CN108751686A - A kind of laser cutting device and its cutting method - Google Patents
A kind of laser cutting device and its cutting method Download PDFInfo
- Publication number
- CN108751686A CN108751686A CN201810782536.1A CN201810782536A CN108751686A CN 108751686 A CN108751686 A CN 108751686A CN 201810782536 A CN201810782536 A CN 201810782536A CN 108751686 A CN108751686 A CN 108751686A
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- CN
- China
- Prior art keywords
- laser
- cutting
- axis workbench
- cutting head
- stepper motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
Abstract
The invention discloses a kind of laser cutting devices,Including engine base,The laser control case being arranged in engine base,And the XY axis workbench and portal frame being arranged on engine base,The XY axis workbench is located at the lower section of portal frame,The absorption platform for placing workpieces processing is equipped on XY axis workbench,It is equipped with laser successively in portal frame upper edge light path,First speculum,Beam expanding lens,Second speculum and cutting head,And the Z axis workbench opposite with XY axis workbench is housed,CCD camera and hollow rotating platform are equipped on the Z axis workbench side by side,It is connected with stepper motor in hollow rotating platform sides,Optoelectronic switch is housed in hollow rotating platform hull,The cutting head is mounted on the lens combination light path output that the second speculum is faced on the turntable of hollow rotating platform,Equipped with the anti-dazzling screen for rotating with and triggering optoelectronic switch on cutting head.The present invention by configure can axial-rotation cutting head, achieve the purpose that improve laser cutting speed and cutting efficiency.
Description
Technical field
The present invention relates to laser cutting technique fields, more specifically, more particularly to it is a kind of for brittleness such as glass-cuttings
The laser cutting device and its cutting method of material.
Background technology
Laser cutting is the high power density laser beam irradiation workpiece using line focus, and illuminated material is made to melt rapidly
Change, vaporization, ablation reach burning point, while blowing down melt substance by with the coaxial high-speed flow of light beam, to realize work
Part is cut open.
Laser cutting can be divided into laser vaporization cutting, laser fusion cutting, Laser Oxygen lancing and laser scribing and control
It is broken four classes：1）Laser vaporization cutting is chiefly used in very thin metal material and nonmetallic materials（Such as paper, cloth, timber, plastics and rubber
Deng）Cutting；2）Laser fusion, which is cut, is mainly used for the cutting of some not oxidizable materials or active metal, as stainless steel,
Titanium, aluminium and its alloy etc.；3）Laser Oxygen lancing is mainly used for the oxidizable metal material such as carbon steel, titanium steel and heat- treated steel
Material；4）Laser scribing is scanned on the surface of fragile material using the laser of high-energy density, makes material is heated to evaporate
One sulculus, then applies certain pressure, and fragile material will split along sulculus；When controlled fracturing blasting is using laser grooving
Generated precipitous Temperature Distribution generates local thermal stress in fragile material, material is made to be disconnected along sulculus.
Cutting glass by laser is to be cut using the principle of laser scribing, but cutting efficiency is lower than break bar cutting.
Its reason is：When mobile focal beam spot acts on the glass sheet, the thermal stress induction crackle generated simultaneously differs
Surely be the advance track along laser beam, in most cases, the direction of crackle can be formed with hot spot direction of advance one compared with
Big angle.In this way, when the speed for improving hot spot movement, when the distance between spot is larger, continuous laser pulse is beaten in glass
Generated crack due to thermal stress is not easy perforation or close on glass, glass will be made to be not readily separated.And to enable glass to be divided
From, it is necessary to the movement speed of hot spot is reduced, the crackle that each spot generates can just be mutually communicated or close, complete pair glass
Cutting.So, cutting speed is just reduced.
Invention content
It is a kind of for fragile materials such as glass-cuttings it is an object of the invention in view of the above shortcomings of the prior art, provide
Laser cutting device, cutting speed is fast, precision is high, and for the glass sheet edges being cut into naturally at frosted effect, intensity is high,
Eliminate the technological process of subsequent edging and cleaning.
To achieve the above object, the technical solution adopted by the present invention is：A kind of laser cutting device, including engine base, setting
Laser control case in engine base and the XY axis workbench and portal frame being arranged on engine base, the XY axis workbench position
In the lower section of portal frame, the absorption platform for placing workpieces processing is equipped on XY axis workbench, in portal frame upper edge light path
It is equipped with laser, the first speculum, beam expanding lens, the second speculum and cutting head successively, and the Z opposite with XY axis workbench is housed
Axis workbench is equipped with CCD camera and hollow rotating platform on the Z axis workbench side by side, is connected in hollow rotating platform sides
There is stepper motor, optoelectronic switch is housed in hollow rotating platform hull, the cutting head is mounted on turning for hollow rotating platform
The lens combination light path output that the second speculum is faced on disk, equipped with the shading for rotating with and triggering optoelectronic switch on cutting head
Piece.
