along the horizontal direction, the processing shaft is perpendicular to the second pendulum shaft, the first pendulum shaft is connected with a light translation assembly and a second pendulum shaft, a galvanometer scanning assembly and a focusing lens are respectively arranged in the second pendulum shaft and the focusing lens, the first pendulum shaft is used for driving the second pendulum shaft and the processing shaft to rotate around the first pendulum shaft, and the second pendulum shaft is used for driving the processing shaft to rotate around the second pendulum shaft.
The laser scanning device further comprises a coaxial detection assembly, wherein the coaxial detection assembly comprises a first light splitting flat plate, a first detection light reflector opposite to the first light splitting flat plate, a lens module opposite to the first detection light reflector and a detection module opposite to the lens module; the first light splitting plate is positioned on the light emitting paths of the parallel plates and used for transmitting laser beams and receiving and reflecting the beams reflected from a processing workpiece or a processing hole, the first detection light reflector is used for reflecting the reflected beams to the lens module, and the lens module is used for focusing the reflected beams; the detection module is used for imaging.
The laser scanning device further comprises a coaxial distance measuring assembly, the coaxial distance measuring assembly comprises a detection light source, a second detection light reflector and a second light splitting plate, a laser beam emitted by the detection light source is reflected to the second light splitting plate through the second detection light reflector and then enters a main light path in a coupling mode, finally, a focusing lens focuses to form a focusing light spot, the focusing light spot is scattered on the surface of a workpiece, part of scattered light returns to the main light path through the focusing lens and enters the detection light source through the reflection of the second light splitting plate, interference fringes are generated through light beam conversion, and the position of the workpiece is judged by calculating the distance between the interference fringes.
The equipment support comprises a horizontal base and an upright post, a workpiece to be processed is arranged above the horizontal base, a vertical sliding rail is arranged on the upright post, and the double-pendulum shaft connecting mechanism is arranged on the vertical sliding rail in a sliding mode.
The laser micropore machining equipment further comprises a workpiece adjusting mechanism, the workpiece adjusting mechanism comprises a first horizontal moving seat and a second horizontal moving seat, a first horizontal sliding rail is arranged on the horizontal base, the first horizontal moving seat is arranged on the first horizontal sliding rail in a sliding mode, a second horizontal sliding rail perpendicular to the first horizontal sliding rail is arranged on the first horizontal moving seat, and the second horizontal moving seat is arranged on the first horizontal moving seat in a sliding mode.
The workpiece adjusting mechanism further comprises a horizontal turntable which is arranged on the second horizontal moving seat and can rotate around the central axis of the second horizontal moving seat, and the machining workpiece is arranged on the horizontal turntable.
The invention also provides a laser micropore processing method suitable for the thin-wall part, which is used for processing the laser micropores by adopting the laser micropore processing equipment, and the laser micropore processing method comprises the following steps:
setting basic technological parameters of laser micropore machining equipment;
mounting the thin-wall part on a horizontal turntable and acquiring machine tool coordinates of all holes to be machined;
and opening the composite beam scanning head, and processing the thin-wall part according to the machine tool coordinates of all holes to be processed.
Wherein, the step of setting basic technological parameters of the laser micropore machining equipment comprises the following steps:
basic technological parameters of the laser micropore machining equipment are adjusted and set in a mode of punching holes in the flat plate sample piece.
The method comprises the following steps of installing the thin-wall part on a horizontal turntable and acquiring the machine tool coordinates of all holes to be machined, wherein the steps of installing the thin-wall part on the horizontal turntable and acquiring the machine tool coordinates of all the holes to be machined specifically comprise:
clamping the thin-wall part on a horizontal turntable, ensuring that the thin-wall part is concentric with the central point of a rotating shaft of the horizontal turntable, and establishing a coordinate system according to the central point of the rotating shaft;
dividing the thin-wall part at equal angles, rotating, measuring the positions of a plurality of points on the surface of the thin-wall part, and establishing machine tool coordinates of all measured points in the coordinate system;
fitting the contour of the thin-wall part according to the machine tool coordinates of all the measuring points, and calculating the perimeter C of the contour of the thin-wall part;
determining the arc length between the holes according to the number N of the holes to be processed, and selecting a point of the hole to be processed corresponding to the fitted thin-wall part outline as a starting point;
and acquiring the machine tool coordinates of all the holes to be processed on the fitted thin-wall part outline according to the starting point and the arc length between the holes.
In the step of machining the thin-wall part according to the machine tool coordinates of all holes to be machined, if the machining part of the laser micropore machining equipment cannot complete full-angle machining or can only machine a fixed position, the horizontal turntable drives the thin-wall part to rotate to the next hole to be machined each time for machining.
The laser micropore machining equipment suitable for the thin-wall part is provided with the composite light beam scanning head of the double-swing-shaft connecting mechanism, the composite light beam scanning head combines the transmission type rotary cutting scanning technology of the light translation component with the reflection type scanning technology of the galvanometer scanning component, the translation and the scanning of any track of the light beam are realized, and the machining of a round hole, a taper hole and a special-shaped hole can be simultaneously met; the double-pendulum shaft connecting mechanism enlarges the processing size range and the processing angle range of the composite beam scanning head, and can meet the laser micropore processing of large-size thin-wall parts.
