CN111496396A - Picosecond laser drilling device and method for ceramic substrate - Google Patents
Picosecond laser drilling device and method for ceramic substrate Download PDFInfo
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- CN111496396A CN111496396A CN202010393369.9A CN202010393369A CN111496396A CN 111496396 A CN111496396 A CN 111496396A CN 202010393369 A CN202010393369 A CN 202010393369A CN 111496396 A CN111496396 A CN 111496396A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention provides a picosecond laser drilling device and method for a ceramic substrate, which comprises the following steps: the device comprises a picosecond laser generator (1), a galvanometer cutting head (2), a main controller (3), a visual positioning observation part (5), a Z-axis cutting head lifting sliding table (8), a rotary platform (9), a working platform (15) and a substrate component; the laser generator (1) is connected with the galvanometer cutting head (2) by adopting an optical fiber; the main controller (3) is connected with the laser generator (1), the galvanometer cutting head (2) and the rotary platform (9); the plane of the center line of the Z-axis cutting head lifting sliding table (8) is perpendicular to the plane of the center line of the working platform (15). The invention adopts picosecond laser to cut smooth edges, has good roundness, smaller taper and low fragmentation probability, almost no boundary heat affected zone, does not yellow the edges, almost has no damage to the ceramic substrate, greatly improves the yield and is particularly suitable for the high-precision application of the current 5G ceramic substrate.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a picosecond laser drilling device and method for a ceramic substrate.
Background
The ceramic materials such as alumina and aluminum nitride have the advantages of high heat conductivity, high insulation degree, high temperature resistance and the like, and are widely applied to the fields of electronics and semiconductors. However, ceramic materials have high hardness and brittleness, and are difficult to mold, particularly, to form micropores. Because the laser has high power density and good directivity, the ceramic plate is generally processed by punching the ceramic substrate by the laser at present, a pulse laser or a quasi-continuous laser is generally adopted at present, the laser beam is focused on a workpiece which is vertically arranged with a laser shaft through an optical system, the laser beam with high energy density (105 and 109W/cm2) is emitted to melt the material, the material is gasified, the air flow which is generally coaxial with the laser beam is ejected by a laser cutting head, and the melted material is blown out from the bottom of a cut to form a through hole step by step. Traditional continuous laser, pulse laser and nanosecond laser, laser instantaneous peak power is low, and the duration is longer, and the cutting round hole tapering is great, and the circularity is relatively poor, and the heat affected zone at edge is great, to the ceramic packaging technique of current rapid development, especially the following 5G field to devices such as pottery ultra-precision punching, cutting and even welded demand can not follow the development of market. The picosecond laser duration is only picosecond level, the instantaneous peak power of the laser can reach the level above GW, perfect cutting can be realized on devices such as glass and ceramics, almost no inclination angle exists, no heat influence area exists, the fragmentation rate is low, and the picosecond laser has very wide market application prospect in the fields of future 3C and medicine, particularly 5G communication.
Patent document CN110605488A discloses a ceramic laser drilling device, which adopts a three-axis laser drilling system with xy + cyclotron vibration for ceramic drilling of electronic and semiconductor devices, but does not refer to what kind of laser is adopted, and does not describe the drilling process specifically, and in addition, a circle with a larger diameter is cut through the cyclotron motion, and the cutting efficiency is low due to the inertia of the machine itself.
Patent document CN105499812A discloses a method for improving the processing quality of a ceramic heat dissipation substrate, and the invention relates to a laser processing method of a L ED ceramic heat dissipation substrate, which mainly adopts a mode of coating a dye in advance, then drying, drilling holes and then cleaning to solve the problems of oxidation, yellowing and the like of the ceramic substrate in the drilling process, although the processing quality is improved, the working procedures are obviously increased, the processing efficiency is reduced, and in addition, the adopted laser is also a conventional continuous solid-state laser.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a picosecond laser drilling device and method for a ceramic substrate.