The cutting method of laser cutting device of the present invention, includes the following steps：
（1）Workpiece to be cut is placed on the absorption platform vacuumized；
（2）It is controlled by laser control case and opens laser, laser beam imports cutting head after reflecting, expanding, focus；
（3）Stepper motor works, and cutting head rotation is driven through hollow rotating platform, when rotating to and Y-axis side in XY axis workbench
To fitting angle when, stepper motor stop, workbench along Y direction back-and-forth motion cut；
（4）After Y direction is cut, stepper motor works again drives cutting head rotation, when rotating to and XY axis workbench
When the angle of middle X-direction fitting, stepper motor stops, and workbench is moved left and right along X-direction and cut；
（5）X-direction closes laser after cutting, stopping vacuumizes absorption platform, removes workpiece, completes entire cutting
Process.
The present invention controls stepper motor rotation by program, and then cutting head is driven to rotate by a certain angle, and accurately adjusts
Laser pulse spot beats the developing direction of glass crack when on glass, is allowed to be bonded the moving direction of laser facula as possible, reach
Improve the purpose of laser cutting speed and cutting efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of the present invention；
Fig. 2 is Z axis workbench and Accessory Members structural schematic diagram in the present invention.
In figure：1- engine bases；2- laser control casees；3-XY axis workbench；4- absorption platforms；5- portal frames；6-
First speculum；7- beam expanding lens；The second speculums of 8-；9- lasers；10-Z axis workbench；11-CCD cameras；In 12-
Empty rotating platform；13- stepper motors；14- optoelectronic switches；15- cutting heads；16- anti-dazzling screens.
Specific implementation mode
The present invention is described in further detail for embodiment in below in conjunction with the accompanying drawings, but does not constitute to the present invention's
Any restrictions.
As shown in Figure 1, a kind of laser cutting device provided by the invention, including engine base 1, the laser that is arranged in engine base 1
Device control cabinet 2 and the XY axis workbench 3 being arranged on engine base 1 and portal frame 5, the XY axis workbench 3 are located at portal frame 5
Lower section, absorption platform 4 for placing workpieces processing is equipped on XY axis workbench 3, is set successively in 5 upper edge light path of portal frame
There are laser 9, the first speculum 6, beam expanding lens 7, the second speculum 8 and cutting head 15, and equipped with opposite with XY axis workbench 3
Z axis workbench 10.As shown in Fig. 2, CCD camera 11 and hollow rotating platform 12 are equipped on the Z axis workbench 10 side by side, in
12 side of empty rotating platform is connected with stepper motor 13, and optoelectronic switch 14 is housed on 12 shell of hollow rotating platform, described to cut
It cuts first 15 and is mounted on the lens combination light path output for facing the second speculum 8 on the turntable of hollow rotating platform 12, by stepper motor 13
Hollow rotating platform 12 is driven to drive rotation, equipped with the anti-dazzling screen for rotating with and triggering optoelectronic switch 14 on cutting head 15
16。
Laser cutting device of the present invention is reflected by light path, expanded, focused, and laser beam is imported cutting head 15, is focused on
On absorption platform 4 with vacuumizing and adsorbing effect, the on or off of laser 9 is controlled by laser control case 2, coordinates XY axis
Cutting action is completed in the movement of workbench 3.In cutting process, cutting head 15 drives hollow rotating flat by stepper motor 13
Platform 12 drives rotation.
When being cut using the present invention, cutting action（Method）It is as follows：
（1）By workpiece to be cut（Such as glass plate）It is placed on the absorption platform 4 vacuumized；
（2）It is controlled by laser control case 2 and opens laser 9, laser beam imports cutting head 15 after reflecting, expanding, focus；
（3）Stepper motor 13 works, and drives cutting head 15 to rotate through hollow rotating platform 12, when rotating to and XY axis workbench 3
When the angle of middle Y direction fitting, stepper motor 13 stops, and workbench 3 is cut along Y direction back-and-forth motion；
（4）After Y direction is cut, stepper motor 13 works again drives cutting head 15 to rotate, when rotating to and XY axis works
When making the angle that X-direction is bonded in platform 3, stepper motor 13 stops, and workbench 3 is moved left and right along X-direction to be cut；
（5）X-direction closes laser 9 after cutting, stopping vacuumizes absorption platform 4, removes workpiece, and completion is entirely cut
Cut process.
In above-mentioned cutting process, the start and stop of stepper motor 13 and the movement of XY axis workbench 3 are by computer program control
System, and stepper motor 3, which drives the rotation of cutting head 15, to be overlapped with optoelectronic switch 14 with anti-dazzling screen 16 as initial origin.
The present invention drives hollow rotating platform 12 that cutting head 15 is driven to rotate by a certain angle by stepper motor 13, Ke Yijing
The developing direction that laser pulse acts on generated crack due to thermal stress on glass really is adjusted, is allowed to be bonded laser facula as possible
Moving direction, reach can sliver best angle, to reach the processing effect of time-saving and efficiency.In swashing using equal-wattage
On the cutting equipment of light device, the cutting speed than being up to 6~7 times without the equipment using rotary laser cutting head is realized, significantly
Ground improves the efficiency of cutting glass by laser.It is utilized moreover, laser cutting device of the present invention and cutting method can be equally used in
Induce crack growth to the cutting of other fragile materials using upper.
