CN208450830U - A kind of laser surface micromachining device quickly focused with CCD - Google Patents
A kind of laser surface micromachining device quickly focused with CCD Download PDFInfo
- Publication number
- CN208450830U CN208450830U CN201820141430.9U CN201820141430U CN208450830U CN 208450830 U CN208450830 U CN 208450830U CN 201820141430 U CN201820141430 U CN 201820141430U CN 208450830 U CN208450830 U CN 208450830U
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- guide rail
- slide block
- rail slide
- mobile platform
- reflecting mirror
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Abstract
Focus centering excessively cumbersome problem when the utility model is directed to Laser Micro-Machining, provides a kind of laser surface micromachining device quickly focused with CCD.It include: marble support plate 1, marble pedestal 2, laser 3, guide rail slide block 1, guide rail slide block 2 42, guide rail slide block 3 43, guide rail slide block 4 44, guide rail slide block 5 45, guide rail slide block 6 46, reflecting mirror 1, reflecting mirror 2 52 and reflecting mirror 3 53, CCD camera 6, dichroscope 7, beam expanding lens 8, focus lamp 9, annular LED light source 10, XY axis mobile platform 11 and Z axis mobile platform 12.It is characterized in that: reflecting mirror 3 53, CCD camera 6, dichroscope 7 and Z axis mobile platform 12 are mounted in marble support plate 1, reflecting mirror 1, reflecting mirror 2 52, laser 3 and XY axis mobile platform 11 are mounted on marble pedestal 2, and beam expanding lens 8 and focus lamp 9 are mounted on Z axis mobile platform 12.XY axis mobile platform 11, Z axis mobile platform 12 and CCD camera 6 are controlled by PC.
Description
Technical field
The present invention relates to laser micro-machining technologies, and in particular to a kind of laser surface micro Process quickly focused using CCD
Device.
Background technique
Laser micro-machining technology has many advantages, such as, such as non-contact technique, heat-affected zone is small, high-precision, high-repetition-rate, energy
Enough realize Flexible Manufacture etc..The characteristics of its " direct write " is processed simplifies technique, realizes the quick manufacture of micromachine.Therefore,
Laser Micro-Machining has a wide range of applications in industry manufacture.
There are many technological parameters for influencing laser assisted microprocessing quality, and wherein defocusing amount is also an important parameter, i.e.,
Laser spot after focusing has a great impact to processing efficiency and processing quality at a distance from workpiece surface.Currently commonly look for
The method of positive laser spot be beat keyhole or lines near focal point with laser, then more resulting keyhole or lines size or
Thickness is to obtain the position of focus, and this method needs constantly test and error is big.
Utility model content
For the excessively cumbersome problem of existing centering of the laser surface micro Process equipment for laser spot, the utility model
A kind of laser surface micromachining device quickly focused with CCD is provided.
The technical solution of the utility model is as follows:
A kind of laser surface micromachining device specifically includes that marble support plate 1, marble pedestal 2, laser 3, leads
Rail sliding block 1, guide rail slide block 2 42, guide rail slide block 3 43, guide rail slide block 4 44, guide rail slide block 5 45, guide rail slide block 6 46,
Reflecting mirror 1, reflecting mirror 2 52 and reflecting mirror 3 53, CCD camera 6, dichroscope 7, beam expanding lens 8, focus lamp 9, annular LED
Light source 10, XY axis mobile platform 11 and Z axis mobile platform 12.It is characterized in that: the marble support plate 1 and marble pedestal 2
Make laser by the threaded hole in the marble support plate 1 and marble pedestal 2 for the rack of package unit, move
Moving platform and each component can location and installation in marble support plate 1 and marble pedestal 2.Wherein, XY axis mobile platform 11
The front and rear sides of marble support plate 1 are separately mounted to laser 3, by the side of marble support plate 1 open one compared with
Big circular through hole enables the laser beam issued from laser 3 to conduct by mirror assembly to marble support plate 1
Front side, recycle the successive effect of several secondary reflections of reflecting mirror, beam expanding lens 8 and focus lamp 9 that hot spot is made to focus on the shifting of XY axis
On the workbench of moving platform 11, to be processed.Guide rail slide block is to navigate to mounting surface by threaded fastener, wherein
Guide rail slide block 1 and guide rail slide block 2 42 are separately mounted to the front and rear sides on marble pedestal 2, guide rail slide block 3 43, guide rail
Sliding block 4 44 and guide rail slide block 5 45 are installed in marble support plate 1, and guide rail slide block 6 46 is installed on Z axis mobile platform 12
On.Reflecting mirror 1, reflecting mirror 2 52 and reflecting mirror 3 53, CCD camera 6, dichroscope 7, beam expanding lens 8 and focus lamp 9 are all
It is mounted on guide rail slide block by threaded fastener.XY axis mobile platform 11, Z axis mobile platform 12 and CCD camera 6 are controlled by PC
System realizes the displacement of three axis mobile platforms, the work for seeking coke, laser of CCD camera by manual operation PC.