The invention provides a picosecond laser drilling device for a ceramic substrate, which is characterized by comprising the following components: the device comprises a picosecond laser generator 1, a galvanometer cutting head 2, a main controller 3, a visual positioning observation part 5, a Z-axis cutting head lifting sliding table 8, a rotary platform 9, a working platform 15 and a substrate component; the laser generator 1 is connected with the galvanometer cutting head 2 by adopting an optical fiber; the rotary platform 9 is arranged below the working platform 15; the visual positioning observation part 5 is connected with the galvanometer cutting head 2; the substrate member is disposed above the work table 15; the main controller 3 is connected with the laser generator 1, the galvanometer cutting head 2 and the rotary platform 9; the plane of the center line of the Z-axis cutting head lifting sliding table 8 is perpendicular to the plane of the center line of the working platform 15.
Preferably, the method further comprises the following steps: a laser protection curtain 16; the laser protection curtain 16 is arranged between the assembling station platform 10 and the cutting station platform 11.
Preferably, said work platform 15 comprises: an assembly station platform 10 and a cutting station platform 11; the assembly station platform 10 includes: the first xy two-axis sliding table and the first workpiece placing jig are arranged on the first support; the cutting station platform 11 includes: the second xy two-axis sliding table and the second workpiece placing jig are arranged; main control unit 3 links to each other with first xy diaxon slip table, second xy diaxon slip table.
Preferably, the method further comprises the following steps: a workpiece position monitor 6, a display 4; the workpiece position monitor 6 and the display 4 are arranged on one side of the picosecond laser drilling device of the ceramic substrate; the workpiece position monitor 6 is connected to the display 4.
Preferably, the method further comprises the following steps: a light source unit 7; the light source unit 7 is disposed above the laser generator 1.
Preferably, the substrate 3 is a ceramic substrate.
Preferably, the visual positioning observation component 5 adopts a CCD visual camera component.
Preferably, the method further comprises the following steps: a protective gas nozzle 12, a smoke suction hood 13 and a protective gas pipe; the protective gas nozzle 12 is connected with a protective gas pipe; the protective gas cylinder is connected with the protective gas pipe; the smoke dust suction hood 13 is connected with the Z-axis cutting head lifting sliding table 8.
Preferably, the method further comprises the following steps: an operation button 14; the operation button 14 is disposed below the work platform 15.
The invention provides a picosecond laser drilling method for a ceramic substrate, which comprises the following steps: step S1: setting cutting path and cutting technological parameters layer by layer or track by track; step S2: placing the workpiece to a special jig for fixing; step S3: rotating the assembling station to a cutting station; the rotary platform rotates 180 degrees, the assembly station rotates to the cutting station, and the xy axis adjusts the center of the hole to be drilled to the center of the light beam focus; step S4: performing CCD visual positioning to obtain CCD visual positioning information; step S5: scanning by a galvanometer, and drilling by laser layer by layer; drilling a ceramic substrate according to set laser process parameters and a cutting track, and opening a protective gas and smoke dust suction device in the process; step S6: returning the cutting platform to a zero position; and after all the holes on the ceramic substrate are drilled, turning off the laser, rotating the platform by 180 degrees, and returning the xy axis of the cutting station to the zero position of assembly. Step S7: judging whether the cutting is finished or not; if so, continuing to cut the rest workpieces, and repeating the steps S2-S6 until the cutting is finished; if not, the cutting station, the assembly station and the cutting head sequentially return to the initial zero position, the laser is turned off, the suction device and the protective gas are turned off, and the next work is waited.
