WO2021051711A1 - Laser processing device and processing method therefor - Google Patents

Abstract

Disclosed are a laser processing device (1) and a processing method therefor. The laser processing device (1) comprises a workbench (100) and a laser system (200), wherein the workbench (100) is provided with a chuck (101) for having a workpiece to be processed mounted therein; the laser system (200) comprises a turning lens (210), a first laser (220), a second laser (230) and a movable first reflector set (240), and the first reflector set (240) moves relative to the turning lens (210) and has an avoidance position and a conduction position; when the first reflector set (240) is in the conduction position, the first laser (220), the first reflector set (240) and the turning lens (210) are sequentially arranged along a first laser path and are used for forming a first light path propagating along the first laser path; and when the first reflector set (240) is in the avoidance position, the first reflector set (240) is located at a side part of a second laser path so as to avoid a second light path, such that the turning lens (210) emits a laser.

Description

Laser processing device and its processing method Technical field

This application relates to the technical field of laser processing, and in particular to a laser processing device and a processing method thereof.

Background technique

Nanosecond laser processing cemented carbide materials (including tools), which mainly use the nanosecond laser beam emitted by it to melt, vaporize or ablate cemented carbide materials at high temperature, thereby forming the cutting of cemented carbide materials to achieve hard Processing of alloy materials. However, when the nanosecond laser is used to cut the cemented carbide material to be processed, due to the high temperature of the nanosecond laser beam, the laser cutting edge of the cemented carbide material will produce cracks, burrs, or scorch, which cannot achieve precision. Repair, fail to meet the requirements of fine processing.

The above content is only used to assist the understanding of the technical solutions of this application, and does not mean that the above content is recognized as prior art.

technical problem

The main purpose of this application is to provide a laser processing device, which aims to achieve fine processing of cemented carbide materials.

Technical solutions

In order to achieve the above objectives, the laser processing device proposed in this application includes

The workbench is equipped with a chuck configured to install the workpiece to be processed; and

The laser system includes a turning lens, a first laser, a second laser, and a movable first mirror group. The turning lens is located above the chuck and is configured to emit a laser to process the workpiece to be processed;

The laser system is provided with a first laser path and a second laser path. The second laser and the turning lens are sequentially arranged along the second laser path and configured to form a first laser path that propagates along the second laser path. Two light paths, so that the turning lens emits laser; the first mirror group moves relative to the turning lens and has an avoiding position and a conducting position;

When the first reflector group is in the on position, the first laser, the first reflector group, and the turning lens are sequentially arranged along the first laser path, and are configured to form along the first laser path. The first light path through which the laser path propagates, so that the turning lens emits laser light;

When the first reflector group is in the avoiding position, the first reflector group is located on the side of the second laser path to avoid the second optical path, so that the turning lens emits laser light.

Optionally, the first laser is a nanosecond laser, and the second laser is a picosecond laser or a femtosecond laser.

Optionally, the first laser is arranged above the first laser path, the first mirror group is horizontally movably arranged below the first laser, and the movement of the first mirror group The direction is set at an included angle with the first laser path.

Optionally, the laser system further includes a driving device, which is drivingly connected to the first mirror group to drive the first mirror group between the avoiding position and the conducting position mobile.

Optionally, the driving device includes a servo motor and a linear guide rail, a screw rod is installed at the rotation output end of the servo motor, the screw rod is arranged in a horizontal direction, and the linear guide rail is provided with a horizontally movable slider, The sliding block is threadedly connected with the screw rod, and the first reflecting mirror group is connected to the sliding block.

Optionally, the laser system further includes a second reflector group and a beam expander group, the second reflector group is arranged between the second laser and the beam expander group along the laser propagation direction, and is configured In order to guide the laser light emitted by the second laser to the beam expander lens group, the laser light is emitted through the beam expander lens group to form the second optical path.

Optionally, the laser system further includes a third mirror group, the third mirror group being arranged before the turning lens along the first laser path, and configured to guide laser light into the turning lens.

Optionally, the laser processing device further includes a dust suction device, and the dust suction port of the dust suction device is opposite to the chuck.

Optionally, the laser processing device further includes a telescopic device, the telescopic device is connected to the dust suction device, and is configured to drive the dust suction device to move relative to the chuck.

Optionally, the workbench is provided with a driving mechanism, and the driving mechanism is connected with the chuck and configured to drive the chuck to move.

Optionally, the driving mechanism includes a horizontal mechanism and a rotating mechanism, the rotating mechanism is mounted on the horizontal mechanism, and the chuck is mounted on the rotating mechanism.

