KR102483670B1 - Laser machining system and laser machining method - Google Patents

Abstract

The present invention provides a laser processing system and a laser processing method. The present invention provides a laser oscillator for outputting a laser beam, a processing table on which a workpiece is seated and moving in a preset direction, and a lens located between the laser oscillator and the processing table and injecting the laser beam into the workpiece. And, an optical unit having a mirror for injecting the laser beam output from the laser oscillator into the lens, and controlling the mirror according to previously stored design processing coordinates of the workpiece, so that the laser beam incident on the lens It provides a laser processing system having a laser processing device including a first controller for adjusting the position of.

Description

Laser processing system and laser processing method {LASER MACHINING SYSTEM AND LASER MACHINING METHOD}

Embodiments of the present invention relate to a laser processing system and a laser processing method.

Recently, a display panel having various shapes or a display panel implemented with zero bezel has been developed and produced according to high concentration of pixels. Such a display panel is formed by stacking a plurality of layers including a dielectric material, and cutting processing is performed using a non-contact cutting method rather than a conventional contact cutting method in consideration of processing precision.

In the case of a conventional non-contact cutting method using a laser, design coordinates of the edge of a workpiece to be cut are input in advance, and then cutting is performed according to the input coordinates. However, there may be an error between the design coordinates and the actual coordinates of the workpiece, and since this error is not constant, when the cutting process is performed depending on the design coordinates, a workpiece having a desired size cannot be obtained.

In addition, the conventional non-contact cutting method using a laser has a problem in that it is difficult to control the laser processing device in real time according to the shape of the workpiece.

The above-described background art is technical information that the inventor possessed for derivation of the present invention or acquired during the derivation process of the present invention, and cannot necessarily be said to be known art disclosed to the general public prior to filing the present invention.

Embodiments of the present invention are to provide a laser processing system and laser processing method capable of performing various non-contact processing including cutting processing with high precision and controlling a laser processing device in real time according to the shape of a workpiece. The purpose. However, the above-described problems are in accordance with embodiments of the present invention, and the objects and problems to be solved by the present invention are not limited thereto.

A laser processing system according to an embodiment of the present invention, a laser oscillator for outputting a laser beam, a processing table on which a workpiece is seated and moving in a preset direction, located between the laser oscillator and the processing table, An optical unit including a lens for injecting a laser beam into the workpiece, and a mirror for injecting the laser beam output from the laser oscillator into the lens, and controlling the mirror according to design processing coordinates of the workpiece stored in advance. Thus, it is provided with a laser processing device including a first controller for adjusting the position of the laser beam incident on the lens.

In the laser processing system according to an embodiment of the present invention, the first controller, in the position of the laser beam incident on the lens, the position of the lens in the circumferential direction and the position in the radial direction of the lens An angle of the laser beam incident on the workpiece may be adjusted by adjusting at least one of the above.

In the laser processing system according to an embodiment of the present invention, the first controller controls the laser input to the lens so that the processing surface of the workpiece has a predetermined inclination according to the shape of the edge of the workpiece. The position of the beam can be adjusted.

In the laser processing system according to an embodiment of the present invention, the first controller maintains a constant distance of the laser beam incident on the lens from the center of the lens according to the shape of the edge of the workpiece while maintaining a constant distance. , It is possible to adjust the position of the laser beam incident on the lens in the circumferential direction.

In the laser processing system according to an embodiment of the present invention, the optical unit may move independently of the processing table.

In the laser processing system according to an embodiment of the present invention, an imaging unit for capturing an image of the workpiece while moving in a preset direction and a second controller for generating actual processing coordinates for the workpiece from the captured image A test device including the may be further provided.

In the laser processing system according to an embodiment of the present invention, the second controller compares the difference between the design processing coordinates and the actual processing coordinates with a preset threshold value, and the difference value is less than or equal to the threshold value. In this case, the actual processing coordinates are transmitted to the first controller, and when the difference value exceeds the threshold value, a decision to stop processing may be made.

In the laser processing system according to an embodiment of the present invention, one or more inspection devices may be provided, and more than one laser processing device may be provided.

A laser processing method according to another embodiment of the present invention is a laser processing method in which a laser beam output from a laser oscillator is incident on a workpiece using an optical unit having a mirror and a lens, and obtains processing coordinates of the workpiece. and performing laser processing by adjusting the position of the laser beam incident on the lens by controlling the mirror according to the obtained processing coordinates.

