CN104972221B - A kind of laser process equipment and Laser Processing focus searching method - Google Patents
A kind of laser process equipment and Laser Processing focus searching method Download PDFInfo
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- CN104972221B CN104972221B CN201410133164.1A CN201410133164A CN104972221B CN 104972221 B CN104972221 B CN 104972221B CN 201410133164 A CN201410133164 A CN 201410133164A CN 104972221 B CN104972221 B CN 104972221B
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Abstract
The present invention proposes a kind of laser process equipment, it includes light combination mirror, scanning galvanometer and the focus lamp that order is placed successively, distinguish incident main laser beam and secondary laser beams in the both sides of the light combination mirror, it also includes the angle of divergence correcting device that the angle of divergence of the secondary laser beams is adjusted, and the angle of divergence correcting device is positioned in the light path of light combination mirror described in the secondary laser beams directive.The laser process equipment can integrate the accurate searching focal position of realization, and can realize real-time tracking Working position, and two beam laser have common focal plane, solve the problems, such as that prior art is present, and improve processing efficiency.The present invention additionally provides one kind to laser machine focus searching method.
Description
Technical field
The present invention relates to laser technology field, more particularly to a kind of laser process equipment and Laser Processing focus searching method.
Background technology
In recent years, continually developed with the laser of industrial process applications, Laser applications in industry is continued to develop.Laser
The characteristics of process technology of device is the monochromaticjty based on laser, high brightness on the focal spot of Laser Focusing to um magnitudes, will form high
The lasing light emitter of energy density, can be with moment heating material surface, so as to cause the physics such as melt material, evaporation and chemical reaction to become
Change, reach the purpose of material processing.Including industrial process applications such as laser engraving, laser welding, laser cuttings.
In processed and applied, no matter which kind of laser, all in the presence of a locating and machining and find focal plane the problem of.Many institute's weeks
Know, for processing laser there is various different-wavebands, infrared laser is invisible due to its in use, focal position without
Method visually obtains, it is therefore desirable to relies on other auxiliary visible rays to reach the purpose of processing instruction.Currently conventional method is main
Have and rely on two-beam visible laser such as 635nm red light semiconductor lasers to aid in seeking burnt (such as Fig. 1), or it is coaxial using auxiliary
635nm red light semiconductor lasers aid in seeking Jiao（Such as Fig. 2）, main laser is coaxially inputted with auxiliary laser by light combination mirror and swept
Tilting mirror is retouched, subsequently into focus lamp, thus auxiliary laser can synchronized tracking with main laser.
But prior art has the following disadvantages：One, can not to realize that main processing laser with auxiliary seeks burnt laser coaxial defeated
Go out；Secondly, can not ensure it is main processing laser and auxiliary seek burnt confocal laser plane（Because optical maser wavelength is different, corresponding to saturating
The refractive index of formula processing camera lens material is penetrated with regard to different, therefore focal plane is with regard to different）, in actual production, seriously govern
Processing efficiency, productivity effect is caused to be difficult to improve.
Specifically, referring to Fig. 1, in prior art one, although auxiliary instruction plane and actual processing can be accomplished
Plane is consistent, but the wavelength due to two-beam 635nm visible lasers and main processing laser is not coaxial, and main laser Working position point occurs
During change, indicators track can not be realized, constrains the flexibility of processing.Referring to Fig. 2, for prior art two, although
Real-time tracking Working position can be realized, but the limitation of this method is that the wavelength of two beam laser is different, passes through focusing system
Focus position it is inconsistent, therefore at this moment auxiliary laser can only play a part of aid in track show, be unable to reach accurately
Find the function that tracks of focal plane.
The content of the invention
In view of the above-mentioned problems, it is an object of the invention to provide a kind of laser process equipment and Laser Processing focus searching method, can
Accurate searching focal position is realized with comprehensive, and real-time tracking Working position can be realized, and there is two beam laser common Jiao to put down
Face, solve the problems, such as that prior art is present, improve processing efficiency.
A kind of laser process equipment, it includes light combination mirror, scanning galvanometer and the focus lamp that order is placed successively, the conjunction beam
Incident main laser beam and secondary laser beams are distinguished in the both sides of mirror, and it also includes the angle of divergence of the secondary laser beams is adjusted
Angle of divergence correcting device, the angle of divergence correcting device is positioned over the light path of light combination mirror described in the secondary laser beams directive
In.
In a better embodiment of the invention, include the main laser of the transmitting main laser beam, the main laser
Using expanding device.
