CN102837125A - Laser processing device - Google Patents
Laser processing device Download PDFInfo
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- CN102837125A CN102837125A CN2011103560425A CN201110356042A CN102837125A CN 102837125 A CN102837125 A CN 102837125A CN 2011103560425 A CN2011103560425 A CN 2011103560425A CN 201110356042 A CN201110356042 A CN 201110356042A CN 102837125 A CN102837125 A CN 102837125A
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Abstract
The invention provides a laser processing device, which comprises a laser device, a first beam expanding lens group, a first reflector, a tail end reflector, a focusing lens, a second beam expanding lens group and a second reflector, wherein the laser device can output a plurality of wavelength lasers in a plurality of paths, and is capable of outputting a first wavelength laser and a second wavelength laser; a light path through which the first wavelength laser passes is a first light path; the light path through which the second wavelength laser passes is a second light path; the first beam expanding lens group, the first reflector, the tail end reflector and the focusing lens are positioned on the first light path; the first reflector is capable of transmitting the first wavelength laser and reflecting the second wavelength laser to the tail end reflector; the tail end reflector is capable of reflecting the received laser to the focusing lens; the focusing lens is capable of gathering the received laser to a focus point; the second beam expanding lens group and the second reflector are positioned on the second light path; and the second reflector is capable of reflecting the second wavelength to the first reflector, so that the first wavelength laser and the second wavelength laser are focused on the same focus point via the focusing lens by adjusting the distance between the lenses in the first beam expanding lens group and the second beam expanding lens group.
Description
Technical field
The present invention relates to laser technology field, relate in particular to a kind of laser processing device.
Background technology
Because working (machining) efficiency is high, precision is good, laser has replaced traditional capillary processing at present, perforation, diamond cut and punching, the jewel that is widely used in monocrystalline silicon piece cutting-up, resin substrate field such as carve characters.
Different materials is different to the absorption of different wavelength of laser, is not that the short more Laser Processing effect of wavelength is good more.For example, diamond is for visible light and infrared light, and its radiation to short wavelength's (like ultraviolet) has higher absorptivity, so if material to be processed is a diamond, have good effect with short wavelength laser processing; And when diamond is material substrate to be processed, add trade union with short (ultraviolet) wave band of laser substrate is caused damage, influence crudy.
So people can select the processing unit (plant) of different wave length according to the difference of rapidoprint usually, need purchase many laser processing devices but just do like this, hardware cost is very high.
Perhaps on a table apparatus, assemble different component according to light sources with different wavelengths, then whole device becomes bulky, complex structure.
Perhaps use multiple-wavelength laser as light source; The light source of different wave length is inequality in the operating distance that adds man-hour; Be equipped with corresponding focusing objective len according to each wavelength, for example the three-wavelength laser instrument needs three object lens, but adds the laser that can only go out single wavelength man-hour; And use other wavelength will change object lens and also regulate operating distance again, very loaded down with trivial details.
Summary of the invention
The technical problem that the present invention will solve provides a kind of laser processing device, uses any one, need not change focusing objective len during two or more Laser Processings, need not adjust operating distance, has improved operating efficiency, has reduced production cost.
To achieve these goals; According to one aspect of the invention; A kind of laser processing device is provided, comprises: but multichannel is exported the laser instrument of a plurality of wavelength lasers, is suitable for exporting first wavelength laser and second wavelength laser; Wherein the light path of the first wavelength laser process is first light path, and the light path of the second wavelength laser process is second light path; The first beam expanding lens group, first speculum, end reflector and focusing objective len on first light path; Said first speculum is suitable for transmission first wavelength laser and reflects second wavelength laser to said end reflector; Said end reflector is suitable for the laser that receives is reflexed to focusing objective len, and said focusing objective len is suitable for the laser that receives is converged to focus; With the second beam expanding lens group, second speculum on second light path, said second speculum be suitable for reflecting second wavelength laser to said first speculum to be coupled into first light path; Wherein, the said first and second beam expanding lens groups comprise the multi-disc lens, leave through the lenticular spacing of regulating in the said first beam expanding lens group and the second beam expanding lens group, make first wavelength laser and second wavelength laser focus on same focus through focusing objective len.