Drawings
FIG. 1 is a perspective view of a laser micro-hole machining apparatus for thin-walled parts according to the present invention;
FIG. 2 is an optical schematic of the laser micro-via machining apparatus of FIG. 1;
FIG. 3 is an optical schematic diagram of a first deflection mirror and a second deflection mirror of the laser scanning device shown in FIG. 2;
FIG. 4 is an enlarged perspective view of the composite beam scanning head of the laser micro-via machining apparatus of FIG. 1;
FIG. 5 is an optical schematic of the composite beam scanning head of FIG. 4;
FIG. 6 is a system block diagram of a detection module;
FIG. 7 is a workpiece processing flow chart of a laser micro-hole processing method for thin-wall parts according to the present invention;
fig. 8 is a diagram illustrating a step of setting basic process parameters of the laser micro-hole machining apparatus in the laser micro-hole machining method of fig. 7.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1 to 6, the laser micro-hole machining apparatus for thin-walled parts according to the present invention includes an apparatus support, and a laser generator 1, a light path transmission component 2, a composite beam scanning head 9, a coaxial detection component 31, a coaxial distance measurement component 32, and a workpiece adjustment mechanism disposed on the apparatus support.
The equipment support comprises a horizontal base 5, a vertical column 4 and a top plate 3. Horizontal base 5 and roof 3 parallel arrangement, horizontal base 5 is connected with stand 4 is perpendicular. The upright column 4 is provided with a vertical slide rail 12 along the first axial direction Z, and the composite beam scanning head 9 is arranged on the vertical slide rail 12 in a sliding manner. Preferably, the vertical slide rails 12 are arranged in pairs at intervals, and the vertical slide rails 12 may be convex strips or sliding grooves. The composite beam scanning head 9 is slidably connected to a slide rail by a slider.
The laser generating device 1 and the optical path transmission member 2 are disposed on the top plate 13. The laser generating device 1 is used for emitting a light beam, the optical path transmission component 2 is used for shaping the light beam emitted by the laser generating device 1 and changing the direction of optical path transmission, and the light beam enters the composite light beam scanning head 9 after passing through the optical path transmission component 12. In this embodiment, the optical path transmission module 2 includes a beam expander 13, and mirrors 14, 15, and 16, which are sequentially arranged along the optical path transmission direction. The beam expander 13 adopts variable-power beam expansion, and the beam expansion multiple is adjusted according to actual processing requirements to obtain different beam diameters. In practical application, the arrangement of the optical path transmission component 2 is not limited by this embodiment, and the arrangement position and number of the reflecting mirrors are adjusted according to practical situations.
The composite beam scanning head 9 comprises a double-pendulum shaft connecting mechanism, and a light translation component 29, a galvanometer scanning component and a focusing mirror 28 which are sequentially arranged on the double-pendulum shaft connecting mechanism along the propagation direction of a light path. The galvanometer scanning assembly is mainly used for drawing a preset scanning track, and the optical translation assembly is mainly used for dynamically changing the offset of the light beam.
The optical translation assembly 29 comprises at least one parallel plate 17, the parallel plate 17 being able to rotate around a first axis, which is the vertical direction Z, and being configured to refract and translate the light beam emitted by the laser generating device 1. The light beam entering the parallel flat plate 17 generates corresponding light beam translation amount after passing through the parallel flat plate 17, different light beam offset amounts are generated by adopting parallel flat plates with different thicknesses, and finally the light beam can be incident to different positions on the focusing lens 9, so that the taper of the processed micropore is influenced. In this embodiment, the number of the parallel flat plates 17 is 1, in other embodiments, the number of the parallel flat plates may also be 2, and when the number of the parallel flat plates 17 is two, the taper change of the machining hole in the machining process may be adjusted by respectively controlling the rotation speed of the two parallel flat plates, so as to meet the requirements of machining holes of more patterns.
The galvanometer scanning assembly comprises a first deflection mirror 22 and a second deflection mirror 23 which are arranged oppositely, the first deflection mirror 22 can rotate around a second axial direction and reflect a received light beam to the second deflection mirror 23, and the second deflection mirror 23 can rotate around a third axial direction and reflect the received light beam. The focusing mirror 28 is used for focusing the light beam after being bent by the parallel flat plate 17 and the galvanometer scanning component. The second axis is the horizontal direction Y, and the third axis will be described with reference to fig. 3.