In the laser processing method according to another embodiment of the present invention, the performing of the laser processing may include a position of the laser beam incident on the lens in a circumferential direction of the lens and a radial direction of the lens. It is possible to adjust the angle of the laser beam incident on the workpiece by adjusting at least one of the positions of .

In the laser processing method according to another embodiment of the present invention, the step of performing the laser processing is incident on the lens so that the processing surface of the workpiece has a predetermined slope according to the shape of the edge of the workpiece. It is possible to adjust the position of the laser beam to be.

In the laser processing method according to another embodiment of the present invention, the step of performing the laser processing is incident on the lens so that the processing surface of the workpiece has a predetermined slope according to the shape of the edge of the workpiece. It is possible to adjust the position of the laser beam to be.

In the laser processing method according to another embodiment of the present invention, the step of acquiring the processing coordinates of the workpiece is the step of taking an image of the workpiece with an imaging unit moving in a preset direction and from the captured image It may include acquiring actual processing coordinates of the workpiece.

In the laser processing method according to another embodiment of the present invention, after the step of obtaining the processing coordinates of the workpiece, comparing the difference between the previously stored design processing coordinates and the actual processing coordinates with a preset threshold value. , When the difference value is less than or equal to the threshold value, replacing the design processing coordinates with the actual processing coordinates, and when the difference value exceeds the threshold value, may further include determining to stop processing.

Other aspects, features, and advantages other than those described above will become clear from the detailed description, claims, and drawings for carrying out the invention below.

The laser processing system and laser processing method according to the present invention can correct the difference between design processing coordinates and actual processing coordinates of a workpiece. In addition, the laser processing system and the laser processing method according to the present invention can process workpieces having various shapes with high precision and high speed by controlling the laser processing apparatus in real time according to the shape of the workpiece. In particular, the laser processing system and laser processing method according to the present invention can control the incident path of the laser to process the processing surface of the workpiece at various angles. In addition, the laser processing system and laser processing method according to the present invention can precisely process a workpiece including a dielectric.

1 is a diagram showing a laser processing system according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a first controller of FIG. 1 .
FIG. 3 is a view showing an example of a position of a laser beam incident on the lens of FIG. 1 .
FIG. 4 is a view showing another example of a position of a laser beam incident on the lens of FIG. 1 .
5A to 5E are diagrams showing the processing state of a workpiece according to the position of the laser beam shown in FIG. 4 .
FIG. 6 is a view showing a state in which a workpiece is processed using the laser processing system of FIG. 1 .
7 is a diagram illustrating an inspection device according to an embodiment of the present invention.
FIG. 8 is a diagram illustrating a second controller of FIG. 7 .
9 is a diagram showing a laser processing system according to another embodiment of the present invention.
FIG. 10 is a diagram illustrating a first controller of FIG. 10 .
11 is a diagram showing a laser processing method according to another embodiment of the present invention.

Since the present invention can apply various transformations and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all conversions, equivalents, or substitutes included in the spirit and scope of the present invention. In describing the present invention, even if shown in different embodiments, the same identification numbers are used for the same components.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. Terms are only used to distinguish one component from another.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. In this application, the terms "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Hereinafter, the present invention will be described in detail with reference to embodiments of the present invention shown in the accompanying drawings.

1 is a diagram showing a laser processing system 1 according to an embodiment of the present invention. FIG. 2 is a diagram showing the first controller 19 of FIG. 1 .

The laser processing system 1 according to an embodiment of the present invention may be used for various laser processing such as laser cutting, laser perforation, laser drawing, laser patterning, and laser scribing. However, hereinafter, for convenience of description, the laser processing system 1 will be described as being used for laser cutting. In addition, the kind of to-be-processed object W is not specifically limited. The workpiece W may be a display panel including a dielectric material, a metal sheet, a ceramic substrate, and the like.

As shown in FIG. 1 , the laser oscillator 11 is disposed on one side of the laser processing device 10 . The laser oscillator 11 may include a laser source capable of generating and outputting a laser beam having a specific wavelength. The type of laser beam output from the laser oscillator 11 is not particularly limited and may be appropriately selected according to the type of workpiece W or processing method. For example, the laser beam output from the laser oscillator 11 includes a solid laser beam including a ruby laser beam, a Nd:YAG laser beam, a Ti:sapphire laser beam, and the like, a liquid laser beam including a dye laser beam, and the like , CO ₂ laser beam, He-Ne laser beam, Ar ⁺ laser beam, excimer laser beam, and the like. However, in the following description, for convenience of description, the laser beam output from the laser oscillator 11 is a CO ₂ laser beam. In addition, the wavelength of the CO ₂ laser beam may be greater than or equal to 9.3 μm and less than or equal to 10.6 μm.

