CN104439715A - Laser cutting device for transparent materials and laser cutting process applied to laser cutting device - Google Patents
Laser cutting device for transparent materials and laser cutting process applied to laser cutting device Download PDFInfo
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- CN104439715A CN104439715A CN201410648485.5A CN201410648485A CN104439715A CN 104439715 A CN104439715 A CN 104439715A CN 201410648485 A CN201410648485 A CN 201410648485A CN 104439715 A CN104439715 A CN 104439715A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser cutting device for transparent materials and a laser cutting process applied to the laser cutting device. The laser cutting device for the transparent materials comprises a laser, a beam expanding lens, a focalizer, a working platform and a server; when a workpiece is cut through the focalizer, the starting position of a laser cutting point is arranged to be located on the side, far away from the working platform top, of a penetrating area, and cutting of the laser cutting point from the side, far away from the focalizer, of the workpiece to the other side is further achieved; in this way, the laser cutting device has the advantages that when the workpiece is cut, mechanical stress is avoided, mechanical wearing is avoided, machined patterns cannot be limited, and cutting lines are narrow; in addition, the laser cutting device has the advantages that plasma shielding is avoided, the energy using efficiency is high, the heat effect is small, the cutting speed is high, and the cutting face does not have taper.
Description
Technical field
The present invention relates to laser cutting field, particularly relate to a kind of laser cutting device of transparent material and the laser cutting parameter of application thereof.
Background technology
Along with the sustainable growth of the consumption electronic product such as mobile phone, panel computer, it is also growing at top speed to the demand of the transparent material such as glass cover-plate, sapphire window.The transparent fragile material cutting mode of high-effect high-quality is conducive to improving the engineering properties of product and reducing the processing cost of transparent fragile material.Traditional transparent fragile material cutting mode one is cut into master with break bar, controlled the position of break bar, utilize CCD (Charge-coupled Device, charge coupled cell) to locate the cutting of material by Digit Control Machine Tool.But can produce that stress easily causes material to material in break bar cutting process collapse limit or cracked; And break bar is through long-time wearing and tearing, easily damages, need often change; Especially for the transparent material of the high rigidity such as sapphire, break bar cutting efficiency is very low and wearing and tearing are very high; In addition break bar cutting can be subject to great restriction when cutting small size or complex figure.The laser cutting of another kind of transparent fragile material mainly adopts the mode of from up to down cutting, and successively ablator is until material is cut wears; This cutting mode can produce a large amount of plasma at upper surface, hinders the propagation (Plasma Shielding Effection) of laser, thus causes the shortcomings such as working (machining) efficiency is low, energy consumption is large, Thermal incubation effect is strong; In addition, from up to down cut the cut surface obtained and have certain tapering.
Summary of the invention
The object of the present invention is to provide and a kind ofly improve the laser cutting device of the transparent material of cut quality and the laser cutting parameter of application thereof.
In order to solve the problems of the technologies described above, the invention provides a kind of laser cutting device of transparent material, wherein, the laser cutting device of described transparent material comprises laser instrument, beam expanding lens, focalizer, workbench and servomechanism, described laser instrument Emission Lasers is to described beam expanding lens, described beam expanding lens is emitted to described focalizer after collimating laser, described focalizer is by the transparent workpiece of Laser Focusing on described workbench, the vertical described workbench table top in Laser emission direction of described focalizer, and control described Laser Focusing point to move along vertical described table surface direction, the table top of described workbench comprises FX and open area, described FX is in order to fix transparent workpiece, described open area is in order to correspond to the place to be cut of described workpiece, described table surface deviates from described focalizer side and is provided with vacuum chamber, described vacuum chamber is in order to remove the cutting waste material of transparent workpiece, described servomechanism is electrically connected described focalizer, in order to the initial position signalling of given Laser Focusing point to described focalizer, described Laser Focusing point original position is positioned at described penetration region and deviates from described workpiece side.
