CN103645563A - Laser shaping device - Google Patents
Laser shaping device Download PDFInfo
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- CN103645563A CN103645563A CN201310725412.7A CN201310725412A CN103645563A CN 103645563 A CN103645563 A CN 103645563A CN 201310725412 A CN201310725412 A CN 201310725412A CN 103645563 A CN103645563 A CN 103645563A
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- shaping device
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Abstract
The invention provides a laser shaping device. The laser shaping device comprises a laser emitter, a beam expanding lens, a spatial filter, a shaping lens and a focus lens; the spatial filter is arranged on an optical path of laser beams and arranged between the laser emitter and the focus lens; the shaping lens is arranged on the optical path of the laser beams and arranged between the spatial filter and the focus lens; the laser beams pass through the shaping lens and accordingly gauss beams emitted from the laser emitter are converted into flat-topped beams. According to the laser shaping device, the laser beams are converted into the flat-topped beams which are uniform in energy density distribution through the beam shaping lens, the energy distribution of the laser beams is the gauss distribution, and accordingly the shaped flat-topped beams can obtain good slit cutting effect and efficiency in comparison with the beams which are in gauss distribution, the slit edge can be smooth without burr, heat effect or taper and the like, and the application in the micro manufacture filed of a laser shaping cutting slit is expanded.
Description
Technical field
The present invention relates to laser shaping technical field, relate in particular to a kind of laser shaping device.
Background technology
At present, laser is widely used in slit cutting field, and slit sheet is generally used for spectrometer accessory, scientific research field, projector etc.Little of radio, greatly in the industries such as space industry, oil drilling equipment, food, chemical analysis, wherein be applied to medical treatment, optics, the material behavior of scientific research field and slit fine degree is had to very high requirement, traditional cut slit, the gauss laser beam central energy density of being launched by generating laser is maximum, while expanding to edge from beam center, energy density diminishes gradually, in the process of cutting slit, there will be edge ablation, burr and tapering excessive, transmittance is reduced greatly.
Summary of the invention
The object of the present invention is to provide a kind of laser shaping device, its gauss laser beam that can generating laser be sent by shaping mirror becomes flat-top laser beam.
For achieving the above object, the invention provides a kind of laser shaping device, it comprises:
Generating laser;
Beam expanding lens;
Spatial filter;
Shaping mirror;
Focus lamp;
Wherein, described spatial filter is arranged between described generating laser and described focus lamp in the light path of laser beam, described shaping mirror is arranged between described spatial filter and described focus lamp in the light path of laser beam, described laser beam, by described shaping mirror, becomes flat top beam by the Gaussian beam of sending from described generating laser.
As a further improvement on the present invention, described shaping mirror comprises upper surface and lower surface, and described upper surface is carved with some grooves, the setting that is square of described groove, and described lower surface is set to plane.
As a further improvement on the present invention, described some grooves are concentric setting.
As a further improvement on the present invention, described laser shaping device also comprises galvanometer, and described galvanometer is arranged between described shaping mirror and described focus lamp in the light path of laser beam, and described galvanometer can be controlled described laser beam and move along X, Y-direction.
As a further improvement on the present invention, described laser shaping device also comprises catoptron, and described catoptron is arranged between described generating laser and described spatial filter in the light path of laser beam.
As a further improvement on the present invention, the quantity of described catoptron is two.
As a further improvement on the present invention, described beam expanding lens is arranged between described generating laser and described catoptron in the light path of laser beam.
As a further improvement on the present invention, the hole diameter of described spatial filter is 4.2mm.
As a further improvement on the present invention, the operation wavelength of described shaping mirror is 355nm, and effective aperture is 8.5mm, and input spot size is 4mm (1/e
2), spot size is 0.17 * 0.17 milliradian, hot spot pattern is flat-top hot spot.
As a further improvement on the present invention, the material of described shaping mirror is fused quartz.
