CN104439716A - Laser processing system and laser processing method - Google Patents
Laser processing system and laser processing method Download PDFInfo
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- CN104439716A CN104439716A CN201410654900.8A CN201410654900A CN104439716A CN 104439716 A CN104439716 A CN 104439716A CN 201410654900 A CN201410654900 A CN 201410654900A CN 104439716 A CN104439716 A CN 104439716A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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Abstract
The invention discloses a laser processing system which comprises a laser device, a light splitter, a first reflecting mirror assembly, a second reflecting mirror assembly, a first focus lens, a second focus lens, a first displacement adjusting mechanism, a second displacement adjusting mechanism and a processing platform. A single laser beam emitted by the laser device enters the light splitter. The light splitter outputs a first laser beam and a second laser beam. The first laser beam and the second laser beam enter the first focus lens and the second focus lens respectively through the first reflecting mirror assembly and the second reflecting mirror assembly. The first displacement adjusting mechanism and the second displacement adjusting mechanism control the first focus lens and the second focus lens to move respectively so as to be used for adjusting the distance between the two points, on which the first laser beam and the second laser beam are focused in parallel, on the processing platform. The invention further discloses a laser processing method. The processing efficiency is improved by means of light splitting, and the displacement adjusting mechanisms improve the accuracy of products.
Description
Technical field
The invention belongs to technical field of laser processing, particularly relate to a kind of laser-processing system and laser processing.
Background technology
Along with the develop rapidly of laser technology, laser processing technology is also constantly perfect, laser processing technology there is the advantages such as high efficiency, high-quality, high accuracy, so instead of traditional Machining Technology gradually at many manufacture fields due to laser processing technology.At present, the cutting technique of the chip of semicon industry is also from mechanical abrasive cutting technique to no material consumption, and high-precision laser cutting technique is changed.
But when adopting existing laser cutting technique diced chip, the single beam laser source that adopts focuses on more, and therefore, there is the problem of the following aspects: the first, processed product may need repeatedly to process, so that working (machining) efficiency is not high; The second, owing to only having single beam laser light beam, so processed product needs repeatedly cutting processing, so that the accuracy of the product size processed is not high.
In sum, how can improve working (machining) efficiency, also can improve the accuracy of the product size processed, be current technical problem urgently to be resolved hurrily.
Summary of the invention
Main purpose of the present invention is to provide a kind of laser-processing system and laser processing, and what solve the existence of existing laser cutting technique both can not improve working (machining) efficiency, also can improve the technical problem of the accuracy of the product processed.
For achieving the above object, the invention provides a kind of laser-processing system, this laser-processing system comprises laser instrument, spectroscope, first mirror assembly, second mirror assembly, first focus lamp, second focus lamp, first shift adjusting machine, second shift adjusting machine and processing platform, the output of the contiguous described laser instrument of described spectroscope is arranged, described first focus lamp and described second focus lamp are all right against processing platform, described first focus lamp, described second focus lamp is arranged at described first shift adjusting machine respectively, on described second shift adjusting machine, the single beam laser light beam that described laser instrument is launched incides in described spectroscope, described spectroscope exports the first laser beam and the second laser beam, described first laser beam incides in the first focus lamp through the first mirror assembly, described second laser beam incides in the second focus lamp through the second mirror assembly, first shift adjusting machine, described second shift adjusting machine controls described first condenser respectively, the movement of described second condenser lens, for described first laser beam of adjustment, described second laser beam walks abreast the distance between 2 that focus on described processing platform.
Preferably, described laser-processing system also comprises beam expanding lens and total reflective mirror, described beam expanding lens is arranged between described laser instrument and described spectroscope, described total reflective mirror is arranged between described beam expanding lens and described spectroscope, the single beam laser light beam that described laser instrument is launched incides in described beam expanding lens, and the single beam laser light beam through described beam expanding lens incides in spectroscope through described total reflective mirror.