Compared with the prior art, the invention has the following beneficial effects:
1. the picosecond laser cutting method has the advantages that the picosecond laser cutting edge is smooth, the roundness is good, the taper is smaller, the fragmentation probability is low, the boundary heat affected zone is almost not generated, the edge is not yellowed, the ceramic substrate is almost not damaged, the yield is greatly improved, and the picosecond laser cutting method is particularly suitable for high-precision application of 5G current ceramic substrates;
2. according to the invention, the xy precision sliding table automatically adjusts the cutting position of each hole, so that automatic and efficient drilling of the ceramic laser porous array can be realized, the edge cutting effect caused by laser inclination can be effectively solved, and the roundness and the taper of the drilled hole are improved;
3. according to the invention, the cutting of a large aperture in a certain range is realized through galvanometer scanning without moving an xy axis of a sliding table, so that the response speed and the cutting speed are improved; the CCD vision automatically identifies and positions the cutting position, obviously improves the processing efficiency and the position precision, and also reduces the position deviation possibly caused by human factors.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a front view of a ceramic substrate laser drilling apparatus according to the present invention.
Fig. 2 is a side view of a ceramic substrate laser drilling apparatus provided by the present invention.
Fig. 3 is a top view of the ceramic substrate laser drilling apparatus provided in the present invention.
FIG. 4 is a basic flow chart of drilling by the laser drilling device for ceramic substrates according to the embodiment of the present invention.
In the figure:
1 is picosecond laser generator 9 is a rotary platform
2 is a vibrating mirror cutting head 10 as an assembly station platform
3 is a main controller 11 is a cutting station platform
4 is a display 12 is a shielding gas nozzle
5 is a visual positioning observation part 13 which is a smoke suction hood
Workpiece position monitor 6 as operation button
7 is a light source part 15 as a working platform
8 is a laser protection curtain with a Z-axis cutting head lifting sliding table 16
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 1 to 4, the invention provides a picosecond laser drilling device for a ceramic substrate, comprising: the device comprises a picosecond laser generator 1, a galvanometer cutting head 2, a main controller 3, a visual positioning observation part 5, a Z-axis cutting head lifting sliding table 8, a rotary platform 9, a working platform 15 and a substrate component; the laser generator 1 is connected with the galvanometer cutting head 2 by adopting an optical fiber; the rotary platform 9 is arranged below the working platform 15; the visual positioning observation part 5 is connected with the galvanometer cutting head 2; the substrate member is disposed above the work table 15; the main controller 3 is connected with the laser generator 1, the galvanometer cutting head 2 and the rotary platform 9; the plane of the center line of the Z-axis cutting head lifting sliding table 8 is perpendicular to the plane of the center line of the working platform 15.
Preferably, the method further comprises the following steps: a laser protection curtain 16; the laser protection curtain 16 is arranged between the assembling station platform 10 and the cutting station platform 11.
Preferably, said work platform 15 comprises: an assembly station platform 10 and a cutting station platform 11; the assembly station platform 10 includes: the first xy two-axis sliding table and the first workpiece placing jig are arranged on the first support; the cutting station platform 11 includes: the second xy two-axis sliding table and the second workpiece placing jig are arranged; main control unit 3 links to each other with first xy diaxon slip table, second xy diaxon slip table.
Preferably, the method further comprises the following steps: a workpiece position monitor 6, a display 4; the workpiece position monitor 6 and the display 4 are arranged on one side of the picosecond laser drilling device of the ceramic substrate; the workpiece position monitor 6 is connected to the display 4.
Preferably, the LED illumination device further comprises a light source part 7, wherein the light source part 7 is arranged above the laser generator 1, and L ED auxiliary light sources are adopted as the light source part 7.
Preferably, the substrate 3 is a ceramic substrate.
Preferably, the visual positioning observation component 5 adopts a CCD visual camera component.
Preferably, the method further comprises the following steps: a protective gas nozzle 12, a smoke suction hood 13 and a protective gas pipe; the protective gas nozzle 12 is connected with a protective gas pipe; the protective gas cylinder is connected with the protective gas pipe; the smoke dust suction hood 13 is connected with the Z-axis cutting head lifting sliding table 8.
Preferably, the method further comprises the following steps: an operation button 14; the operation button 14 is disposed below the work platform 15.