Wherein, the laser cutting device of described transparent material comprises and detaches device, described in detach device and be installed on described vacuum chamber, in order to detach the cutting waste material of described vacuum chamber air and transparent workpiece.
Wherein, the laser cutting device of described transparent material also comprises blowning installation, and described blowning installation is installed on described workbench and places described transparent workpiece side, in order to cool described transparent workpiece and to blow down the cutting waste material of described transparent workpiece.
Wherein, described focalizer comprises galvanometer, and the laser beam of described galvanometer to described beam expanding lens deflects, and focuses in described transparent workpiece.
Wherein, described focalizer comprises speculum and focus lamp, described speculum by the laser beam reflection of described beam expanding lens on described focus lamp, described focus lamp by laser beam focus in described transparent workpiece.
Wherein, the laser cutting device of described transparent material also comprises beam shaping, and described beam shaping is arranged between described laser instrument and described beam expanding lens, is emitted to described beam expanding lens after the laser beam in order to be launched by described laser instrument carries out beam shaping.
Wherein, the laser cutting device of described transparent material also comprises pulse shaper, and described pulse shaper is arranged between described laser instrument and described beam expanding lens, is emitted to described beam expanding lens after the laser beam in order to launch described laser instrument carries out shaping pulse.
The present invention also provides a kind of laser cutting parameter, and wherein, described laser cutting parameter uses the laser cutting device of the transparent material described in above-mentioned any one, and described laser cutting parameter comprises step:
Transparent workpiece is positioned on described workbench, and the position to be cut of transparent workpiece is corresponded to described penetration region;
Control the initial position signalling of described servomechanism given laser cutting point to described focalizer;
Open described laser instrument, adjust described focalizer and laser beam is focused on;
The Laser Focusing point controlling described focalizer cuts described transparent workpiece.
Wherein, the laser wavelength range that described laser instrument is launched is 355nm ~ 1064nm.
Wherein, the laser beam that described laser instrument is launched is nanosecond laser, picosecond laser or femtosecond laser.
The laser cutting device of transparent material provided by the invention and the laser cutting parameter of application thereof, during by described focalizer to described work piece cut, arrange laser cutting point original position to be positioned at described penetration region and to deviate from described work top side, and then realize described laser cutting point and deviate from described focalizer side by described workpiece and cut to opposite side, thus mechanical stress when realizing work piece cut, mechanical is worn and torn, graphics processing can not be limited, the advantages such as line of cut is narrow, and also with or without Plasma Shielding Effection, energy utilization efficiency is high, fuel factor is little, cutting speed is fast, the advantages such as cut surface zero draft.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the laser cutting device of the transparent material of the first embodiment provided by the invention;
Fig. 2 is the laser cutting device of the transparent material of the second embodiment provided by the invention;
Fig. 3 is the laser cutting device of the transparent material of the 3rd embodiment provided by the invention;
Fig. 4 is the laser cutting device of the transparent material of the 4th embodiment provided by the invention;
Fig. 5 is laser cutting parameter provided by the invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1, the laser cutting device 100 of a kind of transparent material that first embodiment of the invention provides, the laser cutting device 100 of described transparent material comprises laser instrument 10, beam expanding lens 20, focalizer 30, workbench 40 and servomechanism (not shown).Described laser instrument 10 Emission Lasers is to described beam expanding lens 20.Described focalizer 30 is emitted to after described beam expanding lens 20 pairs of laser collimate.Described focalizer 30 by the transparent workpiece 1 of Laser Focusing on described workbench 40, vertical described workbench 40 table top in Laser emission direction of described focalizer 30, and control described Laser Focusing point and move along vertical described workbench 40 table top direction.The table top of described workbench 40 comprises FX 40a and penetration region 40b, described FX 40a is in order to fix transparent workpiece 1, described penetration region 40b penetrates in order to the laser beam corresponding to described focalizer 30, described workbench 40 table top deviates from described focalizer 30 side and is provided with vacuum chamber 41, and described vacuum chamber 41 is in order to remove the cutting waste material of transparent workpiece 1.Described servomechanism is electrically connected described focalizer 30, and in order to the initial position signalling of given Laser Focusing point to described focalizer 30, described laser cutting point original position is positioned at described penetration region 40b and deviates from described workpiece 1 side.