In a better embodiment of the invention, include the laser-assisted of the transmitting secondary laser beams.
In a better embodiment of the invention, the angle of divergence correcting device is arranged at the output window of the laser-assisted
Mouthful towards the side of the light combination mirror.
In a better embodiment of the invention, the angle of divergence correcting device dissipates angle apparatus for adjustable become.
In a better embodiment of the invention, the main laser beam is collimated light beam.
In a better embodiment of the invention, the secondary laser beams are divergent beams or collimated light beam.
In a better embodiment of the invention, the secondary laser beams are wavelength 635nm visible laser.
The present invention additionally provides one kind to laser machine focus searching method, and it comprises the following steps：
S101, main laser is opened, processing on real-time is carried out to sample workpiece according to predetermined pattern using main laser beam, until
The lines of processing meet preparatory condition；
S103, laser-assisted is opened, observe the processing graphic pattern on the sample workpiece；
S105, the angle of divergence by angle of divergence correcting device regulation secondary laser beams, until the manuscript observed
Case reaches default clear requirement.
Relative to prior art, the laser process equipment can realize that secondary laser beams are servo-actuated with the coaxial of main laser beam
Output；And change the angle of divergence of secondary laser beams by angle of divergence correcting device, two beam laser can be reached（Secondary laser beams with
Main laser beam）Focus on conplane purpose.Therefore, range estimation need to only be used using the laser process equipment, work in-process
Mode, you can judge focal position, the size after can even being processed in marking application with preview, add it is possible thereby to significantly improve
The flexibility of work and processing efficiency.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, and in order to allow above and other objects of the present invention, feature and advantage can
Become apparent, below especially exemplified by embodiment, and coordinate accompanying drawing, describe in detail as follows.
Brief description of the drawings
Fig. 1 is the schematic diagram of the laser process equipment of prior art one；
Fig. 2 is the schematic diagram of the laser process equipment of prior art two；
Fig. 3 is the schematic diagram for the laser process equipment that first embodiment of the invention provides；
Fig. 4 is the flow chart for the Laser Processing focus searching method that second embodiment of the invention provides.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is further detailed explanation.
Referring to Fig. 3, first embodiment of the invention provides a kind of laser process equipment 100, it includes order successively and placed
Light combination mirror 10, scanning galvanometer 20, focus lamp 30 and angle of divergence correcting device 40, the both sides of the light combination mirror 10 are incident main respectively
Laser beam and secondary laser beams, the angle of divergence correcting device 40 are positioned over light combination mirror 10 described in the secondary laser beams directive
In light path, for the angle of divergence of the secondary laser beams to be adjusted.
In the present embodiment, the laser process equipment 100 also includes main laser 50 and laser-assisted 60, and the master swashs
Light device 50 and the laser-assisted 60 are respectively placed in the both sides of the light combination mirror 10, and the main laser 50, which is used to launch, to be used
In the main laser beam of main processing, it, which is used, expands device, so that the main laser beam reaches parallel or subparallel state,
Ensure the quality of processing；The laser-assisted 60 is used to launch the secondary laser beams.The master that the main laser 50 is launched
The secondary laser beams that laser beam and the laser-assisted 60 are launched are injected from the both sides of the light combination mirror 10 respectively.
Preferably, the secondary laser beams are wavelength 635nm visible laser.
In the present embodiment, the angle of divergence correcting device 40 is arranged at the output window of the laser-assisted 60 towards institute
State the side of light combination mirror 10, i.e., before described angle of divergence correcting device 40 is positioned over the output window of the laser-assisted 60, by
Secondary laser beams before inciding the light combination mirror 10 can be carried out the regulation of the angle of divergence by this.
Preferably, the angle of divergence correcting device 40 dissipates angle apparatus for adjustable become.
It is understood that the design of camera lens is all based on directional light to set in terms of geometric optics in laser process equipment
Input condition is counted, therefore main laser 50 described in the present embodiment uses and expands device, so that the main laser beam reaches flat
Row or nearly parallel light state.The divergent beams random for the angle of divergence for the secondary laser beams that the laser-assisted 60 exports, put down
Row light beam or nearly collimated light beam.
It is understood that into the laser of two beam different wave lengths of the focus lamp 30, it is a branch of be in divergent transport
Secondary laser beams, a branch of is the main laser beam in parallel transmission, passes through the angle of divergence correcting device 40 and adjusts auxiliary laser
After the angle of divergence of beam, this two beams laser enter the post-concentration of focus lamp 30 focus can on common focal plane, thus,
As long as the focal plane for visually finding secondary laser beams is assured that the focal plane of main laser beam.