Specifically, in one embodiment, the high-precision ceramic substrate punching device and method is characterized by comprising a picosecond laser generator, a picosecond galvanometer cutting head, a Z-axis module, a workpiece assembling station platform, a workpiece cutting station platform, a cutting plasma and smoke dust suction device, a shielding gas device, an industrial personal computer and a display, a CCD (charge coupled device) visual positioning and observation system, a rotary platform and a laser protection curtain.
Further, the laser generator generates ultraviolet picosecond laser with the wavelength of 300-360nm, and the ultraviolet picosecond laser is guided into the laser cutting head through the optical fiber, the average power of the laser is 5-50W, the repetition frequency of laser pulse is 10-1Mhz, and the pulse width is 15 ps.
The picosecond laser cutting head is connected with a laser generator through an optical fiber, picosecond ultraviolet light of about 355nm generated by the laser generator is transmitted into the laser head through the optical fiber, and is projected onto a workpiece after being collimated and focused by a lens in the laser head to form a light spot with the diameter of 5-30um, so that precise cutting is realized; meanwhile, the laser cutting head is fixedly connected with a sliding table of the Z-axis module, the distance between a laser spot and a workpiece is adjusted under the driving of a Z-axis servo motor, and the motor drives the Z-axis module to move through a lead screw, so that a laser head is driven to move.
Furthermore, the laser cutting head is a 2-axis or even 3-axis galvanometer cutting head, and is specifically characterized in that laser is reflected by the x-axis galvanometer lens and the y-axis galvanometer lens and then focused on a workpiece through the focusing lens, and the cutting path of the laser beam can be rapidly changed by respectively controlling the angles of the z-axis galvanometer lens and the y-axis galvanometer lens.
Furthermore, the laser cutting head be configured with CCD vision camera system, this system is coaxial with the laser beam, and the direct coaxial shooting laser and the processing region of work piece, the image transmission that CCD vision system shot is discerned and the positioning system to the positional deviation of ceramic substrate relative to the laser facula discerned and is fixed a position.
Furthermore, the working platform is specifically characterized by being a double-station working platform and comprising an assembling station platform and a cutting station platform. Furthermore, every work platform includes the accurate slip table of an xy diaxon and a special tool of placing the work piece, and two work platforms all link firmly on the big platform of gyration, 180 degrees symmetrical arrangement. When drilling, one working platform is a drilling station, one working platform is an assembly station, and the two stations are alternated under the action of the rotary platform. And when the drilling is finished, the rotary platform rotates by 180 degrees, the assembly station is switched to the drilling station to prepare for drilling, and the cutting station platform cuts to the assembly station to start assembling. Further, a protective curtain is arranged between the drilling station and the assembling station, and the laser is prevented from damaging eyes during drilling.
Furthermore, the workpiece assembling device is characterized in that the workpiece assembling device can also adopt a special robot to automatically grab and assemble, the workpiece can be automatically taken away through the robot after cutting, and the installation station and the cutting station can use one robot or two robots to grab and place the workpiece according to the production rhythm.
Furthermore, the working platform is characterized in that the working platform is fixedly connected to an xy-axis precision motion sliding table, and before laser drilling, firstly, the xy-axis of a cutting station platform is adjusted to enable the center of a current hole to be machined to be located at a laser focus position based on the position coordinate of the hole on the whole ceramic substrate, so that the hole edge cutting effect possibly brought by inclined drilling of a vibrating mirror light beam is eliminated, and the size precision of the machined hole is improved.
Further, the protective gas nozzle and the smoke suction hood are arranged at a workpiece cutting position. The protection air tap is connected with a protection air pipe, and the protection air pipe is connected with a protection air bottle. When drilling, the protective gas and the smoke suction are opened, the protective gas protects the ceramic substrate punching area, the ceramic surface is prevented from being oxidized and yellowed in the ceramic drilling process, the performance is influenced, the appearance is attractive, smoke generated during cutting is sucked through the smoke suction cover, the laser absorption rate of a workpiece is improved, and the work environment is purified.
