CN113427138A - Laser processing equipment for turning and grinding by laser - Google Patents
Laser processing equipment for turning and grinding by laser Download PDFInfo
- Publication number
- CN113427138A CN113427138A CN202010205367.2A CN202010205367A CN113427138A CN 113427138 A CN113427138 A CN 113427138A CN 202010205367 A CN202010205367 A CN 202010205367A CN 113427138 A CN113427138 A CN 113427138A
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- 239000000523 sample Substances 0.000 claims description 16
- 238000003754 machining Methods 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 description 7
- 239000002699 waste material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000013178 mathematical model Methods 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The invention discloses laser processing equipment for turning and grinding by adopting laser, which comprises a machine tool base and machine tool pillars, wherein the machine tool pillars are fixedly arranged on two sides of the lower surface of the machine tool base, an X shaft is arranged at the upper end of the machine tool base, a Y shaft is arranged on the X shaft, a working platform is arranged on the Y shaft, a fourth rotating shaft is arranged at the upper end of the working platform and is rotatably connected with the working platform, a fixed upright post is arranged on one side of the upper surface of the machine tool base, a Z shaft is arranged on the fixed upright post, a fixed box is arranged on the Z shaft, and a laser processing assembly is arranged inside the fixed box. The laser turning and grinding machine has the advantages that the laser is adopted to replace the conventional tool grinding tool for turning and grinding, the traditional turning machine tool and grinding equipment are replaced, the laser turning and grinding machine has the characteristics of high processing speed and small surface deformation compared with the traditional turning and grinding equipment, no tool is required for processing, the cost of all tools and grinding tools can be saved, various materials can be processed, the pollution is low, and the environment is friendly.
Description
Technical Field
The invention relates to the technical field of numerical control machine tools, in particular to laser processing equipment for turning and grinding by adopting laser.
Background
The numerical control machine tool is a short name of a digital control machine tool (Computer numerical control machine tools), and is an automatic machine tool provided with a program control system; the control system can logically process a program specified by a control code or other symbolic instructions, decode the program, represent the program by coded numbers, input the program into a numerical control device through an information carrier, send various control signals by the numerical control device through operation processing, control the action of a machine tool, and automatically machine parts according to the shape and the size required by a drawing.
However, when turning a workpiece, most of existing numerically-controlled machine tools machine the rotating workpiece by using a turning tool, and when grinding, redundant materials on the workpiece are cut off by using an abrasive material and a grinding tool, the operation method has low working efficiency, the damage amount of the tool in the machining process is large, a large amount of waste liquid and waste residues are generated in the machining process, the environment is polluted, and the turning and grinding processing cannot be performed on materials with high melting point, high hardness and brittle quality, such as ceramics, diamonds and the like, the range of the processing materials is limited, the use is inconvenient, and the improvement is needed.
Disclosure of Invention
The invention aims to provide laser processing equipment for turning and grinding by adopting laser, and aims to solve the problems that when the conventional numerical control machine tool mentioned in the background art is used for turning a workpiece, a turning tool is mostly used for processing the rotating workpiece, and when the workpiece is ground, redundant materials on the workpiece are cut off by using an abrasive material and a grinding tool, the operation method has low working efficiency, the damage amount of the tool is large in the processing process, a large amount of waste liquid and waste residues are generated in the processing process, the environment is polluted, the turning and grinding processing cannot be carried out on materials with high melting point, high hardness and brittle quality, such as ceramics, diamonds and the like, and the range of processing materials is limited.
In order to achieve the purpose, the invention provides the following technical scheme: adopt laser to carry out the laser beam machining equipment of turning and grinding, including lathe base and lathe pillar, lathe pillar fixed mounting is in lathe base lower surface both sides, the lathe base upper end is equipped with the X axle, X epaxial Y axle, the epaxial work platform that installs of Y, the fourth rotation axis is installed to the work platform upper end, the fourth rotation axis rotates with work platform to be connected, lathe base upper surface one side is equipped with stationary mast, the last Z axle that is equipped with of stationary mast, the epaxial fixed case that is equipped with of Z, the inside laser beam machining subassembly that is equipped with of fixed case.
Preferably, the laser processing assembly comprises a laser and a two-dimensional vibration mirror, the laser is fixedly installed inside the fixed box, the two-dimensional vibration mirror is located under the laser, the two-dimensional vibration mirror is fixedly installed at the bottom end of the fixed box, the laser processing assembly can be used for processing a workpiece, the processing speed is high, and the processing effect is good.
