CN102601529A - Method for improving machining efficiency of micro-channel preparation through femtosecond laser - Google Patents
Method for improving machining efficiency of micro-channel preparation through femtosecond laser Download PDFInfo
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- CN102601529A CN102601529A CN2012100848577A CN201210084857A CN102601529A CN 102601529 A CN102601529 A CN 102601529A CN 2012100848577 A CN2012100848577 A CN 2012100848577A CN 201210084857 A CN201210084857 A CN 201210084857A CN 102601529 A CN102601529 A CN 102601529A
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Abstract
The invention relates to a method for improving the machining efficiency of micro-channel preparation through femtosecond laser, which belongs to the technical field of femtosecond laser application. The method includes the steps: firstly, generating the femtosecond pulse laser by the aid of a femtosecond laser system, adjusting energy by means of combination of a half wave plate and a polarizing film and modulating the femtosecond laser into femtosecond interval pulse sequence by the aid of a pulse shaper; secondly, reflecting the pulse sequence laser obtained in the first step to an objective lens for focusing through a reflector, realizing imaging by the aid of a CCD (charge coupled device) and a lighting source, moving a six-dimensional precision electric control platform and positioning a laser focus on the lower surface of a sample horizontally placed on the six-dimensional precision electric control platform; and thirdly, controlling the six-dimensional precision electric control platform to move along a laser propagation direction by the aid of a computer to machine a micro-channel on the sample. As the femtosecond laser is modulated into the femtosecond interval pulse sequence by the aid of the pulse shaper, the micro-channel preparation efficiency is improved. Moreover, introduction of a vibration source is omitted, so that controllability of precision machining cannot be reduced.
Description
Technical field
The present invention relates to a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves, belong to the femtosecond laser applied technical field.
Background technology
The microchannel of big aspect ratio has a wide range of applications in fields such as gas or liquid microfluidic device, microreactor, electrophoresis, micro-full analytical systems.Silicon is because of its ripe mass production technology, is the matrix material of desirable preparation microchannel, yet at some light transmission had the field of specific (special) requirements, and silicon is substituted by polymer such as transparent dielectric material such as quartz glass, PMMA.
Femtosecond laser is because its high peak power has a wide range of applications at the little/manufacture field of receiving, and it promptly is one of them hot research problem that femtosecond laser is processed big aspect ratio microchannel.At document Y.Li, K.Itoh, W.Watanabe, K.Yamada; D.Kuroda, J.Nishii, Y.Jiang:Opt.Lett.26 is in 23 (2001); The author utilizes the auxiliary method of femtosecond laser water, processes with mode from bottom to top, has prepared inlet diameter～5 μ m; The microchannel of aspect ratio～1: 50, but process velocity has only 0.3 μ m/s, and efficient is lower; At document D.J.Hwang, T.Y.Choi, C.P.Grigoropoulos.Appl.Phys.A; 79; Among the 605-612 (2004), the author is utilized in and introduces the auxiliary method of ultrasonic wave in the water, is increased to 30 μ m/s to the speed of femtosecond laser processing microchannel; But in system of processing, introduce the ultrasonic vibration meeting and bring uncertain factor, reduce precision machined controllability to Precision Machining.
Summary of the invention
To the objective of the invention is in order addressing the above problem, thereby a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves to be provided.
The objective of the invention is to realize through following technology:
A kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves of the present invention, concrete steps are following:
Step 1: utilize fs-laser system to produce femtosecond pulse, utilize the combination adjustment energy of half-wave plate and polarizer, be modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper;
Step 2: in focusing objective len, focus on through mirror reflects the resulting pulse train laser of step 1; And by CCD and lighting source imaging; Move the accurate automatically controlled platform of 6 dimensions, laser spot is positioned at be placed horizontally at the lower surface of the sample of the accurate automatically controlled platform of 6 dimensions.
Step 3: the accurate automatically controlled platform of computer control 6 dimensions moves along the direction of propagation of laser, can on sample, process the microchannel.
Said specimen material is transparent dielectric material, and thickness of sample must be less than the focal length of focusing objective len.
After said sample levels is fixed on the transparent slide, be positioned over again on the accurate automatically controlled platform of 6 dimensions.
Can inject non-corrosive liquid in the gap of said sample and slide.The lower surface of sample contacts with liquid, utilizes the chip that produces in the wicks microchannel process of liquid.
Realize the device of the inventive method, comprising: fs-laser system, half-wave plate, polarizer, pulse shaper, speculum, focusing objective len, sample, the accurate automatically controlled platform of 6 dimensions.
Its annexation is: the trend according to laser connects in order.Fs-laser system produces femtosecond laser, utilize the combination adjustment energy of half-wave plate and polarizer after, the entering pulse shaper is modulated to pulse train, is gone in the focusing objective len to focus on by the mirror reflects of 45 ° of placements then.