The invention has the beneficial effects as follows: the laser beam that the present invention is Gaussian distribution by beam shaping mirror by energy distribution is converted to the uniform flat top beam of energy density distribution, the light beam that is gauss laser than energy distribution, flat top beam after shaping can obtain better slit cutting effect and efficiency, can make slit edge-smoothing without burr, without heat affecting, the advantages such as zero draft, have expanded the application of laser shaping cutting slit in micro-manufacture field.
Accompanying drawing explanation
Fig. 1 is the structural representation of laser shaping device in one embodiment of the invention;
Fig. 2 is the vertical view of shaping mirror in one embodiment of the invention;
Fig. 3 be in one embodiment of the invention in slit cutting the laser of Gaussian distribution and the comparison diagram of the flat-top laser motion after shaping;
Fig. 4 is the laser of Gaussian distribution in one embodiment of the invention and the flat-top cut slit effect contrast figure after shaping.
Embodiment
Below with reference to each embodiment shown in the drawings, describe the present invention.But these embodiments do not limit the present invention, the conversion in the structure that those of ordinary skill in the art makes according to these embodiments, method or function is all included in protection scope of the present invention.
Technical solution of the present invention is: a kind of laser shaping device.
The embodiment of the invention shown in ginseng Fig. 1, described laser shaping device, output terminal at generating laser 10 is provided with beam expanding lens 20, output terminal at this beam expanding lens 20 is provided with two catoptrons 30 and 40, this catoptron 30 and 40 is plane mirror, reflection output terminal at catoptron 40 is provided with shaping mirror 60, between catoptron 40 and shaping mirror 60, be provided with spatial filter 50, output terminal in shaping mirror 60 is provided with galvanometer 70, output terminal at galvanometer 70 is provided with focus lamp 80, and workpiece 90 is arranged on the output terminal of focus lamp 80.
Generating laser 10, produces pulsed laser beam, preferably, adopts the ultraviolet Q-switched pulse laser that wavelength is 355nm, and pulsewidth is picosecond magnitude, M
2be less than 1.3.Ultra-Violet Laser, because of its intrinsic characteristic, when with material effects, is by interrupting the chemical bond of material, molecule to be peeled off, and belongs to cold working, makes can greatly reduce heat-affected zone in this way.Generating laser 10 horizontal positioned.
Beam expanding lens 20, for changing diameter and the angle of divergence of laser beam.The laser beam of sending from generating laser 10 has certain angle of divergence, only has the adjusting by beam expanding lens just can make laser beam become collimated light beam.
Preferably, in the present embodiment, the input wavelength of shaping mirror 60 is 355nm, and effective aperture is 8.5mm, and input spot size is 4mm (1/e
2), spot size is 0.17 * 0.17 milliradian, and hot spot pattern is flat-top hot spot, and input beam pattern is TEM00 basic mode, and operating distance is infinity.
At this, it is worth mentioning that, spatial filter 50 is equivalent to add a diaphragm in light path, reduces the M of laser beam
2, be combined together use with shaping mirror 60, be not only conducive to flat top beam and produce, also helpful to cut edge steepness.
Catoptron 30 and catoptron 40, preferably, adopt plane mirror, be arranged between beam expanding lens 20 and spatial filter 50, be used for changing the direction of propagation of light path, here used 40 two catoptrons of catoptron 30 and catoptron, object is that before laser beam enters spatial filter 50, whether the emission angle of photometry bundle meets testing requirement in order to extend light path.
It is worth mentioning that, laser shaping device also comprises galvanometer 70, laser beam is directly incident on the eyeglass (not shown) in galvanometer 70, motor in galvanometer 70 can drive this eyeglass to move, thereby controlling laser beam moves along X, Y-direction, in moving process, the workpiece 90 on motion track is pulverized and is come off, thereby press cutting profile, forms cutting slit.Certainly, those skilled in the art can expect easily, if do not use galvanometer 70, workpiece 90 moves also and can realize along X, Y-direction.