Claims (3)
1. a kind of laser cutting device, including engine base, the laser control case that is arranged in engine base and it is arranged on engine base
XY axis workbench and portal frame, it is characterised in that：The XY axis workbench is located at the lower section of portal frame, is set on XY axis workbench
Be useful for place workpieces processing absorption platform, portal frame upper edge light path successively be equipped with laser, the first speculum, expand
Mirror, the second speculum and cutting head, and the Z axis workbench opposite with XY axis workbench is housed, it is set side by side on the Z axis workbench
There are CCD camera and hollow rotating platform, stepper motor is connected in hollow rotating platform sides, in hollow rotating platform hull
Equipped with optoelectronic switch, the cutting head is mounted on the optical output that the second speculum is faced on the turntable of hollow rotating platform
End, equipped with the anti-dazzling screen for rotating with and triggering optoelectronic switch on cutting head.
2. a kind of cutting method of laser cutting device as described in claim 1, it is characterised in that：Include the following steps：
（1）Workpiece to be cut is placed on the absorption platform vacuumized；
（2）It is controlled by laser control case and opens laser, laser beam imports cutting head after reflecting, expanding, focus；
（3）Stepper motor works, and cutting head rotation is driven through hollow rotating platform, when rotating to and Y-axis side in XY axis workbench
To fitting angle when, stepper motor stop, workbench along Y direction back-and-forth motion cut；
（4）After Y direction is cut, stepper motor works again drives cutting head rotation, when rotating to and XY axis workbench
When the angle of middle X-direction fitting, stepper motor stops, and workbench is moved left and right along X-direction and cut；
（5）X-direction closes laser after cutting, stopping vacuumizes absorption platform, removes workpiece, completes entire cutting
Process.
3. cutting method according to claim 2, it is characterised in that：In above-mentioned cutting process, the start and stop of stepper motor
And the movement of XY axis workbench is controlled by computer program, and it is with anti-dazzling screen and light that stepper motor, which drives the rotation of cutting head,
It is initial origin that electric switch, which overlaps,.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810782536.1A CN108751686A (en) | 2018-07-17 | 2018-07-17 | A kind of laser cutting device and its cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810782536.1A CN108751686A (en) | 2018-07-17 | 2018-07-17 | A kind of laser cutting device and its cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108751686A true CN108751686A (en) | 2018-11-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201810782536.1A Pending CN108751686A (en) | 2018-07-17 | 2018-07-17 | A kind of laser cutting device and its cutting method |
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| Country | Link |
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| CN (1) | CN108751686A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421272A (en) * | 2019-07-24 | 2019-11-08 | 武汉先河激光技术有限公司 | A kind of semi-automation laser cutting system and method |
| CN111822878A (en) * | 2020-06-16 | 2020-10-27 | 深圳中科光子科技有限公司 | Processing equipment for laser cutting of pipe fitting material |
| CN113059285A (en) * | 2021-04-01 | 2021-07-02 | 深圳市鸿昇自动化设备有限公司 | Laser cutting equipment is used in processing of cell-phone screen |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102189333A (en) * | 2011-05-04 | 2011-09-21 | 苏州天弘激光股份有限公司 | Laser cutting machine with CCD automatic focusing system |
| CN104071974A (en) * | 2014-06-20 | 2014-10-01 | 武汉先河激光技术有限公司 | Laser equipment for cutting glass and cutting method |
| CN108015437A (en) * | 2017-12-31 | 2018-05-11 | 东莞市恒好激光科技有限公司 | A kind of five-axle linkage laser cutting machine and its cutting technique |
| CN208485799U (en) * | 2018-07-17 | 2019-02-12 | 江苏先河激光技术有限公司 | A kind of laser cutting device |
-
2018
- 2018-07-17 CN CN201810782536.1A patent/CN108751686A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189333A (en) * | 2011-05-04 | 2011-09-21 | 苏州天弘激光股份有限公司 | Laser cutting machine with CCD automatic focusing system |
| CN104071974A (en) * | 2014-06-20 | 2014-10-01 | 武汉先河激光技术有限公司 | Laser equipment for cutting glass and cutting method |
| CN108015437A (en) * | 2017-12-31 | 2018-05-11 | 东莞市恒好激光科技有限公司 | A kind of five-axle linkage laser cutting machine and its cutting technique |
| CN208485799U (en) * | 2018-07-17 | 2019-02-12 | 江苏先河激光技术有限公司 | A kind of laser cutting device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421272A (en) * | 2019-07-24 | 2019-11-08 | 武汉先河激光技术有限公司 | A kind of semi-automation laser cutting system and method |
| CN111822878A (en) * | 2020-06-16 | 2020-10-27 | 深圳中科光子科技有限公司 | Processing equipment for laser cutting of pipe fitting material |
| CN113059285A (en) * | 2021-04-01 | 2021-07-02 | 深圳市鸿昇自动化设备有限公司 | Laser cutting equipment is used in processing of cell-phone screen |
| CN113059285B (en) * | 2021-04-01 | 2022-05-17 | 深圳市鸿昇自动化设备有限公司 | Laser cutting equipment is used in processing of cell-phone screen |
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