By the initial position signalling of described servomechanism given Laser Focusing point to described focalizer 30, and then the Laser Focusing point of described focalizer 30 cuts by described workpiece 1 contacts described workbench 40 table top place, cutting is terminated near described focalizer 30 side to described transparent workpiece 1, and then avoid described transparent workpiece 1 generation plasma Screen theory when cutting, and then provide the high cut quality of described transparent workpiece 1.
In present embodiment, the laser beam that described laser instrument 10 emission level direction extends, described beam expanding lens 20 is positioned at the side of described laser instrument 10 horizontal direction.Described beam expanding lens 20 collimates described laser beam in the horizontal direction, and is emitted to described focalizer 30.Described focalizer 30 focuses on described laser beam, and the direction of illumination of described focalizer 30 to described transparent workpiece 1 is vertically arranged.Certainly, in other embodiments, described laser instrument can also be launch vertical direction extend laser beam, described focalizer can also be horizontally disposed with to the direction of illumination of described transparent workpiece.
In present embodiment, the laser cutting device 100 of described transparent material also comprises CCD (Charge-coupled Device, charge coupled cell) positioner (not shown), described CCD positioner is in order to position the cutting laser beam of described focalizer 30, the vertical described lower surface 1a of direction of illumination of the cutting laser beam that described focalizer 30 is launched, and make the focus point of described cutting laser beam precise positioning in described transparent workpiece 1.
In present embodiment, described transparent workpiece 1 can be the glass cover-plate being applied to Mobile phone screen, can be the lucite on display, can also be the translucent plate member on other display equipment.Described in described workbench 40, transparent workpiece 1 comprises the lower surface 1a being contacted with described workbench 40, and the upper surface 1b of close described focalizer 30.When the cutting laser beam of described focalizer 30 cuts described transparent workpiece 1, first can pass described transparent workpiece 1, make Laser Focusing point move to described upper surface 1b by described lower surface 1a and cut.And then described cutting laser beam is when described lower surface 1a cuts to described upper surface 1b, the plasma produced is positioned at away from described cutting laser beam side, thus the cutting of laser beam can not be cut described in welding resistance, namely avoid plasma Screen theory, thus improve the cut quality of the laser cutting device 100 of described transparent material.
Further, the laser cutting device 100 of described transparent material comprises and detaches device 50, described in detach device 50 and be installed on described vacuum chamber 41, in order to detach the cutting waste material of air and transparent workpiece 1 in described vacuum chamber 41.
In present embodiment, when described focalizer 30 cuts described transparent workpiece 1, describedly detach the mode of device 50 by suction airstream, the plasma that described transparent workpiece 1 is produced at described lower surface 1a, cutting waste material, slag and dust etc. detach in described transparent workpiece 1 with air-flow, thus advantageously in the smooth cutting of described cutting laser beam to described transparent workpiece 1.Especially, described in detach device 50 also by the mode of suction airstream, the high temperature gas flow that described lower surface 1a produces is siphoned away, thus makes the cutting of described cutting laser beam to described transparent workpiece 1 more stable.
Further, the laser cutting device 100 of described transparent material also comprises blowning installation 60, described blowning installation 60 is installed on described workbench 40 and places described transparent workpiece 1 side, in order to cool described transparent workpiece 1 and to blow down the cutting waste material of described transparent workpiece 1.