Optionally, the horizontal mechanism includes a first horizontal mechanism and a second horizontal mechanism, the first horizontal mechanism is installed on the second horizontal mechanism, and the second horizontal mechanism drives the first horizontal mechanism along the first horizontal mechanism. The rotation mechanism is installed on the first horizontal mechanism, and the first horizontal mechanism drives the rotation mechanism to move in a second direction, and there is an angle between the first direction and the second direction.

Optionally, the rotation mechanism includes a first rotation mechanism and a second rotation mechanism, the second rotation mechanism is disposed on the first horizontal mechanism, and the second rotation mechanism is installed with the first rotation mechanism, The second rotation mechanism drives the first rotation mechanism to rotate in a third direction, the chuck is mounted on the first rotation mechanism, and the first rotation mechanism drives the chuck to rotate in a fourth direction. There is an angle between the three directions and the fourth direction.

Optionally, the laser processing device further includes a control system, the laser system is electrically connected to the control system, and the control system is electrically connected to the driving mechanism.

Optionally, the laser processing device further includes a detection mechanism configured to detect the installation position of the workpiece to be processed, and the detection mechanism is electrically connected to the control system.

Optionally, the detection mechanism includes a CCD vision system and a probe detector.

Optionally, the laser processing device further includes a first lifting mechanism, and both the CCD vision system and the probe detector are installed in the first lifting mechanism.

Optionally, the laser processing device further includes a rotating head on which the turning lens is mounted and configured to drive the turning lens to rotate horizontally.

Optionally, the laser processing device further includes a second lifting mechanism, and the rotating head is mounted on the second lifting mechanism.

The present application also proposes a laser processing method, applied to the above laser processing device, including the following steps: adjusting the first reflector group to the conducting position to connect the first laser path between the first laser and the turning lens, and The laser beam generated by the first laser is emitted from the turning lens to cut the workpiece to be processed; when the preset conditions are reached, the first mirror group is adjusted to the avoiding position to connect the second laser path between the second laser and the turning lens , So that the laser beam generated by the second laser is emitted from the turning lens to cut the workpiece to be processed.

Beneficial effect

In the technical solution of the present application, the workbench is provided with a chuck for mounting the workpiece to be processed, the turning lens is located above the chuck, the first laser is a nanosecond laser, the second laser is a picosecond laser or a femtosecond laser, and the first The mirror group moves relative to the turning lens and has an avoiding position and a conducting position. When the first mirror group is in the on position, the first laser, the first mirror group, and the turning lens are arranged in sequence along the first laser path to form a first optical path that propagates along the first laser path, so that the turning lens When the first mirror group is in the avoiding position, the first mirror group is located on the side of the second laser path to avoid the second light path, so that the turning lens emits laser light.

During the cutting process of the workpiece to be processed, first adjust the first reflector group to the conducting position to connect the first laser path between the first laser and the turning lens, so that the laser beam generated by the first laser is emitted from the turning lens. Cutting the workpiece to be processed; when the preset conditions are reached, adjust the first reflector group to the avoiding position to connect the second laser path between the second laser and the turning lens, so that the laser beam generated by the second laser is removed from the turning lens Injection, cutting the workpiece to be processed. In this way, through the cooperation of the first laser and the second laser, on the one hand, the first laser emits a nanosecond laser beam, which ensures the processing efficiency of the workpiece to be processed; on the other hand, the second laser emits a picosecond laser beam or a femtosecond laser beam. , To ensure the fine quality of the workpiece to be processed. It is understandable that the technical solution of the present application can realize fine and micro processing of cemented carbide and superhard materials.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on the structure shown in these drawings.

Fig. 1 is a schematic structural diagram of an embodiment of a laser processing device according to the present application;

Fig. 2 is a schematic diagram of the switching of the laser system in Fig. 1 of this application.

Attached icon number description:

Label	name	Label	name
1	Laser processing device	310	Horizontal organization
100	Workbench	311	First level institution
101	Chuck	312	Second level institution
200	Laser system	320	Rotating mechanism
210	Turning lens	321	First rotating mechanism
220	First laser	322	Second rotating mechanism
230	Second laser	400	testing facility
231	Beam expander group	410	CCD vision system
232	Second mirror group	411	The first CCD vision system
240	First mirror group	412	Second CCD vision system
250	Drive device	420	Probe detector
251	servo motor	500	The first lifting mechanism
252	Screw	600	Second lifting mechanism
253	Linear Guides	610	Rotating head
254	Slider	700	Jet port
260	Third mirror group	800	Vacuum cleaner
300	Drive mechanism	810	Vacuum port
900	Telescopic device	To	To

The realization, functional characteristics, and advantages of the purpose of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of this application.

It should be noted that all directional indicators (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the difference between components in a specific posture (as shown in the accompanying drawings). If the relative position relationship, movement situation, etc. change, the directional indication will change accordingly.

This application proposes a laser processing device 1.