Specifically, the first deflecting mirror 22 is mounted on a first driving shaft (not shown) extending along the second axial direction Y, and the first driving shaft drives the first deflecting mirror 22 to swing within a first preset angle and reflects the light beam reflected by the reflecting mirror 21 to the second deflecting mirror 23. The second deflecting mirror 23 is mounted on a second driving shaft (not shown) extending along a third axial direction, and the second driving shaft drives the second deflecting mirror 23 to swing within a second preset angle and reflects the light beam reflected by the first deflecting mirror 22 to the focusing mirror 28; the focusing mirror 28 is used for focusing the light beam reflected by the second deflecting mirror 23. The starting vector direction of the galvanometer scanning component is the same as the starting vector direction of the parallel flat plate 17 and the two move synchronously.
In other words, the movement of the first deflection mirror 22 and the second deflection mirror 23 is related to the rotation of the parallel plate 17, the light beam passes through the reflection mirror 21 to the first deflection mirror 22 and the second deflection mirror 23 when the parallel plate 17 rotates, the light beam rotates along the optical axis of the first deflection mirror 22, the second deflection mirror 23 and the focusing mirror 28, and the light beam and the optical axis are parallel. At any moment, the light beam and the optical axis can define a plane, and the first deflection mirror 22 and the second deflection mirror 23 are required to ensure that the light beam is deflected in the plane, so that the deflection directions of the first deflection mirror 22 and the second deflection mirror 23 are strictly limited by the movement of the parallel plate 17.
In this embodiment, in an initial state, an included angle between the first deflecting mirror 22 and a horizontal direction (a plane direction perpendicular to the first axial direction Z) is 67.5 °, an included angle between the second deflecting mirror 23 and the horizontal direction is 22.5 °, an included angle between the first deflecting mirror 22 and the second deflecting mirror 23 is 45 °, the second axial direction Y is perpendicular to the first axial direction Z, the third axial direction is 22.5 ° with a horizontal direction X perpendicular to the first axial direction Z and the second axial direction Y, and the third axial direction is perpendicular to the second axial direction Y. X, Y, Z are three directions in a common three-dimensional coordinate system.
The above arrangement can minimize the occupied space of the optical elements, and at the same time, can reduce the distance between the first deflection mirror 22 and the second deflection mirror 23, reducing the machining error. In practical application, the included angle between the first deflecting mirror 22 and the second deflecting mirror 23 can be adjusted properly on the basis of a preferred scheme, for example, the included angle between the first deflecting mirror 22 and the horizontal direction can be 50-80 degrees, the included angle between the second deflecting mirror 23 and the horizontal direction is 10-40 degrees, and the requirement that the included angles between the first deflecting mirror 22 and the horizontal direction and the included angles between the second deflecting mirror 23 and the horizontal direction are complementary is met.
In practical applications, the first deflection mirror 22 and the second deflection mirror 23 may be arranged in other manners. For example, in the initial state, the included angle between the first deflecting mirror 22 and the horizontal direction is 45 °, the included angle between the second deflecting mirror 23 and the horizontal direction is 45 °, the first deflecting mirror 22 and the second deflecting mirror 23 are parallel to each other, the second axial direction Y is perpendicular to the third axial direction and both are located in the horizontal direction, and at this time, the third axial direction is the horizontal direction X; the starting vector direction of the galvanometer scanning component is opposite to the starting vector direction of the parallel flat plate 17 and the two move synchronously. Or, the included angle between the first deflecting mirror 7 and the second deflecting mirror 8 can be adjusted properly on the basis of the preferred scheme, for example, the included angle between the first deflecting mirror 7 and the horizontal direction can be between 50 to 80 degrees, the included angle between the second deflecting mirror and the horizontal direction is 10 to 40 degrees, and the like, and it is sufficient that the included angles between the first deflecting mirror and the horizontal direction are complementary.
In the technical scheme of the application, when the first deflection mirror 22 and the second deflection mirror 23 rotate to any position, the corresponding parallel flat plate 17 can determine the only position through rotation, and then the maximum machining taper is obtained. The rotating speed of the whole system is determined by the rotating speed of the parallel flat plate 17, and in the moving process, the parallel flat plate 17 and the galvanometer scanning component rotate synchronously.
The double-pendulum shaft connecting mechanism comprises a first pendulum shaft, a second pendulum shaft 30, a processing shaft 33 and an air nozzle assembly 34 which are connected in sequence. The first swing shaft is arranged along the vertical direction, the second swing shaft 30 is arranged along the horizontal direction, the processing shaft 33 is perpendicular to the second swing shaft 30, the first swing shaft is connected with the optical translation assembly 29 and the second swing shaft 30, the galvanometer scanning assembly and the focusing mirror 28 are respectively arranged in the second swing shaft 30 and the focusing mirror 28, the first swing shaft is used for driving the second swing shaft 30 and the processing shaft 33 to rotate around the first swing shaft, and the second swing shaft 30 is used for driving the processing shaft 33 to rotate around the second swing shaft 30.
