CN109926731A - A kind of method and device for the preparation of diamond cutter femtosecond laser - Google Patents
A kind of method and device for the preparation of diamond cutter femtosecond laser Download PDFInfo
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- CN109926731A CN109926731A CN201711398567.9A CN201711398567A CN109926731A CN 109926731 A CN109926731 A CN 109926731A CN 201711398567 A CN201711398567 A CN 201711398567A CN 109926731 A CN109926731 A CN 109926731A
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Abstract
The present invention relates to a kind of method and devices for the preparation of diamond cutter femtosecond laser, belong to laser processing and field of machining.This method is using specially designed digital control platform installation positioning diamond cutter, and the cutting and polishing that can adjust angle and the height and position of femto-second laser galvanometer simultaneously to meet diamond cutter require.Working position of cutter can be adjusted by the accurate multiaxis positioning system on lathe during this, so that machining accuracy is guaranteed.The present invention is suitable for the laser processing of arc-blade diamond cutter, and the Circular Nose Cutting Edge laser cutting of diamond segment can be realized by the deflection of laser galvanometer and the uniform rotation of cutter pedestal and polishing and obtains sharp complete cutting edge roundness.The present invention is suitable for the cutting and polishing preparation of traditional diamond bit milling cutter and diamond micropowder milling cutter lathe tool simultaneously.Dedicated unit is then made of cutter holding device, multiaxis laser-processing system, femto-second laser three parts.
Description
Technical field
The present invention relates to a kind of method and devices for the preparation of diamond cutter femtosecond laser, belong to laser processing and machine
Tool manufacture field.
Technical background
Diamond cutter industrially has extensive purposes, wherein diamond cutter milling and turning technology military project,
The fields such as electronic semi-conductor and optical component have important application.The workpiece processed using sharp diamond cutter
Surface smoothness is high, reliable in quality, and cutter life is much higher than conventional rigid alloy cutter.In all kinds of cutting tools,
Hard alloy and coated cutting tool are relatively easy to due to preparation so cheap dosage is very big, however since diamond difficulty adds
The characteristic of work, so that the processing of single-crystal diamond, cvd diamond cutter is more difficult in contrast, still Price-dependent at present
High diamond grinders' dop device fabrication, simultaneously because the hard brittleness of diamond makes the forming of cutter head and sharpening especially tired
Difficulty causes processing efficiency extremely low, and is likely to occur the destructivenesses such as cutter head fracture and damages, since these factors make this kind of cutter
Price is higher and production efficiency is lower.And laser machine have many advantages, such as it is high-efficient, do not influenced by material hardness, can be used for gold
The cutting processing of hard rock material, but traditional nanosecond laser is big to the heat affecting of material, causes diamond to will appear cleavage broken
Equal machining damages can not process bright and clean tool surface and form sharp complete cutting edge.And in recent years, femtosecond laser processing
Technology is gradually applied to micro processing field, and femtosecond laser refers to that (1 femtosecond is equal to 10 to pulsewidth in femtosecond rank-15Second)
Laser, have the characteristics that process that heat affected area is small, material removal efficiency is high, cut edge is fine, make it in processing Buddha's warrior attendant
It is with significant advantage when this kind of hard brittle material of stone.Therefore this patent is using the cooperation NC cutting tool positioning of femtosecond laser system of processing
Platform realizes the Precision Machining preparation of diamond micropowder cutter.
Summary of the invention
The purpose of the present invention is in diamond cutter preparation process, diamond removal difficulty is big, processing efficiency is low
The laser process of preparing and dedicated unit of a kind of efficient, high processing quality are proposed the problems such as poor, with grinding quality to mention
The preparation efficiency and quality of high diamond cutter.
A kind of method for the preparation of diamond micropowder cutter femtosecond laser of the present invention comprising following steps:
1) by diamond cutter training part clamping on numerical control collet, cutter head exposes at least 1cm long, it is made to be processed portion
Divide focusing that can be unobstructed by laser；
2) XY is adjusted to control platform, cutter is moved to laser galvanometer and coaxially or below not coaxial CCD microscope,
And cutter head is adjusted to accurate by microscope real-time measurement function and is processed position；
3) when processing straight sword diamond cutter, laser is first opened, laser is then adjusted according to the cutting angle of cutter
The corner of galvanometer, then galvanometer height is adjusted to realize laser exact focus by Z axis motor, and determine focal position；
4) diamond tool is realized by the laser two-dimension scanning function of galvanometer or by the accurate movement of lower straight motor
Have the straight cuts and polishing of cutting edge；
5) in Machining Arc blade diamond cutter, then need first to adjust ultraprecise slide unit on rotating platform for knife to be processed
The blade center of arc of tool is adjusted to be overlapped with beneath rotating platform center, requires to adjust laser galvanometer further according to tool clearance
Angle is simultaneously focused；
6) cutter is moved near laser machining site by XY Shaft and NC Machining Test platform, passes through XY Shaft and NC Machining Test platform and CCD
Microscopical real-time observing function requires to find machining starting point according to knife tool arc radial design, finally by rotary electric machine and swashs
The cutting and polishing of Circular Nose Cutting Edge are completed in the cooperation of photosystem.