In present embodiment, described blowning installation 60 acts on the upper surface 1b of described transparent workpiece 1.When described focalizer 30 carries out laser cutting to described transparent workpiece 1, the high temperature gas flow of described upper surface 1b blows away by described blowning installation 60, and then described transparent workpiece 1 is cooled, and blow away the dust of described upper surface 1b, the cutting waste material of the transparent workpiece 1 such as slag and particle, the cutting laser beam of described focalizer 30 is stablized, thus improves the cut quality of the laser cutting device 100 of described transparent material.
Further, described focalizer 30 comprises galvanometer 31, and the laser beam of described galvanometer 31 to described beam expanding lens 20 deflects, and focuses in described transparent workpiece 1.
In present embodiment, described galvanometer 31 scans the laser beam that described beam expanding lens 20 is launched, and then deflects described laser beam, makes the laser beam of described beam expanding lens 20 meet machining path.When described focalizer 30 cuts described transparent workpiece 1, the focus point that described galvanometer 31 adjusts described cutting laser beam moves at working face according to machining path, and by the position of described galvanometer 31 in the vertical direction of adjustment, and then realize focus point the moving playing surface along vertical described workbench 40 of described cutting laser beam, and then realize the cutting to described transparent workpiece 1.
Further, refer to Fig. 2, based on the improvement to the first embodiment of the present invention, there is provided in the second embodiment, described focalizer 30 comprises speculum 301 and focus lamp 302, described speculum 301 by the laser beam reflection of described beam expanding lens 20 on described focus lamp 302, described focus lamp 302 by laser beam focus in described transparent workpiece 1.
In present embodiment, described focus lamp 302 is near described transparent workpiece 1, described focus lamp 302 vertically moves up and down, realize focus point the moving playing surface along vertical described workbench 40 of described cutting laser beam, and then the cutting realized described transparent workpiece 1, namely realize punching in described transparent workpiece 1, thus realize the multiple cutting mode of the laser cutting device 100 of described transparent material.
Further, refer to Fig. 3, based on the first embodiment basis of the present invention, in the 3rd embodiment provided, the laser cutting device 100 of described transparent material also comprises beam shaping 70, described beam shaping 70 is arranged between described laser instrument 10 and described beam expanding lens 20, is emitted to described beam expanding lens 20 after the laser beam in order to be launched by described laser instrument 10 carries out beam shaping.
In present embodiment, described beam shaping 70 is refractive or diffraction type beam shaping device, for changing the spatial distribution of near focal point energy, compression depth of focus, prevent attacking material before ablation workpiece lower surface inner, and reduce the peak light intensity of the cutting laser beam focus points of described focalizer 30, and then avoid described focalizer 30 and produce strong self-focusing when cutting described transparent workpiece 1, further improve the cut quality of described laser cutting device 100.Described beam shaping 70 is mainly used in the beam shaping that picosecond laser launched by described laser instrument 10.Certainly, in other embodiments, described beam shaping also can be directed to the beam shaping of nanosecond laser or femtosecond laser.
Further, refer to Fig. 4, on the basis based on the second embodiment of the present invention, in the 4th embodiment provided, the laser cutting device 100 of described transparent material also comprises pulse shaper 701, described pulse shaper 701 is arranged between described laser instrument 10 and described beam expanding lens 20, is emitted to described beam expanding lens 20 after the laser beam in order to launch described laser instrument 10 carries out shaping pulse.
In present embodiment, described pulse shaper 701 comprises the first reflecting grating 8a and the second reflecting grating 8b, described first reflecting grating 8a by the laser beam reflection of described laser instrument 10 to described second reflecting grating 8b, described second reflecting grating 8b by described laser beam reflection to described beam expanding lens 20.After the laser beam of described shaping pulse 70 to described laser instrument 30 carries out two lateral reflections, thus each spectrum component spatially overlapped by the femtosecond laser of laser instrument 30 spatially disperses, and then reach the object of the laser beam of described laser instrument 30 being carried out to light splitting, thus reduce the peak light intensity of the cutting laser beam focus points of described focalizer 30, and then avoid described focalizer 30 and produce strong Self-focusing when cutting described transparent workpiece 1, further improve the cut quality of the laser cutting device 100 of described transparent material.The laser cutting device 100 of the described transparent material in present embodiment is applied to described laser instrument 10 and launches femtosecond laser.Certainly, in other embodiments, described pulse shaper can also be realizing the device of each spectrum component of spatially overlapping spatially divergent function of other.
