CN101856773A - Focusing positioning method based on initial laser processing position and laser processing device - Google Patents
Focusing positioning method based on initial laser processing position and laser processing device Download PDFInfo
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- CN101856773A CN101856773A CN201010159047A CN201010159047A CN101856773A CN 101856773 A CN101856773 A CN 101856773A CN 201010159047 A CN201010159047 A CN 201010159047A CN 201010159047 A CN201010159047 A CN 201010159047A CN 101856773 A CN101856773 A CN 101856773A
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Abstract
The invention discloses a focusing positioning method based on an initial laser processing position. In the method, a beam emitted by a laser is projected on the surface of a work piece to be processed to form a light spot through the optical system of the laser processing head, light spot images are promptly collected through moving the laser processing head and using a camera, the properties of the light spot images are then compared with a computer to find out a light spot image on a focal plane, and then the laser processing head is moved according to the moving distance of the laser processing head corresponding to the light spot image, thereby completing the focusing; and the position relationship between the center of the initial processing point and the center of the light spot is determined by the computer, and the laser processing head is moved according to the position relationship, thereby obtaining the accurate positioning of the initial processing position. Compared with the prior art, the invention has high accuracy in focusing and positioning of the initial processing position, and can satisfy finishing requirements. Simultaneously, the invention also discloses a laser processing device, which has the functions of auxiliary focusing and positioning, thereby facilitating the laser processing operation.
Description
Technical field
The present invention relates to laser processing technology, the focusing localization method and the laser processing device of initial position in particularly a kind of Laser Processing.
Background technology
At present, laser process equipment is widely used in fields such as semiconductor and microelectronic industry, auto industry, shipping industry, aerospace industries.Since laser be cut by after focusing on, weld, processing such as punching, so the relative position on laser beam foucing and workpiece to be machined surface also seems important unusually.Conventional laser focusing method mainly contains: burned spot method, infrared photography method, aperture scanning method etc.Wherein the burned spot method is the most commonly used, only need get a l Water Paper and be attached to surface of the work and get final product, and is simple.But this method can only provide the profile of focus roughly to people, and because the transverse heat transfer effect of material makes and burns the focus pattern distortion of getting, smudgy sometimes, it is inaccurate to focus.And, when determining initial processing position, adopt the not high ocular estimate of accuracy at present, can not satisfy accurately machined requirement.
Summary of the invention
One of purpose of the present invention is to provide the focusing localization method of the high based on initial laser processing position of a kind of focusing and setting accuracy.
To achieve these goals, the technical solution used in the present invention is: a kind of focusing localization method of based on initial laser processing position comprises the steps:
(a) workpiece to be machined is placed on the processing platform, opens laser instrument, the light beam that laser instrument sends is incident upon the surface of workpiece to be machined through the light path system of laser Machining head, forms hot spot;
(b) along moving laser Machining head with the perpendicular direction in processing platform surface, and use the camera that is synchronized with the movement with this laser Machining head to gather light spot image in real time, and transfer to Computer Processing, computer compares the attribute of the light spot image that obtains, determine to be positioned at the light spot image of focal plane, and regulate the position of laser Machining head on this basis in processing platform surface vertical direction;
(c) move laser Machining head near the processing initial point D of workpiece to be machined along the direction that parallels with the processing platform surface, the image D1 of camera collection processing initial point D and go out light spot image D2 under the light state at laser instrument, obtain the center of D1 and D2 respectively, and serve as according to regulating the position of laser Machining head in processing platform surface parallel direction with this.
Utilization of the present invention is positioned at the attribute of light spot image of focal plane (as brightness, definition, area) with the different principle of attribute of the light spot image of other position, earlier along moving laser Machining head with the perpendicular direction in processing platform surface, gather light spot image in real time with camera simultaneously, find out the light spot image that is positioned at the focal plane by the attribute of computer contrast light spot image again, then according to the displacement of the pairing laser Machining head of this light spot image in processing platform surface vertical direction, mobile laser Machining head, focusing work is finished, and the accuracy height can reach 0.05mm.After focusing is finished, determine the center and the relation of the position between the spot center of processing initial point by computer, move laser Machining head according to this position relation along processing platform surface parallel direction, thereby obtain the accurate location of initial processing position, the setting accuracy height can reach 0.05mm.
In the step (b) of said method, the attribute of the light spot image that computer obtains is preferably one or more in brightness, definition and the area.Be positioned at the light spot image of focal plane the brightness maximum, definition is the highest, area is minimum.
Preferred embodiment as said method, also be provided with the light path system aligning step before in step (a): the nozzle with described laser Machining head unloads earlier, on described processing platform, draw the reference circle that a center has cross wire then, mobile laser Machining head, make the sleeve of laser Machining head coaxial with this reference circle, adjust described camera again, the cross wire of camera and the cross wire of this reference circle are coincided; Open laser instrument then, adjust the deflection angle of the speculum of described laser Machining head, spot center is overlapped with the cross wire of camera; At last described nozzle is loaded onto, the position of fine setting nozzle makes nozzle aperture center overlap with the cross wire crosspoint of camera.This light path system bearing calibration has advantage fast and accurately.