Beneficial effect
1, a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves of the present invention is modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper, thereby has improved the preparation efficiency of microchannel.
2, a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves of the present invention is compared with traditional femtosecond laser processing method, and under the energy of 20 μ J, the material of 500 femtoseconds pulse train is at interval removed efficient and improved 60 times than traditional pulse.
3, a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves of the present invention; Compare with traditional femtosecond laser processing method, under the energy of 35 μ J, pulse train is with the process velocity of 100 μ m/s; The about 20 μ m of inlet diameter have been prepared, 40: 1 microchannel of aspect ratio.And traditional femtosecond laser can't reach this processing effect under this speed.
4, the present invention need not to introduce vibration source, so this method can not reduce precision machined controllability.
Description of drawings
Fig. 1 is femto-second laser pulse sequence processing light path sketch map:
Fig. 2 places partial enlarged drawing for sample
Wherein, 1-fs-laser system, 2-half-wave plate, 3-polarizer, 4-pulse shaper, 5-speculum, 6-imaging CCD, 7-speculum, 8-focusing objective len, 9-sample, 10-6 tie up space, 14-slide between accurate automatically controlled platform, 11-lighting source, 12-double faced adhesive tape, 13-sample and the slide.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Embodiment 1
What fs-laser system 1 adopted is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50 femtoseconds, repetition rate 1KHz, pulse ceiling capacity 3mJ, light distribution is a Gaussian, linear polarization.
Test specimen 9 is a K9 glass, and its thickness is 1.5mm.
The present invention proposes a kind ofly improves the method that femtosecond laser prepares the microchannel working (machining) efficiency, and processing light path sketch map is as shown in Figure 1, and concrete procedure of processing is following:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse; 3 combinations are adjusted into 20 μ J to single pulse energy with polarizer to utilize half-wave plate 2; Be modulated to pulse train to traditional femtosecond laser through pulse shaper 4, comprise two sub-pulse in this sequence, the pulse spacing is 500 femtoseconds;
Step 2: be horizontally fixed on slide 14 on the accurate automatically controlled platform 10 of 6 dimensions, be horizontally fixed on sample 9 on the slide 14 with double faced adhesive tape 12, the fixed form of sample 9 is as shown in Figure 2; In the space 13 of sample 9 and slide 14, inject distilled water, the lower surface of sample 9 is contacted with water;
Step 3: reflex to focusing in 10 times of object lens 8 to the resulting pulse train laser of step 1 through speculum 7, by CCD 6 and lighting source 11 imagings; Move the relative position of accurate automatically controlled platform 10 adjustment focuses of 6 dimensions and sample 9; When the focusing focus is positioned at the lower surface of sample 9; The accurate automatically controlled platform 10 of control 6 dimensions moves 100 μ m along the opposite direction of laser propagation, makes laser spot be positioned at 100 μ m places under the lower surface of sample 9;
Step 4: the accurate automatically controlled platform 10 of computer control 6 dimensions moves 1000 μ m with the constant speed of 60 μ m/s along the direction of propagation of laser, promptly on sample 9, process the microchannel with the femto-second laser pulse sequence.
When closing pulse shaper, promptly be to process under the immovable situation of other experimental procedures with traditional femtosecond laser processing method, the about 0.5um3/s of its working (machining) efficiency; 500 femtoseconds that this experiment the is adopted about 30um3/s of pulse train working (machining) efficiency has at interval improved about 60 times, and this material removing rate of sentencing in the unit interval characterizes working (machining) efficiency.
Embodiment 2
What fs-laser system 1 adopted is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50 femtoseconds, repetition rate 1KHz, pulse ceiling capacity 3mJ, light distribution is a Gaussian, linear polarization.
Test specimen 9 is a K9 glass, and its thickness is 1.5mm.
The present invention proposes a kind ofly improves the method that femtosecond laser prepares the microchannel working (machining) efficiency, and processing light path sketch map is as shown in Figure 1, and concrete procedure of processing is following:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse; 3 combinations are adjusted into 36 μ J to single pulse energy with polarizer to utilize half-wave plate 2; Be modulated to pulse train to traditional femtosecond laser through pulse shaper 4, comprise two sub-pulse in this sequence, the pulse spacing is 900 femtoseconds;
Step 2: be horizontally fixed on slide 14 on the accurate automatically controlled platform 10 of 6 dimensions, be horizontally fixed on sample 9 on the slide 14 with double faced adhesive tape 12, the fixed form of sample 9 is as shown in Figure 2;
Step 3: reflex to focusing in 10 times of object lens 8 to the resulting pulse train laser of step 1 through speculum 7, by CCD 6 and lighting source 11 imagings; Move the relative position of accurate automatically controlled platform 10 adjustment focuses of 6 dimensions and sample 9; When the focusing focus is positioned at the lower surface of sample 9; The accurate automatically controlled platform 10 of control 6 dimensions moves 100 μ m along the opposite direction of laser propagation, makes laser spot be positioned at 100 μ m places under the K9 lower glass surface;
Step 4: the accurate automatically controlled platform 10 of computer control 6 dimensions moves 1200 μ m with the constant speed of 100 μ m/s along the direction of propagation of laser, promptly on sample 9, process the microchannel with the femto-second laser pulse sequence.