Referring to Figures 1 to 2, in an embodiment of the present application, the laser processing device 1 includes

The workbench 100 is provided with a chuck 101 for mounting the workpiece to be processed; and

The laser system 200 includes a turning lens 210, a first laser 220, a second laser 230, and a movable first mirror group 240. The turning lens 210 is located above the chuck 101 and is used to emit a laser to process the workpiece to be processed ；

The laser system 200 is provided with a first laser path and a second laser path. The second laser 230 and the turning lens 210 are sequentially arranged along the second laser path to form a second optical path propagating along the second laser path, so that the turning lens 210 emits a laser; the first mirror group 240 moves relative to the turning lens 210 and has an avoiding position and a conducting position;

When the first mirror group 240 is in the on position, the first laser 220, the first mirror group 240, and the turning lens 210 are sequentially arranged along the first laser path to form a first light path that propagates along the first laser path. So that the turning lens 210 emits a laser;

When the first mirror group 240 is in the avoiding position, the first mirror group 240 is located at the side of the second laser path to avoid the second light path, so that the turning lens 210 emits laser light.

In the technical solution of the present application, the workbench 100 is provided with a chuck 101 for mounting the workpiece to be processed, the turning lens 210 is located above the chuck 101, the first laser 220 is a nanosecond laser, and the second laser 230 is a picosecond laser or For femtosecond lasers, the first mirror group 240 moves relative to the turning lens 210 and has an avoiding position and a conducting position. When the first mirror group 240 is in the on position, the first laser 220, the first mirror group 240, and the turning lens 210 are sequentially arranged along the first laser path to form a first light path that propagates along the first laser path. In order to make the turning lens 210 emit laser light; when the first mirror group 240 is in the avoiding position, the first mirror group 240 is located at the side of the second laser path to avoid the second light path, so that the turning lens 210 emits laser light.

During the cutting process of the workpiece to be processed, first adjust the first mirror group 240 to the on position to connect the first laser path between the first laser 220 and the turning lens 210, so that the laser beam generated by the first laser 220 is removed from The turning lens 210 is emitted to cut the workpiece to be processed; when the preset conditions are reached, the first mirror group 240 is adjusted to the avoiding position to connect the second laser path between the second laser 230 and the turning lens 210, so that the second laser path The laser beam generated by the laser 230 is emitted from the turning lens to cut the workpiece to be processed. In this way, through the cooperation of the first laser 220 and the second laser 230, on the one hand, the first laser 220 emits a nanosecond laser beam to ensure the processing efficiency of the workpiece to be processed; on the other hand, the second laser 240 emits a picosecond laser beam or The femtosecond laser beam ensures the fine quality of the workpiece to be processed. It is understandable that the technical solution of the present application can realize fine and micro processing of cemented carbide and superhard materials.

The alignment mode of the turning lens 210 and the workpiece to be processed installed on the chuck 101 in the embodiment of the present application can be manual alignment or automatic alignment. Both methods can realize the alignment of the turning lens 210 and the workpiece to be processed. Not limited to this, the above two methods are both within the protection scope of this application. In addition, the chuck 101 is a rotating chuck 101. During the cutting process of the tool, the position of the turning lens 210 can be fixed, and the workpiece to be processed can be processed by rotating the rotating chuck 101. Of course, the rotation of the chuck 101 and the rotation of the turning lens 210 can also be used to realize the processing of the workpiece to be processed. This application is not limited to this, and the above two cutting methods are prepared within the protection scope of this application. It is additionally pointed out that the turning lens 210 is located above the chuck 101, either the turning lens 210 is located directly above the chuck 101, or the turning lens 210 is located obliquely above the chuck 101. The specified machining position of the machining tool is used to adjust the relative position of the turning lens 210 and the chuck 101.

1 to 2, in an embodiment of the present application, the first laser 220 is a nanosecond laser, and the second laser 230 is a picosecond laser or a femtosecond laser. The pulse time of a nanosecond laser is nanosecond, the pulse time of a picosecond laser is picosecond, and the pulse time of a femtosecond laser is femtosecond. Lasers with different pulse times correspond to different laser beam effects. Nanosecond lasers are suitable for rough cutting of workpieces to be processed; picosecond lasers and femtosecond lasers are suitable for fine cutting of workpieces to be processed. In this way, the cutting efficiency of the workpiece to be processed is ensured, and the cutting accuracy of the workpiece to be processed is improved.