Optional, said focusing objective len is microcobjective or catoptric lens.
Optional, but said multichannel is exported the pulsewidth form of laser of the laser instrument output of a plurality of wavelength lasers and is comprised nanosecond laser, picosecond laser and femtosecond laser.
Optional, but said multichannel export the laser instrument of a plurality of wavelength lasers and also be suitable for exporting three-wavelength laser, the light path of said three-wavelength laser process is the 3rd light path; Said laser processing device also comprises the 3rd beam expanding lens group, the 3rd speculum on the 3rd light path, and said the 3rd speculum is suitable for transmission second wavelength laser and reflects three-wavelength laser to first speculum; Said first speculum also is suitable for reflecting three-wavelength laser it is coupled into first light path.
Optional, but said multichannel export the laser instrument of a plurality of wavelength lasers and also be suitable for exporting the 4th wavelength laser, the light path of said the 4th wavelength laser process is the 4th light path; Said laser processing device also comprises the 4th beam expanding lens group, the 4th speculum on the 4th light path, and said the 4th speculum is suitable for transmission second wavelength laser and reflects the 4th wavelength laser to first speculum; Said the 3rd speculum also is suitable for transmission the 4th wavelength laser to said first speculum; Said first speculum also is suitable for reflecting the 4th wavelength laser it is coupled into first light path.
Optional, the wavelength of said first wavelength laser is 355nm; The wavelength of said second wavelength laser is 1064nm; Said three-wavelength Wavelength of Laser is 532nm.
Optional, said first speculum plating 355nm45 degree increases transmission film, 532nm and 1064nm45 degree highly reflecting films; Said the 3rd speculum plating 1064nm45 degree increases transmission film, 532nm45 degree highly reflecting films; Said second speculum plating 1064nm45 degree highly reflecting films; Said end reflector plating 355nm, 532nm and 1064nm45 degree highly reflecting films.
Optional, said laser processing device also comprises vacuum cup and four-dimensional accurate electronic control translation stage; Said vacuum cup absorption processing object, thus the influence that environmental vibration causes processing reduced; Said vacuum cup is fixed on the four-dimensional accurate electronic control translation stage; The accurate electronic control translation stage of the said four-dimension can linear movement and is rotatablely moved.
Optional, the lens type in the said beam expanding lens group is convex lens or concavees lens.
With prior art elder generation ratio, the invention has the advantages that:
(1) lenticular spacing leaves in the utilization adjusting beam expanding lens group, makes different wavelength of laser can focus on same along, so use a focusing objective len to focus on multiple laser, need not change focusing objective len.
(2) the laser line focus object lens back focus of a plurality of wavelength when machining composite material, can select to adopt the optical maser wavelength number of processing at same position according to material, can realize the time processing moulding, does not need to process repeatedly.
Description of drawings
Fig. 1 is the light path sketch map of the laser processing device that provides in the one embodiment of the invention;
Fig. 2 is a beam expanding lens group structural representation among Fig. 1;
Fig. 3 regulates among Fig. 2 the beam expanding lens group to change the sketch map of focus;
Fig. 4 is 355nm in the one embodiment of the invention, the focal beam spot sketch map of 532nm and 1064nm wavelength laser.
The specific embodiment
In order to make the object of the invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing, to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
In one embodiment of the present of invention, a kind of laser processing device is provided.As shown in Figure 1; This laser processing device comprises: can three the tunnel laser instrument 101 of three wavelength lasers of output; Beam expanding lens group 102, speculum 103～106 and focusing objective len 107, vacuum cup 109 and four-dimensional accurate electronic control translation stage 110 on the laser optical path of laser instrument 101 outputs.
Wherein, laser instrument 101 exportable optical maser wavelengths are respectively 1064nm (being fundamental frequency light), 532nm (i.e. two frequency doubled lights) and 355nm (being frequency tripling light).Power is: 15W during 1064nm, 7.5W during 532nm, 3W during 355nm.Repetition rate is 10KHz, and pulse width is 13ps.