The device is mainly characterized in that a composite beam scanning head is adopted, the advantages of a transmission type rotary cutting scanning technology and a reflection type scanning technology are combined, the translation of a beam and the scanning of any track are realized simultaneously, the processing of circular holes and special-shaped holes such as runway holes and dustpan holes can be simultaneously met, and the processing of forward cones, reverse cones and non-taper holes can be realized. The advantage is obvious in the aspect of the processing of special hole shape, for example contain the stack of special-shaped hole and round hole in the course of working of dustpan hole, and the one shot forming in dustpan hole can be realized through the real-time change and the layering scanning of scanning orbit in the course of working for efficiency is higher, avoids causing the hole shape deviation because positioning error.
In the present application, the double-swing-axis spatial optical path transmission positioning technology of the light beam composite light beam scanning head 9 mainly includes two rotation axes with rotation centers arranged orthogonally, a focusing mirror 28, an air nozzle assembly 34, and the like, and is one of the core modules for realizing 3D laser processing. Safe, high-precision and high-reliability processing of thin-wall parts is realized through high-precision positioning of double rotating shafts and a focus space detection technology.
The air nozzle assembly 34 is adapted according to the focal length of the focusing lens, and has the main function of removing fine dust generated during processing in time so as not to shield the laser beam.
The coaxial detection assembly 31 mainly realizes real-time detection of the punching effect in the machining process, and adjusts corresponding technological parameters according to the punching effect. Specifically, the coaxial detection assembly 31 includes a light splitting plate 24, a detection light reflector 25 opposite to the light splitting plate 24, a lens module 26 opposite to the detection light reflector 25, and a detection module 27 opposite to the lens module 26, where the light splitting plate 24 is located on a light exit path of the second deflecting mirror 23 and is used for transmitting a laser processing beam and receiving and reflecting a beam reflected from a processing workpiece or a processing hole, the detection light reflector 25 is used for reflecting the reflected beam to the lens module 26, the lens module 26 is used for focusing the detection beam, and the detection module 27 is used for imaging. From the optical realization functional principle, the focusing lens 28 is an objective lens of a coaxial detection assembly, the lens module 26 is an eyepiece lens of the coaxial detection assembly, the beam splitter plate 24 separates an imaging beam from a laser processing beam, the main principle is that the laser beam and a workpiece generate visible light under the action of the laser beam, the visible light enters a main light path through the objective lens 28, the visible light is separated by the beam splitter plate 24 and enters the eyepiece lens 26, and finally a clear image is formed at the detection module 27.
Further, as shown in fig. 6, the detection module 27 includes an image detector 270 and a correction device 271, wherein the image detector 270 is used for imaging, and the correction device 271 is used for learning the offset of the laser beam spot relative to the target position and correcting the position of the spot in real time according to the learning result. The correction device 271 may be constituted by a computer having a processor and a storage section.
In order to learn the offset of the light spot relative to the target position, in the present embodiment, the laser micro-hole machining apparatus repeatedly executes a trial machining program to try laser micro-hole machining, and the correction device jointly learns the position of the light spot during the machining process and the change condition of the micro-hole during the laser machining process to obtain an initial learning result, where the initial learning result may be an initial sample of the offset of the light spot relative to the target position.
Further, the correction device 271 specifically includes a recording module 50 and an executing module 51. The recording module 50 is used for recording the position of the light spot in real time, and the executing module 51 is used for predicting the offset of the light spot at the t +1 moment relative to the target position according to the initial learning result and the position of the light spot at the t moment, and correcting the position of the light spot at the t +1 moment according to the predicted offset, so that the light spot correction efficiency and accuracy are improved, and the processing quality of the micropore is ensured.
The coaxial distance measurement assembly 32 comprises a detection light source 20, a detection light reflector 19 and a light splitting plate 18, and the main principle is that a laser beam is emitted by the detection light source 20, the laser beam is reflected to the light splitting plate 18 through the detection light reflector 19 and coupled into a main light path, and is finally focused by a focusing mirror 28 to form a focusing light spot, the focusing light spot is scattered on the surface of a workpiece, part of the scattered light returns to the main light path through the focusing mirror, is reflected to the detection light source through the light splitting plate 18, interference fringes are generated through light beam conversion, and the position of the workpiece can be judged by calculating the distance between the.
The coaxial distance measurement can directly carry out focus compensation after the distance measurement, the single-hole single measurement is convenient and fast, the coordinate conversion between the paraxial distance measurement and the machining head in the machining process is avoided, the machining efficiency can be greatly increased, the volume of the machining head is reduced, and the machining range is enlarged.
The workpiece adjusting mechanism comprises a first horizontal moving seat 6, a second horizontal moving seat 7 and a horizontal rotary table 8, a first horizontal sliding rail 10 is arranged on the horizontal base 5, the first horizontal moving seat 6 is arranged on the first horizontal sliding rail 10 in a sliding mode, a second horizontal sliding rail 11 perpendicular to the first horizontal sliding rail 10 is arranged on the first horizontal moving seat 6, and the second horizontal moving seat 7 is arranged on the first horizontal moving seat 6 in a sliding mode. The horizontal rotary table 8 is arranged on the second horizontal moving seat 7 and can rotate around the central axis C thereof, and the processing workpiece is arranged on the horizontal rotary table 8.
