CN105598579A - Laser processing device and method for carrying out vision positioning based on two coaxial CCDs - Google Patents
Laser processing device and method for carrying out vision positioning based on two coaxial CCDs Download PDFInfo
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- CN105598579A CN105598579A CN201610185805.7A CN201610185805A CN105598579A CN 105598579 A CN105598579 A CN 105598579A CN 201610185805 A CN201610185805 A CN 201610185805A CN 105598579 A CN105598579 A CN 105598579A
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- galvanometer
- laser
- ccd
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser processing device and method for carrying out vision positioning based on two coaxial CCDs. The device comprises a processing platform, a lighting source, a high-transmittance reflector, a first CCD module, a control computer, a laser, a galvanometer and a second CCD module, wherein the processing platform is used for holding a to-be-processed workpiece; the second CCD module is arranged at a light inlet side of the galvanometer and is coaxial with the galvanometer; the control computer is electrically connected with the laser, the first CCD module, the second CCD module and the galvanometer respectively; laser light emitted from the laser irradiates the to-be-processed workpiece through the second CCD module, the galvanometer and the high-transmittance reflector; the light reflected from the to-be-processed workpiece is divided into a first light path and a second light path through the high-transmittance reflector; the first light path enters the first CCD module through the high-transmittance reflector; and the second light path enters the second CCD module through the high-transmittance reflector and the galvanometer. Through combination of the first CCD module and the second CCD module, the vision positioning breadth is expanded; the positioning accuracy is improved; and meanwhile, the problem of repeated accuracy caused by galvanometer drift is solved.
Description
Technical field
The present invention relates to technical field of laser processing, relate in particular to a kind of based on two coaxial CCDCarry out laser processing device and the method for vision location.
Background technology
Laser Processing has become the modern important processing method of manufacturing, and particularly adds in precisionWork, micro-manufacture field, comprise cutting, marking, spray printing, boring, engraving, scanning etc. SwashLight processing be widely used in microelectronics, liquid crystal, diffusion barrier, measurement, automobile, aviation,The field such as nano material, space flight.
Along with scientific and technical development, the accuracy of form and position of modern precision manufacture to Laser Processing,Flexible adaptation, intellectuality and efficiency require more and more higher. The laser-processing system of low requirement does not haveHave vision positioning function, the laser-processing system of high request, conventionally with vision system, comprises otherAxle CCD system and coaxial CCD system etc.
Sight path and the laser optical path of paraxonic CCD system are structurally branches, addMan-hour requirement is rigid is divided into shooting, location, three actions of mobile galvanometer, therefore can cause smallVibration, displacement and the machining deviation of workpiece, simultaneously process velocity slow, affect machining accuracy.
The coaxial CCD system that vision breadth is little exists image to have the problems such as distortion and aberration, because ofThis has limited its range of application and positioning precision. The coaxial CCD system that vision breadth is large is commonExistence cannot overcome the deviations that the drift of galvanometer self causes, need be to frequently to looking when useVision system and galvanometer system are proofreaied and correct, and affect service efficiency and convenience.
In view of this, reality is necessary to provide a kind of lifting positioning precision and can overcomes galvanometer drift and makesThe laser processing of the deviations becoming is to address the deficiencies of the prior art.
Summary of the invention
Technical problem to be solved by this invention is to provide one and carries out based on two coaxial CCDLaser processing device and the method for vision location, it is by the large coaxial CCD mould of vision breadthGroup carries out accurately locating to promote picture quality and positioning precision, meanwhile, little by vision breadthCoaxial CCD module detect in real time galvanometer whether occur skew and occur skew after carry out in timeProofread and correct to overcome the galvanometer defect causing of drifting about.
In order to address the above problem, to the invention provides one and carry out based on two coaxial CCDThe laser processing device of vision location, comprises processing platform for placing workpiece to be processed, establishesBe placed in the lighting source of processing platform top, high speculum, a CCD module, control thoroughlyComputer, laser instrument, galvanometer and be arranged at the light inlet side of galvanometer and with galvanometer coaxial secondCCD module. Control computer respectively with laser instrument, a CCD module, the 2nd CCD mouldGroup, galvanometer are electrically connected. The laser of laser instrument transmitting is through the 2nd CCD module, galvanometer, heightSpeculum exposes to workpiece to be processed thoroughly. The light of workpiece to be processed reflection divides through the saturating speculum of heightBe the first light path and the second light path, the first light path incides a CCD mould through the saturating speculum of heightGroup, the second light path incides the 2nd CCD module through the saturating speculum of height, galvanometer.