The laser oscillator 11 is connected to a power supply (not shown), and can output a laser beam as power is applied from the power supply. Moreover, as shown in FIG. 1, the laser oscillator 11 is connected with the 1st controller 19. The characteristics of the laser beam output from the laser oscillator 11 , for example, intensity, cycle, output timing, etc. of the laser beam may be controlled by a signal generated by the first controller 19 .

Referring to FIG. 1 , a laser processing apparatus 10 according to an embodiment of the present invention includes a processing table 13 . The processing table 13 may be arranged to face the laser oscillator 11 . The processing table 13 has a seating surface on which the workpiece W is seated, and can move in a preset direction with the workpiece W seated thereon. For example, the processing table 13 may move in directions of the X axis, Y axis, and Z axis, and may rotate around the Z axis.

The processing table 13 may include a fixing member (not shown). The fixing member is formed on one side of the processing table 13 to fix the workpiece W to the seating surface of the processing table 13 . Accordingly, the fixing member can prevent the workpiece W from being separated from the seating surface during the machining process. The type of the fixing member is not particularly limited, and may be a plurality of suction holes formed on the upper surface of the processing table 13 or a plurality of clamping units that mechanically fix the workpiece W. As shown in FIGS. 1 and 2 , the processing table 13 is connected to the first controller 19 . The operation of the processing table 13, for example, the operation in which the fixing member fixes the workpiece W, or the moving speed or rotational speed of the processing table 13, the moving direction, the moving distance, etc., is performed by the first controller 19 ) can be controlled by

Referring to FIG. 1 , a mirror 15 may be disposed between a laser oscillator 11 and a processing table 13 . The mirror 15 may control an optical path of the laser beam La output from the laser oscillator 11 . The number of mirrors 15 included in the laser processing device 10 is not particularly limited, but hereinafter, for convenience of description, the laser processing device 10 includes a first mirror 15a and a second mirror 15b. explain by doing In one embodiment of the present invention, in order to implement a fast response speed according to the control signal of the first controller 19, the mirror 15 may be a galvano-mirror.

As shown in FIGS. 1 and 2 , the mirror 15 is connected to the first controller 19 . An operation of the mirror 15 , eg, a tilting angle and a tilting speed of the mirror 15 , may be controlled by the first controller 19 . More specifically, referring to FIGS. 1 and 2 , the laser beam La output from the laser oscillator 11 is first reflected by the first mirror 15a. The laser beam Lb reflected by the first mirror 15a is incident on the second mirror 15b. Again, the laser beam Lc reflected by the second mirror 15b is incident on one surface of a lens 17 to be described later, and is irradiated to the workpiece W through the lens 17 (laser beam Ld) .

Referring to FIG. 1 , a lens 17 may be disposed between a processing table 13 and a mirror 15 . The lens 17 condenses the laser beam Lc reflected from the mirror 15 and irradiates the workpiece W with the laser Ld. In one embodiment of the invention, lens 17 may be an f-theta lens. In FIG. 1 , the lens 17 is shown as one, but is not limited thereto. For example, the lens 17 may be composed of a plurality of spherical lenses or flat lenses. Accordingly, the lens 17 may focus the laser beam Ld on the workpiece W even when the laser beam Lc is incident on an area other than the center of the lens 17 .

Referring to FIG. 1 , a mirror 15 and a lens 17 may constitute an optical unit 14 . The optical unit 14 may adjust the optical path of the laser beam La output from the laser oscillator 11 to radiate the laser beam Ld to a desired location on the workpiece W. Also, the operation and position of the optical unit 14 can be controlled by the first controller 19 .