The advantages of the utility model are as follows:
(1) apparatus structure of the laser processing is flexible, is conveniently replaceable accessory.
(2) movement of tri- axis of XYZ and the working condition of laser are controlled by computer control system, while benefit
The position of focus is found, with CCD camera to meet the required required precision of processing.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.
As shown in the figure.
A kind of laser surface micromachining device specifically includes that marble support plate 1, marble pedestal 2, laser 3, leads
Rail sliding block 1, guide rail slide block 2 42, guide rail slide block 3 43, guide rail slide block 4 44, guide rail slide block 5 45, guide rail slide block 6 46,
Reflecting mirror 1, reflecting mirror 2 52 and reflecting mirror 3 53, CCD camera 6, dichroscope 7, beam expanding lens 8, focus lamp 9, annular LED
Light source 10, XY axis mobile platform 11 and Z axis mobile platform 12.It is characterized in that: the marble support plate 1 and marble pedestal 2
Make laser by the threaded hole in the marble support plate 1 and marble pedestal 2 for the rack of package unit, move
Moving platform and each component can location and installation in marble support plate 1 and marble pedestal 2.Wherein, XY axis mobile platform 11
The front and rear sides of marble support plate 1 are separately mounted to laser 3, by the side of marble support plate 1 open one compared with
Big circular through hole enables the laser beam issued from laser 3 to conduct by mirror assembly to marble support plate 1
Front side, recycle the successive effect of several secondary reflections of reflecting mirror, beam expanding lens 8 and focus lamp 9 that hot spot is made to focus on the shifting of XY axis
On the workbench of moving platform 11, to be processed.Guide rail slide block is to navigate to mounting surface by threaded fastener, wherein
Guide rail slide block 1 and guide rail slide block 2 42 are separately mounted to the front and rear sides on marble pedestal 2, guide rail slide block 3 43, guide rail
Sliding block 4 44 and guide rail slide block 5 45 are installed in marble support plate 1, and guide rail slide block 6 46 is installed on Z axis mobile platform 12
On.Reflecting mirror 1, reflecting mirror 2 52 and reflecting mirror 3 53, CCD camera 6, dichroscope 7, beam expanding lens 8 and focus lamp 9 are all
It is mounted on guide rail slide block by threaded fastener.XY axis mobile platform 11, Z axis mobile platform 12 and CCD camera 6 are controlled by PC
System realizes the displacement of three axis mobile platforms, the work for seeking coke, laser of CCD camera by manual operation PC.
The course of work:
When laser surface micro Process, clamping workpiece is in the laser on XY axis mobile platform 11, from 1 rear of marble support plate
The laser beam that device 3 issues is first through changing conduction orientation under the action of reflecting mirror 1, across the circle of marble support plate 1
The front side of shape through-hole arrival marble support plate 1.Similarly, laser beam using reflecting mirror 2 52 and reflecting mirror 3 53, two to
The effect of Look mirror 7, beam expanding lens 8 and focus lamp 9 focuses on it on workpiece of XY axis mobile platform 11.The laser is micro- to be added
When work device initialization, the test of keyhole and lines is got by laser, adjusting CCD camera focal length makes itself and focal position of laser
It is overlapped, obtains workpiece clear image, and the focal length of fixed CCD camera at this time.It is first thick for different workpiece surfaces when processing
The position for adjusting Z axis relatively clear to workpiece image, then auto-focusing program is executed by the end PC, Z axis is adjusted with fixed step-length
The up and down motion of mobile platform acquires several workpiece images, clearest picture position is compared by image processing techniques, i.e.,
For focus.Mobile Z axis realizes the micro Process of workpiece surface to herein.