Further, the CCD microscope in step 2) can be coaxial with the object lens of laser galvanometer or be co-axially mounted, but not
Its focal length difference need to horizontal position distance needs to repair by the movement of XY Shaft and NC Machining Test platform simultaneously by assembly compensation when being co-axially mounted
Just to ensure the accurate and convenient of tool sharpening positioning.
Further, by the axially opposing rotation of laser galvanometer and corresponding fixture, (corner can be by turning in step 3)
Dynamic slide unit marking line determines) realize that galvanometer deflection angle is adjusted.
Further, settable galvanometer if the repetitive positioning accuracy lower (being greater than 5 microns) in step 4) if laser galvanometer
Laser is only focused on immediately below object lens at a bit, and is run by the high-precision of beneath XY Shaft and NC Machining Test motor to be cut into cutter
Required cutting edge pattern.
Further, the center of step 5) turntable and cutter blade circular arc is needed through the microscopical real-time sight of CCD
It surveys and measures to find.
In addition, the present invention also provides a kind of device of femtosecond laser processing diamond cutter forming preparation, the device packet
Include cutter clamping positioning machine tool and laser-processing system, in which:
Cutter clamping positioning machine tool includes bed body (1), the X being mounted on lathe to linear motor (2), Y-direction linear motor
(3), electric rotating platform (4), cutter fine adjustment clamping device (5), tool-holder cylinder and the knife handle of installation on a spinstand turn
Dynamic motor (6)；
Laser-processing system includes that the swivel slide (7) being installed on truss (10) is used to adjust laser galvanometer deflection angle
Degree, Z axis linear motor (8) are mounted on (1), laser galvanometer (9), galvanometer installation truss (10) are matched with Z axis linear motor (8)
Close installation；It installs micrometering tool setting device (11) additional on galvanometer, realize that CCD microscope is adopted by light source (13) connection (11)
Light, laser light source import lens combination (12) be mounted on the right side of truss (10) and bed body (1) on, laser freuqency doubling and polarising means
(14) it is mounted on the output end of femto-second laser (15) and imports laser, motor and microscope software installation with respective optical path device
The process of cutter is controlled and detected on PC machine (16) and with it.
The electric rotating platform and swivel slide adjustable rotary angle are 360 degree, and resolution ratio is 0.1 degree, rotation
Graduation mark is indicated on slide unit, can accurately adjust the turned position of fixture；Knife handle collet both can also be with by fastening screw
Through interference fit clamping on knife handle rotary electric machine.
The invention has the advantages that this method is different from traditional diamond micropowder tool grinding preparation method, use
The method of femtosecond laser processing is cut and polishing diamond cutter, without macroscopical active force in process, to the rigidity of machine tool without too
High request；Make laser spot hot spot opposite piece can by specific lines or pattern movement using laser galvanometer or digital control platform simultaneously
It realizes the forming cutting of cutter blade of various shapes, and can guarantee the higher accuracy of form and position and cutting edge quality, can also pass through vibration
The two dimension filling scanning function of mirror software, realizes cutter larger surface (> 1cm2) femtosecond laser polishing treatment；And it can lead to
The rotation system for crossing lathe realizes the processing preparation of the arc-blade diamond milling cutter or lathe tool with unified relief angle；Due to laser plus
The versatility of work, the present apparatus can process each diamond-like or other superhard cutters, including single-crystal diamond (ND), plycrystalline diamond
Diamond (PCD), cvd diamond, nano polycrystal diamond (BLPCD), PCBN and CBN cutter etc..Related device at
It is this relative moderate, simple and reliable for structure, easy to use, can be adjusted in real time by numerical control and CCD display system tool position with
The cutter preparation for realizing different designs structure, is able to achieve each of all kinds of conventional PCD lathe tools, milling cutter and diameter 0.01mm to 1mm
The efficient of the fine milling cutter of diamond-like, high-precision and high quality preparation.
Detailed description of the invention
Fig. 1 is a kind of schematic device for the preparation of diamond micropowder cutter femtosecond laser according to the present invention.
Fig. 2 is femto-second laser and frequency doubling device riding position schematic diagram.
Fig. 3 is the schematic diagram of the different axis installation form of CCD microscope.
Wherein each label title: 1- bed body, 2-X axis linear motor, 3-Y axis linear motor, 4- accurate digital control swivel slide,
5- piezoelectric ceramics precision positioning slide unit, 6- cutter clamping device, 7- rotate slide unit, 8-Z axis servo linear motor, the vibration of 9- laser
Mirror, 10- galvanometer clamping truss, 11-CCD microscope, 12- laser optical path reflector mount lens systems, 13- light intensity light source, 14-
Laser freuqency doubling and polarization regulating device, 15- femto-second laser, 16- real time monitoring and electric machine control system.
Specific embodiment
The present invention relates to a kind of method and devices for the preparation of diamond cutter femtosecond laser, are suitable for PCD (plycrystalline diamond gold
Hard rock), efficient, the high-precision preparation forming and polishing of single-crystal diamond and cvd diamond cutter.