Preferably, the type of the laser is any one of a fiber laser and a solid laser, and the laser has the advantages of small volume, convenient use, large output power and stable laser emission.
Preferably, the laser pulse width of the laser is any one of nanosecond pulse, picosecond pulse or femtosecond pulse, and the laser can process materials with high melting point, high hardness and brittle quality and is wide in processing range.
Preferably, the laser device swings through the two-dimensional galvanometer to form a required laser shape, the laser shape is any one of a cylinder, a cone, a rectangle or other laser shapes, the flexibility is good, and the laser shape can be changed randomly according to the requirement.
Preferably, the upper end of the fourth rotating shaft is provided with a workpiece positioning mechanism, and a workpiece is mounted on the workpiece positioning mechanism, so that the workpiece can be stably mounted.
Preferably, the fixed box is provided with a probe, the probe is positioned on one side of the workpiece, and the probe can be used for detecting the size and the angle of the workpiece, so that subsequent processing is facilitated.
Preferably, the probe detects the length and other angle sizes of the workpiece, and the probe can be used for detecting the size and the angle of the workpiece, so that the subsequent processing is facilitated.
The invention provides laser processing equipment for turning and grinding by adopting laser, which has the following beneficial effects:
(1) according to the invention, by arranging the laser processing assembly, the length and other angle sizes of the workpiece can be detected through the probe, then the laser is used for emitting laser, the required laser shape is formed through the two-dimensional galvanometer, the workpiece is turned and ground, the turning and grinding processing by the laser can be realized, the traditional turning machine tool and grinding equipment are replaced, and compared with the traditional turning and grinding equipment, the laser processing assembly has the characteristics of high processing speed and small surface deformation, no tool is required for processing, the cost of all cutters and grinding tools can be saved, various materials can be processed, and the laser processing assembly is small in pollution and environment-friendly.
(2) According to the invention, the fourth rotating shaft is arranged on the working platform, the fourth rotating shaft can be controlled to rotate continuously through numerical control, and the standard revolving bodies in any shapes such as a cylinder, a cone or a ball head can be processed by controlling the linkage of the X shaft, the Y shaft, the Z shaft and the fourth rotating shaft, so that the processing operations such as straight grooves, spiral grooves or punching can be completed, the processing range is wide, the processing speed is high, and the popularization and the use are convenient.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic view of the Z-axis structure of the present invention.
In the figure: 1. a machine tool base; 2. fixing the upright post; 3. an X axis; 4. a Y axis; 5. a working platform; 6. a fourth rotation axis; 7. a workpiece; 8. a probe; 9. a fixed box; 10. a Z axis; 11. a machine tool post; 12. a laser; 13. two-dimensional galvanometer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, the present invention provides a technical solution: adopt laser to carry out the laser beam machining equipment of turning and grinding, including machine tool base 1 and machine tool pillar 11, machine tool pillar 11 fixed mounting is in 1 lower surface both sides of machine tool base, 1 upper end of machine tool base is equipped with X axle 3, Y axle 4 on the X axle 3, install work platform 5 on the Y axle 4, fourth rotation axis 6 is installed to 5 upper ends of work platform, fourth rotation axis 6 rotates with work platform 5 to be connected, 1 upper surface one side of machine tool base is equipped with stationary mast 2, be equipped with Z axle 10 on the stationary mast 2, be equipped with fixed box 9 on the Z axle 10, the inside laser beam machining subassembly that is equipped with of fixed box 9.
The laser processing assembly comprises a laser 12 and a two-dimensional vibration mirror 13, the laser 12 is fixedly installed inside the fixed box 9, the two-dimensional vibration mirror 13 is located under the laser 12, the two-dimensional vibration mirror 13 is fixedly installed at the bottom end of the fixed box 9, laser 12 can be utilized to generate laser, then the two-dimensional vibration mirror 13 swings to form a required laser shape, and then the workpiece 7 is turned and ground.
The laser 12 is any one of a fiber laser and a solid laser, so that the laser 12 has a small volume, is convenient to use and has high output power, and the laser is ensured to be stable.
The laser pulse width of the laser 12 is any one of nanosecond pulse, picosecond pulse or femtosecond pulse, and the laser can process materials with high melting point, high hardness and brittle property, and has a wide processing range.
The laser 12 swings through the two-dimensional galvanometer 13 to form a required laser shape, the laser shape is any one of a cylinder, a cone, a rectangle or other laser shapes, the flexibility is good, and the laser shape can be changed randomly according to the requirement.