The rotary platform is characterized in that the rotary platform is driven by a servo motor, the platform is fixedly connected with the assembly station platform and the cutting station platform, the assembly station platform and the cutting station platform are symmetrically arranged at 180 degrees, and the assembly platform and the cutting platform are alternately rotated mutually through rotation of the platform, so that the production beat is improved.
The industrial personal computer comprises a motion control card, a switching value input/output I/O control card, laser parameter setting software and cutting track setting software. The industrial computer is as the main control unit of whole picosecond laser ceramic substrate drilling, and the control includes the accurate slip table of xy axle of laser instrument, cutting head, assembly station, the accurate slip table of xy axle, rotary platform and cutting head z axle slider, the protection gas of drilling station, and the smoke and dust sucks the coordinated action of all component parts such as cover to guarantee the smooth completion of ceramic substrate drilling. The motion control card respectively controls the linkage of an xy-axis sliding table of the cutting station platform and an xy-axis sliding table of the assembling station platform, and the laser cutting head moves up and down to move the Z-axis sliding block and the station switching rotary platform; the switching value input and output control I/O card is mainly used for actions such as laser on and off, cutting start, cutting stop, smoke plasma suction generated by cutting, protective gas opening, station switching confirmation and the like, and also comprises display output of information such as alarm, fault and the like. The cutting software comprises laser parameter setting and cutting track setting software, specifically comprises parameters such as laser power, pulse frequency and pulse width, and the position control mainly comprises the position of a laser head (related to defocusing amount), a cutting track, the number of layered layers, stepping amount and the like. Furthermore, the industrial personal computer is provided with a corresponding display for the operation of system state monitoring, parameter setting and the like.
Furthermore, the industrial personal computer is connected with the laser generator through the Ethernet and is used for setting relevant cutting process parameters such as laser power, modes, frequency and the like, and setting and programming complex laser power so as to set different laser regulation and control modes according to different materials and obtain the best cutting quality.
The CCD positioning and observing and identifying system comprises a CCD visual camera, a visual positioning system and a monitor. The CCD vision camera is arranged on the laser cutting head and is coaxial with the focused cutting laser beam, the vision recognition system carries out image processing and feature extraction on the shot workpiece image, the position of the ceramic substrate relative to the cutting center is obtained through calculation, and meanwhile, the monitor is arranged, so that the current cutting position can be directly observed, and the operation and the manual intervention are convenient.
The invention provides a picosecond laser drilling method for a ceramic substrate, which comprises the following steps: step S1: setting cutting path and cutting technological parameters layer by layer or track by track; step S2: placing the workpiece to a special jig for fixing; step S3: rotating the assembling station to a cutting station; the rotary platform rotates 180 degrees, the assembly station rotates to the cutting station, and the xy axis adjusts the center of the hole to be drilled to the center of the light beam focus; step S4: performing CCD visual positioning to obtain CCD visual positioning information; step S5: scanning by a galvanometer, and drilling by laser layer by layer; drilling a ceramic substrate according to set laser process parameters and a cutting track, and opening a protective gas and smoke dust suction device in the process; step S6: returning the cutting platform to a zero position; and after all the holes on the ceramic substrate are drilled, turning off the laser, rotating the platform by 180 degrees, and returning the xy axis of the cutting station to the zero position of assembly. Step S7: judging whether the cutting is finished or not; if so, continuing to cut the rest workpieces, and repeating the steps S2-S6 until the cutting is finished; if not, the cutting station, the assembly station and the cutting head sequentially return to the initial zero position, the laser is turned off, the suction device and the protective gas are turned off, and the next work is waited.