The first controller 19 adjusts the position of the laser beam incident on the lens by controlling the mirror according to the design processing coordinates of the workpiece W stored in advance. As shown in FIGS. 1 and 2 , the first controller 19 may include a driving unit 191 , a processor 193 , a memory 195 , and an input/output interface unit 197 . The driver 191 receives a control signal from the processor 193 and controls the laser oscillator 11 , the processing table 13 , the mirror 15 , and the lens 17 . More specifically, the driving unit 191 transmits signals for controlling the location of the laser oscillator 11, the intensity, cycle, and output timing of the laser beam output from the laser oscillator 11, based on the command of the processor 193. can be made and sent In addition, the driving unit 191 controls the position, moving speed, moving direction, and moving distance of the processing table 13 based on the command of the processor 193, and the workpiece W using a fixing member provided on the processing table 13. ) can be created and sent. In addition, the driving unit 191 may generate and send signals for controlling the position, tilting angle, and tilting speed of the mirror 15 based on a command of the processor 193 . In addition, the driver 191 may generate and send a signal for controlling the position of the lens 17 based on a command of the processor 193 . In addition, the driving unit 191 may generate and send a signal integrally controlling the optical unit 14 including the mirror 15 and the lens 17 based on a command of the processor 193 .

In addition, the driving unit 191 can independently control the laser oscillator 11, the processing table 13, the mirror 15, and the lens 17 by sending signals to each other. For example, the driving unit 191 may control only the processing table 13 on which the workpiece W is seated to perform the processing process, or control only the mirror 15 or the lens 17 to perform the processing process.

The processor 193 may control the driving unit 191 based on processing information of the workpiece W stored in the memory 195 . For example, the processor 193 may control the driving unit 191 based on design processing coordinates stored in the memory 195 and serving as processing reference values of the workpiece W. Accordingly, the driving unit 191 controls the laser oscillator 11, the processing table 13, the mirror 15, and the lens 17 so that the laser beam La output from the laser oscillator 11 It can be controlled by sending a signal to be irradiated to the design processing coordinates on the workpiece (W) along a previously set light path.

FIG. 3 is a view showing an example of a position of a laser beam Lc incident on the lens of FIG. 1 . FIG. 4 is a view showing another example of a position of a laser beam Lc incident on the lens of FIG. 1 . 5A to 5E are views showing the processing state of the workpiece W according to the position of the laser beam Lc shown in FIG. 4 . FIG. 6 is a diagram showing a state in which a workpiece W is processed using the laser processing system 1 of FIG. 1 .

As described above, the laser processing system 1 according to an embodiment of the present invention can process the workpiece W by controlling the optical path of the laser beam La output from the laser oscillator 11. . For example, as shown in FIG. 3, the laser processing system 1 controls the position of the laser beam Lc incident on the lens 17, and the position of the laser beam Ld incident on the workpiece W. position can be controlled. More specifically, referring to FIG. 1, the laser beam La output from the laser oscillator 11 is deflected in an optical path through the first mirror 15a and the second mirror 15b, and the deflected laser beam Lc ) may be incident on one surface of the lens 17. At this time, the first controller 19 controls the position, tilting angle, or tilting speed of the first mirror 15a and the second mirror 15b to inject the laser beam Lc to a desired location on the lens 17. can

As shown in FIG. 3, a coordinate system (X' axis and Y' axis) having the center point O' of the lens 17 as the origin may be defined. In addition, the position of the laser beam (Lc) incident on the upper surface of the lens 17 is represented by polar coordinates expressed as the horizontal distance (r) from the center point (O') and the angle (θ) with the center point (O'). can In addition, referring to FIG. 3, when the lens 17 is viewed from the top surface, that is, when the lens 17 is viewed from the direction in which the laser beam Lc is incident, the laser beam is located at various positions on the top surface of the lens 17. (Lc) can be incident. Each of the laser beams Lc may have the same or different positions in the circumferential direction of the lens 17 or in the radial direction of the lens 17 .

4, in the laser processing system 1 according to an embodiment of the present invention, in the position of the laser beam (Lc) incident on the lens 17, from the center point (O') of the lens 17 The distance of can be controlled differently. More specifically, the laser beam Lc1 may be incident on the central point O' of the lens 17 . At this time, the distance r1 from the central point O' is 0. In addition, the laser beam Lc2 may be incident at a position spaced apart from the center point O' of the lens 17 by a distance r2 in the X'-axis direction. In addition, the laser beam Lc3 may be incident at a position spaced apart from the center point O' of the lens 17 by a distance r3 in the X'-axis direction. In addition, the laser beam Lc4 may be incident at a position spaced apart from the center point O' of the lens 17 by a distance r4 in the X'-axis direction. In addition, the laser beam Lc5 may be incident at a position spaced apart from the center point O' of the lens 17 by a distance r5 in the X'-axis direction.