The laser micropore machining equipment adopts a six-axis mode, the first horizontal moving seat 6, the second horizontal moving seat 7 and the horizontal rotary table 8 control the positioning of a machined workpiece, and the light beam composite light beam scanning head 9 which can move along the vertical direction, the scanning galvanometer component and the focusing mirror 28 which rotate around the axis A and the focusing mirror 28 which rotate around the axis B control the space conduction positioning of a laser beam. The traditional processing head does not have double swing shafts, the deflection of light beams in the direction of a space position cannot be realized, the double swing shaft structure of the light beam composite light beam scanning head 9 is larger in space adjustment position compared with the traditional processing head, the space movement range of the whole equipment is wide, and the processing of large-scale thin-wall parts can be realized.
The movement of the light beam composite light beam scanning head 9, the first horizontal moving seat 6 and the second horizontal moving seat 7 along the Z axis, the Y axis and the X axis in the plane rectangular coordinate system can adopt a servo motor to drive a lead screw through a coupler to control the movement of three linear axes. The horizontal rotary table 8 can adopt a rotary worktable with higher precision to realize the rotation of the workpiece on the worktable.
Compared with the prior art, the laser micropore machining equipment suitable for the thin-wall part is provided with the composite light beam scanning head of the double-swing-shaft connecting mechanism, the composite light beam scanning head combines the transmission type rotary cutting scanning technology of the light translation component with the reflection type scanning technology of the galvanometer scanning component, the translation and the scanning of any track of the light beam are realized, and the machining of a round hole, a taper hole and a special-shaped hole can be simultaneously met; the double-pendulum shaft connecting mechanism enlarges the processing size range and the processing angle range of the composite light beam scanning head, can meet the requirement of laser micropore processing of large-size thin-wall parts, and simultaneously corrects the offset of light spots in real time by utilizing the detection module, thereby improving the processing quality of micropores.
In addition, the invention also provides a laser micropore machining method suitable for the thin-wall part, and the laser micropore machining equipment is adopted to machine the laser micropore.
Referring to fig. 7 and 8 together, the laser micro-hole machining method includes:
s10, setting basic technological parameters of the laser micropore machining equipment;
s20, mounting the thin-wall parts on the horizontal turntable and acquiring the machine tool coordinates of all holes to be processed;
and S30, starting the composite beam scanning head, and machining the thin-wall part according to the machine tool coordinates of all holes to be machined.
In step S10, before processing the workpiece, it is necessary to ensure that the equipment operates normally and to set basic process parameters, and the basic process parameters are mainly ensured by punching holes on the flat plate sample. Then the workpiece is installed, the workpiece and the horizontal turntable are required to be coaxial during installation, the coaxiality of the workpiece and the horizontal turntable is mainly ensured by means of a magnetic force meter, the installation reference surface of the workpiece and the tool are mainly ensured to be coaxial between the tool and the workpiece,
the device can not avoid the deformation of the workpiece, especially the processing of cylindrical thin-wall parts, so the positioning of the workpiece is very important, and the device adopts a six-point positioning mode aiming at the positioning of small complex curved surfaces and adopts a self-adaptive compensation positioning mode for workpieces such as large flame tubes and the like to realize the final positioning of the workpiece.
Specifically, the self-adaptive compensation method can solve the technical problem that in the prior art, deviation exists between the equal-angle distribution positioning position and the actual position of the deformed thin-wall part. When the adaptive compensated positioning method is adopted, step S20 at least includes:
s21, clamping the thin-wall part on a horizontal turntable, ensuring the thin-wall part to be concentric with the central point of a rotating shaft of the horizontal turntable, and establishing a coordinate system according to the central point of the rotating shaft;
s22, dividing the thin-wall part at equal angles, rotating, measuring the positions of a plurality of points on the surface of the thin-wall part, and establishing machine coordinates of all measured points in the coordinate system;
s23, fitting the contour of the thin-wall part according to the machine tool coordinates of all the measuring points, and calculating the perimeter C of the contour of the thin-wall part;
s24, determining the arc length between the holes according to the number N of the holes to be processed, and selecting a point of the thin-wall part outline corresponding to the fit of one hole to be processed as a starting point;
and S25, acquiring the machine tool coordinates of all holes to be processed on the fitted thin-wall part contour according to the starting point and the arc length between the holes.
Preferably, in step S22, the position of the point on the surface of the thin-walled part may be measured by a distance measuring sensor or a standard gauge.
Preferably, in step S24, if the holes to be processed are uniformly distributed, the perimeter of the fitted thin-wall part profile is divided into N equal arc lengths L1 according to the number N of the holes to be processed, and the arc lengths are equal
Preferably, in step S24, if the holes to be machined are unevenly distributed, the perimeter of the contour of the thin-walled part to be fitted is divided into N unequal arc lengths L2 according to calculation.
