CN212496031U - Ultrafast laser cutting device of transparent material - Google Patents
Ultrafast laser cutting device of transparent material Download PDFInfo
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- CN212496031U CN212496031U CN202021201211.9U CN202021201211U CN212496031U CN 212496031 U CN212496031 U CN 212496031U CN 202021201211 U CN202021201211 U CN 202021201211U CN 212496031 U CN212496031 U CN 212496031U
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- transparent material
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- 239000012780 transparent material Substances 0.000 title claims abstract description 25
- 238000003698 laser cutting Methods 0.000 title claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 230000003287 optical effect Effects 0.000 claims abstract description 9
- 239000013307 optical fiber Substances 0.000 claims abstract description 9
- 238000000926 separation method Methods 0.000 claims description 2
- 239000002918 waste heat Substances 0.000 abstract description 4
- 238000012545 processing Methods 0.000 description 23
- 239000011521 glass Substances 0.000 description 17
- 239000010980 sapphire Substances 0.000 description 9
- 229910052594 sapphire Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000003672 processing method Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
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Abstract
The utility model discloses a transparent material's ultrafast laser cutting device, including laser generating device, light steering component, optical head, work platform, be equipped with three-dimensional motion between optical head and work platform, the characteristic is: the laser generating device is an ultrafast pulse train laser and mainly comprises a semiconductor laser, an optical fiber amplifier and a collimator, wherein the semiconductor laser provides pulse train seed laser with the wavelength of 1020-1090 nanometers; the optical head is a Bessel cutting head; the pulse train seed laser enters a collimator after being amplified by an optical fiber amplifier, the ultrafast pulse train laser is output and guided into a Bessel cutting head by a light steering assembly, and more than three focusing points are formed inside a processed material on a working platform. The utility model discloses guaranteed the reliability of cutting light beam, effectively utilized the waste heat of preceding pulse, guaranteed cutting process's quality, realized the sharp and various special-shaped appearance cutting of material.
Description
Technical Field
The utility model relates to a laser beam machining device, concretely relates to ultrafast laser cutting device for cutting process is carried out transparent material.
Background
Glass and sapphire transparent materials have become an indispensable part of people's daily life, and with the development of economy, the demand for glass products is increasing day by day. In the glass and sapphire production industry, glass and sapphire processing is a very important link.
Generally, glass and sapphire processing (cold working) mainly includes polishing, cutting, drilling, engraving, edging, and the like. For the purpose of industrially realizing the above-mentioned glass and sapphire processing, the processing methods adopted in the prior art mainly include a mechanical processing method, a chemical processing method (mainly used for polishing and etching), a high-pressure water jet processing method (mainly used for cutting and drilling), and a laser processing method. Among them, the laser processing method is far superior to other methods in terms of processing speed and degree of automation.
In general, glass and sapphire are laser processed with CO having a wavelength of about 10.6 μm2The output power of the laser is generally required to be over 100W. CO 22Laser processing of glass and sapphire is achieved by laser incidence which causes glass to break when heated. Taking the cutting of sheet glass as an example, CO is added2Laser beams emitted by the laser are focused on the flat glass, the high-power laser enables the glass to be heated and broken at the focal position of the laser, and the cracks extend to the upper surface and the lower surface of the glass so as to finish cutting. During the thermal cutting process, it is usually necessary to use a quenching nozzle to spray cold water or gas onto the cutting path to break the glass apart. The method has low cutting precision and is difficult to process complex patterns.
The nanosecond pulse laser can be used for laser processing of glass and sapphire to reach the specific CO2Better processing effect of the laser. With conventional CO2Different from lasers, the nanosecond laser realizes glass processing by means of micro blasting. Also taking the cutting of the flat glass as an example, the focus of the laser can be moved in the vertical direction by the 3D scanning galvanometer, and the glass can be blasted in the micron order where the focus of the laser passes through, and the tiny blast can be generatedThe damage is superimposed in the vertical direction so that a higher precision cut is achieved. Such nanosecond lasers also have some drawbacks in glass and sapphire processing. The edge break after nanosecond laser processing is generally greater than 50 microns, however in many applications, edge break less than 20 microns is required.