5A to 5E , the laser processing system 1 according to an embodiment of the present invention controls the position of the laser beam Lc incident on the upper surface of the lens 17, so that the workpiece W is formed. The surface to be machined can be machined differently. More specifically, in FIGS. 5A to 5E , the axis Ax1 is an axis extending in a vertical direction from the lowermost end of the area to be processed formed on the workpiece W. Further, C1 is the distance between the axis Ax1 and the left end of the area to be processed on the upper surface of the workpiece W. Further, C2 is the distance between the axis Ax1 and the right end of the area to be processed on the upper surface of the workpiece W. Further, φ is an angle between the axis Ax1 and the right side to be machined of the workpiece W. At this time, the target to be processed may be the right side to be processed of the workpiece (W).

5A is a view showing a processing state when the laser beam Lc1 of FIG. 4 is incident on the upper surface of the lens 17, wherein the processing area of the workpiece W is substantially symmetrical about the axis Ax1. can know that That is, in FIG. 5A , C1 and C2 may be substantially the same. Also, φ1 and φ2 may be substantially the same.

5A is a view showing a processing state when the laser beam Lc2 of FIG. 4 is incident on the upper surface of the lens 17, and the position of the laser beam Lc2 is X from the center point O' of the lens 17. It can be seen that the axis Ax1 is shifted to the right compared to FIG. 5A as it is spaced apart by r2 in the 'axial direction. That is, C1 may be greater than C2. Also, φ1 may be greater than φ2.

5C is a view showing a processing state when the laser beam Lc3 of FIG. 4 is incident on the upper surface of the lens 17, and the position of the laser beam Lc3 is X from the center point O' of the lens 17. It can be seen that the axis Ax1 is further shifted to the right compared to FIG. 5B as it is spaced apart by r3 in the 'axial direction. That is, C1 may be greater than C2. Also, φ1 may be greater than φ2.

Figure 5d is a view showing a processing state when the laser beam (Lc4) of Figure 4 is incident on the upper surface of the lens 17, the position of the laser beam (Lc4) X from the center point (O') of the lens 17 It can be seen that the axis Ax1 is further shifted to the right compared to FIG. 5C as it is spaced apart by r4 in the 'axial direction. In particular, the upper surface of the workpiece W and the right side of the workpiece W may be substantially perpendicular to each other. That is, on the upper surface of the workpiece W, the total distance between the ends of the workpiece region is C1, and C2 may be substantially zero. Also, φ2 may be substantially zero.

5E is a view showing a processing state when the laser beam Lc5 of FIG. 4 is incident on the upper surface of the lens 17, and the position of the laser beam Lc5 is X from the center point O' of the lens 17. It can be seen that the axis Ax1 is further shifted to the right compared to FIG. 5D as it is spaced apart by r5 in the 'axial direction. In particular, an overhang area in which the right side to be processed of the workpiece W protrudes leftward from the axis Ax1 is formed. Accordingly, the right side to be machined of the workpiece W may have a reverse taper shape inclined to the left with respect to the axis Ax1. That is, C1 is greater than C2, and φ5 may be in the negative direction. However, the above-described "substantially symmetrical, vertical, or 0" is a concept including an engineering error, and may not mean symmetrical, vertical, or 0 in a mathematically strict sense.

As described above, the laser processing system 1 according to an embodiment of the present invention controls the position of the laser beam Lc incident on the lens 17 to make the processing surface of the workpiece W into various shapes. can be processed For example, as shown in FIG. 6 , the workpiece W may include edges of various shapes such as a long side, a short side, a concave portion, and a convex portion. In addition, the curvature of the edge of the workpiece (W) may be different according to the processing coordinates of the workpiece (W).

The laser processing system 1 includes a laser oscillator 11, a processing table 13, a mirror 15 and , By controlling at least one of the lenses 17, it is possible to correspond to various shapes of the workpiece W. More specifically, when it is desired to form a constant inclination of the processing surface of the workpiece W, the laser processing system 1 controls the position and tilting angle of the mirror 15 to determine the center point of the lens 17 ( The machining process may be performed while maintaining a constant distance r between O′) and the laser beam Lc. Alternatively, when the inclination of the processing surface of the workpiece (W) is to be formed differently according to the shape or processing coordinates of the workpiece (W), the laser processing system (1) mirrors ( 15), the machining process may be performed while differently setting the distance r between the central point O' of the lens 17 and the laser beam Lc by controlling the position and the tilting angle. At this time, when the workpiece W is viewed from a plane, the distance between the edge of the workpiece W and the lens 17 may be maintained constant.