Preferably, between laser instrument and the 2nd CCD module, be provided with for laser instrument is sentThe beam expanding lens that laser coaxially expands.
Preferably, the bright dipping side of galvanometer is provided with the field lens for laser is focused on.
In order to address the above problem, the present invention also provides a kind of and has entered based on two coaxial CCDThe laser processing of row vision location, comprises the steps:
Workpiece to be processed is placed on processing platform, and workpiece to be processed is provided with original position point, waits to addWork workpiece or processing platform are fixedly installed identification point.
Lighting source sends illumination beam workpiece to be processed.
The one CCD module gathers the first image information of workpiece to be processed by high speculum thoroughlyAnd the first image information is sent to control computer.
Controlling computer obtains in the galvanometer origin position information and the first image information of galvanometerThe initial Working position information corresponding with original position point.
Control computer according to galvanometer origin position information, initial Working position information and defaultCoordinate system generates control command and causes the galvanometer initial point of galvanometer by control command control galvanometerOverlap with original position point.
The laser that laser instrument sends forms machining beams through galvanometer and exposes to workpiece to be processed to lead toCross machining beams and realize the process operation to workpiece to be processed.
The 2nd CCD module gathers the second image information of workpiece to be processed by high speculum thoroughlyAnd the second image information is sent to control computer, the optical axis of machining beams and the 2nd CCDModule gathers the light shaft coaxle of the second image information.
Control computer according to the identification point positional information of the identification point in the second image information andPreset standard dot position information judges whether galvanometer occurs drift.
If skew appears in galvanometer, control computer according to identification point positional information, preset standard pointPositional information and preset coordinate system generate control command and adjust galvanometer by control command.
Preferably, after the laser that beam expanding lens sends laser instrument coaxially expands, transfer to and shakeMirror.
Preferably, field lens focuses on after processing the laser of galvanometer output, and laser is through thoroughly highSpeculum exposes to workpiece to be processed.
Compared with prior art, the present invention is undertaken by the large coaxial CCD module of vision breadthLocation has promoted positioning precision, meanwhile, real-time by the coaxial CCD module that vision breadth is littleDetect after whether galvanometer occurs skew and occur skew and proofread and correct in time and overcome galvanometer driftThe defect causing, thus promote process velocity and widened range of application.
Brief description of the drawings
Fig. 1 is the laser processing device that the present invention is based on two coaxial CCD and carry out vision locationThe frame structure schematic diagram of a kind of embodiment.
Fig. 2 is the laser processing that the present invention is based on two coaxial CCD and carry out vision locationThe schematic flow sheet of a kind of embodiment.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction withDrawings and Examples, are further elaborated to the present invention. Should be appreciated that this place retouchesThe specific embodiment of stating only, in order to explain the present invention, is not used for limiting the present invention.
Fig. 1 has shown that the present invention is based on two coaxial CCD carries out the Laser Processing of vision locationA kind of embodiment of device. In the present embodiment, should carry out vision based on two coaxial CCDThe laser processing device of location comprises that processing platform 1, the setting for placing workpiece to be processed addsThe lighting source 2 of work platform 1 top, high speculum 3 thoroughly, a CCD module 4, controlComputer 5 processed, laser instrument 7, galvanometer 6 and be arranged at the light inlet side of galvanometer 6 and with shakeThe 2nd CCD module 10 that mirror 6 is coaxial. Wherein, the 2nd CCD module 10 comprises high thoroughly anti-Penetrate mirror 9. Control computer 5 respectively with laser instrument 7, a CCD module 4, the 2nd CCDModule 10, galvanometer 6 are electrically connected. Workpiece to be processed is provided with original position point. Work to be processedPart or processing platform 1 are fixedly installed identification point.
Lighting source 2 sends illumination beam workpiece to be processed, and the light of illuminating bundle existsThere is reflection and be incident to a CCD module 4 through the saturating speculum 3 of height in the surface of workpiece to be processed,The one CCD module 4 gathers the first image information of workpiece to be processed and by the first image informationBe sent to and control computer 5, the optical axis of illuminating bundle and a CCD module 4 gather firstThe light shaft coaxle of image information. Control computer 5 and receive after this first image information, obtainIt is right with original position point to get in the galvanometer origin position information of galvanometer 6 and the first image informationThe initial Working position information of answering. Control computer 5 according to galvanometer origin position information, riseBeginning Working position information and preset coordinate system generates control command and by control command controlGalvanometer 6 causes the galvanometer initial point of galvanometer 6 to overlap with original position point. First of the present embodimentWhat CCD module 4 gathered is the surface reflection of workpiece to be processed and transmits through the saturating speculum 3 of heightWhole light, therefore, the vision breadth of a CCD module 4 is large, therefore, a CCDThe first image information that module 4 obtains is more clear, therefore carries out based on the first image informationThe positioning precision of location is high.
