CN209969874U

CN209969874U - Laser cutting system for ground glass

Info

Publication number: CN209969874U
Application number: CN201920363181.2U
Authority: CN
Inventors: 张�浩; 陈蔚; 郭鹏峰; 刘阳
Original assignee: Innovo Laser Polytron Technologies Inc
Current assignee: Innovo Laser Polytron Technologies Inc
Priority date: 2019-03-21
Filing date: 2019-03-21
Publication date: 2020-01-21
Anticipated expiration: 2029-03-21

Abstract

The utility model provides a laser cutting system of ground glass, which comprises a cutting device and a splinter device, wherein the cutting device comprises an ultrafast laser, a cutting head and an X-Y platform, the ultrafast laser and the cutting head are arranged along an optical axis in sequence, and the X-Y platform is arranged below the cutting head; the splitting device comprises a laser, a scanning galvanometer and a focusing lens, the laser, the scanning galvanometer and the focusing lens are sequentially arranged along an optical axis, and a workbench is arranged below the focusing lens. The beneficial effects of the utility model reside in that: providing a system for cutting ground glass, the system using BThe target glass is cut by the essel beam, holes with a certain interval are formed on the surface of the glass, cracks are generated between the holes, and then CO is scanned by the scanning galvanometer₂The laser is shot to the cutting position, so that cracks between the holes are heated and cracked, and finally the required product is obtained.

Description

Laser cutting system for ground glass

Technical Field

The utility model belongs to the technical field of the glass-cutting technique and specifically relates to indicate a rough glass's laser cutting system.

Background

Glass is a common material in industry and life, cutting is one of the most common processing applications in glass production, and in certain industries, such as 3C, the requirements for glass cutting are increasing.

The traditional way of cutting glass by laser is to use CO with the wavelength of 10.6um₂The laser device, glass have the strong absorption to this band light, and the high power laser makes glass break at the focus position heating of laser, and the crack extends to the upper and lower surface of glass thereby accomplishes the cutting. During the thermal cutting process, it is usually necessary to use a quenching nozzle to spray cold water or gas onto the cutting path to break the glass apart. The method has low cutting precision and is difficult to process complex patterns. Secondly, a nanosecond short pulse width green laser with the wavelength of 532nm is used, output green light is focused to a position to be processed of the transparent glass through a focusing lens after passing through a scanning galvanometer, the glass is blasted in a micron order, and the position of a focus is moved through the scanning galvanometer, so that blasting points are superposed in a region to be processed, and processing is achieved. However, the quality of the edge obtained by the two cutting methods is poor, and the higher and higher requirements of the 3C industry cannot be met.

In general, laser is suitable for cutting glass with smooth surface and good light transmittance, if the upper surface of the material has microstructures such as patterns and pits, when the laser irradiates the upper surface, scattering, diffraction or refraction in different directions occurs, then the light beam spreads in the material, and the effective energy density is seriously reduced, so that the processing cannot be realized.

Therefore, there is a need for innovations in the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the system for cutting the roughened surface glass with high efficiency is provided to overcome the problems of surface scattering and poor cutting quality of the existing laser cutting method.

In order to solve the technical problem, the utility model discloses a technical scheme be: a laser cutting system for ground glass comprises a cutting device and a splitting device, wherein the cutting device comprises an ultrafast laser, a cutting head and an X-Y platform, the ultrafast laser and the cutting head are sequentially arranged along an optical axis, and the X-Y platform is arranged below the cutting head; the splitting device comprises a laser, a scanning galvanometer and a focusing lens, the laser, the scanning galvanometer and the focusing lens are sequentially arranged along an optical axis, and a workbench is arranged below the focusing lens.

Further, the ultrafast laser of the cutting device is a picosecond laser, and the working wavelength of the picosecond laser is 1030 and 1090 nm.

Further, the working pulse width of the picosecond laser is 5-15 ps.

Further, the laser of the splitting device is CO₂Laser, the CO₂The operating wavelength of the laser is 10.6 um.

Further, the cutting head is used for shaping a Gaussian beam emitted by the cutting laser into a Bessel beam.

The beneficial effects of the utility model reside in that: a system for cutting ground glass is provided, the system firstly uses Bessel light beam to cut target glass, holes with a certain distance are formed on the surface of the glass, cracks are generated between the holes, and then CO is scanned by a scanning galvanometer₂The laser is shot to the cutting position, so that cracks between the holes are heated and cracked, and finally the required product is obtained.