Preferably, described laser-processing system also comprises attenuator, described first mirror assembly comprises the first mirror in front group and the first rearmounted speculum group, described second mirror assembly comprises the second mirror in front group and the second rearmounted transmitting mirror group, described spectroscope exports the first laser beam and the second laser beam, described first laser beam incides in attenuator through described first mirror in front group, described first laser beam through described attenuator incides described first rearmounted speculum group, described first laser beam through described first rearmounted speculum group incides in described first focus lamp, described second laser beam incides in attenuator through described second mirror in front group, described second laser beam through described attenuator incides described second rearmounted speculum group, and described second laser beam through described second rearmounted speculum group incides in described second focus lamp.
Preferably, described laser-processing system also comprises stage driving, described processed product is arranged on described processing platform, described stage driving is for controlling the movement of described processing platform, cut towards processed products for according to the spacing adjusted, form machining locus, the distance that described spacing is described first laser beam, described second laser beam walks abreast focuses on described processing platform between 2.
Preferably, the distance that described first laser beam, described second laser beam walk abreast between 2 that focus on described processing platform is 1um ~ 1cm, and the radial width of described machining locus is 1um ~ 30um.
Preferably, described spectroscope is DOE diffraction spectroscope, the single beam laser light beam that laser instrument is launched by described DOE diffraction spectroscope is divided into described first laser beam and described second laser beam, and the angle between described first laser beam and described second laser beam is 1 ° ~ 80 °;
Described first shift adjusting machine and the second shift adjusting machine are piezoelectric ceramics displacement drive mechanism, Linear Motor Drive Mechanism or driven by servomotor mechanism;
Described laser instrument is solid state laser, gas laser or excimer laser, and the optical maser wavelength that described laser instrument is launched is 10640nm, 1064nm, 532nm, 355nm or 266nm;
Described first mirror assembly comprises at least two the first angle mirror, described second mirror assembly comprises at least two the second angle mirror, described first angle mirror and described second angle mirror are 0 ~ 100% to the reflectivity of the optical maser wavelength that described laser instrument is launched, and reflection angle is 0 ° ~ 180 °.
In addition, for achieving the above object, present invention also offers a kind of laser processing, described laser processing comprises the steps:
The single beam laser light beam light splitting that laser instrument is launched by spectroscope is the first laser beam and the second laser beam;
Described first laser beam imports in the first focus lamp through the first mirror assembly, described second laser beam imports to the second focus lamp through the second mirror assembly, and described first laser beam, described second laser beam walk abreast focus on processing platform through described first focus lamp, described second focus lamp respectively;
Described first shift adjusting machine, described second shift adjusting machine control the movement of described first focus lamp, described second focus lamp respectively, so that the distance that adjustment walks abreast between 2 that focus on described processing platform through described first laser beam of described first focus lamp, described second focus lamp, described second laser beam.
Preferably, the single beam laser light beam light splitting that laser instrument is launched by described spectroscope is that the step of the first laser beam and the second laser beam comprises:
The single beam laser light beam that described laser instrument is launched incides in beam expanding lens, and the single beam laser light beam through described beam expanding lens incides in spectroscope through total reflective mirror;
The light splitting of described single beam laser light beam is the first laser beam and the second laser beam by spectroscope.
Preferably, described first laser beam imports in the first focus lamp through the first mirror assembly, and the step that described second laser beam imports to the second focus lamp through the second mirror assembly comprises:
Described first laser beam incides in attenuator through the first mirror in front group, and described second laser beam incides in attenuator through the first rearmounted speculum group;
Incide the first rearmounted speculum group through described first laser beam in described attenuator, incide the second rearmounted speculum group through described second laser beam in described attenuator;
Described first laser beam through described first rearmounted speculum group incides in described first focus lamp, and described second laser beam through described second rearmounted speculum group incides in described second focus lamp.