The upper end of the fourth rotating shaft 6 is provided with a workpiece positioning mechanism, the workpiece 7 is installed on the workpiece positioning mechanism, the workpiece 7 can be installed on the workpiece positioning mechanism, and then the fourth rotating shaft 6 is used for driving work to rotate, so that the turning and grinding effects on the workpiece 7 are good.
The fixed box 9 is provided with the probe 8, the probe 8 is positioned on one side of the workpiece 7, the length and other angle sizes of the workpiece 7 arranged on the machine tool can be detected through the probe 8, and a mathematical model of the workpiece 7 is established through machine tool software according to data obtained by detection so as to facilitate subsequent turning and grinding work.
The probe 8 is used for detecting the length and other angle sizes of the workpiece 7, the probe 8 can be used for detecting the length and other angle sizes of the workpiece 7 arranged on the machine tool, and a mathematical model of the workpiece 7 is established through machine tool software according to data obtained by detection so as to facilitate subsequent turning and grinding work.
It should be noted that, the laser processing equipment using laser to perform turning and grinding, when in operation, the workpiece 7 is fixed on the workpiece positioning mechanism, then the probe 8 can be used to detect the length and other angle sizes of the workpiece 7 installed on the machine tool, according to the data obtained by detection, a mathematical model of the workpiece 7 is established by machine tool software, an operator can use the laser 12 to generate laser by controlling the machine tool in a numerical control manner, the laser swings through the two-dimensional galvanometer 13 to form a required laser shape, the workpiece 7 is turned and ground by using the formed laser shape, while in operation, the fourth rotating shaft 6 can be controlled by the numerical control manner to rotate continuously, so that the workpiece 7 can be driven by the fourth rotating shaft 6 to rotate, the laser beam ablates redundant materials, the unnecessary materials are removed at one time, or the unnecessary materials are removed layer by layer, the required shape of a workpiece 7 is processed, the good turning and grinding operation effects of the workpiece 7 are ensured, the standard cylinder, or the cone, or the revolving body with any shape such as a ball head and the like can be processed by controlling the linkage of the X shaft 3, the Y shaft 4, the Z shaft 10 and the fourth rotating shaft 6, the processing operations such as straight groove, spiral groove, or punching and the like are completed, the conventional tool grinding tool is replaced by laser for turning and grinding, the traditional turning and grinding equipment can be replaced, compared with the traditional turning and grinding equipment, the processing device has the characteristics of high processing speed, small surface deformation and the like, the processing efficiency of materials such as diamond, ceramics and the like is improved by more than 5 times compared with the conventional turning and grinding, tools are not needed for processing, the cost of all tools and grinding tools can be saved, various materials can be processed, and a large amount of waste liquid and waste residue can not, small pollution, environment protection and convenient popularization and use.
In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Adopt laser to carry out laser beam machining equipment of turning and grinding, its characterized in that, including lathe base (1) and lathe pillar (11), lathe pillar (11) fixed mounting is in lathe base (1) lower surface both sides, lathe base (1) upper end is equipped with X axle (3), Y axle (4) are gone up in X axle (3), install work platform (5) on Y axle (4), fourth rotation axis (6) are installed to work platform (5) upper end, fourth rotation axis (6) rotate with work platform (5) and are connected, lathe base (1) upper surface one side is equipped with stationary mast (2), be equipped with Z axle (10) on stationary mast (2), be equipped with on Z axle (10) fixed case (9), the inside laser beam machining subassembly that is equipped with of fixed case (9).
2. The laser processing apparatus for turning and grinding using a laser according to claim 1, wherein: the laser processing assembly comprises a laser (12) and a two-dimensional vibrating mirror (13), the laser (12) is fixedly installed inside a fixed box (9), the two-dimensional vibrating mirror (13) is located under the laser (12), and the two-dimensional vibrating mirror (13) is fixedly installed at the bottom end of the fixed box (9).
3. The laser processing apparatus for turning and grinding using a laser according to claim 2, wherein: the laser (12) is any one of a fiber laser and a solid laser.
4. The laser processing apparatus for turning and grinding using a laser according to claim 2, wherein: the laser pulse width of the laser (12) is any one of nanosecond pulse, picosecond pulse or femtosecond pulse.
5. The laser processing apparatus for turning and grinding using a laser according to claim 2, wherein: the laser (12) swings through a two-dimensional galvanometer (13) to form a required laser shape, and the laser shape is any one of a cylinder, a cone, a rectangle or other laser shapes.