Drawings

The specific structure of the present invention is detailed below with reference to the accompanying drawings:

fig. 1 is a schematic structural view of the cutting device of the present invention;

fig. 2 is a schematic structural view of the lobe splitting device of the present invention;

11-ultrafast laser; 12-a mirror; 13-a cutting head; 14-X-Y stage; 15-glass to be cut;

21-CO₂a laser; 22-a mirror; 23-scanning galvanometer; 24-a focusing lens; 25-a workbench; 26-cut glass.

Detailed Description

In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.

Examples

Referring to fig. 1 and 2, a laser cutting system for ground glass includes a cutting device and a breaking device, a conveying device is disposed between the cutting device and the breaking device, after the cutting device finishes cutting glass to be cut, the cut glass is conveyed to the breaking device through the conveying device, and then the breaking device performs breaking processing on the cut glass, so as to realize flow production, thereby improving production efficiency.

The cutting device comprises an ultrafast laser 11, a reflector 12, a cutting head 13 and an X-Y platform 14, wherein the ultrafast laser 11, the reflector 12 and the cutting head 13 are sequentially arranged along an optical axis, the X-Y platform 14 is arranged below the cutting head, and a glass 15 to be cut is placed on the X-Y platform 14, wherein the X-Y platform 14 can move along the X axis and the Y axis, the cutting head can move along the Z axis, the X axis, the Y axis and the Z axis are mutually vertical, the ultrafast laser 11 of the cutting device is a picosecond laser, the working wavelength of the picosecond laser is 1030 and 1090nm, the working pulse width is 5-15ps, and the cutting head 13 is used for shaping a Gaussian beam emitted by the ultrafast laser 11 into a Bessel beam;

the splitting device comprises a laser, a reflecting mirror 22, a scanning vibrating mirror 23 and a focusing lens 24, the laser, the reflecting mirror 22, the scanning vibrating mirror 23 and the focusing lens 24 are sequentially arranged along an optical axis, a workbench 25 is arranged below the focusing lens 24, cut glass 26 is placed on the workbench 25, the focusing lens 24 and the workbench 25 have relative movement along the Z-axis direction, and the degree of freedom of the relative movement along the Z-axis direction is realized, so that CO and the relative movement along the Z-axis direction are realized₂The focal position of the laser is adjusted by a focusing lens 24 in the Z-axis, and the scanning galvanometer 23 can change CO₂The emitting direction of laser realizes CO₂The laser scans the cut glass 26 along the cutting line, and the laser of the splitting device is CO₂Laser 21, said CO₂The working wavelength of the laser 21 is 10.6um, and the glass material can strongly absorb the laser in the wave band, thereby ensuring good splinter effect.

In the above description, the upper, lower, left, right, front, and rear merely represent relative positions thereof and do not represent absolute positions thereof.

From the above description, the beneficial effects of the present invention are: a system for cutting ground glass is provided, the system firstly uses Bessel light beam to cut target glass, holes with a certain distance are formed on the surface of the glass, cracks are generated between the holes, and then CO is scanned by a scanning galvanometer₂The laser is shot to the cutting position, so that cracks between the holes are heated and cracked, and finally the required product is obtained.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A laser cutting system of ground glass is characterized in that: the cutting device comprises an ultrafast laser, a cutting head and an X-Y platform, wherein the ultrafast laser and the cutting head are sequentially arranged along an optical axis, and the X-Y platform is arranged below the cutting head; the splitting device comprises a laser, a scanning galvanometer and a focusing lens, the laser, the scanning galvanometer and the focusing lens are sequentially arranged along an optical axis, and a workbench is arranged below the focusing lens.

2. The laser cutting system for ground glass according to claim 1, wherein: the ultrafast laser of the cutting device is a picosecond laser, and the working wavelength of the picosecond laser is 1030 and 1090 nm.

3. The laser cutting system for ground glass according to claim 2, wherein: the working pulse width of the picosecond laser is 5-15 ps.

4. The laser cutting system for ground glass according to claim 3, characterized in that: the laser of the splitting device is CO₂Laser, the CO₂The operating wavelength of the laser is 10.6 um.

5. The laser cutting system for ground glass according to any one of claims 1 to 4, characterized in that: the cutting head is used for shaping a Gaussian beam emitted by the cutting laser into a Bessel beam.