To achieve laser processing levels of less than 20 microns, ultrafast laser processing may be employed. Picosecond laser pulses are focused on the position to be processed of the transparent material, and the transparent material is processed by moving the focusing position. During processing, the laser beam is focused on the lower surface of the transparent material to be processed, processing is carried out according to a set track, the focus point is gradually raised, and the transparent material is processed from bottom to top. The moving focusing position can be realized by a scanning galvanometer, the output laser passes through the scanning galvanometer and then is focused to the position to be processed of the transparent material by a focusing lens, so that the transparent material is removed in a micron order, and the position of the moving focus of the scanning galvanometer is used for overlapping the removal point in the area to be processed so as to realize processing. During specific processing, a laser beam is focused on the lower surface of the transparent material to be processed, processing is carried out according to a set track, a focus point is gradually raised, and the transparent material is processed from bottom to top. Such ultrafast laser processing has no bevel angle. However, this method is relatively slow.
The processing speed is faster by adopting an ultra-fast laser Bessel cutting method, however, a picosecond free space solid laser is generally adopted in the Bessel cutting. The picosecond free space solid laser is inconvenient to manufacture, poor in reliability, poor in light beam quality and high in price.
Therefore, it would be of great interest to find a new ultrafast picosecond laser for fast, low-cost processing of transparent materials.
Disclosure of Invention
The invention aims to provide an ultrafast laser cutting device for transparent materials, which aims to overcome the problem of limited processing in the prior art and improve the processing precision and speed of laser transparent materials.
In order to achieve the purpose of the invention, the technical scheme adopted by the utility model is as follows: an ultrafast laser cutting device for transparent materials comprises a laser generating device, a light steering assembly, an optical head and a working platform, wherein a three-dimensional movement mechanism is arranged between the optical head and the working platform, the laser generating device is an ultrafast pulse train laser, the ultrafast pulse train laser mainly comprises a semiconductor laser, an optical fiber amplifier and a collimator, and the semiconductor laser provides pulse train seed laser with the wavelength of 1020-1090 nanometers; the optical head is a Bessel cutting head; the pulse train seed laser emitted by the semiconductor laser enters the collimator after being amplified by the optical fiber amplifier, the ultrafast pulse train laser is output and guided into the Bessel cutting head by the light steering assembly, and more than three focusing points are formed inside a processed material on the working platform.
In the above technical solution, the pulse output laser is a fiber laser having a wavelength of about 1 μm. The output pulse train comprises at least four laser pulses in each pulse train, the pulse width is less than 60ps, the peak power of the pulses is more than 1MW, the time between each laser pulse in each pulse train is less than 30ns, and the interval time between the pulse trains is more than 100 ns. The first pulse acts on the material to microcrack the material and increase the temperature of the surrounding material. The second pulse reaches and further rapidly increases the temperature of the surrounding material, increasing the length of the microcracks, before the heat of the surrounding material is dissipated. The third pulse can utilize the waste heat of the first two pulses to effectively increase the length of the microcrack, and so on, the pulse train can greatly improve the length of the microcrack. At the same time, the bessel cutting head may produce multiple focal points in the material. For example more than three focal points. When the microcracks of different focus points are connected together, the processed material can generate microcracks from top to bottom, so that the cutting is realized.
During laser machining, thermal diffusion requires microsecond time levels, but subsequent pulses typically arrive at around ten and several nanoseconds. A typical pulse interval for a burst is approximately ten nanoseconds, much less than the microsecond time required for thermal diffusion. The waste heat from the previous pulse can thus be used efficiently.