It is understood that the main laser 50 is not limited to infrared laser, or ultraviolet laser, green
Light laser or other lasers.Similarly, the laser-assisted 60 can also be the laser of other visible wavelengths, such as may be used
Think the laser of 670nm, 650nm equiwavelength.
Referring to Fig. 4, second embodiment of the invention provides a kind of Laser Processing focus searching method, it comprises the following steps：
S101, main laser is opened, processing on real-time is carried out to sample workpiece according to predetermined pattern using main laser beam, until
The lines of processing meet preparatory condition.
In the present embodiment, the preparatory condition is the line weight degree of processing when processing on real-time is carried out to sample workpiece,
For example the line weight processed reaches Xmm, it can be configured or judge according to actual processing demand.
S103, laser-assisted is opened, observe the processing graphic pattern on the sample workpiece.
S105, the angle of divergence by angle of divergence correcting device regulation secondary laser beams, until the manuscript observed
Case reaches default clear requirement.
In the present embodiment, the clear observation readability required as the processing graphic pattern can be according to actual processing feelings
Condition is judged.
Embodiment
Further illustrated below so that laser marking is applied as an example, first by industrial control system, being inputted in control software needs
Want the character of mark, such as " focus " two word；Then, main laser 50 is opened, carries out repeating processing, uses debugging sample workpiece
Processing on real-time is carried out, while adjusts the processing distance between field lens and sample workpiece, until " focus " two wordline bar of engraving is most
Carefully, it is most suitable focal length now to show existing operating distance；Thereafter, laser-assisted 60 and scanning galvanometer are opened
20, then scanning galvanometer 20 will be visual on the surface of sample workpiece by focus lamp 30 by the track repeating motion of " focus " two word
It was observed that " focus " two word continuously displays；Afterwards, the angle of divergence correcting device 40 before laser-assisted 60 is adjusted, it is auxiliary to change
Help the angle of divergence of laser beam, until " focus " two word can estimate and most clearly indicate position, now show the position also into
For the focal position of secondary laser beams, so far, two beam laser（Main laser beam and secondary laser beams）Confocal plane is reached
It is required that.
It is understood that no matter the workpiece of following process which kind of height, it is only necessary to adjust the distance of field lens and machined surface,
Most clearly position is shown to secondary laser beams, because this position is also necessarily the focal position of main laser beam, therefore, reach
Tracked the effect of the focal plane of sightless main laser beam using visible secondary laser beams.
Relative to prior art, the laser process equipment can realize that secondary laser beams are servo-actuated with the coaxial of main laser beam
Output；And change the angle of divergence of secondary laser beams by angle of divergence correcting device, two beam laser can be reached（Secondary laser beams with
Main laser beam）Focus on conplane purpose.Therefore, range estimation need to only be used using the laser process equipment, work in-process
Mode, you can judge focal position, the size after can even being processed in marking application with preview, add it is possible thereby to significantly improve
The flexibility of work and processing efficiency.
It is described above, only it is embodiments of the invention, any formal limitation not is made to the present invention, although this
Invention is disclosed above with embodiment, but is not limited to the present invention, any person skilled in the art, is not taking off
In the range of technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to equivalent variations
Equivalent embodiment, as long as being without departing from technical solution of the present invention content, the technical spirit according to the present invention is to above example
Any simple modification, equivalent change and modification made, in the range of still falling within technical solution of the present invention.
Claims (7)
1. a kind of laser process equipment, it includes light combination mirror, scanning galvanometer and the focus lamp that order is placed successively, the light combination mirror
Both sides distinguish incident main laser beam and secondary laser beams, it is characterised in that also include the angle of divergence to the secondary laser beams
The angle of divergence correcting device being adjusted, the angle of divergence correcting device are positioned over light combination mirror described in the secondary laser beams directive
Light path in；
The laser process equipment, which is used for processing, which seeks burnt process, includes：Main laser is opened, using main laser beam according to default
Pattern carries out processing on real-time to sample workpiece, until the lines of processing meet preparatory condition；Laser-assisted is opened, described in observation
Processing graphic pattern on sample workpiece；The angle of divergence of secondary laser beams is adjusted by angle of divergence correcting device, until the institute observed
State processing graphic pattern and reach default clear requirement；
Into in the laser of two beam different wave lengths of the focus lamp, a branch of is the secondary laser beams in divergent transport, Yi Shushi
In the main laser beam of parallel transmission, after the angle of divergence that secondary laser beams are adjusted by the angle of divergence correcting device, this two beam swashs
The focus that light enters the focus lamp post-concentration can be on common focal plane；
The laser process equipment also includes the main laser for launching the main laser beam, and the main laser uses and expands dress
Put, so that the main laser beam reaches parallel or subparallel state.