Regarding step S30, if the machining portion of the machine tool can complete full-angle machining, the thin-walled part does not need to be driven to rotate by the rotating shaft, and the machining is directly performed according to the machine tool coordinates of the hole to be machined; if the machining part of the machine tool can not complete full-angle machining or can only process a fixed position, the thin-wall part is required to be driven to rotate by a certain angle through the rotating shaft every time to complete machining (the horizontal turntable drives the thin-wall part to rotate to the next hole to be machined every time to complete machining). The rotation angle is connected with the origin of the coordinate system to form a straight line L3 according to the coordinates of the current processing hole site, the coordinates of the machine tool of the next hole site to be processed is connected with the origin of the coordinate system to form a straight line L4, and the included angle between the straight lines L3 and L4 is the rotation angle of the rotation shaft.
In step S30, when the workpiece is processed, the composite beam scanning head is started, the laser generator emits light and converges on the surface of the workpiece, and the processing air blowing is started to start processing the workpiece, and after the scanning of the current layer number is finished, the processing head feeds into the next layer, and when the current scanning layer number reaches the target layer number, the scanning is stopped, that is, the hole processing is finished.
In general, after a plurality of front holes are machined on a workpiece, inspection is needed to ensure that the hole shape, the hole diameter and the like are controlled within a required range, and under the condition that the requirements of the front holes are met, next hole type machining is directly carried out, and the punching effect is detected through a coaxial detection assembly in the process.
Meanwhile, an auxiliary system is required to be added in the processing process and mainly comprises a light path protection system, an auxiliary blowing system and a dust removal system. In the processing process, the processing area can produce smoke and dust, and in order to ensure the punching effect, it is necessary to increase the light path protection in the light path to ensure the stability of the light path. The laser acts on the surface of a workpiece to form metal residues, in order to ensure the punching effect, processing blowing is required to be added, and compressed air, nitrogen, argon and other gases are selected as common gas sources. The auxiliary system also comprises a dust removal device, and because the processing area can form large smoke in the processing process, in order to ensure the processing effect, the dust removal device is required to be arranged to remove the smoke in the processing area, and the cleanness of the processing area is ensured.
And finally, checking and disassembling the workpiece or replacing the workpiece. The workpiece inspection mainly aims at detecting the hole shape, the hole diameter and the like, a plug gauge is selected for detecting the hole diameter, and the hole diameter tolerance is controlled within a required range.
The above embodiments are merely illustrative of one or more embodiments of the present invention, and the description is specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The laser micropore machining equipment is characterized by comprising an equipment support, a laser generating device and a composite light beam scanning head, wherein the laser generating device and the composite light beam scanning head are arranged on the equipment support;
the light translation assembly at least comprises a parallel flat plate, the parallel flat plate can rotate around a first axial direction and is used for refracting and translating light beams emitted by the laser generating device, and the first axial direction is a vertical direction;
the galvanometer scanning assembly comprises a first deflection mirror and a second deflection mirror which are arranged oppositely, the first deflection mirror can rotate around a second axial direction and reflect a received light beam to the second deflection mirror, and the second deflection mirror can rotate around a third axial direction and reflect the received light beam;
the focusing mirror is used for focusing the light beam which is converted by the parallel flat plate and the galvanometer scanning component;
the double-pendulum shaft connecting mechanism comprises a first pendulum shaft, a second pendulum shaft and a processing shaft which are sequentially connected, the first pendulum shaft is arranged along the vertical direction, the second pendulum shaft is arranged along the horizontal direction, the processing shaft is perpendicular to the second pendulum shaft, the first pendulum shaft is connected with a light translation assembly and a second pendulum shaft, a galvanometer scanning assembly and a focusing lens are respectively arranged in the second pendulum shaft and the focusing lens, the first pendulum shaft is used for driving the second pendulum shaft and the processing shaft to rotate around the first pendulum shaft, and the second pendulum shaft is used for driving the processing shaft to rotate around the second pendulum shaft.
2. The laser micropore machining apparatus according to claim 1, wherein the laser scanning device further comprises a coaxial detection assembly, the coaxial detection assembly comprising a first beam splitting plate, a first detection light reflector opposite to the first beam splitting plate, a lens module opposite to the first detection light reflector, and a detection module opposite to the lens module; the first light splitting plate is positioned on the light emitting paths of the parallel plates and used for transmitting laser beams and receiving and reflecting the beams reflected from a processing workpiece or a processing hole, the first detection light reflector is used for reflecting the reflected beams to the lens module, and the lens module is used for focusing the reflected beams; the detection module is used for imaging.
3. The laser micropore machining device according to claim 2, wherein the laser scanning device further comprises a coaxial distance measuring component, the coaxial distance measuring component comprises a detection light source, a second detection light reflector and a second light splitting plate, a laser beam emitted by the detection light source is reflected by the second detection light reflector to the second light splitting plate to be coupled into the main light path, and is finally focused by the focusing mirror to form a focusing light spot, the focusing light spot is scattered on the surface of the workpiece, part of the scattered light returns to the main light path through the focusing mirror, and is reflected by the second light splitting plate to enter the detection light source, interference fringes are generated through light beam transformation, and the position of the workpiece is judged by calculating the distance between the interference fringes.
