CN205437508U - Hard brittle material heterotype hole processing equipment based on laser cutting - Google Patents
Hard brittle material heterotype hole processing equipment based on laser cutting Download PDFInfo
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- CN205437508U CN205437508U CN201521132371.1U CN201521132371U CN205437508U CN 205437508 U CN205437508 U CN 205437508U CN 201521132371 U CN201521132371 U CN 201521132371U CN 205437508 U CN205437508 U CN 205437508U
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- brittle material
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Abstract
The utility model discloses a hard brittle material heterotype hole processing equipment based on laser cutting, it is including the laser head, and the laser pulse's that sends along the laser head transmission direction has set gradually the beam expanding lens, the mirror that shakes, focus field lens and processing platform, processing platform top to one side is equipped with gas blowing device, be used for placing the hard brittle material on the processing platform, gas blowing device's export is towards the hard brittle material, laser head electric connection has a computer control module, by computer control module and control laser head outgoing laser and the control mirror operation of shaking, shake the mirror for the 2D mirror that shakes. The utility model discloses improve heterotype hole's processingquality, shown and improving heterotype hole machining efficiency, avoided causing the hard brittle material cracked because of the thermal stress is too big betterly, improved machining efficiency and processing product matter greatly.
Description
Technical field
This utility model relates to Laser cutting technical field, particularly relates to a kind of hard brittle material processing special holes equipment based on cut.
Background technology
In recent years, laser processing technology is widely used in the cutting of hard brittle material, in especially retrofit technique.The profiled holes of traditional hard material (such as glass, sapphire, pottery etc.) is to use mechanism based on carbon dioxide laser or optical fiber laser to cut, the method is more effective for large-sized special-shaped cutting, but its zlasing mode is poor, the feature that focal beam spot is big, cause it when processing fine profiled holes, pass weak effect occurs and stitches wider situation.
Cut is that the high power density laser bundle utilizing line focus irradiates workpiece, makes irradiated material melt rapidly or vaporize, thus realizes a kind of hot-working method of work piece cut.The working mechanism of laser instrument is mainly laser beam focusing in material surface so that photon energy be converted into chemical energy or heat energy and by sputtering of materials out.Wherein, solid state laser has the advantages that beam mode is good, focal beam spot is little, coordinates the relative motion of workpiece can process the good pass of effect, but its structural cost is high and presents, when processing multiple profiled holes, the feature that working (machining) efficiency is slow.And use high power solid state laser to cut, owing to focal beam spot is little and energy density is high, light beam carries the biggest heat, so easily cause fragmentation in the course of processing because thermal stress is excessive.
Utility model content
The technical problems to be solved in the utility model is, for the deficiencies in the prior art, it is provided that a kind of can reduce product cost, improve irregularly-shaped hole hole shape, avoids causing because thermal stress is excessive the processing special holes equipment of hard brittle material fragmentation.
For solving above-mentioned technical problem, this utility model adopts the following technical scheme that.
A kind of hard brittle material processing special holes equipment based on cut, it includes laser head, the transmission direction of the laser pulse sent along laser head is disposed with beam expanding lens, galvanometer, focusing field lens and processing platform, described processing platform oblique upper is provided with blowning installation, it is used for placing hard brittle material on described processing platform, the outlet of described blowning installation is towards hard brittle material, described laser head is electrically connected with computer control module, controlling laser head shoot laser by described computer control module and control galvanometer operating, described galvanometer is 2D galvanometer.
Preferably, described laser head is nanosecond ND:YAG, YLF, YVO4 type solid-state laser.
Preferably, the outlet of described blowning installation is planar as outlet.
The disclosed hard brittle material processing special holes equipment based on cut of this utility model, its having the beneficial effects that compared to existing technologies, this utility model have employed nanosecond laser with low cost and 2D galvanometer can realize processing special holes, mobile without processing platform auxiliary, thus improve the crudy of profiled holes, significantly improve processing special holes efficiency, preferably avoid and cause hard brittle material fragmentation because thermal stress is excessive, substantially increase working (machining) efficiency and processing quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model hard brittle material processing special holes equipment.
Fig. 2 is the distribution trajectory schematic diagram of aperture during processing special holes.
Detailed description of the invention
With embodiment, this utility model is described in more detail below in conjunction with the accompanying drawings.
The utility model discloses a kind of hard brittle material processing special holes equipment based on cut, as shown in Figure 1, it includes laser head 1, the transmission direction of the laser pulse sent along laser head 1 is disposed with beam expanding lens 2, galvanometer 3, focus on field lens 4 and processing platform 5, described processing platform 5 oblique upper is provided with blowning installation 6, it is used for placing hard brittle material 7 on described processing platform 5, the outlet of described blowning installation 6 is towards hard brittle material 7, described laser head 1 is electrically connected with computer control module 8, control laser head 1 shoot laser by described computer control module 8 and control galvanometer 3 operates, described galvanometer 3 is 2D galvanometer.Described laser head 1 is nanosecond ND:YAG, YLF, YVO4 type solid-state laser.Further, the outlet of described blowning installation 6 is planar as outlet.
In work process, laser carries out light beam amplification and collimation via beam expanding lens 2, the scanning of profiled holes path is carried out again through galvanometer 3, the hard brittle material 7 to processing platform 5 is transmitted by focusing on field lens 4, this hard brittle material 7 can be aluminium oxide ceramic substrate, can also be that other have the substrate of characteristic hard, crisp, blowning installation 6 be for blowing heat radiation to hard brittle material 7, and computer control module 8 is used for controlling laser head 1 shoot laser and galvanometer 3 operates.