Preferably, described first shift adjusting machine, described second shift adjusting machine control the movement of described first focus lamp, described second focus lamp respectively, thus adjustment through described first laser beam of described first focus lamp, described second focus lamp, described second laser beam walk abreast the distance between 2 that focus on described processing platform step after comprise:
Stage driving controls the movement of described processing platform, so that the spacing according to adjusting is cut towards processed products, form machining locus, the distance that described spacing is described first focus lamp, described first laser beam of described second focus lamp, described second laser beam walk abreast focuses on described processing platform between 2.
The single beam laser light beam that laser instrument emits by the present invention, spectroscope is utilized to carry out light-splitting processing outside chamber, become the first laser beam and the second laser beam, first laser beam, the second laser beam walk abreast focus on processing platform through the first focus lamp, the second focus lamps respectively, adopt the first laser beam and the second laser beam to carry out processing process towards processed products simultaneously, this improves working (machining) efficiency.
Simultaneously, first laser beam of the present invention and the second laser beam walk abreast and focus on processing platform, respectively by the first shift adjusting machine, second shift adjusting machine controls the first focus lamp, second focus lamp, to adjust described first laser beam, described second laser beam walks abreast the distance between 2 that focus on described processing platform, on the one hand, can according to producing or the needs of user, adjust the first laser beam at any time, second laser beam walks abreast the distance between 2 that focus on processing platform, on the other hand, according to the spacing cutting processed product adjusted, compare existing single beam laser light beam cutting method, improve the precision of the size of the product processed etc.
figure of description
Fig. 1 is the light-dividing principle schematic diagram of laser-processing system embodiment 1 of the present invention;
Fig. 2 is the light-dividing principle schematic diagram of laser-processing system embodiment 2 of the present invention;
Fig. 3 is the light-dividing principle schematic diagram of laser-processing system embodiment 3 of the present invention;
Fig. 4 is the schematic flow sheet of laser processing embodiment 4 of the present invention;
Fig. 5 is the schematic flow sheet of laser processing embodiment 5 of the present invention;
Fig. 6 is the schematic flow sheet of laser processing embodiment 6 of the present invention.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not used for limiting the present invention.
Embodiment 1
See the light-dividing principle schematic diagram that Fig. 1, Fig. 1 are laser-processing system embodiment 1 of the present invention.
In embodiment 1, the invention provides a kind of laser-processing system, it comprises laser instrument 1, spectroscope 2, first mirror assembly, second mirror assembly, first focus lamp 3, second focus lamp 5, first shift adjusting machine 4, second shift adjusting machine 6 and processing platform 7, the output of the contiguous described laser instrument 1 of described spectroscope 2 is arranged, described first focus lamp 3 and described second focus lamp 5 are all right against processing platform 6, described first focus lamp 3, described second focus lamp 5 is arranged at described first shift adjusting machine 4 respectively, on described second shift adjusting machine 6, the single beam laser light beam that described laser instrument 1 is launched incides in described spectroscope 2, described spectroscope 2 exports the first laser beam and the second laser beam, described first laser beam incides in the first focus lamp 3 through the first mirror assembly, described second laser beam incides in the second focus lamp 5 through the second mirror assembly, first shift adjusting machine 4, described second shift adjusting machine 6 controls described first condenser 3 respectively, the movement of described second condenser lens 5, for described first laser beam of adjustment, described second laser beam walks abreast the distance between 2 that focus on described processing platform 7.
Described first focus lamp 3 is arranged on described first shift adjusting machine 4, and the first shift adjusting machine 4 is for controlling the movement of described first focus lamp 3; Described second focus lamp 5 is arranged on described second shift adjusting machine 6, and the second shift adjusting machine 6 is for controlling the movement of described second focus lamp 5.
What deserves to be explained is, the present invention can according to producing or the needs of user, and the single beam laser light beam that laser instrument 1 occurs by spectroscope 2 is divided into multiple laser light beam, such as: three beams of laser light beam is parallel to be focused on processing platform, so that disposablely process two products, so that working (machining) efficiency is higher.Therefore, owing to adopting light-dividing principle of the present invention, adopt spectroscope 2 single beam laser light beam to be divided into the technical scheme of multiple laser light beam; also technical problem of the present invention can be solved; reach more technique effect, so above-mentioned technical scheme is all within protection scope of the present invention.