4. The laser micropore machining device of claim 1, wherein the device support comprises a horizontal base and a vertical column, the workpiece to be machined is arranged above the horizontal base, a vertical slide rail is arranged on the vertical column, and the double-swing shaft connecting mechanism is slidably arranged on the vertical slide rail.
5. The laser micropore machining device of claim 4, further comprising a workpiece adjusting mechanism, wherein the workpiece adjusting mechanism comprises a first horizontal moving seat and a second horizontal moving seat, a first horizontal sliding rail is arranged on the horizontal base, the first horizontal moving seat is slidably arranged on the first horizontal sliding rail, a second horizontal sliding rail perpendicular to the first horizontal sliding rail is arranged on the first horizontal moving seat, and the second horizontal moving seat is slidably arranged on the first horizontal moving seat.
6. The laser micropore machining apparatus of claim 5, wherein the workpiece adjusting mechanism further comprises a horizontal turntable disposed on the second horizontal movable base and capable of rotating about a central axis thereof, the machining workpiece being disposed on the horizontal turntable.
7. A laser micro-hole machining method for thin-walled parts, which machines laser micro-holes using the laser micro-hole machining apparatus of claim 6, wherein the laser micro-hole machining method comprises:
setting basic technological parameters of laser micropore machining equipment;
mounting the thin-wall part on a horizontal turntable and acquiring machine tool coordinates of all holes to be machined;
and opening the composite beam scanning head, and processing the thin-wall part according to the machine tool coordinates of all holes to be processed.
8. The laser micro-via machining method of claim 7, wherein the step of setting basic process parameters of the laser micro-via machining apparatus comprises:
basic technological parameters of the laser micropore machining equipment are adjusted and set in a mode of punching holes in the flat plate sample piece.
9. The laser micro-hole machining method according to claim 7, wherein the step of mounting the thin-walled part on a horizontal turntable and acquiring machine coordinates of all holes to be machined specifically comprises:
clamping the thin-wall part on a horizontal turntable, ensuring that the thin-wall part is concentric with the central point of a rotating shaft of the horizontal turntable, and establishing a coordinate system according to the central point of the rotating shaft;
dividing the thin-wall part at equal angles, rotating, measuring the positions of a plurality of points on the surface of the thin-wall part, and establishing machine tool coordinates of all measured points in the coordinate system;
fitting the contour of the thin-wall part according to the machine tool coordinates of all the measuring points, and calculating the perimeter C of the contour of the thin-wall part;
determining the arc length between the holes according to the number N of the holes to be processed, and selecting a point of the hole to be processed corresponding to the fitted thin-wall part outline as a starting point;
and acquiring the machine tool coordinates of all the holes to be processed on the fitted thin-wall part outline according to the starting point and the arc length between the holes.
10. The laser micro-hole machining method according to claim 7, wherein in the step of machining the thin-wall part according to the machine tool coordinates of all the holes to be machined, if the machining part of the laser micro-hole machining equipment cannot complete full-angle machining or can only machine a fixed position, the thin-wall part is driven to rotate to the next hole to be machined by the horizontal turntable each time for machining.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113465533A (en) * | 2021-06-23 | 2021-10-01 | 中国科学院长春光学精密机械与物理研究所 | Non-contact optical profile measuring method and device |
| CN113798664A (en) * | 2021-10-12 | 2021-12-17 | 山东大学 | Processing device and method for surface treatment of non-stick pan |
| CN114211140A (en) * | 2021-11-26 | 2022-03-22 | 中国科学院西安光学精密机械研究所 | Light beam pointing adjusting method for laser double swing shafts |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5760951A (en) * | 1992-09-01 | 1998-06-02 | Arthur Edward Dixon | Apparatus and method for scanning laser imaging of macroscopic samples |
| US20120200832A1 (en) * | 2009-10-15 | 2012-08-09 | Nec Corporation | Image projection device, image protection method, distance measuring device and distance measuring method |
| CN102699526A (en) * | 2012-06-01 | 2012-10-03 | 苏州德龙激光有限公司 | Method and device for cutting machined object by using laser |