Continue shown in ginseng Fig. 1 and Fig. 2, when this device cuts for slit, generating laser 10 sends the laser beam directive beam expanding lens 20 that energy distribution is Gaussian distribution, the laser beam that the energy distribution that obtains collimation is Gaussian distribution, enter catoptron 30 and 40, when changing the direction of propagation of light, also extended light path, whether this emission angle that is conducive to detect light meets the requirements, then enter spatial filter 50, spatial filter 50 is apertures of a planar structure, the diameter in its hole is 4.2mm, laser beam by aperture by clutter filtering, the laser beam that makes energy be distributed as Gaussian distribution is optimized, reduce the M of laser beam
2, obtain smooth pure sphere or plane wave, this and then incident shaping mirror of laser beam 60 that is Gaussian distribution through the energy distribution of spatial filter optimization, shaping mirror 60 is carved with some deep mixed grooves 61 at the upper surface of the incident direction towards laser beam in the position near the center of circle, groove 61 is square, be concentric setting, energy distribution is that the laser beam of Gaussian distribution is directly converted into the uniform flat-top laser beam of energy distribution through groove 61, spatial filter 50 is combined together use with shaping mirror 60, not only being conducive to flat top beam produces, also helpful to the edge steepness of cutting slit, the lower surface of shaping mirror 60 is provided with gives permeable membrane, make to interfere and strengthen, increase the transmitance of laser beam, prevent that thereby laser beam from reflecting away and causing energy loss when incident.The uniform flat-top laser beam of energy distribution is the eyeglass in incident galvanometer 70 (in figure for indicating) subsequently, this eyeglass can be along moving along X, Y-direction by the driven by motor in galvanometer 70, the flat-top laser beam that the moving belt energy of eyeglass is evenly distributed moves, and controls cut position.Output terminal at galvanometer 70 is also provided with focus lamp 80, flat-top laser beam incides focus lamp 80 from galvanometer 70, and flat-top laser beam is focused and forms the surface that hot spot acts on workpiece 90, for the material of different-thickness, give focus the corresponding amount of feeding, until cut workpiece completely.
As shown in Figure 3, in tradition cutting, because hot spot 12 energy present Gaussian distribution, at the marginal existence of Cutting Road, fail the material 11 of removing, along with the motion of hot spot, Cutting Road presents the narrow phenomenon of width gradually.Energy distribution is that the hot spot of Gaussian distribution becomes the uniform flat-top hot spot of energy distribution after shaping, because energy distribution is even, there will not be and has the material of not removing, and Cutting Road width is consistent.
As shown in Figure 4, adopt the flat-top laser beam cutting slit after beam shaping to there is larger advantage, can accomplish that less seam is wide, better edge effect, higher efficiency, compares traditional cut slit, has avoided edge ablation, burr, tapering is excessive, and transmittance is reduced greatly.
Be to be understood that, although this instructions is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of instructions is only for clarity sake, those skilled in the art should make instructions as a whole, technical scheme in each embodiment also can, through appropriately combined, form other embodiments that it will be appreciated by those skilled in the art that.
Listed a series of detailed description is above only illustrating for feasibility embodiment of the present invention; they are not in order to limit the scope of the invention, all disengaging within equivalent embodiment that skill spirit of the present invention does or change all should be included in protection scope of the present invention.
Claims (10)
1. a laser shaping device, is characterized in that, described laser shaping device comprises:
Generating laser;
Beam expanding lens;
Spatial filter;
Shaping mirror;
Focus lamp;
Wherein, described spatial filter is arranged between described generating laser and described focus lamp in the light path of laser beam, described shaping mirror is arranged between described spatial filter and described focus lamp in the light path of laser beam, described laser beam, by described shaping mirror, becomes flat top beam by the Gaussian beam of sending from described generating laser.
2. a kind of laser shaping device according to claim 1, is characterized in that, described shaping mirror comprises upper surface and lower surface, and described upper surface is carved with some grooves, the setting that is square of described groove, and described lower surface is set to plane.