In addition, the laser processing system 1 may perform processing while moving the processing table 13 on which the workpiece W is seated in a preset direction. Alternatively, the laser processing system 1 may perform processing while moving the optical unit 14 as well as the processing table 13 in a preset direction. Accordingly, when the workpiece W has various shapes according to processing coordinates, high-speed processing can be easily performed.

Through this configuration, the laser processing system 1 according to an embodiment of the present invention can process the shape of the processing surface of the workpiece W in various ways. In addition, the laser processing system 1 can also rapidly process the workpiece W having various shapes.

7 is a diagram illustrating an inspection device 20 according to an embodiment of the present invention. FIG. 8 is a diagram showing the second controller 29 of FIG. 7 .

Referring to FIG. 7 , the laser processing system 1 according to another embodiment of the present invention may further include an inspection device 20 . The inspection device 20 may inspect the shape of the workpiece (W), obtain actual processing coordinates of the workpiece (W), and transmit them to the laser processing device (10). The inspection device 20 may include an inspection table 21 , a support 23 , an imaging unit 25 , a transfer unit 27 , and a second controller 29 .

The inspection table 21 has a seating surface on which the workpiece W is seated. 7 shows that the inspection table 21 moves the workpiece W in one direction, but is not limited thereto. For example, like the processing table 13 described above, the inspection table 21 itself may rotate around the Z axis while horizontally moving in the X, Y, and Z-axis directions. The inspection table 21 may have substantially the same configuration as the processing table 13 described above, and a detailed description thereof will be omitted.

The support 23 is installed on one side of the examination table 21 and may have a gantry shape. An imaging unit 25 to be described below is installed on the support 23 and may include a configuration for moving the imaging unit 25 in a preset direction. 7 shows that the support 23 is fixed to the examination table 21, but is not limited thereto. For example, the support 23 is connected to the inspection table 21 through a roller (not shown) and the like, and can move in one direction.

The imaging unit 25 is installed on one side of the support 23 and captures an image of the workpiece W while moving in a preset direction. More specifically, an image may be captured along the edge of the workpiece W and transmitted to the second controller 29 to be described later. The second controller 29 may obtain actual processing coordinates of the workpiece W based on the captured image. At this time, the imaging unit 25 may selectively capture a specific point of the edge of the workpiece W to be imaged.

The transfer unit 27 may be installed apart from the inspection table 21 . The transfer unit 27 transfers the inspected workpiece W to the laser processing device 10 or carries it out. The transfer method is not particularly limited.

The second controller 29 generates actual processing coordinates of the workpiece W from the image captured by the imaging unit 25 . Referring to FIGS. 7 and 8 , the second controller 29 may include a driving unit 291 , a processor 293 , a memory 295 , and an input/output interface unit 297 . The drive unit 291 receives a command from the processor 293 and sends a signal to control the examination table 21, the support 23, the imaging unit 25, and the transfer unit 27 as a whole or independently. there is.

The processor 293 may control the driving unit 291 based on processing information of the workpiece W stored in the memory 295 . For example, the processor 293 operates the drive unit 291 so that the imaging unit 25 captures an image of the edge of the workpiece W based on the design processing coordinates of the workpiece W stored in the memory 295. ) can be controlled. At this time, the processor 293 may set an imaging point of the workpiece W to be imaged. For example, the processor 293 may appropriately set the number and positions of imaging points of the long side and the short side, or the concave and convex portions. Further, the processor 293 acquires actual processing coordinates for the edge of the workpiece W based on the image captured by the imaging unit 25 . Further, the processor 293 may calculate a difference value (offset value) between the obtained actual processing coordinates and the stored design processing coordinates.

The processor 293 may perform an operation of comparing a difference value between actual processing coordinates and design processing coordinates with a threshold value stored in the memory 295 . More specifically, when the difference between the two coordinates is equal to or less than a preset threshold value, the processor 293 transfers the actual processing coordinates to the first controller 19 of the laser processing device 10 . Then, the processor 293 controls the transfer unit 27 to transfer the workpiece W to the laser processing device 10 . On the other hand, when the difference value between the two coordinates exceeds a preset threshold value, the processor 293 may determine that the workpiece W is unsuitable for laser processing and may stop processing. And by controlling the transfer unit 27, the to-be-processed object W can be carried out to the outside.