The laser that laser instrument 7 sends forms machining beams through the saturating speculum 9 of height, galvanometer 6 and shinesBe incident upon workpiece to be processed to realize the process operation to workpiece to be processed by machining beams. SecondThe second image information that CCD module 10 gathers workpiece to be processed by the saturating speculum 3 of height also willThe second image information is sent to controls computer 5, the optical axis of machining beams and the 2nd CCD mouldGroup 10 gathers the light shaft coaxle of the second image information. Controlling computer 5 believes according to the second imageIdentification point positional information and the preset standard dot position information of the identification point in breath judge galvanometer 6Whether appearance is drifted about. If skew appears in galvanometer 6, control computer 5 according to identification point positionInformation, preset standard dot position information and preset coordinate system generate control command and pass through and controlGalvanometer 6 is adjusted in order. The 2nd CCD module 10 of the present embodiment is arranged at the light inlet of galvanometer 6Side and coaxial with galvanometer 6. The 2nd CCD module 10 is coaxial and by the 2nd CCD with galvanometer 6Module 10 and galvanometer 6 be same light beam, therefore, the 2nd CCD module 10 can essenceReally and timely detect whether galvanometer occurs drift.
In other embodiment, between laser instrument 7 and the 2nd CCD module 10, be provided with useThe beam expanding lens 8 coaxially expanding in the laser that laser instrument 7 is sent. The present embodiment adoptsBeam expanding lens 8 coaxially expands laser, has improved the angle of divergence of beam propagation, makes lightRoad collimation.
In other embodiment, the bright dipping side of galvanometer 6 is provided with for laser is gatheredBurnt field lens 11. The present embodiment carries out focusing operation by field lens 11 to laser, causesWorkpiece to be processed is less at the hot spot forming, and meets higher precision machined of more precisionDemand.
Fig. 2 has shown that the present invention is based on two coaxial CCD carries out the Laser Processing of vision locationA kind of embodiment of method. In the present embodiment, should carry out vision based on two coaxial CCDThe laser processing of location comprises the steps:
Step S1, workpiece to be processed is placed on processing platform, and workpiece to be processed is provided with start bitPut a little, workpiece to be processed or processing platform are fixedly installed identification point.
Step S2, lighting source sends illumination beam workpiece to be processed.
Step S3, a CCD module gathers first of workpiece to be processed by high speculum thoroughlyImage information is also sent to control computer by the first image information.
Step S4, control computer obtains galvanometer origin position information and first figure of galvanometerThe initial Working position information corresponding with original position point in picture information.
Step S5, controls computer according to galvanometer origin position information, initial Working position letterBreath and preset coordinate system generate control command and cause galvanometer by control command control galvanometerGalvanometer initial point overlap with original position point.
Step S6, the laser that laser instrument sends transfers to and shakes after beam expanding lens coaxially expandsMirror.
Step S7, field lens focuses on and processes the rear machining beams that forms the laser of galvanometer outputExpose to workpiece to be processed to realize workpiece to be processed by machining beams through the saturating speculum of heightProcess operation.
Step S8, the 2nd CCD module gathers second of workpiece to be processed by high speculum thoroughlyImage information is also sent to control computer by the second image information, the optical axis of machining beams andTwo CCD modules gather the light shaft coaxle of the second image information.
Step S9, controls computer according to the identification point position of the identification point in the second image informationPut information and preset standard dot position information and judge whether galvanometer occurs drift. If galvanometer occurs partiallyMove, execution step S10, if there is not skew in galvanometer, execution step S7.
Step S10, controls computer according to identification point positional information, preset standard point position letterBreath and preset coordinate system generate control command and adjust galvanometer by control command, execution stepS1。
Above the detailed description of the invention of invention is had been described in detail, but it is as example,The present invention does not limit and detailed description of the invention described above. For those skilled in the art, any equivalent modifications that this invention is carried out or substitute also all category of the present invention itIn, therefore, do not departing from the equalization conversion of doing under the spirit and principles in the present invention scope and repairingChange, improvement etc., all should contain within the scope of the invention.