Specifically, in one embodiment, in the picosecond laser drilling method for the ceramic substrate, the drilling operation flow is as follows: step 1: setting cutting path and cutting technological parameters layer by layer or track by track; step 2: placing the workpiece to a special jig for fixing; and step 3: rotating the assembling station to a cutting station; the rotary platform rotates 180 degrees, the assembly station rotates to the cutting station, and the xy axis adjusts the center of the hole to be drilled to the center of the light beam focus. And 4, step 4: CCD visual positioning; and 5: scanning by a galvanometer, and drilling by laser layer by layer; and drilling the ceramic substrate according to the set laser process parameters and the cutting track, and opening a protective gas and smoke dust suction device in the process. Step 6: the cutting platform returns to the zero position. And after all the holes on the ceramic substrate are drilled, turning off the laser, rotating the platform by 180 degrees, and returning the xy axis of the cutting station to the zero position of assembly. And 7: and judging whether the cutting is finished or not. If the residual workpieces are continuously cut, repeating the steps 2-6 until the cutting is finished; otherwise, the cutting station, the assembly station and the cutting head return to the initial zero position in sequence, the laser is turned off, the suction device and the protective gas are turned off, and the next work is waited.
The specific workflow is described as follows:
firstly, setting a cutting path, a cutting sequence, a layered cutting process parameter and the like for a workpiece to be drilled; then a workpiece is placed to a special jig of an assembly station, the rotary platform rotates 180 degrees, the workpiece to be cut rotates to a cutting station, the xy axis of the cutting station translates at the same time to enable the hole to be drilled to be located in the center of a laser focus, and the cutting head descends to a cutting position (the defocusing amount is determined by the process); the CCD on the laser cutting head shoots workpiece images, the position of a hole to be drilled is automatically identified, then the ceramic substrate is precisely drilled layer by the vibrating mirror laser beam, the smoke dust suction device and the protective gas are simultaneously started, after the cutting is finished, the rotary table rotates 180 degrees, the assembly station is switched to the cutting station to wait for the next processing, when all the workpieces are cut, the laser is turned off, the suction device and the protective gas are turned off, the cutting station and the assembly station are cut, and the cutting head returns to the zero position of coordinates.
Specifically, in one embodiment, as shown in fig. 1 to 4, the picosecond laser drilling system for ceramic substrates of the present invention comprises a picosecond laser generator 1, a galvanometer cutting head 2, a main controller 3, a display 4, a CCD vision positioning and observation system 5, a workpiece position monitor 6, an L ED auxiliary light source 7, a Z-axis cutting head lifting and lowering sliding table 8, a swivel platform 9, an assembly station platform 10, a cutting station platform 11, a shielding gas nozzle 12, a smoke suction hood 13, an operation button 14, a system working platform 15, and a laser protection curtain 16.
Example specific parameters are:
preferably, the laser generator generates ultraviolet picosecond laser with the wavelength of 300-360nm and leads the ultraviolet picosecond laser into the laser cutting head through the optical fiber. The average laser power is 5-50W, the laser pulse repetition frequency is 10-1Mhz, and the pulse width is 15 ps. The method specifically comprises the following steps: ultraviolet picosecond laser with the wavelength of 355nm and the laser power of 30W.
Laser cutting head facula diameter be 15um, the focus is 100 mm.
The laser head upper and lower Z-axis module has a stroke of 200mm and a stroke precision of 10um and is mainly used for controlling the defocusing amount of the galvanometer cutting head;
work platform include the accurate slip table of xy diaxon and a special tool of placing the work piece, slip table stroke range is 100mmx100mm, repetition precision is for being less than or equal to 1um, positioning accuracy is for being less than or equal to 3um for the accurate regulation of work piece position.
The rotary platform is mainly used for assembling workpieces and mutually switching cutting stations, and the positioning precision is 10 um.
The CCD visual positioning precision can reach less than or equal to +/-5 um.
The cutting speed of the laser galvanometer is 100-3000 mm/s adjustable, and a hole with the diameter not more than 40mm can be cut by directly utilizing the galvanometer scanning without basically losing the cutting precision.