The first controller 19 of the laser processing apparatus 10 may perform laser processing on the workpiece W based on the received actual processing coordinates. Laser processing using the laser processing device 10 may be substantially the same as the above-described laser processing, and a detailed description thereof will be omitted.

As such, the laser processing system 1 according to the present invention includes both the laser processing device 10 and the inspection device 20, thereby correcting the error between the design processing coordinates and the actual processing coordinates of the workpiece W. can Accordingly, the laser processing system 1 can more precisely process the workpiece W.

In another embodiment, the second controller 29 may obtain corrected processing coordinates by correcting the acquired actual processing coordinates of the workpiece W. For example, when processing the workpiece W by reducing or enlarging the actual processing coordinates, the corrected processing coordinates may be acquired by enlarging or reducing the obtained actual processing coordinates at a predetermined ratio. The second controller 29 transmits the obtained corrected processing coordinates to the first controller 19, and the first controller 19 may perform laser processing based on the corrected processing coordinates. However, the corrected processing coordinates are not limited to enlarged or reduced actual processing coordinates, and may only be corrected coordinates of a specific region.

As another embodiment, the laser processing system 1 according to the present invention may include a plurality of laser processing devices 10 and a plurality of inspection devices 20 . For example, when the process time required by the laser processing device 10 is longer than the processing time required by the inspection device 20, the laser processing system 1 includes one or more inspection devices 20 and the inspection device. It may be provided with a greater number of laser processing devices 10 than the number of (20). Accordingly, the processing time required for laser processing of the workpiece W may be minimized by transferring the workpiece W, which has been inspected by the inspection device 20, to the laser processing device 10 . However, the number of the laser processing device 10 and the inspection device 20 is not particularly limited, and may be appropriately selected in consideration of the time required for the processing process.

In another embodiment, the laser processing system 1 according to the present invention may be used to process both sides of one workpiece W. For example, the laser processing system 1 may include two laser processing devices 10 and one inspection device 20 . In addition, the two laser processing devices 10 may be disposed on the upper and lower surfaces of the workpiece W, respectively. First, actual processing coordinates are generated for one side of the workpiece W using the inspection device 20, and the laser processing device 10 disposed on one side of the workpiece W is based on the actual processing coordinates. One side of the workpiece W is processed. Next, the laser processing device 10 disposed on the other surface of the workpiece W inverts the actual processing coordinates to generate inverted processing coordinates, and performs processing on the other side of the workpiece W based on this. can That is, without the need to invert the seated workpiece W, only the generated actual processing coordinates can be inverted and processing can be performed as it is. Through this configuration, it is possible to shorten the time required for laser processing.

9 is a diagram showing a laser processing system 1 according to another embodiment of the present invention. FIG. 10 is a diagram showing the first controller 19 of FIG. 9 .

As another embodiment, the laser processing system 1 according to the present invention may include the laser processing device 10 and the inspection device 20 integrally configured. 9 and 10, the laser processing system 1 according to the present invention is a laser processing device 10, and an optical unit 14 including a laser oscillator 11, a mirror 15, and a lens 17 ) and a first controller 19. In addition, the inspection device 20 may include an inspection table 21 , a support 23 , and an imaging unit 25 . In addition, both the optical unit 14 and the imaging unit 25 may be installed on the support 23 . Also, the first controller 19 may control the laser oscillator 11 , the optical unit 14 , the inspection table 21 , the support 23 , and the imaging unit 25 . Accordingly, the laser processing system 1 according to the present embodiment may obtain actual processing coordinates by capturing an image of the workpiece W seated on the inspection table 21 with the imaging unit 25 .

Also, the laser processing system 1 may perform laser processing on the workpiece W using the laser oscillator 11 and the optical unit based on the obtained actual processing coordinates. Through this configuration, laser processing can be performed on the workpiece W in one area, the overall size of the laser processing system 1 can be reduced, and the structure of the laser processing system 1 can be simplified. can

11 is a diagram showing a laser processing method according to another embodiment of the present invention.