3. a kind of laser shaping device according to claim 2, is characterized in that, described some grooves are concentric setting.
4. a kind of laser shaping device according to claim 1, it is characterized in that, described laser shaping device also comprises galvanometer, and described galvanometer is arranged between described shaping mirror and described focus lamp in the light path of laser beam, and described galvanometer can be controlled described laser beam and move along X, Y-direction.
5. a kind of laser shaping device according to claim 1, is characterized in that, described laser shaping device also comprises catoptron, and described catoptron is arranged between described generating laser and described spatial filter in the light path of laser beam.
6. a kind of laser shaping device according to claim 5, is characterized in that, the quantity of described catoptron is two.
7. a kind of laser shaping device according to claim 5, is characterized in that, described beam expanding lens is arranged between described generating laser and described catoptron in the light path of laser beam.
8. a kind of laser shaping device according to claim 1, is characterized in that, the hole diameter of described spatial filter is 4.2mm.
9. a kind of laser shaping device according to claim 1, is characterized in that, the operation wavelength of described shaping mirror is 355nm, and effective aperture is 8.5mm, and input spot size is 4mm (1/e
2), spot size is 0.17 * 0.17 milliradian, hot spot pattern is flat-top hot spot.
10. a kind of laser shaping device according to claim 1, is characterized in that, the material of described shaping mirror is fused quartz.
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Cited By (12)
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CN105750729A (en) * | 2016-05-03 | 2016-07-13 | 长春理工大学 | Laser processing device with linear array optical lens assembly with micro cylindrical lenses in cylindrical distribution |
CN106409733A (en) * | 2016-12-06 | 2017-02-15 | 中国科学院微电子研究所 | Laser annealing device and method |
CN107111146A (en) * | 2015-01-21 | 2017-08-29 | 龙卷风光谱系统有限公司 | Mixed image pupil optics reformatting device |
CN108348764A (en) * | 2015-11-02 | 2018-07-31 | 量子系统股份公司 | The laser system of selective therapy for acne |
CN108430575A (en) * | 2015-12-22 | 2018-08-21 | 量子系统股份公司 | The laser apparatus for carrying out selective therapy acne is increased with the skin temperature of reduction |
CN110102960A (en) * | 2019-05-30 | 2019-08-09 | 北京兆维科技开发有限公司 | A kind of method that laser scribing scanning display screen repairs light leakage defect |
CN110842377A (en) * | 2018-07-27 | 2020-02-28 | 武汉中谷联创光电科技股份有限公司 | Laser cutting process and special device for positive plate of manganese lithium primary battery |
CN111624725A (en) * | 2020-04-22 | 2020-09-04 | 大族激光科技产业集团股份有限公司 | System for realizing zooming and light path shaping |
CN112630983A (en) * | 2020-12-24 | 2021-04-09 | 中国工程物理研究院激光聚变研究中心 | Laser system, laser-induced damage testing system and method |
CN113433706A (en) * | 2021-06-21 | 2021-09-24 | 深圳市大族数控科技股份有限公司 | Debugging and checking method of laser shaping light path |
CN115194342A (en) * | 2022-09-19 | 2022-10-18 | 武汉引领光学技术有限公司 | Taper controllable laser grooving device and method |
CN116460422A (en) * | 2023-04-07 | 2023-07-21 | 珠海市申科谱工业科技有限公司 | MEMS chip cantilever laser cutting process |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2197933C1 (en) * | 2001-05-23 | 2003-02-10 | Государственное учреждение Межотраслевой научно-технический комплекс "Микрохирургия глаза" | Energy distribution transformer usable in ophthalmological laser device |