In the technical scheme, a rack is fixedly arranged above the working platform, the plane where the working platform is located is an X-Y plane, a Z axis is perpendicular to the X-Y plane, the laser generating device is positioned on the rack, an X axis movement module is arranged on the front side of the rack, a Z axis movement module is arranged on a movement part of the X axis movement module, the Bessel cutting head is fixed on the movement part of the Z axis movement module, and the working platform is provided with a Y axis movement mechanism; the light steering component comprises 4 total reflection lenses, wherein a first lens and a second lens are fixed on the rack and guide laser beams to the upper part of the Bezier cutting head, and a third lens and a fourth lens are arranged on a moving part of the Z-axis movement module, so that the laser beams are turned to be in a vertical downward direction and enter the Bezier cutting head. Thereby, the third lens, the fourth lens, the Bessel cutting head,
In the technical scheme, each laser pulse train comprises at least four laser pulses, the pulse width of each laser pulse is less than 60ps, the peak power of the pulse is more than 1MW, and the time between adjacent laser pulses in the pulse train is less than 30 ns; the separation time between adjacent bursts is greater than 100 ns.
According to the preferable technical scheme, the number of the laser pulses in each laser pulse train is 4-50.
More preferably, the number of laser pulses in each laser pulse train is 4 to 15.
In the above technical solution, the transparent material is one of glass, crystalline material, semiconductor and plastic.
In the above technical solution, the cutting may be a vertical cutting or an angular cutting.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
1. the utility model utilizes the optical fiber amplifier to match with the Bessel cutting head, thereby ensuring the reliability of the cutting beam, and meanwhile, the waste heat of the previous pulse is effectively utilized by limiting the time between the adjacent laser pulses in the pulse train, thereby ensuring the quality of cutting processing;
2. the utility model discloses a light turns to subassembly and motion's reasonable cooperation, has constituted three-dimensional machining space, realizes the sharp and the cutting of various special-shaped appearance to the material through the combined motion of triaxial.
Drawings
Fig. 1 is a schematic structural frame diagram of an ultrafast burst laser according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the present invention.
Detailed Description
The invention will be further described with reference to the following drawings and examples:
the first embodiment is as follows: referring to fig. 2, the ultrafast laser cutting device for the transparent material comprises an ultrafast pulse train laser, a light steering assembly, a bessel cutting head and a working platform, wherein the transparent material to be processed is placed on the working platform.
As shown in fig. 1, in the ultrafast burst laser, a semiconductor laser forms an ultrafast burst seed laser, a multi-stage or single-stage fiber amplifier and a collimator are provided, and the semiconductor laser provides a burst seed laser with a wavelength of 1020 nm to 1090 nm, and the burst seed laser enters the collimator after being amplified by the fiber amplifier and outputs the ultrafast burst laser. Each laser pulse train comprises at least four laser pulses, the pulse width of each laser pulse is less than 60ps, the peak power of the pulse is more than 1MW, and the time between adjacent laser pulses in the pulse train is less than 30 ns; the interval time between adjacent pulse trains is more than 100ns, and the number of laser pulses in each laser pulse train is 4-50. The ultrafast laser beam output by the laser only adopts the optical fiber amplifier to amplify energy, and the laser pulse width broadening quantity and the laser pulse width compression quantity do not exceed 20% of the seed laser pulse width from the seed light to the optical fiber output.
In this embodiment, a three-dimensional motion mechanism is provided, which is configured to: a rack is fixedly arranged above the working platform, the plane where the working platform is located is an X-Y plane, a Z axis is perpendicular to the X-Y plane, the ultrafast pulse train laser is located on the rack, and the light emitting direction of the laser is the side of the rack.
An X-axis movement module is arranged on the front side of the rack, a Z-axis movement module is arranged on a movement part of the X-axis movement module, the Bessel cutting head is fixed on the movement part of the Z-axis movement module, and the working platform is provided with a Y-axis movement mechanism.
The light steering component comprises 4 total reflection lenses of 45 degrees, wherein a first lens 1 and a second lens 2 are fixed on the frame, laser beams emitted to the side are guided to the horizontal front of the laser, a third lens 3 and a fourth lens 4 are arranged on a moving piece of the Z-axis movement module, wherein the third lens 3 converts the horizontal laser beams to the left into forward beams, and the fourth lens 4 is positioned right above the Bessel cutting head, so that the laser beams are converted into the vertical downward direction and enter the Bessel cutting head.