Another preferred embodiment as said method, the light path system of described laser Machining head comprises semi-permeable and semi-reflecting mirror, the light beam that described laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through semi-permeable and semi-reflecting mirror and enters described camera.
Another object of the present invention is to provide a kind of laser processing device, the driving mechanism that comprises processing platform, laser instrument, laser Machining head and be used to regulate laser instrument, laser Machining head and processing platform relative position, also comprise camera and computer, this camera is installed on the described laser Machining head and with described computer and links to each other, and described computer links to each other with described driving mechanism; Described laser Machining head comprises semi-permeable and semi-reflecting mirror, and the light beam that described laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through semi-permeable and semi-reflecting mirror and enters described camera.
By setting up parts such as camera and computer, make laser processing device not only can be used for conventional Laser Processing, also have the function of auxiliary focusing and location, made things convenient for laser processing operation.
In the said apparatus, described camera preferably adopts the CCD camera, to obtain the light spot image of high-res.In addition, also comprise the HDMI capture card, described camera links to each other with described computer through this HDMI capture card, utilizes the HDMI capture card to gather high-definition image.
Compared with prior art, the invention has the advantages that: method of the present invention can satisfy finishing requirements to the focusing and the location accuracy height of initial processing position, and can proofread and correct light path system rapidly and accurately; Laser aid of the present invention not only can Laser Processing, also has the function of auxiliary focusing and location, has made things convenient for laser processing operation.
Description of drawings
Fig. 1 is the structural representation of embodiment of the invention laser processing device;
Fig. 2 is the focusing and the Positioning Principle figure of embodiment of the invention initial position;
Fig. 3 is the location diagram between the center of circle D2 of the center of circle D1 of initial position D and light spot image.
Description of reference numerals:
1-processing platform, 2-workpiece to be machined, 3-nozzle, 4-sleeve, 5-focus lamp group, 6-laser beam, 7-semi-permeable and semi-reflecting mirror, 8-camera, 9-support, 10-laser Machining head, 11-laser instrument, 12-HDMI capture card, 13-computer.
The specific embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated:
See Fig. 1, the laser processing device of the embodiment of the invention mainly is made up of processing platform 1, laser instrument 11, laser Machining head 10, camera 8, HDMI capture card 12 and computer 13, wherein laser Machining head 10 be vertical at processing platform 1 directly over, side at this laser Machining head 10 is provided with laser instrument 11, and install by support 9 at its top and to be equipped with camera 8, this camera 8 links to each other with computer 13 by HDMI capture card 12, and computer 13 links to each other with driving mechanism again.Camera 8 is the CCD camera.Laser instrument 11 and camera and laser Machining head 10 synchronous interactions can unify to be driven to move synchronously by driving mechanism to focus and locate.The driving mechanism of present embodiment adopts mechanical hand, and its repetitive positioning accuracy reaches 0.05mm.Also the screw mandrel driving mechanism can be set on processing platform 1, drive processing platform 1 by the screw mandrel driving mechanism and move with respect to laser Machining head 10 and focus and locate.
Laser Machining head 10 is laser cutting head or laser welding system, selects according to the processing needs.Present embodiment laser Machining head 10 mainly is made up of semi-permeable and semi-reflecting mirror 7, nozzle 3, sleeve 4 and focus lamp group 5.The light beam 6 that laser instrument 11 sends forms hot spot through the surface at workpiece to be machined after the reflection of semi-permeable and semi-reflecting mirror 7, and this light spot image sees through semi-permeable and semi-reflecting mirror 7 and enters camera 8.Other structure of laser Machining head 10 is same as the prior art.
See Fig. 2, the focusing and the localization method of the based on initial laser processing position of present embodiment are as follows:
(a), at first carry out the correction of light path system.
(b), then, carry out the focusing work of laser processing device.
Workpiece to be machined 2 is placed on the processing platform 1, open the indication light source (ruddiness) of laser instrument 11, the light beam 6 that laser instrument 11 sends is incident upon the surface of workpiece to be machined 2 through the light path system of laser Machining head 10, form red some shaped laser spot, the shape of hot spot can be circle, square or regular polygon, is easy to convert get final product; At this moment, manipulator drives laser Machining head 10 and moves up and down, and light spot image is real-time transmitted in the computer 13 by camera 8, HDMI capture card 12, computer 13 carry out light spot image attribute to recently determining the focal plane.Detailed process is: because it is the highest to be positioned at area minimum, brightness maximum and the definition of the light spot image of focal plane, therefore, by to one in specific area, brightness and the definition or multinomially can find out the light spot image that is positioned at the focal plane.Present embodiment is example with the definition, see Fig. 2, when the focus of laser beam drops on position B or C place, the definition of light spot image is minimum, by moving up and down laser Machining head 10, the focus of laser beam drops on the somewhere between B and the C, computer 13 compares the definition of the light spot image between this, find out the highest clear light spot image, i.e. the light spot image of A position that is to say the position at place, focal plane, then, computer 13 is according to the displacement of the pairing laser Machining head 10 of this light spot image, and control laser Machining head 10 makes progress or moves down, and makes laser beam just in time drop on the A place, be of the reflection of the laser beam that sends of laser instrument 11 by semi-permeable and semi-reflecting mirror 7, and after being focused on by focus lamp group 5, the laser spot after coming out from nozzle 3 just in time drops on the workpiece to be machined 2, and this moment, focusing work was finished.