Preferably because power when 355nm is minimum, in order to reduce power loss, the laser of 355nm should be before arriving focusing objective len 107 eyeglass of process minimum.Therefore, as shown in Figure 1, the wavelength of three beams of laser is 355nm, 532nm and 1064nm from top to bottom successively.
Preferably, laser instrument 101 has and can select output function.That is: the laser of exportable any wavelength, the laser of the laser of two wavelength or three wavelength is exported simultaneously.
The plated film kind of speculum 103～speculum 106 is respectively: speculum 103 plating 355nm45 degree increase transmission film, 532nm and 1064nm45 degree highly reflecting films; Speculum 104 plating 1064nm45 degree increase transmission film, 532nm45 degree highly reflecting films; Speculum 105 plating 1064nm45 degree highly reflecting films; Speculum 106 platings 45 degree 355nm, 532nm and 1064nm highly reflecting films.Thereby speculum 103～106 becomes: frequency tripling or quadruple frequency light transmission, two frequency doubled lights and fundamental frequency light reflection mirror 103; The reflection of two frequency doubled lights, fundamental frequency light diaphotoscope 104; Fundamental frequency light reflection mirror 105; Fundamental frequency light, two frequency doubled lights and frequency tripling or quadruple frequency light completely reflecting mirror 106.
Said gathering object lens 107 can be catoptric lens or microcobjective, can laser be focused on the focus, and this focus is positioned at processing object 108 surfaces; This surface is operating distance 111 to the distance of focusing objective len 107.Processing object 108 is attracted on the vacuum cup 109, and purpose is to reduce the influence that environmental vibration causes processing.Vacuum cup 109 is fixed on the four-dimensional accurate electronic control translation stage 110.Four-dimensional accurate electronic control translation stage 110 is by computer control, can realize linear movement and rotatablely moves.In the present embodiment, focusing objective len is a microcobjective.Effective focal length is 40.9mm, and numerical aperture is 0.3.
355nm, 532nm and 1064nm wavelength directional light are through same focusing objective len, and the 355nm light wavelength is short, and refractive index is big, focus at first, and its focal length focusing objective len is nearest; Being 532nm light then, is 1064nm light at last.Though the coaxial focusing objective len that incides of this three-beam, focus occurs three, Here it is aberration.In the present embodiment, said beam expanding lens group 102 comprises two lens, and lens 301 and lens 302 are as shown in Figure 2.Wherein, the focal length of lens 301 is f1, and the focal length of lens 302 is f2, and the distance between lens 301 and the lens 302 is d, and then the account form of the focal distance f of beam expanding lens group 102 is following:
Analyze this formula, if d increases, then f increases, and then incident ray will converge in farther place.
With reference to figure 3, the left side is an incident light, when increasing apart from d between lens 301 and the lens 302; Emergent ray is parallel no longer fully, and angle increase (being light) D1 will increase between the light, through two speculums, 401,402 backs (speculum does not change the trend of light); D2, D3 also will increase; Pass through focusing objective len 107 at last, the distance B of focus ' greater than D, promptly focus 1071 is further from focusing objective len 107.
Based on above-mentioned analysis, with reference to figure 1, with one in said three focuses for example the focus of 532nm light (through beam expanding lens group 1022) through focusing objective len 107 be benchmark; Enlarge in the beam expanding lens group 1021 distance between two lens, the light of the 355nm wavelength focus through focusing objective len 107 is moved down, overlap with the 532nm corresponding focus; Dwindle in the beam expanding lens group 1023 distance between two lens, the light of 1064nm wavelength is moved through on the focus of focusing objective len 107, overlap with the 532nm corresponding focus; Said three focuses are adjusted to same position.The lens position in the beam expanding lens group 102 is fixed, so just having guaranteed to add the man-hour operating distance is definite value again.
In other embodiments of the invention, the lens in the said beam expanding lens group can be convex lens or concavees lens, can comprise the multi-disc lens.
As shown in Figure 4; The position of focal beam spot is all on processing object 108 surfaces; Wherein hot spot 301 is the laser focal beam spot of 1064nm wavelength (diameter is about 12 microns); Hot spot 302 is the laser focal beam spot of 532nm wavelength (diameter is about 6 microns), and hot spot 303 is the laser focal beam spot of 355nm wavelength (diameter is about 4 microns).