1 to 11, the laser processing method according to the present invention uses an optical unit 14 including a mirror 15 and a lens 17 to avoid a laser beam output from a laser oscillator 11. As a laser processing method incident on the workpiece (W), obtaining processing coordinates of the workpiece (W) (S100), controlling the mirror 15 according to the obtained processing coordinates, and incident on the lens 17 A step of performing laser processing by adjusting the position of the laser beam (S300) may be included.

First, processing coordinates of the workpiece W are acquired (S100). Here, the processing coordinates of the workpiece W may be design processing coordinates stored in the first controller 19 of the laser processing apparatus 10 . Alternatively, the processing coordinates of the workpiece W may be actual processing coordinates acquired by capturing an image of the workpiece W using the inspection device 20 . Alternatively, it may be corrected processing coordinates obtained by reducing or enlarging correction based on the obtained actual processing coordinates.

Next, by comparing the obtained processing coordinates with the stored processing coordinates, it may be determined whether the difference between the two coordinate values exceeds a preset threshold value (S200). Specifically, when the actual processing coordinates of the workpiece W are obtained using the inspection device 20, the design processing coordinates and the actual processing coordinates stored in the memory 195 of the laser processing device 10 are compared, and the amount Calculate the difference between the coordinate values. And, when the difference between the two coordinate values exceeds a preset threshold, the inspection device 20 may determine that the corresponding workpiece W is not suitable for laser processing and may make a decision to stop processing (S300). . When processing is stopped, the workpiece W may be taken out by the inspection device 20 . Alternatively, when the difference between the two coordinate values is equal to or less than a preset threshold value, the inspection device 20 transfers the actual processing coordinates to the laser processing device 10 . Also, the laser processing device 10 may replace the stored design processing coordinates with the obtained actual processing coordinates.

When laser processing is performed based on design processing coordinates, or when the obtained actual processing coordinates are corrected according to a preset standard and laser processing is performed based on the corrected processing coordinates, the above-described step (S200) can be omitted. there is.

Next, laser processing is performed by controlling the position of the laser beam Lc incident on the lens 17 (S300). Specifically, in order to perform laser processing based on the obtained processing coordinates, the laser oscillator 11 outputs a laser beam La. The outputted laser beam La passes through the mirror 15 and is incident on the lens 17 (laser beam Lc). At this time, the laser processing apparatus 10 controls the position of the laser beam Lc incident on the lens 17 by controlling the mirror 15 in correspondence to the obtained processing coordinates and the shape of the workpiece W. can The position of the laser beam Lc incident on the lens 17 may be controlled by at least one of a position of the lens 17 in a circumferential direction and a position of the lens 17 in a radial direction. Accordingly, the position of the laser beam Ld incident on the workpiece W through the lens 17 can be controlled. The position of the laser beam Lc incident on the lens 17 may be controlled according to the shape of the edge of the workpiece W and the slope of the surface to be processed.

The laser processing system 1 and the laser processing method according to the present invention can correct the difference between the design processing coordinates and the actual processing coordinates of the workpiece W. In addition, the laser processing system 1 and the laser processing method according to the present invention control the laser processing apparatus 10 according to the shape of the workpiece W in real time, so that the workpiece W having various shapes can be processed with high precision. can be processed at high speed. In particular, the laser processing system 1 and the laser processing method according to the present invention control the incident path of the laser, so that the processing surface of the workpiece W can be processed at various angles. In addition, the laser processing system 1 and the laser processing method according to the present invention can precisely process the workpiece W including a dielectric.

In this specification, the present invention has been described with a focus on limited embodiments, but various embodiments are possible within the scope of the present invention. Also, although not described, equivalent means will also be incorporated in the present invention as they are. Therefore, the true scope of protection of the present invention will be defined by the claims below.

1: Laser processing system
10: laser processing device
20: inspection device
W: Workpiece

Claims (2)

delete a laser oscillator that outputs a laser beam;
an optical unit disposed between the laser oscillator and the workpiece, and including a lens for injecting the laser beam into the workpiece, and a mirror for injecting the laser beam output from the laser oscillator into the lens; and
A laser processing apparatus comprising a; first controller for controlling the mirror according to the design processing coordinates of the workpiece stored in advance to adjust the position of the laser beam incident on the lens;
The first controller,
In the position of the laser beam incident on the lens, at least one of a position in the circumferential direction and a position in the radial direction of the lens is adjusted to process according to the shape of the edge of the workpiece, A laser processing system for adjusting the angle of the laser beam incident on the workpiece.

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