1 to 2, in an embodiment of the present application, the first laser 220 is arranged above the first laser path, and the first mirror group 240 is horizontally movable and arranged below the first laser 220. The moving direction of the mirror group 240 is set at an included angle with the first laser path. In this way, in the embodiment of the present application, the light path can be switched by moving the first mirror group 240 horizontally. When the first mirror group 240 moves horizontally to the on position, the first laser path is turned on, and the light emitted by the first laser 220 After the first reflector group 240 is emitted to the turning lens 210, the nanosecond laser beam is used for rough cutting of the workpiece to be processed; when the first reflector group 240 moves horizontally to the avoiding position, the second laser path is turned on, and the second laser beam is turned on. The picosecond laser beam or femtosecond laser beam emitted by the laser 230 is emitted to the turning lens 210, thereby realizing the finishing of the workpiece to be processed by the picosecond laser beam or femtosecond laser beam. In this application, the optical path switching is realized by adjusting the horizontal movement of the first reflector group 240.

1 to 2, in an embodiment of the present application, the laser system 200 further includes a driving device 250, the driving device 250 is drivingly connected with the first mirror group 240 to drive the first mirror group 240 in the avoiding position and guide Move between pass positions. In the embodiment of the present application, the driving device 250 drives the first mirror group 240 to move horizontally. When the driving device 250 is connected to the control system, the control system controls the driving device 250, thereby realizing the intelligent switching of the optical path. Of course, the driving device 250 in the embodiment of the present application may be a motor or an air cylinder, and the above two methods can drive the first mirror group 240 to move. In the embodiment of the present application, the driving device 250 drives the first mirror group 240 to move, thereby connecting different optical paths, so as to realize the switching processing of the workpiece to be processed with different laser beams.

1 to FIG. 2, in an embodiment of the present application, the driving device 250 includes a servo motor 251 and a linear guide 253, the rotation output end of the servo motor 251 is installed with a screw rod 252, the screw rod 252 is arranged in the horizontal direction, the linear guide 253 is provided with a horizontally movable slider 254, the slider 254 is screwed with the screw rod 252, and the first mirror group 240 is connected to the slider 254. In the embodiment of the present application, the servo motor 251 drives the screw rod 252 to rotate. The screw rod 252 is threadedly connected to the slider 254, so that the slider 254 moves horizontally along the linear guide 253. The first mirror group 240 moves horizontally with the slider 254 to This realizes the horizontal movement of the first mirror group 240. Of course, in the embodiment of the present application, the first reflector group 240 can be directly connected to the slider 254, or can be connected to the slider 254 through a bracket. Both methods can realize the horizontal movement of the first reflector. Limited to this, the above are all within the protection scope of the embodiments of the present application. Obviously, when the servo motor 251 is connected to the control system, by controlling the servo motor 251 through the control system, the intelligent switching of the optical path can also be realized.

1 to 2, the laser system further includes a second mirror group 232 and a beam expander group 231. The second mirror group 232 is arranged between the second laser 230 and the beam expander group 231 along the laser propagation direction. When the laser light emitted by the second laser 230 is guided to the beam expander group 231, the laser light is emitted through the beam expander group 231 to form a second optical path; and/or, the laser system 200 further includes a third mirror group 260, and a third mirror group The 260 is arranged before the turning lens 210 along the first laser path, and is used to guide the laser into the turning lens 210. It should be noted that due to structural limitations, when the light exit port of the second laser 230 and the light entrance port of the turning lens 210 cannot be arranged oppositely, the angle of the second mirror group 232 can be used to adjust the exit direction of the laser beam, so that the laser can emit The laser beam emitted by the device 231 can be incident on the turning lens 210. Of course, in order to achieve the finishing processing of the turning lens 210, a beam expander group 231 is arranged between the second mirror group 232 and the light path of the turning lens 210. The laser beam is expanded by the beam expander group 231 and then focused by the turning lens 210. The laser beam is reshaped to further realize the finishing of the tool to be processed. In addition, in the embodiment of the present application, a third mirror group 260 is arranged before the turning lens 210 along the laser path, so that the third mirror group 260 ensures that the laser beam is smoothly injected into the turning lens 210, and the position of the turning lens 210 is realized. adjust. It can be pointed out that the third reflector group 260 can be provided with three, namely reflector group A, reflector group B, and reflector group C. The reflector group A, reflector group B, and reflector group C are along the laser path. Setting, the mirror group C is arranged before the turning lens 210, the mirror group C is located above the turning lens 210, and the laser is guided into the turning lens 210 through the mirror group C. Of course, the embodiment of the present application may also add a reflector group according to actual conditions. The embodiment of the present application is not limited to this, and the above methods of adjusting the reflector group are all within the protection scope of the embodiment of the present application.