The invention adopts picosecond laser to drill the ceramic substrate, automatically positions the drilling position through the sliding table, and automatically identifies and positions the workpiece by CCD vision, thereby realizing high-precision position alignment, and based on galvanometer scanning, the cutting speed of the laser beam is adjustable within 100-3000 mm/s, thereby realizing high-speed laser cutting and drilling, and the laser can directly cut the aperture smaller than 40 mm. A multilayer layer-by-layer processing method can be adopted according to different ceramic thicknesses, and protective gas can protect a cutting area and prevent a ceramic cutting part from oxidizing and yellowing. The invention fully utilizes the ultrashort and ultrastrong characteristic of picosecond laser, instantly melts and gasifies ceramic materials, overcomes the problem of ceramic fragmentation in the conventional laser cutting, has smooth cutting edge, good roundness, smaller taper and low fragmentation probability, has no thermal influence area on the boundary, does not yellow the edge, almost has no damage to the ceramic substrate, greatly improves the yield, and is particularly suitable for the high-precision application of the ceramic substrates of 5G and the like.
The picosecond laser cutting method has the advantages that the picosecond laser cutting edge is smooth, the roundness is good, the taper is smaller, the fragmentation probability is low, the boundary heat affected zone is almost not generated, the edge is not yellowed, the ceramic substrate is almost not damaged, the yield is greatly improved, and the picosecond laser cutting method is particularly suitable for high-precision application of 5G current ceramic substrates; according to the invention, the xy precision sliding table automatically adjusts the cutting position of each hole, so that automatic and efficient drilling of the ceramic laser porous array can be realized, the edge cutting effect caused by laser inclination can be effectively solved, and the roundness and the taper of the drilled hole are improved; according to the invention, the cutting of a large aperture in a certain range is realized through galvanometer scanning without moving an xy axis of a sliding table, so that the response speed and the cutting speed are improved; the CCD vision automatically identifies and positions the cutting position, obviously improves the processing efficiency and the position precision, and also reduces the position deviation possibly caused by human factors.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. A ceramic substrate picosecond laser drilling device, comprising: the device comprises a picosecond laser generator (1), a galvanometer cutting head (2), a main controller (3), a visual positioning observation part (5), a Z-axis cutting head lifting sliding table (8), a rotary platform (9), a working platform (15) and a substrate component;
the laser generator (1) is connected with the galvanometer cutting head (2) by adopting an optical fiber;
the rotary platform (9) is arranged below the working platform (15);
the visual positioning observation part (5) is connected with the galvanometer cutting head (2);
the substrate member is arranged above the working platform (15);
the main controller (3) is connected with the laser generator (1), the galvanometer cutting head (2) and the rotary platform (9);
the plane of the center line of the Z-axis cutting head lifting sliding table (8) is perpendicular to the plane of the center line of the working platform (15).
2. The picosecond laser drilling apparatus for ceramic substrates of claim 1, further comprising: a laser protection curtain (16);
the laser protection curtain (16) is arranged between the assembly station platform (10) and the cutting station platform (11).
3. Picosecond laser drilling device according to claim 1, characterized in that the working platform (15) comprises: an assembly station platform (10) and a cutting station platform (11);
the assembly station platform (10) comprises: the first xy two-axis sliding table and the first workpiece placing jig are arranged on the first support;
the cutting station platform (11) comprises: the second xy two-axis sliding table and the second workpiece placing jig are arranged;
and the main controller (3) is connected with the first xy two-axis sliding table and the second xy two-axis sliding table.
4. The picosecond laser drilling apparatus for ceramic substrates of claim 1, further comprising: a workpiece position monitor (6) and a display (4);
the workpiece position monitor (6) and the display (4) are arranged on one side of the picosecond laser drilling device of the ceramic substrate;
the workpiece position monitor (6) is connected with the display (4).
5. The picosecond laser drilling apparatus for ceramic substrates of claim 1, further comprising: a light source unit (7);
the light source component (7) is arranged above the laser generator (1).