Claims (6)
1. carry out a laser processing device for vision location based on two coaxial CCD, its spyLevy and be, comprise processing platform for placing workpiece to be processed, be arranged at processing platform topLighting source, high speculum thoroughly, a CCD module, control computer, laser instrument,Galvanometer and be arranged at the light inlet side of described galvanometer and the two CCD mould coaxial with described galvanometerGroup; Described control computer respectively with described laser instrument, a described CCD module, described inThe 2nd CCD module, described galvanometer are electrically connected; Described in the laser warp of described laser instrument transmittingThe 2nd CCD module, described galvanometer, the saturating speculum of described height expose to described workpiece to be processed;The light of described workpiece to be processed reflection is divided into the first light path and second through the saturating speculum of described heightLight path, described the first light path incides a described CCD module through the saturating speculum of described height,Described the second light path incides described the 2nd CCD mould through the saturating speculum of described height, described galvanometerGroup.
According to claim 1 based on two coaxial CCD carry out vision location swashOptical machining device, is characterized in that, between described laser instrument and described the 2nd CCD module, establishesBe useful on the beam expanding lens that laser that described laser instrument is sent coaxially expands.
According to claim 1 based on two coaxial CCD carry out vision location swashOptical machining device, is characterized in that, the bright dipping side of described galvanometer is provided with for laser is carried outThe field lens focusing on.
4. carry out a laser processing for vision location based on two coaxial CCD, its spyLevy and be, comprise the steps:
Workpiece to be processed is placed on processing platform, and described workpiece to be processed is provided with original position point,Described workpiece to be processed or described processing platform are fixedly installed identification point;
Lighting source sends workpiece to be processed described in illumination beam;
The one CCD module gathers the first image of described workpiece to be processed by the saturating speculum of heightInformation is also sent to control computer by described the first image information;
Control galvanometer origin position information and described the first image letter that computer obtains galvanometerThe initial Working position information corresponding with described original position point in breath;
Control computer according to described galvanometer origin position information, described initial Working position informationAnd preset coordinate system generates control command and causes by galvanometer described in described control command controlThe galvanometer initial point of described galvanometer is overlapped with described original position point;
The laser that laser instrument sends forms machining beams through galvanometer and exposes to described workpiece to be processedTo realize the process operation to described workpiece to be processed by described machining beams;
The 2nd CCD module gathers second of described workpiece to be processed by the saturating speculum of described heightImage information is also sent to described control computer by described the second image information, described processing lightThe optical axis of bundle and described the 2nd CCD module gather the light shaft coaxle of the second image information;
Control computer according to the identification point position of the described identification point in described the second image informationPut information and preset standard dot position information and judge whether described galvanometer occurs drift;
If skew appears in described galvanometer, control computer according to described identification point positional information, instituteState preset standard dot position information and preset coordinate system generation control command also by described controlDescribed galvanometer is adjusted in system order.
According to claim 4 based on two coaxial CCD carry out vision location swashLight processing method, is characterized in that, the laser that beam expanding lens sends described laser instrument carries out coaxiallyAfter expanding, transfer to described galvanometer.
According to claim 4 based on two coaxial CCD carry out vision location swashLight processing method, is characterized in that, field lens focuses on processing to the laser of described galvanometer outputAfter, laser exposes to described workpiece to be processed through the saturating speculum of described height.
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| CN106680286A (en) * | 2016-12-20 | 2017-05-17 | 深圳信息职业技术学院 | Machine vision-based laser processing system and machine vision-based laser processing method |
| CN107052571A (en) * | 2016-12-27 | 2017-08-18 | 深圳信息职业技术学院 | A kind of laser welding apparatus and method for laser welding |
| CN108393589A (en) * | 2018-04-25 | 2018-08-14 | 上海西邦电气有限公司 | A kind of sighting device and application method of laser obstacle eliminating system |
| CN109277695A (en) * | 2018-08-01 | 2019-01-29 | 普聚智能系统（苏州）有限公司 | A kind of laser coaxial vision system suitable for stereochemical structure workpiece |
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Address after: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Applicant after: Innovo laser Polytron Technologies Inc Applicant after: CHANGZHOU YINGWEI LASER TECHNOLOGY CO., LTD. Address before: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Applicant before: Shenzhen Inno Laser Technology Co., Ltd. Applicant before: CHANGZHOU YINGWEI LASER TECHNOLOGY CO., LTD. |
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