In other embodiments of the invention; But above-mentioned laser processing device can comprise the laser instrument of multichannel (more than or equal to two-way) output laser; Through adjusting the lenticular spacing in the beam expanding lens group in each road laser optical path; Make multi-path laser focus on same point, guarantee that the operating distance in the processing is constant through focusing objective len.
Laser processing device of the present invention can provide multi-wavelength's laser to export through same light path, need not change original paper.Not only practiced thrift cost, and easy to adjust simple, have application promise in clinical practice.
Should be noted that and understand, under the situation that does not break away from the desired the spirit and scope of the present invention of accompanying Claim, can make various modifications and improvement the present invention of above-mentioned detailed description.Therefore, the scope of the technical scheme of requirement protection does not receive the restriction of given any specific exemplary teachings.
Claims (9)
1. laser processing device comprises:
But multichannel is exported the laser instrument of a plurality of wavelength lasers, is suitable for exporting first wavelength laser and second wavelength laser, and wherein the light path of the first wavelength laser process is first light path, and the light path of the second wavelength laser process is second light path;
The first beam expanding lens group, first speculum, end reflector and focusing objective len on first light path; Said first speculum is suitable for transmission first wavelength laser and reflects second wavelength laser to said end reflector; Said end reflector is suitable for the laser that receives is reflexed to focusing objective len, and said focusing objective len is suitable for the laser that receives is converged to focus; With
The second beam expanding lens group on second light path, second speculum, said second speculum be suitable for reflecting second wavelength laser to said first speculum to be coupled into first light path;
Wherein, the said first and second beam expanding lens groups comprise the multi-disc lens, leave through the lenticular spacing of regulating in the said first beam expanding lens group and the second beam expanding lens group, make first wavelength laser and second wavelength laser focus on same focus through focusing objective len.
2. laser processing device according to claim 1, wherein, said focusing objective len is microcobjective or catoptric lens.
3. laser processing device according to claim 1, wherein, but said multichannel is exported the pulsewidth form of laser of the laser instrument output of a plurality of wavelength lasers and is comprised nanosecond laser, picosecond laser and femtosecond laser.
4. laser processing device according to claim 1, wherein,
But said multichannel is exported the laser instrument of a plurality of wavelength lasers and also is suitable for exporting three-wavelength laser, and the light path of said three-wavelength laser process is the 3rd light path;
Said laser processing device also comprises the 3rd beam expanding lens group, the 3rd speculum on the 3rd light path, and said the 3rd speculum is suitable for transmission second wavelength laser and reflects three-wavelength laser to first speculum;
Said first speculum also is suitable for reflecting three-wavelength laser it is coupled into first light path.
5. laser processing device according to claim 4, wherein,
But said multichannel is exported the laser instrument of a plurality of wavelength lasers and also is suitable for exporting the 4th wavelength laser, and the light path of said the 4th wavelength laser process is the 4th light path;
Said laser processing device also comprises the 4th beam expanding lens group, the 4th speculum on the 4th light path, and said the 4th speculum is suitable for transmission second wavelength laser and reflects the 4th wavelength laser to first speculum;
Said the 3rd speculum also is suitable for transmission the 4th wavelength laser to said first speculum;
Said first speculum also is suitable for reflecting the 4th wavelength laser it is coupled into first light path.
6. laser processing device according to claim 4, wherein,
The wavelength of said first wavelength laser is 355nm;
The wavelength of said second wavelength laser is 1064nm;
Said three-wavelength Wavelength of Laser is 532nm.
7. laser processing device according to claim 6, wherein,
Said first speculum plating 355nm45 degree increases transmission film, 532nm and 1064nm45 degree highly reflecting films;
Said the 3rd speculum plating 1064nm45 degree increases transmission film, 532nm45 degree highly reflecting films;
Said second speculum plating 1064nm45 degree highly reflecting films;
Said end reflector plating 355nm, 532nm and 1064nm45 degree highly reflecting films.