6. The laser processing apparatus for turning and grinding using a laser according to claim 1, wherein: and a workpiece positioning mechanism is arranged at the upper end of the fourth rotating shaft (6), and a workpiece (7) is arranged on the workpiece positioning mechanism.
7. The laser processing apparatus for turning and grinding using a laser according to claim 1, wherein: and a probe (8) is arranged on the fixed box (9), and the probe (8) is positioned on one side of the workpiece (7).
8. The laser processing apparatus for turning and grinding using a laser according to claim 7, wherein: the probe (8) detects the length and other angular dimensions of the workpiece (7).
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CN202010205367.2A CN113427138A (en) | 2020-03-21 | 2020-03-21 | Laser processing equipment for turning and grinding by laser |
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CN202010205367.2A CN113427138A (en) | 2020-03-21 | 2020-03-21 | Laser processing equipment for turning and grinding by laser |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114985902A (en) * | 2022-07-05 | 2022-09-02 | 深圳市力博刀具技术有限公司 | Device for machining integral PCD cutter through laser linkage |
CN116652837A (en) * | 2023-07-31 | 2023-08-29 | 烟台大学 | Diamond coating polishing equipment and method |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000167681A (en) * | 1998-12-04 | 2000-06-20 | Samsung Electronics Co Ltd | Laser cutting substrate, liquid crystal display panel and manufacture of the panel |
CN101767252A (en) * | 2010-01-06 | 2010-07-07 | 北京希波尔科技发展有限公司 | Laser tool grinding method and tool grinding machine |
CN103842124A (en) * | 2011-09-21 | 2014-06-04 | 阿莱恩技术有限公司 | Laser cutting system and method of laser cutting |
CN104923606A (en) * | 2015-04-23 | 2015-09-23 | 上海交通大学 | Light path device and method for laser peening forming of large workpiece |
CN105328331A (en) * | 2015-11-10 | 2016-02-17 | 哈尔滨工程大学 | Strong-focusing optical system used for composite machining of laser turning and grinding and machining method |
US20170189998A1 (en) * | 2015-10-30 | 2017-07-06 | Citic Dicastal Co., Ltd | Device and Method for Degating of Aluminum Wheel Blank by Laser Cutting |
CN109926731A (en) * | 2017-12-18 | 2019-06-25 | 夏浥 | A kind of method and device for the preparation of diamond cutter femtosecond laser |
CN110587123A (en) * | 2019-09-17 | 2019-12-20 | 深圳市牧激科技有限公司 | Laser processing device and processing method thereof |
-
2020
- 2020-03-21 CN CN202010205367.2A patent/CN113427138A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000167681A (en) * | 1998-12-04 | 2000-06-20 | Samsung Electronics Co Ltd | Laser cutting substrate, liquid crystal display panel and manufacture of the panel |
CN101767252A (en) * | 2010-01-06 | 2010-07-07 | 北京希波尔科技发展有限公司 | Laser tool grinding method and tool grinding machine |
CN103842124A (en) * | 2011-09-21 | 2014-06-04 | 阿莱恩技术有限公司 | Laser cutting system and method of laser cutting |
CN104923606A (en) * | 2015-04-23 | 2015-09-23 | 上海交通大学 | Light path device and method for laser peening forming of large workpiece |
US20170189998A1 (en) * | 2015-10-30 | 2017-07-06 | Citic Dicastal Co., Ltd | Device and Method for Degating of Aluminum Wheel Blank by Laser Cutting |
CN105328331A (en) * | 2015-11-10 | 2016-02-17 | 哈尔滨工程大学 | Strong-focusing optical system used for composite machining of laser turning and grinding and machining method |
CN109926731A (en) * | 2017-12-18 | 2019-06-25 | 夏浥 | A kind of method and device for the preparation of diamond cutter femtosecond laser |
CN110587123A (en) * | 2019-09-17 | 2019-12-20 | 深圳市牧激科技有限公司 | Laser processing device and processing method thereof |
Non-Patent Citations (2)
Title |
---|
史玉升: "《3D打印技术系列丛书 3D打印技术概论》", 29 February 2016 * |
胡玉禧: "《应用光学》", 28 February 2009 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114985902A (en) * | 2022-07-05 | 2022-09-02 | 深圳市力博刀具技术有限公司 | Device for machining integral PCD cutter through laser linkage |
CN116652837A (en) * | 2023-07-31 | 2023-08-29 | 烟台大学 | Diamond coating polishing equipment and method |
CN116652837B (en) * | 2023-07-31 | 2023-10-03 | 烟台大学 | Diamond coating polishing equipment and method |
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Application publication date: 20210924 |