| CN103111765A (en) * | 2013-03-20 | 2013-05-22 | 江苏扬力数控机床有限公司 | Three-dimensional laser cutting machine with four-axis-linkage secondary laser head driving device |
| CN105643110A (en) * | 2014-11-14 | 2016-06-08 | 大族激光科技产业集团股份有限公司 | Precise laser cutting system |
| CN107030379A (en) * | 2016-02-03 | 2017-08-11 | 中国科学院西安光学精密机械研究所 | Laser processing head, laser processing device and processing method thereof |
| CN108180851A (en) * | 2017-12-22 | 2018-06-19 | 中国航空工业集团公司北京航空精密机械研究所 | A kind of five axis image measuring devices for being used to measure air film hole morpheme parameter |
| CN108286936A (en) * | 2017-04-18 | 2018-07-17 | 北京理工大学 | Laser micro/nano processes differential confocal on-line monitoring integral method and device |
| CN108480841A (en) * | 2018-02-01 | 2018-09-04 | 西安中科微精光子制造科技有限公司 | Optical beam scanning system and beam scanning method for laser micropore processing |
| CN208019649U (en) * | 2018-02-08 | 2018-10-30 | 西安中科微精光子制造科技有限公司 | It is a kind of to penetrate monitoring system for the laser processing of hollow blade air film hole |
| CN108827595A (en) * | 2018-03-12 | 2018-11-16 | 西安应用光学研究所 | Detection device based on adaptation theory optical system mismachining tolerance |
| CN110695523A (en) * | 2019-06-19 | 2020-01-17 | 西安中科微精光子制造科技有限公司 | Laser scanning device |
| CN110695521A (en) * | 2019-06-04 | 2020-01-17 | 西安中科微精光子制造科技有限公司 | Light beam scanning system for laser micropore machining |
| CN111098026A (en) * | 2019-12-19 | 2020-05-05 | 中国科学院西安光学精密机械研究所 | Light beam deflection self-compensation system and method of laser double-pendulum-axis machining head |
| CN111283478A (en) * | 2020-05-13 | 2020-06-16 | 西安中科微精光子制造科技有限公司 | Self-adaptive positioning method for machining of similar rotary parts |
-
2020
- 2020-10-16 CN CN202011109250.0A patent/CN112264722A/en not_active Withdrawn
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5760951A (en) * | 1992-09-01 | 1998-06-02 | Arthur Edward Dixon | Apparatus and method for scanning laser imaging of macroscopic samples |
| US20120200832A1 (en) * | 2009-10-15 | 2012-08-09 | Nec Corporation | Image projection device, image protection method, distance measuring device and distance measuring method |
| CN102699526A (en) * | 2012-06-01 | 2012-10-03 | 苏州德龙激光有限公司 | Method and device for cutting machined object by using laser |
| CN103111765A (en) * | 2013-03-20 | 2013-05-22 | 江苏扬力数控机床有限公司 | Three-dimensional laser cutting machine with four-axis-linkage secondary laser head driving device |
| CN105643110A (en) * | 2014-11-14 | 2016-06-08 | 大族激光科技产业集团股份有限公司 | Precise laser cutting system |
| CN107030379A (en) * | 2016-02-03 | 2017-08-11 | 中国科学院西安光学精密机械研究所 | Laser processing head, laser processing device and processing method thereof |
| CN108286936A (en) * | 2017-04-18 | 2018-07-17 | 北京理工大学 | Laser micro/nano processes differential confocal on-line monitoring integral method and device |
| CN108180851A (en) * | 2017-12-22 | 2018-06-19 | 中国航空工业集团公司北京航空精密机械研究所 | A kind of five axis image measuring devices for being used to measure air film hole morpheme parameter |
| CN108480841A (en) * | 2018-02-01 | 2018-09-04 | 西安中科微精光子制造科技有限公司 | Optical beam scanning system and beam scanning method for laser micropore processing |
| CN208019649U (en) * | 2018-02-08 | 2018-10-30 | 西安中科微精光子制造科技有限公司 | It is a kind of to penetrate monitoring system for the laser processing of hollow blade air film hole |
| CN108827595A (en) * | 2018-03-12 | 2018-11-16 | 西安应用光学研究所 | Detection device based on adaptation theory optical system mismachining tolerance |
| CN110695521A (en) * | 2019-06-04 | 2020-01-17 | 西安中科微精光子制造科技有限公司 | Light beam scanning system for laser micropore machining |
| CN110695523A (en) * | 2019-06-19 | 2020-01-17 | 西安中科微精光子制造科技有限公司 | Laser scanning device |
| CN111098026A (en) * | 2019-12-19 | 2020-05-05 | 中国科学院西安光学精密机械研究所 | Light beam deflection self-compensation system and method of laser double-pendulum-axis machining head |
| CN111283478A (en) * | 2020-05-13 | 2020-06-16 | 西安中科微精光子制造科技有限公司 | Self-adaptive positioning method for machining of similar rotary parts |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113465533A (en) * | 2021-06-23 | 2021-10-01 | 中国科学院长春光学精密机械与物理研究所 | Non-contact optical profile measuring method and device |
| CN113465533B (en) * | 2021-06-23 | 2022-04-22 | 中国科学院长春光学精密机械与物理研究所 | Non-contact optical profile measuring method and device |
| CN113798664A (en) * | 2021-10-12 | 2021-12-17 | 山东大学 | Processing device and method for surface treatment of non-stick pan |
| CN113798664B (en) * | 2021-10-12 | 2022-06-14 | 山东大学 | Processing device and method for treating inner surface of non-stick pan |
| CN114211140A (en) * | 2021-11-26 | 2022-03-22 | 中国科学院西安光学精密机械研究所 | Light beam pointing adjusting method for laser double swing shafts |
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