When closing pulse shaper, promptly be to process under the immovable situation of other experimental procedures with traditional femtosecond laser processing method; 900 femtoseconds that this experiment is adopted pulse train at interval can process the about 20 μ m of diameter, the microchannel that aspect ratio is about 15: 1, and traditional with this understanding femtosecond laser can't reach this processing effect.
Embodiment 3
What fs-laser system 1 adopted is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50 femtoseconds, repetition rate 1KHz, pulse ceiling capacity 3mJ, light distribution is a Gaussian, linear polarization.
Test specimen 9 is a vitreous silica, and its thickness is 1.5mm.
The present invention proposes a kind ofly improves the method that femtosecond laser prepares the microchannel working (machining) efficiency, and processing light path sketch map is as shown in Figure 1, and concrete procedure of processing is following:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse; 3 combinations are adjusted into 30 μ J to single pulse energy with polarizer to utilize half-wave plate 2; Be modulated to pulse train to traditional femtosecond laser through pulse shaper 4, comprise two sub-pulse in this sequence, the pulse spacing is 600 femtoseconds;
Step 2: be horizontally fixed on slide 14 on the accurate automatically controlled platform 10 of 6 dimensions, be horizontally fixed on sample 9 on the slide 14 with double faced adhesive tape 12, the fixed form of sample 9 is as shown in Figure 2; In the space 13 of sample 9 and slide 14, inject ethanol, the lower surface of sample 9 is contacted with ethanol;
Step 3: reflex to focusing in 10 times of object lens 8 to the resulting pulse train laser of step 1 through speculum 7, by CCD 6 and lighting source 11 imagings; Move the relative position of accurate automatically controlled platform 10 adjustment focuses of 6 dimensions and sample 9; When the focusing focus is positioned at the lower surface of sample 9; The accurate automatically controlled platform 10 of control 6 dimensions moves 100 μ m along the opposite direction of laser propagation, makes laser spot be positioned at 100 μ m places under the lower surface of sample 9;
Step 4: the accurate automatically controlled platform 10 of computer control 6 dimensions moves 1000 μ m with the constant speed of 80 μ m/s along the direction of propagation of laser, promptly on sample 9, process the microchannel with the femto-second laser pulse sequence.
When closing pulse shaper, promptly be to process under the immovable situation of other experimental procedures with traditional femtosecond laser processing method; 600 femtoseconds that this experiment is adopted pulse train at interval can process the about 18 μ m of diameter, the microchannel that aspect ratio is about 30: 1, and traditional with this understanding femtosecond laser can't reach this processing effect.
Claims (4)
1. one kind is improved the method that femtosecond laser prepares the microchannel working (machining) efficiency, it is characterized in that: comprise the steps:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse, utilize the combination adjustment energy of half-wave plate 2 and polarizer 3, be modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper 4;
Step 2: reflex to focusing in the object lens 8 to the resulting pulse train laser of step 1 through speculum 7, and, move the accurate automatically controlled platform 10 of 6 dimensions, make laser spot be positioned at the lower surface of the sample 9 of horizontal positioned by CCD 6 and lighting source 11 imagings;
Step 3: the accurate automatically controlled platform 10 of computer control 6 dimensions moves along the direction of propagation of laser, can on sample 9, process the microchannel.
2. a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves as claimed in claim 1 is characterized in that: said sample 9 materials of step 2 are transparent dielectric material, and thickness of sample must be less than the focal length of focusing objective len.
3. a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves as claimed in claim 1 is characterized in that: after can also transparent slide 14 being horizontally fixed on the below of the said sample 8 of step 2, be positioned on the accurate automatically controlled platform 10 of 6 dimensions again.
4. a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves as claimed in claim 3 is characterized in that: can add non-corrosive liquid in the gap 13 of said sample 9 and slide 14.
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| CN103658993A (en) * | 2013-12-11 | 2014-03-26 | 北京理工大学 | Crystal silicon surface femtosecond laser selective ablation method based on electron dynamic control |
| CN103706955A (en) * | 2013-12-19 | 2014-04-09 | 北京理工大学 | Method for preparing high depth-diameter-ratio three-dimensional micro-channel through electronic dynamic control |
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Application publication date: 20120725 |