2. laser process equipment as claimed in claim 1, it is characterised in that also include the auxiliary for launching the secondary laser beams
Laser.
3. laser process equipment as claimed in claim 2, it is characterised in that the angle of divergence correcting device is arranged at described auxiliary
The output window of laser is helped towards the side of the light combination mirror.
4. laser process equipment as claimed in claim 1, it is characterised in that the angle of divergence correcting device is sent out for adjustable become
Dissipate angle apparatus.
5. laser process equipment as claimed in claim 1, it is characterised in that the secondary laser beams are divergent beams or parallel
Light beam.
6. laser process equipment as claimed in claim 1, it is characterised in that the secondary laser beams can for wavelength 635nm's
See laser.
7. one kind Laser Processing focus searching method, it is characterised in that comprise the following steps：
S101, main laser is opened, processing on real-time is carried out to sample workpiece according to predetermined pattern using main laser beam, until processing
Lines meet preparatory condition；
S103, laser-assisted is opened, observe the processing graphic pattern on the sample workpiece；
S105, the angle of divergence by angle of divergence correcting device regulation secondary laser beams, until the processing graphic pattern observed reaches
To default clear requirement；
Into in the laser of two beam different wave lengths of focus lamp, a branch of is the secondary laser beams in divergent transport, and a branch of is in flat
Row transmission main laser beam, by the angle of divergence correcting device adjust secondary laser beams the angle of divergence after, this two beams laser enters
The focus for entering the focus lamp post-concentration can be on common focal plane.
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| CN201410133164.1A CN104972221B (en) | 2014-04-03 | 2014-04-03 | A kind of laser process equipment and Laser Processing focus searching method |
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| CN201410133164.1A CN104972221B (en) | 2014-04-03 | 2014-04-03 | A kind of laser process equipment and Laser Processing focus searching method |
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| CN104972221B true CN104972221B (en) | 2017-12-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109434278A (en) * | 2018-11-06 | 2019-03-08 | 大族激光科技产业集团股份有限公司 | A kind of laser processing device and method |
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| CN106964893B (en) * | 2017-05-15 | 2018-11-06 | 中国工程物理研究院激光聚变研究中心 | Laser pre-treated device and processing method for optical element |
| JP7066368B2 (en) * | 2017-10-24 | 2022-05-13 | 住友重機械工業株式会社 | Laser machining machine control device, laser machining method, and laser machining machine |
| CN107717213A (en) * | 2017-11-27 | 2018-02-23 | 广东铭钰科技股份有限公司 | A kind of feux rouges pre-viewing device for laser machine |
| CN109909601A (en) | 2017-12-13 | 2019-06-21 | 京东方科技集团股份有限公司 | A kind of laser-processing system and method |
| CN115315661B (en) * | 2020-03-31 | 2024-05-28 | 青岛海信激光显示股份有限公司 | Laser projection equipment |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1026294C (en) * | 1992-08-07 | 1994-10-26 | 中国科学院上海光学精密机械研究所 | Prism type double-beam dynamic laser focusing aiming indicating device |
| JP2000042775A (en) * | 1998-07-28 | 2000-02-15 | Amada Co Ltd | Laser beam machining method and its device |
| JP2001150171A (en) * | 1999-11-26 | 2001-06-05 | Nippon Sharyo Seizo Kaisha Ltd | Focus adjustment method and apparatus for laser beam machine |
| CN2725044Y (en) * | 2004-07-15 | 2005-09-14 | 武汉众泰数码光电设备有限公司 | Multiheand green laser internal carving machine |
| CN2813333Y (en) * | 2005-01-24 | 2006-09-06 | 武汉众泰数码光电设备有限公司 | Large-width high-speed laser glass internal carving machine |
| CN101856773B (en) * | 2010-04-22 | 2012-08-22 | 广州中国科学院工业技术研究院 | Focusing positioning method based on initial laser processing position and laser processing device |
-
2014
- 2014-04-03 CN CN201410133164.1A patent/CN104972221B/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109434278A (en) * | 2018-11-06 | 2019-03-08 | 大族激光科技产业集团股份有限公司 | A kind of laser processing device and method |
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