The single beam laser light beam that laser instrument 1 emits by the present invention, spectroscope 2 is utilized to carry out light-splitting processing outside chamber, become the first laser beam and the second laser beam, first laser beam, the second laser beam walk abreast through the first focus lamp 3, second focus lamp 5 respectively and focus on processing platform, adopt the first laser beam and the second laser beam to carry out processing process towards processed products simultaneously, this improves working (machining) efficiency.
Simultaneously, first laser beam of the present invention and the second laser beam walk abreast and focus on processing platform 7, respectively by the first shift adjusting machine 4, second shift adjusting machine 6 controls the first focus lamp 3, second focus lamp 5, to adjust described first laser beam, described second laser beam walks abreast the distance between 2 that focus on described processing platform 7, on the one hand, can according to producing or the needs of user, adjust the first laser beam at any time, second laser beam walks abreast the distance between 2 that focus on processing platform 7, on the other hand, according to the spacing cutting processed product adjusted, compare existing single beam laser light beam cutting method, improve the precision of the size of the product processed etc.
Embodiment 2
See the light-dividing principle schematic diagram that Fig. 2, Fig. 2 are laser-processing system embodiment 2 of the present invention.
In example 2, substantially identical with the structure of above-described embodiment 1, difference is, described laser-processing system also comprises beam expanding lens 8 and total reflective mirror 9, described beam expanding lens 8 is arranged between described laser instrument 1 and described spectroscope 2, described total reflective mirror 9 is arranged between described beam expanding lens 8 and described spectroscope 2, and the single beam laser light beam that described laser instrument 1 is launched incides in described beam expanding lens 8, and the single beam laser light beam through described beam expanding lens 8 incides in spectroscope 2 through described total reflective mirror 9.
Beam expanding lens 8 in the present invention has the multiplying power regulatory function of 8 ~ 15 times, known for having the laser-processing system expanding function by first-order theory principle, the waist diameter expanding multiplying power and focal beam spot of beam expanding lens 8 is inversely proportional to, and therefore the beam expanding lens 8 of adjustable multiplying power effectively can control the Energy distribution of the laser beam focusing hot spot of laser-processing system.Meanwhile, the total reflective mirror 9 in the present invention have two dimension angular regulate and along emergent light axis one dimension translational adjustment function.
Embodiment 3
See the light-dividing principle schematic diagram that Fig. 3, Fig. 3 are laser-processing system embodiment 3 of the present invention.
In embodiment 3, substantially identical with the structure of above-described embodiment 1 or 2, difference is, described laser-processing system also comprises attenuator 14, described first mirror assembly comprises the first mirror in front group 10 and the first rearmounted speculum group 11, described second mirror assembly comprises the second mirror in front group 12 and the second rearmounted transmitting mirror group 13, described spectroscope 2 exports the first laser beam and the second laser beam, described first laser beam incides in attenuator 14 through described first mirror in front group 10, described first laser beam through described attenuator 14 incides described first rearmounted speculum group 11, described first laser beam through described first rearmounted speculum group 11 incides in described first focus lamp 3, described second laser beam incides in attenuator 14 through described second mirror in front group 12, described second laser beam through described attenuator 14 incides described second rearmounted speculum group 13, and described second laser beam through described second rearmounted speculum group 13 incides in described second focus lamp 5.
What deserves to be explained is, first mirror in front group 10 and the first rearmounted speculum group 11 of the present invention, can according to producing or the needs of user or other reasons, the angle mirror of more than one piece is set, as the first mirror in front group or the first rearmounted speculum group, the first mirror in front group 10 in the present invention comprises one piece of angle mirror, and the first rearmounted speculum group 11 comprises two pieces of angle mirror.Second mirror in front group 12 and the second rearmounted speculum group 13 is in like manner described.As long as can solve technical problem of the present invention, the first mirror in front group 10 and the first rearmounted speculum group can arrange polylith angle mirror as required.