Referring to FIGS. 1 to 2, in an embodiment of the present application, the workbench 100 is provided with a driving mechanism 300, and the driving mechanism 300 is connected to the chuck 101 to drive the movement of the chuck 101. In the embodiment of the present application, the drive mechanism 300 drives the workpiece to be processed on the chuck 101 to move to be opposite to the turning lens 210. In this way, the drive mechanism 300 realizes the alignment of the workpiece to be processed and the turning lens 210, thereby achieving Machining at the specified position of the workpiece to be processed. Compared with manual alignment, the present application improves the alignment efficiency of the workpiece to be processed and the turning lens 210, and improves the efficiency of cutting the workpiece to be processed.

Referring to FIGS. 1 to 2, in an embodiment of the present application, the driving mechanism 300 includes a horizontal mechanism 310 and a rotating mechanism 320. The horizontal mechanism 310 is equipped with a rotating mechanism 320, and the chuck 101 is mounted on the rotating mechanism 320. In the embodiment of the present application, the rotating mechanism 320 drives the chuck 101 to rotate. During the cutting process of the workpiece to be processed, the position of the turning lens 210 remains stationary, and the rotating mechanism 320 drives the chuck 101 to rotate, thereby realizing the cutting of the workpiece to be processed.

1 to 2, in an embodiment of the present application, the horizontal mechanism 310 includes a first horizontal mechanism 311 and a second horizontal mechanism 312, the first horizontal mechanism 311 is installed on the second horizontal mechanism 312, the second horizontal mechanism 312 drives The first horizontal mechanism 311 moves in a first direction. The first horizontal mechanism 311 is equipped with a rotating mechanism 320. The first horizontal mechanism 311 drives the rotating mechanism 320 to move in a second direction. There is an angle between the first direction and the second direction. . In this way, the horizontal position of the chuck 101 can be adjusted by the first horizontal mechanism 311 and the second horizontal mechanism 312, thereby realizing the accurate alignment of the workpiece to be processed and the turning lens 210, and ensuring precise processing of the designated position of the workpiece to be processed.

1 to 2, in an embodiment of the present application, the rotation mechanism 320 includes a first rotation mechanism 321 and a second rotation mechanism 322, the second rotation mechanism 322 is placed on the first horizontal mechanism 311, and the second rotation mechanism 322 A first rotating mechanism 321 is installed. The second rotating mechanism 322 drives the first rotating mechanism 321 to rotate in a third direction. The chuck 101 is installed on the first rotating mechanism 321. The first rotating mechanism 321 drives the chuck 101 to rotate in the fourth direction. Turn, there is an angle between the third direction and the fourth direction. In this way, through the rotation of the first rotating mechanism 321 and the second rotating mechanism 322, the installation angle of the workpiece to be processed can be effectively adjusted, thereby realizing the cutting processing of the workpiece to be processed at different angles.

Referring to FIGS. 1 to 2, in an embodiment of the present application, the laser processing apparatus 1 further includes a control system, the laser system 200 is electrically connected to the control system, and the control system is electrically connected to the driving mechanism 300. In the embodiment of the application, the driving mechanism 300 is controlled by the control system, so that the driving mechanism 300 drives the chuck 101 to move until the turning lens 210 is above the chuck 101, and then the laser system 200 is controlled to start laser cutting the workpiece to be processed on the chuck 101 Therefore, intelligent control is realized, the processing continuity of the workpiece to be processed is ensured, and the cutting efficiency of the workpiece to be processed is improved.

1 to 2, in an embodiment of the present application, the laser processing device 1 further includes a detection mechanism 400 for detecting the installation position of the workpiece to be processed, and the detection mechanism 400 is electrically connected to the control system. The control system of the embodiment of the present application generates a turning program according to the detection information of the detection mechanism 400, and the control system is connected to the driving system, and the driving mechanism 300 is controlled through the turning program, so that the driving mechanism 300 drives the chuck 101 to move to the cutting position of the workpiece to be processed. The turning lens 210 is aligned, and the control system is also electrically connected to the laser system 200. The control system controls the laser system 200 to perform laser processing and laser switching according to the turning program, so as to complete the processing of the specified cutting position of the workpiece to be processed. The embodiments of the present application realize the automatic processing of the designated cutting position of the workpiece to be processed, improve the intelligence of laser processing, and at the same time ensure the accurate positioning and processing of the designated cutting position of the workpiece to be processed.