CN101363922A (en) * | 2008-06-25 | 2009-02-11 | 深圳市世纪人无线通讯设备有限公司 | Method for implementing beam alignment and uniformization and optical device |
CN102218606A (en) * | 2011-05-18 | 2011-10-19 | 苏州德龙激光有限公司 | Ultraviolet laser drilling device |
CN103399406A (en) * | 2013-07-26 | 2013-11-20 | 王晓峰 | Diffractive optical element for shaping gauss beam into flat-topped beam, and preparation method thereof |
CN203630445U (en) * | 2013-12-25 | 2014-06-04 | 苏州德龙激光股份有限公司 | Laser shaping device |
-
2013
- 2013-12-25 CN CN201310725412.7A patent/CN103645563A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2197933C1 (en) * | 2001-05-23 | 2003-02-10 | Государственное учреждение Межотраслевой научно-технический комплекс "Микрохирургия глаза" | Energy distribution transformer usable in ophthalmological laser device |
CN101363922A (en) * | 2008-06-25 | 2009-02-11 | 深圳市世纪人无线通讯设备有限公司 | Method for implementing beam alignment and uniformization and optical device |
CN102218606A (en) * | 2011-05-18 | 2011-10-19 | 苏州德龙激光有限公司 | Ultraviolet laser drilling device |
CN103399406A (en) * | 2013-07-26 | 2013-11-20 | 王晓峰 | Diffractive optical element for shaping gauss beam into flat-topped beam, and preparation method thereof |
CN203630445U (en) * | 2013-12-25 | 2014-06-04 | 苏州德龙激光股份有限公司 | Laser shaping device |
Cited By (16)
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CN107111146B (en) * | 2015-01-21 | 2020-05-26 | 龙卷风光谱系统有限公司 | Hybrid image-pupil optical reformatter |
CN107111146A (en) * | 2015-01-21 | 2017-08-29 | 龙卷风光谱系统有限公司 | Mixed image pupil optics reformatting device |
AU2016209000B2 (en) * | 2015-01-21 | 2020-07-02 | Tornado Spectral Systems Inc. | Hybrid image-pupil optical reformatter |
CN108348764B (en) * | 2015-11-02 | 2020-09-29 | 量子系统股份公司 | Laser system for selective treatment of acne |
CN108348764A (en) * | 2015-11-02 | 2018-07-31 | 量子系统股份公司 | The laser system of selective therapy for acne |
CN108430575A (en) * | 2015-12-22 | 2018-08-21 | 量子系统股份公司 | The laser apparatus for carrying out selective therapy acne is increased with the skin temperature of reduction |
CN108430575B (en) * | 2015-12-22 | 2020-02-21 | 量子系统股份公司 | Laser device for selective treatment of acne with reduced skin temperature rise |
CN105750729A (en) * | 2016-05-03 | 2016-07-13 | 长春理工大学 | Laser processing device with linear array optical lens assembly with micro cylindrical lenses in cylindrical distribution |
CN106409733A (en) * | 2016-12-06 | 2017-02-15 | 中国科学院微电子研究所 | Laser annealing device and method |
CN110842377A (en) * | 2018-07-27 | 2020-02-28 | 武汉中谷联创光电科技股份有限公司 | Laser cutting process and special device for positive plate of manganese lithium primary battery |
CN110102960A (en) * | 2019-05-30 | 2019-08-09 | 北京兆维科技开发有限公司 | A kind of method that laser scribing scanning display screen repairs light leakage defect |
CN111624725A (en) * | 2020-04-22 | 2020-09-04 | 大族激光科技产业集团股份有限公司 | System for realizing zooming and light path shaping |
CN112630983A (en) * | 2020-12-24 | 2021-04-09 | 中国工程物理研究院激光聚变研究中心 | Laser system, laser-induced damage testing system and method |
CN113433706A (en) * | 2021-06-21 | 2021-09-24 | 深圳市大族数控科技股份有限公司 | Debugging and checking method of laser shaping light path |
CN115194342A (en) * | 2022-09-19 | 2022-10-18 | 武汉引领光学技术有限公司 | Taper controllable laser grooving device and method |
CN116460422A (en) * | 2023-04-07 | 2023-07-21 | 珠海市申科谱工业科技有限公司 | MEMS chip cantilever laser cutting process |
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Application publication date: 20140319 |