What deserves to be explained is; the present invention only provides a best embodiment, and front end is not provided with beam expanding lens 8 and total reflective mirror 9 also can solve the technology of the present invention problem, therefore; the technical scheme of beam expanding lens 8 and total reflective mirror 9 is not set between laser instrument 1 and spectroscope 2, within protection scope of the present invention yet.
Attenuator 14 of the present invention is reproducible, is adapted to the decay of the laser of higher-wattage, can arrange the laser power decay of differential declines degree, for the Laser Processing demand of different demand, can meet laser power fast and regulate, and effectively reduce costs.
Further, described laser-processing system also comprises stage driving (depending on not going out in Figure of description), described processed product is arranged on described processing platform 7, described stage driving is for controlling the movement of described processing platform 7, cut towards processed products for according to the spacing adjusted, form machining locus, the distance that described spacing is described first laser beam, described second laser beam walks abreast focuses on described processing platform 7 between 2.
What deserves to be explained is; stage driving of the present invention can be arranged at the bottom of processing platform 7; also other positions of processing platform 7 can be arranged at; as long as driving processing platform 7 that can be stable; ensure that processed product on processing platform 7 can the stage driving of movement stably; equal energy solves technical problem of the present invention, all within protection scope of the present invention.
Further, the distance that described first laser beam, described second laser beam walk abreast between 2 that focus on described processing platform 7 is 1um ~ 1cm, and the radial width of described machining locus is 1um ~ 30um.
The adjusting range of spacing of the present invention is wide, and the radial width scope of machining locus is wide, and therefore, the laser-processing system provided of the present invention, has technique effect applied widely.
Further, described spectroscope 2 is DOE diffraction spectroscope, the single beam laser light beam that laser instrument is launched by described DOE diffraction spectroscope is divided into described first laser beam and described second laser beam, and the angle between described first laser beam and described second laser beam is 1 ° ~ 80 °.
Spectroscope 2 of the present invention is DOE diffraction spectroscope, the single beam laser light beam that laser instrument 1 emits separates multiple laser light beam after DOE diffraction spectroscope: 0 grade, + 1, + 2, the light beams such as+3..., wherein+1 grade of two-beam accounts for more than 80% of gross energy, remainder light beam minimum energy, + 1 grade of two-beam angle 21 is about 36mard (2deg), thus ensures the pattern of laser beam after light splitting and the uniformity of power.
For this reason, the Spiricon M 2-200S laser beam analyzer that present invention applicant uses OPHIR company to produce has carried out the test of the beam-pointing after light splitting power and beam quality, and test result is: the beam-pointing before and after light splitting is all better than 10urad.Beam quality total difference before and after light splitting is little, and compare existing spectroscope scheme, its uniformity has great improvement.
Described first shift adjusting machine 4 and the second shift adjusting machine 6 are piezoelectric ceramics displacement drive mechanism, Linear Motor Drive Mechanism or driven by servomotor mechanism.
The first shift adjusting machine 4 in the present invention and the second shift adjusting machine 6 are XY axle mobile platform, simultaneously, it is high that the first shift adjusting machine 4 in the present invention and the second shift adjusting machine 6 have control resolution, the characteristics such as repeatable accuracy is high, so that the accuracy of the spacing after the first shift adjusting machine 4 and the adjustment of the second shift adjusting machine 6, compare existing guiding mechanism, accuracy is higher.
Described laser instrument is solid state laser, gas laser or excimer laser, and the optical maser wavelength that described laser instrument is launched is 10640nm, 1064nm, 532nm, 355nm or 266nm.
Described first mirror assembly comprises at least two the first angle mirror, described second mirror assembly comprises at least two the second angle mirror, described first angle mirror and described second angle mirror are 0 ~ 100% to the reflectivity of the optical maser wavelength that described laser instrument is launched, and reflection angle is 0 ° ~ 180 °.