See also Fig. 1 and Fig. 5, the invention provides a kind of laser cutting parameter, described laser cutting parameter uses the laser cutting device 100 of described transparent material.Described laser cutting parameter comprises step:
S01: transparent workpiece 1 is positioned on described workbench 40, and the position to be cut of transparent workpiece 1 is corresponded to described penetration region 40b.
In present embodiment, be fixed on described FX 40a by described transparent workpiece 1, namely transparent workpiece 1 is stated in described FX support residence.
S02: control the initial position signalling of described servomechanism given laser cutting point to described focalizer 30.
In present embodiment, described servomechanism converts the cutting pattern of described transparent workpiece 1 to control signal, and then control described focalizer 30 described transparent workpiece 1 is cut, namely described servomechanism is except the initial position signalling of given institute's laser cutting point to described focalizer 10, and also given laser cutting point operating path signal is to described focalizer 30.
S03: open described laser instrument 10, adjusts described focalizer 30 pairs of laser beams and focuses on.
In present embodiment, described laser instrument 10 is switched on power, described laser instrument 10 Emission Lasers bundle is to described beam expanding lens 20, described beam expanding lens 20 is sent to described focalizer 30 after being collimated by described laser beam, and then by the guiding mechanism (not shown) on the described focalizer 30 of adjustment, and then make described laser beam focus on a focus point.
In present embodiment, the laser beam wavelength scope that described laser instrument 10 is launched is 355nm ~ 1064nm.Select suitable optical maser wavelength according to the absorption characteristic of material, to facilitate described transparent workpiece 1 to produce stronger non-linear absorption near the focus point of cutting laser beam, and strong absorption can not be produced in the region that power density is less.Certainly, in other embodiments, the laser beam wavelength that described laser instrument is launched also can be less than 355nm or be greater than 1064nm.
In present embodiment, the laser beam that described laser instrument 10 is launched is nanosecond laser.Because nanosecond laser has lower peak power, so when described focalizer 30 cuts described transparent workpiece 1, general without the need to considering self-focusing effect, and non-linear absorption district is only in the region that near focal point is less, therefore do not need to carry out beam shaping or shaping pulse to described laser beam.Certainly, in other embodiments, the laser that described laser instrument is launched also can be picosecond laser or femtosecond laser, when described laser beam is picosecond laser, because the peak value of described laser beam is higher, adopt described beam shaping to carry out beam shaping to described laser beam, thus reach compression depth of focus and reduce the object of focus place peak light intensity; When described laser beam is femtosecond laser, peak light intensity due to described laser beam is higher and frequency spectrum is wider, adopt described pulse shaper to carry out shaping pulse to described laser beam, thus reach the object of spatially monodispersed spectrum composition, and then improve the cutting efficiency of described laser cutting parameter.
S04: the Laser Focusing point controlling described focalizer 30 cuts described transparent workpiece 1.
In present embodiment, need climbing speed and the ablation velocity of the Laser Focusing point controlling described focalizer 30 accurately, namely need the ratio of the climbing speed and ablation velocity controlling described Laser Focusing point in 0.8 ~ 1.2 scope.