Referring to FIGS. 1 to 2, in an embodiment of the present application, the detection mechanism 400 includes a CCD vision system 410 and a probe detector 420. The CCD vision system 410 of the embodiment of the present application detects the clamping position of the workpiece to be processed, so as to generate a turning program based on the clamping position. In addition, in order to further ensure the cutting accuracy of the workpiece to be processed, the embodiment of the present application is provided with a probe detector 420, and the probe detector 420 detects the concentricity of the workpiece to be processed on the chuck 101 to determine whether the workpiece to be processed has a relative The offset occurs in the chuck 101 to ensure the accuracy of the cutting process. When the workpiece to be processed is offset relative to the chuck 101, the control system will prompt an abnormality and sound an alarm to remind the workpiece to be processed installed on the chuck 101 to be readjusted. It should be noted that the CCD vision system 410 includes a first CCD vision system 411 and a second CCD vision system 412. The first CCD vision system 411 and the second CCD vision system 412 are arranged side by side, and the detection accuracy of the second CCD vision system 412 is high. In the first CCD vision system 411. In the embodiment of the present application, the first CCD vision system 411 and the second CCD vision system 412 detect the installation position of the workpiece to be processed, which improves the accuracy of the installation position detection, thereby ensuring that the turning program generated based on the detection data can be accurate.

Referring to FIGS. 1 to 2, in an embodiment of the present application, the laser processing apparatus 1 further includes a first lifting mechanism 500, and the CCD vision system 410 and the probe detector 420 are both installed on the first lifting mechanism 500. In order to detect workpieces with different installation heights and lengths, the embodiment of the present application installs the CCD vision system 410 and the probe detector 420 on the first lifting mechanism 500, so as to adjust the CCD vision system 410 and the probe detector 420. It can accurately detect the installation position of the workpiece to be processed on the chuck 101, thereby ensuring accurate turning procedures.

Referring to FIGS. 1 to 2, in an embodiment of the present application, the turning lens 210 is mounted on the rotating head 610, and the turning lens 210 rotates with the rotating head 610. In the embodiment of the application, the turning lens 210 is installed on the rotating head 610. In this way, by adjusting the offset angle of the turning lens 210, products of different shapes can be processed, thereby realizing the processing of products without shapes and adding this laser Applicability of the processing device 1.

Referring to FIGS. 1 to 2, in an embodiment of the present application, the rotating head 610 is provided with an air jet 700, the air jet 700 communicates with the air jet device, and the air jet 700 is arranged opposite to the chuck 101. Of course, the jet device can be connected to the control system to realize automatic jetting. In the embodiment of the present application, an air jet 700 is provided on the rotating head 610. During the cutting process of the workpiece to be processed, as the laser cutting process proceeds, the air jet 700 continuously sprays protective gas to the cutting position, thereby preventing laser cutting from being generated The cutting surface is oxidized. In addition, jetting through the jet nozzle 700 is also beneficial to chip removal and cooling, so as to facilitate the subsequent processing of the workpiece to be processed.

Referring to FIGS. 1 to 2, in an embodiment of the present application, the rotating head 610 is installed on the second lifting mechanism 600, and the second lifting mechanism 600 drives the rotating head 610 to move up and down. It should be noted that the second lifting mechanism 600 in the embodiment of the present application includes a lifting platform and a driving member. The driving member is connected to the lifting platform. A rotating head 610 is installed on the lifting platform, and the rotating head 610 moves with the lifting platform. In the embodiment of the present application, the height position of the rotating head 610 is adjusted by the second lifting mechanism 600, thereby adjusting the relative distance between the turning lens 210 and the workpiece to be processed, so as to realize the cutting processing of the workpiece to be processed without depth.

1 to FIG. 2, in an embodiment of the present application, the laser processing device further includes a dust collection device 800, the dust collection device 800 is installed on the telescopic device 900, the telescopic device 900 drives the dust suction port of the dust collection device 800 810 moves relative to the chuck 101. In the embodiment of the present application, the dust collection device 800 is installed on the telescopic device 900. Of course, the telescopic device 900 can be driven by a cylinder, and the telescopic device 900 can also be driven by a motor. The embodiment of the present application is not limited to this, and the above two driving modes All are within the protection scope of the embodiments of the present application. In the embodiment of the present application, the position of the dust suction port 910 is adjusted by the telescopic device 900, so that the debris generated by laser cutting the surface of the workpiece to be processed can be sucked by the dust suction port 810 of the dust suction device 800, thus ensuring the laser processing device 1 Clean inside.

The present application also proposes a laser processing method, including the laser processing device 1. The laser processing device 1 refers to the above-mentioned embodiments. Since the laser processing device 1 adopts all the technical solutions of all the above-mentioned embodiments, it has at least the technical solutions of the above-mentioned embodiments. All the effects brought about, I will not repeat them one by one here. A laser processing method includes the following steps: adjusting the first mirror group 240 to the conducting position to connect the first laser path between the first laser 220 and the turning lens 210, so that the laser beam generated by the first laser 220 It is emitted from the turning lens 210 to cut the workpiece to be processed; when the preset conditions are reached, the first reflector group 240 is adjusted to the avoiding position to connect the second laser path between the second laser 230 and the turning mirror 210, so that the second laser path The laser beam generated by the second laser 230 is emitted from the turning lens 210 and cuts the workpiece to be processed. In the embodiment of this application, through the cooperation of the first laser 220 and the second laser 230, the first laser 220 is first used for rough cutting. When the preset conditions are reached, the first mirror group 240 can be adjusted to make the second laser 230 It is connected with the turning lens 210 to complete the finishing of the workpiece to be processed, so that the cutting accuracy of the workpiece to be processed is improved.