Embodiment 4
See the schematic flow sheet that Fig. 4, Fig. 4 are laser processing embodiment 4 of the present invention.
For achieving the above object, the embodiment of the present invention 4 additionally provides a kind of laser processing, and described laser processing comprises the steps:
Step S10, the single beam laser light beam light splitting that laser instrument is launched by spectroscope is the first laser beam and the second laser beam;
Single beam laser light beam launched by laser instrument, and this single beam laser light beam incides in spectroscope, and this single beam laser light beam light splitting is the first laser beam and the second laser beam by this spectroscope.
Step S11, described first laser beam imports in the first focus lamp through the first mirror assembly, described second laser beam imports to the second focus lamp through the second mirror assembly, and described first laser beam, described second laser beam walk abreast focus on processing platform through described first focus lamp, described second focus lamp respectively;
First laser beam focuses on processing platform through the first condenser, and the second laser beam is focused on processing platform by the second focus lamp.
Step S12, described first shift adjusting machine, described second shift adjusting machine control the movement of described first focus lamp, described second focus lamp respectively, so that the distance that adjustment walks abreast between 2 that focus on described processing platform through described first laser beam of described first focus lamp, described second focus lamp, described second laser beam.
The single beam laser light beam that laser instrument emits by the present invention, spectroscope is utilized to carry out light-splitting processing outside chamber, become the first laser beam and the second laser beam, first laser beam, the second laser beam walk abreast focus on processing platform through the first focus lamp, the second focus lamps respectively, adopt the first laser beam and the second laser beam to carry out processing process towards processed products simultaneously, this improves working (machining) efficiency.
Simultaneously, first laser beam of the present invention and the second laser beam walk abreast and focus on processing platform, respectively by the first shift adjusting machine, second shift adjusting machine controls the first focus lamp, second focus lamp, to adjust described first laser beam, described second laser beam walks abreast the distance between 2 that focus on described processing platform, on the one hand, can according to producing or the needs of user, adjust the first laser beam at any time, second laser beam walks abreast the distance between 2 that focus on processing platform, on the other hand, according to the spacing cutting processed product adjusted, compare existing single beam laser light beam cutting method, improve the precision of the size of the product processed etc.
Embodiment 5
See the schematic flow sheet that Fig. 5, Fig. 5 are laser processing embodiment 5 of the present invention.
In embodiment 5, identical with the configuration steps of above-described embodiment 4, difference is, described step S10 comprises:
Step S20, the single beam laser light beam that described laser instrument is launched incides in beam expanding lens, and the single beam laser light beam through described beam expanding lens incides in spectroscope through total reflective mirror;
Step S21, the light splitting of described single beam laser light beam is the first laser beam and the second laser beam by spectroscope.
Beam expanding lens in the present invention has the multiplying power regulatory function of 8 ~ 15 times, known for having the laser-processing system expanding function by first-order theory principle, the waist diameter expanding multiplying power and focal beam spot of beam expanding lens is inversely proportional to, and therefore the beam expanding lens of adjustable multiplying power effectively can control the Energy distribution of the laser beam focusing hot spot of laser-processing system.Meanwhile, the total reflective mirror in the present invention have two dimension angular regulate and along emergent light axis one dimension translational adjustment function.
Embodiment 6
See the schematic flow sheet that Fig. 6, Fig. 6 are laser processing embodiment 6 of the present invention.
In embodiment 6, identical with the configuration steps of above-described embodiment 4 or 5, difference is, described first laser beam imports in the first focus lamp through the first mirror assembly, and the step that described second laser beam imports to the second focus lamp through the second mirror assembly comprises:
Step S30, described first laser beam incides in attenuator through the first mirror in front group, and described second laser beam incides in attenuator through the first rearmounted speculum group;
Step S31, incides the first rearmounted speculum group through described first laser beam in described attenuator, incides the second rearmounted speculum group through described second laser beam in described attenuator;
Step S32, described first laser beam through described first rearmounted speculum group incides in described first focus lamp, and described second laser beam through described second rearmounted speculum group incides in described second focus lamp.