8. laser processing device according to claim 1 also comprises vacuum cup and four-dimensional accurate electronic control translation stage;
Said vacuum cup absorption processing object, thus the influence that environmental vibration causes processing reduced;
Said vacuum cup is fixed on the four-dimensional accurate electronic control translation stage;
The accurate electronic control translation stage of the said four-dimension can linear movement and is rotatablely moved.
9. the lens type in the laser processing device according to claim 1, said beam expanding lens group is convex lens or concavees lens.
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Cited By (10)
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| CN105425402A (en) * | 2016-01-05 | 2016-03-23 | 王美航 | Fixed-distance laser beam combining device |
| CN106197258A (en) * | 2016-07-14 | 2016-12-07 | 中国科学院上海光学精密机械研究所 | Dual pathways dual wavelength interference checking device |
| WO2017140265A1 (en) * | 2016-02-18 | 2017-08-24 | 上海微电子装备（集团）股份有限公司 | Exposure system, exposure device and exposure method |
| CN108318800A (en) * | 2017-12-30 | 2018-07-24 | 北京工业大学 | A kind of GaN base semiconductor laser chip detection device and method |
| CN109088300A (en) * | 2018-08-30 | 2018-12-25 | 吉林省科英激光股份有限公司 | A kind of three wavelength laser generators with built-in power detection device |
| CN110587122A (en) * | 2019-10-28 | 2019-12-20 | 中国科学院上海光学精密机械研究所 | Pretreatment device and treatment method for damage performance of laser material |
| WO2021157546A1 (en) * | 2020-02-05 | 2021-08-12 | パナソニックＩｐマネジメント株式会社 | Laser processing apparatus |
| CN114577965A (en) * | 2022-03-25 | 2022-06-03 | 陕西周源光子科技有限公司 | Photoelectric detection system for liquid chromatograph |
| CN115032806A (en) * | 2022-04-22 | 2022-09-09 | 北京遥测技术研究所 | Multi-wavelength laser beam expanding method and beam expanding system |
| US11914269B2 (en) | 2020-09-11 | 2024-02-27 | Industrial Technology Research Institute | Laser processing system |
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Cited By (13)
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| CN105425402A (en) * | 2016-01-05 | 2016-03-23 | 王美航 | Fixed-distance laser beam combining device |
| US10942458B2 (en) | 2016-02-18 | 2021-03-09 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Exposure system, exposure device and exposure method |
| WO2017140265A1 (en) * | 2016-02-18 | 2017-08-24 | 上海微电子装备（集团）股份有限公司 | Exposure system, exposure device and exposure method |
| CN106197258A (en) * | 2016-07-14 | 2016-12-07 | 中国科学院上海光学精密机械研究所 | Dual pathways dual wavelength interference checking device |
| CN106197258B (en) * | 2016-07-14 | 2019-06-18 | 中国科学院上海光学精密机械研究所 | Binary channels dual wavelength interference checking device |
| CN108318800A (en) * | 2017-12-30 | 2018-07-24 | 北京工业大学 | A kind of GaN base semiconductor laser chip detection device and method |
| CN108318800B (en) * | 2017-12-30 | 2020-06-26 | 北京工业大学 | GaN-based semiconductor laser chip detection device and method |
| CN109088300A (en) * | 2018-08-30 | 2018-12-25 | 吉林省科英激光股份有限公司 | A kind of three wavelength laser generators with built-in power detection device |
| CN110587122A (en) * | 2019-10-28 | 2019-12-20 | 中国科学院上海光学精密机械研究所 | Pretreatment device and treatment method for damage performance of laser material |
| WO2021157546A1 (en) * | 2020-02-05 | 2021-08-12 | パナソニックＩｐマネジメント株式会社 | Laser processing apparatus |
| US11914269B2 (en) | 2020-09-11 | 2024-02-27 | Industrial Technology Research Institute | Laser processing system |
| CN114577965A (en) * | 2022-03-25 | 2022-06-03 | 陕西周源光子科技有限公司 | Photoelectric detection system for liquid chromatograph |
| CN115032806A (en) * | 2022-04-22 | 2022-09-09 | 北京遥测技术研究所 | Multi-wavelength laser beam expanding method and beam expanding system |
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Application publication date: 20121226 |