In an embodiment of the present application, the preset condition includes a preset time and a preset size. In this embodiment of the application, by setting a preset time or a preset size, when it is detected that the workpiece to be processed reaches the preset condition, the control system controls the laser system 200 to automatically switch, so that the gap between the second laser 230 and the turning lens 210 The second laser path is turned on, and the laser beam generated by the second laser 230 is emitted from the turning lens 210 and cuts the workpiece to be processed. As a result, the automatic switching of the laser light path is completed, thereby ensuring the processing accuracy of the workpiece to be processed.

It should be noted that the laser processing device 1 of the embodiment of the present application can process various types of cemented carbide materials or superhard material products. In order to facilitate the description of the technical effects brought by the embodiments of the present application, the embodiments of the present application The following will illustrate the cutting process of the tool.

Specifically, a laser processing method includes the following steps: (1) clamping the tool to be processed to the chuck 101; (2) moving the tool to be processed to the first horizontal mechanism 311 and the second horizontal mechanism 312 Under a CCD vision system 411; (3) The first lifting mechanism 500 adjusts the position of the first CCD vision system 411 to realize the focus adjustment of the first CCD vision system 411 and initially locate the installation position of the tool to be processed; (4) The first horizontal mechanism 311 and the second horizontal mechanism 312 move the tool under the second CCD vision system 412; (5) the first lifting mechanism 500 adjusts the position of the second CCD vision system 412 to achieve the second CCD vision system 412 Adjust the focus and accurately position the installation position of the tool to be processed; (6) The first horizontal mechanism 311 and the second horizontal mechanism 312 move the tool to be processed to the probe detector 420, and the probe detector 420 detects the workpiece and the workpiece to be processed The concentricity of the chuck 101 is determined by detecting the concentricity to determine whether the workpiece to be processed is abnormal in clamping; if an abnormality occurs, re-adjustment is prompted, and subsequent operations are stopped; if it is found to be normal, the control system generates a turning program according to the detection information of the detection mechanism 400 (7) The control system controls the first horizontal mechanism 311 and the second horizontal mechanism 312 according to the generated turning program, so that the specified cutting position of the workpiece to be processed clamped to the chuck 101 is opposite to the turning lens 210; (8) The second lifting mechanism 600 drives the turning lens 210 to deflect to a certain angle, and the second lifting mechanism 600 drives the turning lens 210 to move to the cutting height; (9) Connecting the first laser path between the nanosecond laser and the turning lens 210, and the nanosecond laser from turning The lens 210 shoots out and cuts the workpiece to be processed, and at the same time sprays protective gas to prevent the cutting surface of the workpiece to be processed from overheating and accelerate chip removal, and turn on the dust collection system to suck away the debris; (10) When the roughing is completed, switch The laser light path connects the second laser path between the picosecond laser and the turning lens 210. The picosecond laser is emitted from the turning lens 210 and cuts the workpiece to be processed, thereby completing the finishing of the workpiece to be processed; (11) Turning is completed Then, the tool moves to the second CCD vision system 412 to detect the tool size, complete the data comparison, if the size is not in place, make corrections, and then perform secondary turning.

The above are only optional embodiments of the application, and do not limit the scope of the patent for this application. Under the inventive concept of the application, the equivalent structure transformation made by using the content of the specification and drawings of the application, or directly/indirectly used in Other related technical fields are included in the scope of patent protection of this application.

Claims (20)

1. A laser processing device, which includes

   The workbench is equipped with a chuck configured to install the workpiece to be processed; and

   The laser system includes a turning lens, a first laser, a second laser, and a movable first mirror group. The turning lens is located above the chuck and is configured to emit a laser to process the workpiece to be processed;

   The laser system is provided with a first laser path and a second laser path. The second laser and the turning lens are sequentially arranged along the second laser path and configured to form a first laser path that propagates along the second laser path. Two light paths, so that the turning lens emits laser; the first mirror group moves relative to the turning lens and has an avoiding position and a conducting position;

   When the first reflector group is in the on position, the first laser, the first reflector group, and the turning lens are sequentially arranged along the first laser path, and are configured to form along the first laser path. The first light path through which the laser path propagates, so that the turning lens emits laser light;