What deserves to be explained is; the present invention only provides a best embodiment, and the technical scheme without step S20 and step S21 also can solve the technology of the present invention problem, therefore; do not comprise the technical scheme of step S20 and step S21, within protection scope of the present invention yet.
Attenuator of the present invention is reproducible, is adapted to the decay of the laser of higher-wattage, can arrange the laser power decay of differential declines degree, for the Laser Processing demand of different demand, can meet laser power fast and regulate, and effectively reduce costs.
Further, described first shift adjusting machine, described second shift adjusting machine control the movement of described first focus lamp, described second focus lamp respectively, thus adjustment through described first laser beam of described first focus lamp, described second focus lamp, described second laser beam walk abreast the distance between 2 that focus on described processing platform step after comprise:
Stage driving controls the movement of described processing platform, so that the spacing according to adjusting is cut towards processed products, form machining locus, the distance that described spacing is described first focus lamp, described first laser beam of described second focus lamp, described second laser beam walk abreast focuses on described processing platform between 2.
What deserves to be explained is; stage driving of the present invention can be arranged at the bottom of processing platform; also other positions of processing platform can be arranged at; as long as driving processing platform that can be stable; ensure that processed product on processing platform can the stage driving of movement stably; equal energy solves technical problem of the present invention, all within protection scope of the present invention.
Be described in detail the detailed description of the invention of invention above, but it is as example, the present invention does not limit and detailed description of the invention described above.For a person skilled in the art, any equivalent modifications or alternative also all among category of the present invention that this invention is carried out, therefore, not departing from the equalization conversion and amendment, improvement etc. done under the spirit and principles in the present invention scope, all should contain within the scope of the invention.
Claims (10)
1. a laser-processing system, it is characterized in that, described laser-processing system comprises laser instrument, spectroscope, the first mirror assembly, the second mirror assembly, the first focus lamp, the second focus lamp, the first shift adjusting machine, second shift adjusting machine and processing platform, the output of the contiguous described laser instrument of described spectroscope is arranged, described first focus lamp and described second focus lamp are all right against processing platform, and described first focus lamp, described second focus lamp are arranged on described first shift adjusting machine, described second shift adjusting machine respectively, the single beam laser light beam that described laser instrument is launched incides in described spectroscope, described spectroscope exports the first laser beam and the second laser beam, described first laser beam incides in the first focus lamp through the first mirror assembly, described second laser beam incides in the second focus lamp through the second mirror assembly, first shift adjusting machine, described second shift adjusting machine controls described first condenser respectively, the movement of described second condenser lens, for described first laser beam of adjustment, described second laser beam walks abreast the distance between 2 that focus on described processing platform.
2. laser-processing system according to claim 1, it is characterized in that, described laser-processing system also comprises beam expanding lens and total reflective mirror, described beam expanding lens is arranged between described laser instrument and described spectroscope, described total reflective mirror is arranged between described beam expanding lens and described spectroscope, the single beam laser light beam that described laser instrument is launched incides in described beam expanding lens, and the single beam laser light beam through described beam expanding lens incides in spectroscope through described total reflective mirror.
3. laser-processing system according to claim 1 and 2, it is characterized in that, described laser-processing system also comprises attenuator, described first mirror assembly comprises the first mirror in front group and the first rearmounted speculum group, described second mirror assembly comprises the second mirror in front group and the second rearmounted transmitting mirror group, described spectroscope exports the first laser beam and the second laser beam, described first laser beam incides in attenuator through described first mirror in front group, described first laser beam through described attenuator incides described first rearmounted speculum group, described first laser beam through described first rearmounted speculum group incides in described first focus lamp, described second laser beam incides in attenuator through described second mirror in front group, described second laser beam through described attenuator incides described second rearmounted speculum group, and described second laser beam through described second rearmounted speculum group incides in described second focus lamp.