The pulse series laser beam passes through the Bessel cutting head, more than three focusing points are formed inside a processed material on the working platform, and the linear and various special-shaped shapes of the material are cut through the combined motion of three shafts.
Claims (5)
1. The utility model provides a transparent material's ultrafast laser cutting device, turns to subassembly, optical head, work platform including laser generating device, light, is equipped with three-dimensional motion mechanism, its characterized in that between optical head and work platform: the laser generating device is an ultrafast pulse train laser, the ultrafast pulse train laser mainly comprises a semiconductor laser, an optical fiber amplifier and a collimator, and the semiconductor laser provides pulse train seed laser with the wavelength of 1020-1090 nanometers; the optical head is a Bessel cutting head; the pulse train seed laser emitted by the semiconductor laser enters the collimator after being amplified by the optical fiber amplifier, the ultrafast pulse train laser is output and guided into the Bessel cutting head by the light steering assembly, and more than three focusing points are formed inside a processed material on the working platform.
2. The ultrafast laser cutting apparatus of transparent material of claim 1, wherein: a rack is fixedly arranged above the working platform, the plane where the working platform is located is an X-Y plane, a Z axis is perpendicular to the X-Y plane, the laser generating device is positioned on the rack, an X axis movement module is arranged on the front side of the rack, a Z axis movement module is arranged on a movement part of the X axis movement module, the Bessel cutting head is fixed on the movement part of the Z axis movement module, and the working platform is provided with a Y axis movement mechanism; the light steering component comprises 4 total reflection lenses, wherein a first lens and a second lens are fixed on the rack and guide laser beams to the upper part of the Bezier cutting head, and a third lens and a fourth lens are arranged on a moving part of the Z-axis movement module, so that the laser beams are turned to be in a vertical downward direction and enter the Bezier cutting head.
3. The ultrafast laser cutting apparatus of transparent material of claim 1, wherein: each laser pulse train comprises at least four laser pulses, the pulse width of each laser pulse is less than 60ps, the peak power of the pulse is more than 1MW, and the time between adjacent laser pulses in the pulse train is less than 30 ns; the separation time between adjacent bursts is greater than 100 ns.
4. The ultrafast laser cutting apparatus of transparent material of claim 1, wherein: the number of laser pulses in each laser pulse train is 4-50.
5. The ultrafast laser cutting apparatus of transparent material of claim 4, wherein: the number of laser pulses in each laser pulse train is 4-15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021201211.9U CN212496031U (en) | 2020-06-26 | 2020-06-26 | Ultrafast laser cutting device of transparent material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021201211.9U CN212496031U (en) | 2020-06-26 | 2020-06-26 | Ultrafast laser cutting device of transparent material |
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| CN212496031U true CN212496031U (en) | 2021-02-09 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111618454A (en) * | 2020-06-26 | 2020-09-04 | 苏州图森激光有限公司 | Ultrafast laser cutting method and device for transparent material |
| CN115533301A (en) * | 2022-09-23 | 2022-12-30 | 深圳腾睿微电子科技有限公司 | a processing equipment |
| CN117226254A (en) * | 2023-11-02 | 2023-12-15 | 武汉华日精密激光股份有限公司 | Laser drilling device and method based on ultrafast laser-long pulse laser combination |
-
2020
- 2020-06-26 CN CN202021201211.9U patent/CN212496031U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111618454A (en) * | 2020-06-26 | 2020-09-04 | 苏州图森激光有限公司 | Ultrafast laser cutting method and device for transparent material |
| CN115533301A (en) * | 2022-09-23 | 2022-12-30 | 深圳腾睿微电子科技有限公司 | a processing equipment |
| CN117226254A (en) * | 2023-11-02 | 2023-12-15 | 武汉华日精密激光股份有限公司 | Laser drilling device and method based on ultrafast laser-long pulse laser combination |
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