   When the first reflector group is in the avoiding position, the first reflector group is located on the side of the second laser path to avoid the second optical path, so that the turning lens emits laser light.
2. The laser processing apparatus according to claim 1, wherein the first laser is a nanosecond laser, and the second laser is a picosecond laser or a femtosecond laser.
3. 3. The laser processing apparatus according to claim 1, wherein the first laser is arranged above the first laser path, and the first mirror group is horizontally movable and arranged below the first laser, The moving direction of the first mirror group and the first laser path are arranged at an included angle.
4. The laser processing device according to claim 3, wherein the laser system further comprises a driving device, the driving device is drivingly connected with the first mirror group to drive the first mirror group in the avoidance Move between the position and the conduction position.
5. The laser processing device according to claim 4, wherein the driving device comprises a servo motor and a linear guide rail, the rotation output end of the servo motor is equipped with a screw rod, the screw rod is arranged in a horizontal direction, and the linear guide rail A horizontally movable sliding block is provided, the sliding block is threadedly connected with the screw rod, and the first reflecting mirror group is connected to the sliding block.
6. The laser processing apparatus according to claim 1, wherein the laser system further comprises a second mirror group and a beam expander group, the second mirror group being arranged on the second laser and the laser beam along the laser propagation direction. The beam expander lens groups are configured to guide the laser light emitted by the second laser to the beam expander lens group, and the laser light is emitted through the beam expander lens group to form the second optical path.
7. The laser processing apparatus according to claim 1, wherein the laser system further comprises a third mirror group, the third mirror group is disposed before the turning lens along the first laser path, and is configured to Laser is introduced into the turning lens.
8. 8. The laser processing device according to any one of claims 1 to 7, wherein the laser processing device further comprises a dust suction device, and the dust suction port of the dust suction device is opposite to the chuck.
9. 8. The laser processing device according to claim 8, wherein the laser processing device further comprises a telescopic device, the telescopic device is connected to the dust collection device, and is configured to drive the dust collection device to move relative to the chuck.
10. 10. The laser processing apparatus according to claim 10, wherein the driving mechanism includes a horizontal mechanism and a rotating mechanism, the rotating mechanism is mounted on the horizontal mechanism, and the chuck is mounted on the rotating mechanism.
11. 10. The laser processing apparatus according to claim 10, wherein the driving mechanism includes a horizontal mechanism and a rotating mechanism, the rotating mechanism is mounted on the horizontal mechanism, and the chuck is mounted on the rotating mechanism.
12. The laser processing apparatus according to claim 11, wherein the horizontal mechanism comprises a first horizontal mechanism and a second horizontal mechanism, the first horizontal mechanism is installed on the second horizontal mechanism, and the second horizontal mechanism drives The first horizontal mechanism moves in a first direction, the rotation mechanism is installed on the first horizontal mechanism, and the first horizontal mechanism drives the rotation mechanism to move in a second direction, the first direction and the second direction There is an angle between them.
13. The laser processing apparatus according to claim 11, wherein the rotation mechanism includes a first rotation mechanism and a second rotation mechanism, the second rotation mechanism is placed on the first horizontal mechanism, and the second rotation mechanism The first rotation mechanism is installed, the second rotation mechanism drives the first rotation mechanism to rotate in a third direction, the chuck is installed on the first rotation mechanism, and the first rotation mechanism drives the The chuck rotates around the fourth direction, and there is an angle between the third direction and the fourth direction.
14. 10. The laser processing device of claim 10, wherein the laser processing device further comprises a control system, the laser system is electrically connected to the control system, and the control system is electrically connected to the driving mechanism.
15. 11. The laser processing device according to claim 11, wherein the laser processing device further comprises a detection mechanism configured to detect the installation position of the workpiece to be processed, and the detection mechanism is electrically connected to the control system.
16. The laser processing apparatus according to claim 12, wherein the detection mechanism includes a CCD vision system and a probe detector.
17. 15. The laser processing device according to claim 13, wherein the laser processing device further comprises a first lifting mechanism, and both the CCD vision system and the probe detector are installed in the first lifting mechanism.
18. The laser processing device according to any one of claims 1 to 7, wherein the laser processing device further comprises a rotating head on which the turning lens is mounted and configured to drive the turning lens to rotate horizontally .
19. 17. The laser processing device of claim 18, wherein the laser processing device further comprises a second lifting mechanism, and the rotating head is mounted on the second lifting mechanism.
20. A laser processing method, applied to the laser processing device according to any one of claims 1 to 19, and comprising the following steps:

    Adjusting the first reflector group to the conducting position to connect the first laser path between the first laser and the turning lens, so that the laser beam generated by the first laser is emitted from the turning lens to cut the workpiece to be processed;

    When the preset conditions are reached, adjust the first reflector group to the avoiding position to connect the second laser path between the second laser and the turning lens, so that the laser beam generated by the second laser is emitted from the turning lens to cut to be processed Artifact.