4. laser-processing system according to claim 3, it is characterized in that, described laser-processing system also comprises stage driving, described processed product is arranged on described processing platform, described stage driving is for controlling the movement of described processing platform, cut towards processed products for according to the spacing adjusted, form machining locus, the distance that described spacing is described first laser beam, described second laser beam walks abreast focuses on described processing platform between 2.
5. laser-processing system according to claim 4, it is characterized in that, the distance that described first laser beam, described second laser beam walk abreast between 2 that focus on described processing platform is 1um ~ 1cm, and the radial width of described machining locus is 1um ~ 30um.
6. laser-processing system according to claim 1, it is characterized in that, described spectroscope is DOE diffraction spectroscope, the single beam laser light beam that laser instrument is launched by described DOE diffraction spectroscope is divided into described first laser beam and described second laser beam, and the angle between described first laser beam and described second laser beam is 1 ° ~ 80 °;
Described first shift adjusting machine and the second shift adjusting machine are piezoelectric ceramics displacement drive mechanism, Linear Motor Drive Mechanism or driven by servomotor mechanism;
Described laser instrument is solid state laser, gas laser or excimer laser, and the optical maser wavelength that described laser instrument is launched is 10640nm, 1064nm, 532nm, 355nm or 266nm;
Described first mirror assembly comprises at least two the first angle mirror, described second mirror assembly comprises at least two the second angle mirror, described first angle mirror and described second angle mirror are 0 ~ 100% to the reflectivity of the optical maser wavelength that described laser instrument is launched, and reflection angle is 0 ° ~ 180 °.
7. application rights requires a laser processing for 1 ~ 6 arbitrary described laser-processing system, and it is characterized in that, described laser processing comprises the steps:
The single beam laser light beam light splitting that laser instrument is launched by spectroscope is the first laser beam and the second laser beam;
Described first laser beam imports in the first focus lamp through the first mirror assembly, described second laser beam imports to the second focus lamp through the second mirror assembly, and described first laser beam, described second laser beam walk abreast focus on processing platform through described first focus lamp, described second focus lamp respectively;
Described first shift adjusting machine, described second shift adjusting machine control the movement of described first focus lamp, described second focus lamp respectively, so that the distance that adjustment walks abreast between 2 that focus on described processing platform through described first laser beam of described first focus lamp, described second focus lamp, described second laser beam.
8. laser processing according to claim 7, is characterized in that, the single beam laser light beam light splitting that laser instrument is launched by described spectroscope is that the step of the first laser beam and the second laser beam comprises:
The single beam laser light beam that described laser instrument is launched incides in beam expanding lens, and the single beam laser light beam through described beam expanding lens incides in spectroscope through total reflective mirror;
The light splitting of described single beam laser light beam is the first laser beam and the second laser beam by spectroscope.
9. the laser processing according to claim 7 or 8, is characterized in that, described first laser beam imports in the first focus lamp through the first mirror assembly, and the step that described second laser beam imports to the second focus lamp through the second mirror assembly comprises:
Described first laser beam incides in attenuator through the first mirror in front group, and described second laser beam incides in attenuator through the first rearmounted speculum group;
Incide the first rearmounted speculum group through described first laser beam in described attenuator, incide the second rearmounted speculum group through described second laser beam in described attenuator;
Described first laser beam through described first rearmounted speculum group incides in described first focus lamp, and described second laser beam through described second rearmounted speculum group incides in described second focus lamp.
10. laser processing according to claim 9, it is characterized in that, described first shift adjusting machine, described second shift adjusting machine control the movement of described first focus lamp, described second focus lamp respectively, thus adjustment through described first laser beam of described first focus lamp, described second focus lamp, described second laser beam walk abreast the distance between 2 that focus on described processing platform step after comprise:
Stage driving controls the movement of described processing platform, so that the spacing according to adjusting is cut towards processed products, form machining locus, the distance that described spacing is described first focus lamp, described first laser beam of described second focus lamp, described second laser beam walk abreast focuses on described processing platform between 2.
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