Claims (1)
1. a kind of laser surface micromachining device quickly focused with CCD, specifically includes that marble support plate (1), marble
Pedestal (2), laser (3), guide rail slide block one (41), guide rail slide block two (42), guide rail slide block three (43), guide rail slide block four
(44), guide rail slide block five (45), guide rail slide block six (46), reflecting mirror one (51), reflecting mirror two (52) and reflecting mirror three (53),
CCD camera (6), dichroscope (7), beam expanding lens (8), focus lamp (9), annular LED light source (10), XY axis mobile platform (11) and
Z axis mobile platform (12), it is characterized in that: the marble support plate (1) and marble pedestal (2) they are the rack of package unit,
By the threaded hole on the marble support plate (1) and marble pedestal (2), make laser, mobile platform and each group
Part can location and installation in marble support plate (1) and marble pedestal (2)；Wherein, XY axis mobile platform (11) and laser
Device (3) is separately mounted to the front and rear sides of marble support plate (1), by the side of marble support plate (1) open one compared with
Big circular through hole enables the laser beam issued from laser (3) to conduct by reflecting mirror to marble support plate (1)
Front side, recycle the successive effect of several secondary reflections of reflecting mirror, beam expanding lens (8) and focus lamp (9) that hot spot is made to focus on XY
On the workbench of axis mobile platform (11), to be processed；Guide rail slide block is to navigate to mounting surface by threaded fastener,
Wherein, guide rail slide block one (41) and guide rail slide block two (42) are separately mounted to the front and rear sides on marble pedestal (2) panel, lead
Rail sliding block three (43), guide rail slide block four (44) and guide rail slide block five (45) are installed on marble support plate (1), guide rail slide block
Six (46) are installed on Z axis mobile platform (12)；Reflecting mirror one (51), reflecting mirror two (52) and reflecting mirror three (53), CCD camera
(6), dichroscope (7), beam expanding lens (8) and focus lamp (9) are mounted on guide rail slide block by threaded fastener；XY axis moves
Moving platform (11), Z axis mobile platform (12) and CCD camera (6) are controlled by PC, realize XY axis mobile platform by manual operation PC
(11) and the displacement of Z axis mobile platform (12), CCD camera (6) seek burnt, laser (3) work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820141430.9U CN208450830U (en) | 2018-01-22 | 2018-01-22 | A kind of laser surface micromachining device quickly focused with CCD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820141430.9U CN208450830U (en) | 2018-01-22 | 2018-01-22 | A kind of laser surface micromachining device quickly focused with CCD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208450830U true CN208450830U (en) | 2019-02-01 |
Family
ID=65141197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820141430.9U Expired - Fee Related CN208450830U (en) | 2018-01-22 | 2018-01-22 | A kind of laser surface micromachining device quickly focused with CCD |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208450830U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112828467A (en) * | 2020-12-29 | 2021-05-25 | 孙永超 | Intelligent laser spot welding equipment for chip processing and chip processing technology |
| CN113070577A (en) * | 2021-04-08 | 2021-07-06 | 北京航空航天大学 | Laser shock strengthening device and method for welding seam part of aerospace propellant storage tank |
-
2018
- 2018-01-22 CN CN201820141430.9U patent/CN208450830U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112828467A (en) * | 2020-12-29 | 2021-05-25 | 孙永超 | Intelligent laser spot welding equipment for chip processing and chip processing technology |
| CN113070577A (en) * | 2021-04-08 | 2021-07-06 | 北京航空航天大学 | Laser shock strengthening device and method for welding seam part of aerospace propellant storage tank |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190201 Termination date: 20200122 |
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| CF01 | Termination of patent right due to non-payment of annual fee |