The laser cutting device of transparent material provided by the invention and the laser cutting parameter of application thereof, during by described focalizer to described work piece cut, arrange laser cutting point original position to be positioned at described penetration region and to deviate from described work top side, and then realize described laser cutting point and deviate from described focalizer side by described workpiece and cut to opposite side, thus mechanical stress when realizing work piece cut, mechanical is worn and torn, graphics processing can not be limited, the advantages such as line of cut is narrow, and also with or without Plasma Shielding Effection, energy utilization efficiency is high, fuel factor is little, cutting speed is fast, the advantages such as cut surface zero draft.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. the laser cutting device of a transparent material, it is characterized in that, the laser cutting device of described transparent material comprises laser instrument, beam expanding lens, focalizer, workbench and servomechanism, described laser instrument Emission Lasers is to described beam expanding lens, described beam expanding lens is emitted to described focalizer after collimating laser, described focalizer is by the transparent workpiece of Laser Focusing on described workbench, the vertical described workbench table top in Laser emission direction of described focalizer, and control described Laser Focusing point to move along vertical described table surface direction, the table top of described workbench comprises FX and open area, described FX is in order to fix transparent workpiece, described open area is in order to correspond to workpiece place to be cut, described table surface deviates from described focalizer side and is provided with vacuum chamber, described vacuum chamber is in order to remove the cutting waste material of transparent workpiece, described servomechanism is electrically connected described focalizer, in order to the initial position signalling of given Laser Focusing point to described focalizer, described Laser Focusing point original position is positioned at described penetration region and deviates from described workpiece side.
2. the laser cutting device of transparent material according to claim 1, it is characterized in that, the laser cutting device of described transparent material comprises and detaches device, described in detach device and be installed on described vacuum chamber, in order to detach the cutting waste material of described vacuum chamber air and transparent workpiece.
3. the laser cutting device of transparent material according to claim 1, it is characterized in that, the laser cutting device of described transparent material also comprises blowning installation, described blowning installation is installed on described workbench and places described transparent workpiece side, in order to cool described transparent workpiece and to blow down the cutting waste material of described transparent workpiece.
4. the laser cutting device of transparent material according to claim 1, is characterized in that, described focalizer comprises galvanometer, and the laser beam of described galvanometer to described beam expanding lens deflects, and focuses in described transparent workpiece.
5. the laser cutting device of transparent material according to claim 1, it is characterized in that, described focalizer comprises speculum and focus lamp, described speculum by the laser beam reflection of described beam expanding lens on described focus lamp, described focus lamp by laser beam focus in described transparent workpiece.
6. the laser cutting device of transparent material according to claim 1, it is characterized in that, the laser cutting device of described transparent material also comprises beam shaping, described beam shaping is arranged between described laser instrument and described beam expanding lens, is emitted to described beam expanding lens after the laser beam in order to be launched by described laser instrument carries out beam shaping.
7. the laser cutting device of transparent material according to claim 1, it is characterized in that, the laser cutting device of described transparent material also comprises pulse shaper, described pulse shaper is arranged between described laser instrument and described beam expanding lens, is emitted to described beam expanding lens after the laser beam in order to launch described laser instrument carries out shaping pulse.
8. a laser cutting parameter, is characterized in that, described laser cutting parameter uses the laser cutting device of the transparent material described in claim 1 ~ 7 any one, and described laser cutting parameter comprises step:
Transparent workpiece is positioned on described workbench, and the position to be cut of transparent workpiece is corresponded to described penetration region;
Control the initial position signalling of described servomechanism given laser cutting point to described focalizer;
Open described laser instrument, adjust described focalizer and laser beam is focused on;
The Laser Focusing point controlling described focalizer cuts described transparent workpiece.
9. laser cutting parameter according to claim 8, is characterized in that, the laser wavelength range that described laser instrument is launched is 355nm ~ 1064nm.
10. laser cutting parameter according to claim 8, is characterized in that, the laser beam that described laser instrument is launched is nanosecond laser, picosecond laser or femtosecond laser.
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| CN107350628A (en) * | 2017-08-08 | 2017-11-17 | 上海致凯捷激光科技有限公司 | A kind of brittle transparent material laser processing device and processing method |
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Application publication date: 20150325 |