(c), at last, carry out the location work of initial position.
The direction that will parallel along processing platform 1 surface defocused laser Machining head 10, move near the processing initial point D of workpiece to be machined 2, the image D1 that gathers processing initial point D by camera 8 in advance is stored in the computer 13, after passing through image preliminary treatment, removal noise and interference then, the center of circle that obtains image D1 again by center of circle location algorithm; Open the indication light source of laser instrument 11, gather the light spot image D2 of this position by camera 8, then through after the image preliminary treatment, removing noise and interference, obtain the center of circle of image D2 again by center of circle location algorithm, owing to be pre-determined bit, the center of circle of D2 does not overlap (see figure 3) with the center of circle of D1, obtains the positional information between the center of circle of the center of circle of D2 and D1 by calculating, all around moves according to this positional information control laser Machining head 10.This kind method is simple to operate, and positioning accuracy can reach 0.05mm.
This moment, whole focusing location work was finished, and regulated laser instrument 11 then to light source for processing, can carry out Laser Processing.
Be specific embodiments of the invention only below, do not limit protection scope of the present invention with this; Any replacement and the improvement done on the basis of not violating the present invention's design all belong to protection scope of the present invention.
Claims (9)
1. the focusing localization method of a based on initial laser processing position is characterized in that comprising the steps:
(a) workpiece to be machined is placed on the processing platform, opens laser instrument, the light beam that laser instrument sends is incident upon the surface of workpiece to be machined through the light path system of laser Machining head, forms hot spot;
(b) along moving laser Machining head with the perpendicular direction in processing platform surface, and use the camera that is synchronized with the movement with this laser Machining head to gather light spot image in real time, and transfer to Computer Processing, computer compares the attribute of the light spot image that obtains, determine to be positioned at the light spot image of focal plane, and regulate the position of laser Machining head on this basis in processing platform surface vertical direction;
(c) move laser Machining head near the processing initial point D of workpiece to be machined along the direction that parallels with the processing platform surface, the image D1 of camera collection processing initial point D and go out light spot image D2 under the light state at laser instrument, obtain the center of D1 and D2 respectively, and serve as according to regulating the position of laser Machining head in processing platform surface parallel direction with this.
2. the focusing localization method of based on initial laser processing position according to claim 1, it is characterized in that: in the step (b), the attribute of the light spot image that computer obtains is one or more in brightness, definition and the area.
3. the focusing localization method of based on initial laser processing position according to claim 1 and 2, it is characterized in that: also be provided with the light path system aligning step before in step (a): the nozzle with described laser Machining head unloads earlier, the reference circle that a center has cross wire is set on described processing platform then, mobile laser Machining head, make the sleeve of laser Machining head coaxial with this reference circle, adjust described camera again, the cross wire of camera and the cross wire of this reference circle are coincided; Open laser instrument then, adjust the deflection angle of the speculum of described laser Machining head, spot center is overlapped with the cross wire of camera; At last described nozzle is loaded onto, the position of fine setting nozzle makes nozzle aperture center overlap with the cross wire crosspoint of camera.
4. the focusing localization method of based on initial laser processing position according to claim 3, it is characterized in that: the speculum of described laser Machining head is a semi-permeable and semi-reflecting mirror, the light beam that described laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through semi-permeable and semi-reflecting mirror and enters described camera.
5. the focusing localization method of based on initial laser processing position according to claim 4, it is characterized in that: described laser Machining head is laser cutting head or laser welding system.
6. laser processing device, the driving mechanism that comprises processing platform, laser instrument, laser Machining head and be used to regulate laser instrument, laser Machining head and processing platform relative position, it is characterized in that: also comprise camera and computer, this camera is installed on the described laser Machining head and with described computer and links to each other, and described computer links to each other with described driving mechanism; Described laser Machining head comprises semi-permeable and semi-reflecting mirror, and the light beam that described laser instrument sends forms hot spot through the surface at workpiece to be machined after the reflection of this semi-permeable and semi-reflecting mirror, and this light spot image sees through semi-permeable and semi-reflecting mirror and enters described camera.
7. laser processing device according to claim 6 is characterized in that: described camera is the CCD camera.
8. laser processing device according to claim 7 is characterized in that: also comprise the HDMI capture card, described camera links to each other with described computer through this HDMI capture card.
9. the described laser processing device arbitrary according to claim 6 to 8 is characterized in that: described laser Machining head is laser cutting head or laser welding system.
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