6. Picosecond laser drilling device for ceramic substrates according to claim 1, characterised in that the substrate (3) is a ceramic substrate.
7. The picosecond laser drilling device for ceramic substrates according to claim 1, wherein the visual positioning and observation means (5) is a CCD visual camera means.
8. The picosecond laser drilling apparatus for ceramic substrates of claim 1, further comprising: a protective gas nozzle (12), a smoke dust suction hood (13) and a protective gas pipe;
the protective gas nozzle (12) is connected with a protective gas pipe;
the protective gas cylinder is connected with the protective gas pipe;
the smoke dust suction hood (13) is connected with the Z-axis cutting head lifting sliding table (8).
9. The picosecond laser drilling apparatus for ceramic substrates of claim 1, further comprising: an operation button (14);
the operating button (14) is arranged below the working platform (15).
10. A picosecond laser drilling method for a ceramic substrate is characterized by comprising the following steps:
step S1: setting cutting path and cutting technological parameters layer by layer or track by track;
step S2: placing the workpiece to a special jig for fixing;
step S3: rotating the assembling station to a cutting station; the rotary platform rotates 180 degrees, the assembly station rotates to the cutting station, and the xy axis adjusts the center of the hole to be drilled to the center of the light beam focus;
step S4: performing CCD visual positioning to obtain CCD visual positioning information;
step S5: scanning by a galvanometer, and drilling by laser layer by layer; drilling a ceramic substrate according to set laser process parameters and a cutting track, and opening a protective gas and smoke dust suction device in the process;
step S6: returning the cutting platform to a zero position; after all the empty drill holes on the ceramic substrate are finished, turning off the laser, rotating the platform by 180 degrees, and returning the xy axis of the cutting station to the zero assembly position;
step S7: judging whether the cutting is finished or not; if so, continuing to cut the rest workpieces, and repeating the steps S2-S6 until the cutting is finished;
if not, the cutting station, the assembly station and the cutting head sequentially return to the initial zero position, the laser component, the suction device and the protective gas are closed, and the next work is waited.
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| CN202010393369.9A CN111496396A (en) | 2020-05-11 | 2020-05-11 | Picosecond laser drilling device and method for ceramic substrate |
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| CN202010393369.9A CN111496396A (en) | 2020-05-11 | 2020-05-11 | Picosecond laser drilling device and method for ceramic substrate |
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| CN112139679A (en) * | 2020-09-22 | 2020-12-29 | 东莞市盛雄激光先进装备股份有限公司 | LTCC (Low temperature Co-fired ceramic) green ceramic ultrafast laser drilling system and method |
| CN112238295A (en) * | 2020-09-09 | 2021-01-19 | 大族激光科技产业集团股份有限公司 | Processing method of ultrathin piezoelectric ceramic |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112238295A (en) * | 2020-09-09 | 2021-01-19 | 大族激光科技产业集团股份有限公司 | Processing method of ultrathin piezoelectric ceramic |
| CN112139679A (en) * | 2020-09-22 | 2020-12-29 | 东莞市盛雄激光先进装备股份有限公司 | LTCC (Low temperature Co-fired ceramic) green ceramic ultrafast laser drilling system and method |
| CN112139679B (en) * | 2020-09-22 | 2022-06-28 | 东莞市盛雄激光先进装备股份有限公司 | LTCC (Low temperature Co-fired ceramic) green ceramic ultrafast laser drilling system and method |
| CN112809196A (en) * | 2020-12-22 | 2021-05-18 | 安捷利（番禺）电子实业有限公司 | 5G high-frequency LCP material shape cutting method |
| CN113770562A (en) * | 2021-08-25 | 2021-12-10 | 武汉博宇鑫科教仪器有限公司 | Ultraviolet picosecond ultrafast laser precision drilling equipment and technology |
| CN117300395A (en) * | 2023-11-28 | 2023-12-29 | 富通尼科技(苏州)有限公司 | Ceramic drilling method, system, equipment and storage medium based on picosecond laser |
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