Above-mentioned hard brittle material processing special holes equipment based on cut, which employs nanosecond laser with low cost and 2D galvanometer can realize processing special holes, mobile without processing platform auxiliary, thus improve the crudy of profiled holes, significantly improve processing special holes efficiency, preferably avoid and cause hard brittle material fragmentation because thermal stress is excessive, substantially increase working (machining) efficiency and processing quality.
Hard brittle material processing special holes method based on cut, shown in Fig. 1 and Fig. 2, comprises the following steps that
Step S1, utilizes computer control module 8 to edit different in nature hole to be processed, profiled holes resolves into multiple aperture 100, and wherein, during Drilling operation, the size of aperture 100 isThe processing speed of aperture 100 is 40-50 hole/second, and owing to aperture is short for process time, thermal stress cannot be accumulated in a large number, so that hard brittle material is unlikely to rupture；
Step S2, the laser of laser instrument 1 outgoing is delivered to the surface of hard brittle material 7 via beam expanding lens 2, galvanometer 3 and focusing field lens 4, draws circular arc more than 3 time via described galvanometer and is cut into profiled holes；
Step S3, described computer control module 8 controls galvanometer 3 and rotates, to make the laser of laser head 1 outgoing repair along the edge of profiled holes.
In the disclosed hard brittle material processing special holes equipment based on cut of this utility model, laser head is without selecting psec or the femto-second laser that accumulation of heat is less, and galvanometer is without selecting the 3D galvanometer system that price is higher, processing platform 5 is without completing working motion by XY axle drive mechanism simultaneously, add and only do hollow out and process below cutting pass man-hour, can be seen that in conjunction with the above, this utility model reduces equipment cost, and can obtain stitching the profiled holes of wide minimum 40um, for comparing optical fiber laser or the carbon dioxide laser in traditional working special-shaped hole, the quality of the profiled holes of this utility model processing is improved, simultaneously, galvanometer jumps the speed of hole machined can reach 5000mm/s, the speed moved much larger than platform, thus improve working (machining) efficiency.
It is more than this utility model preferred embodiment, is not limited to this utility model, all amendment, equivalent or improvement etc. made in technical scope of the present utility model, should be included in the range of this utility model protected.
Claims (3)
1. a hard brittle material processing special holes equipment based on cut, it is characterized in that, include laser head, the transmission direction of the laser pulse sent along laser head is disposed with beam expanding lens, galvanometer, focus on field lens and processing platform, described processing platform oblique upper is provided with blowning installation, it is used for placing hard brittle material on described processing platform, the outlet of described blowning installation is towards hard brittle material, described laser head is electrically connected with computer control module, control laser head shoot laser by described computer control module and control galvanometer operating, described galvanometer is 2D galvanometer.
2. hard brittle material processing special holes equipment based on cut as claimed in claim 1, it is characterised in that described laser head is nanosecond ND:YAG, YLF, YVO4 type solid-state laser.
3. hard brittle material processing special holes equipment based on cut as claimed in claim 1, it is characterised in that the outlet of described blowning installation is planar as outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521132371.1U CN205437508U (en) | 2015-12-30 | 2015-12-30 | Hard brittle material heterotype hole processing equipment based on laser cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521132371.1U CN205437508U (en) | 2015-12-30 | 2015-12-30 | Hard brittle material heterotype hole processing equipment based on laser cutting |
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| CN205437508U true CN205437508U (en) | 2016-08-10 |
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| CN201521132371.1U Active CN205437508U (en) | 2015-12-30 | 2015-12-30 | Hard brittle material heterotype hole processing equipment based on laser cutting |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458531A (en) * | 2015-12-30 | 2016-04-06 | 常州英诺激光科技有限公司 | Hard and brittle material special-shaped hole machining equipment and method based on laser cutting |
| CN108526684A (en) * | 2018-06-26 | 2018-09-14 | 中船重工海为郑州高科技有限公司 | A kind of nanosecond laser processing unit (plant) of the big aspect ratio through-hole of Ti-alloyed filter element |
| CN111590218A (en) * | 2020-04-28 | 2020-08-28 | 深圳市东赢激光设备有限公司 | Vibrating mirror type laser glass drilling method |
-
2015
- 2015-12-30 CN CN201521132371.1U patent/CN205437508U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458531A (en) * | 2015-12-30 | 2016-04-06 | 常州英诺激光科技有限公司 | Hard and brittle material special-shaped hole machining equipment and method based on laser cutting |
| CN108526684A (en) * | 2018-06-26 | 2018-09-14 | 中船重工海为郑州高科技有限公司 | A kind of nanosecond laser processing unit (plant) of the big aspect ratio through-hole of Ti-alloyed filter element |
| CN111590218A (en) * | 2020-04-28 | 2020-08-28 | 深圳市东赢激光设备有限公司 | Vibrating mirror type laser glass drilling method |
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Legal Events
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Room 1111-1126, South Building, Huiyan Building, Changzhou Science and Education City, No. 801 Changwuzhong Road, Wujin District, Changzhou City, Jiangsu Province, 213000 Co-patentee after: Innovo laser Polytron Technologies Inc Patentee after: Inno Machining Co., Ltd. Address before: Room 1111-1126, South Building, Huiyan Building, Changzhou Science and Education City, No. 801 Changwuzhong Road, Wujin District, Changzhou City, Jiangsu Province, 213000 Co-patentee before: Shenzhen Inno Laser Technology Co., Ltd. Patentee before: Inno Machining Co., Ltd. |