The key step for preparing diamond cutter using device of the present invention is as follows:
Step 1, by diamond cutter training part clamping on cutter clamping device 6, cutter head exposes at least 1cm long, makes its quilt
Process the focusing that part can be unobstructed by laser；
Step 2, X is adjusted to the position of linear motor 2 and Y-direction linear motor 3 by numerical control program, cutter is moved to sharp
11 lower section of light galvanometer 9 and coaxial or different axis CCD microscope, and arrived cutter head adjusting by 11 real-time measurement function of CCD microscope
Accurately processed position；
Step 3, when processing straight sword diamond cutter, femto-second laser 15 is first opened, then according to the cutting angle of cutter
Degree adjusts the correspondence corner of laser galvanometer 9 by rotation slide unit 7, then adjusts laser galvanometer 9 by Z axis servo linear motor 8
Height simultaneously realizes laser exact focus in the part that cutter needs to remove, and is examined by the numerical control program position of tri- spindle motor of XYZ
Measurement of power can determine that position of the focus in three-dimensional system of coordinate, finally by laser galvanometer 9 two-dimensional scanning function or pass through numerical control
The accurate movement of XY axis linear motor realizes the straight cuts and polishing of diamond cutter cutting edge below process control；
Step 4, in Machining Arc blade diamond cutter, then the real-time observation and measurement function by CCD microscope 11 are needed
The piezoelectric ceramics precision positioning slide unit 5 on accurate digital control swivel slide 4 is adjustable by knife tool arc center adjustment to be processed extremely
It is overlapped with beneath rotating platform center, requires to adjust 9 rotational angle of laser galvanometer further according to tool clearance, open femtosecond laser
Device 15 realizes laser exact focus in the part that cutter needs to remove, while determining position of the focus in three-dimensional system of coordinate；
Step 5, cutter is moved near focal position of laser by XY Shaft and NC Machining Test platform, it is real by CCD microscope 11
When measurement function and according to knife tool arc radial design require determine machining starting point, finally by accurate digital control swivel slide 4
The energy of uniform rotation and laser spot removes material to complete the cutting and polishing of knife tool arc sword.
Above-mentioned femto-second laser should select the model suitable for diamond cutting processing, general lower heavy using having
Frequently the femto-second laser of (1KHz`10KHz) and higher single pulse energy (>=100 μ J).
As shown in Figure 1, Figure 2 and Fig. 3, it is a kind of for diamond micropowder cutter femtosecond laser preparation device, the device include 1,
Cutter essence of the X to linear motor 2, Y-direction linear motor 3, electric rotating platform 4, installation on a spinstand being mounted on lathe
Close clamping device 5, tool-holder cylinder and knife handle rotary electric machine 6, the swivel slide 7 being installed on truss 10 of adjusting is for adjusting laser
Galvanometer deflection angle, Z axis linear motor 8 are mounted on 1, laser galvanometer 9, galvanometer installation truss 10 and Z axis linear motor 8 cooperate
Installation；It installs micrometering tool setting device 11 additional on galvanometer, the daylighting of CCD microscope, laser light is realized by the connection of light source 13 11
Source importing lens combination 12 is mounted in 10 right side of truss and bed body 1, laser freuqency doubling and polarising means 14 are mounted on femtosecond laser
The output end of device 15 is simultaneously controlled with respective optical path device importing laser, motor and microscope software installation in PC machine 16 and with it
With the process of detection cutter.
Above-mentioned accurate digital control swivel slide 4 and rotation 7 adjustable rotary angle of slide unit are 360 degree, and resolution ratio is 0.1
Degree rotates and indicates graduation mark on slide unit 7, can accurately adjust the turned position of fixture；8 shift motion of Z axis servo linear motor
30mm need to be greater than, X-axis linear motor and Y-axis linear motor shift motion are both needed to be greater than 50mm.Knife handle collet both can be by tight
Gu screw can also can also select stepper motor to drive by interference fit clamping on knife handle rotary electric machine or rotation slide unit
Rotary table for clamp cutter and adjust cutter axial direction corner.
There are many concrete application approach of the present invention, the above is only a preferred embodiment of the present invention, it is noted that for
For those skilled in the art, without departing from the principle of the present invention, several improvement can also be made, this
A little improve also should be regarded as protection scope of the present invention.
Claims (12)
1. a kind of method prepared for straight sword and arc-blade diamond cutter femtosecond laser, it is characterised in that including walking as follows
It is rapid:
1) by diamond cutter training part clamping on numerical control collet, cutter head exposes at least 1cm long, and so that it is processed part can
With the focusing unobstructed by laser；
2) it adjusts XY cutter is moved to below laser galvanometer and coaxial CCD microscope to control platform, and passes through microscope
Cutter head is adjusted to accurate and is processed position by real-time measurement function；
3) when processing straight sword diamond cutter, laser is first opened, laser galvanometer is then adjusted according to the cutting angle of cutter
Corner, then galvanometer height is adjusted to realize laser exact focus by Z axis motor, and determine focal position；
4) diamond cutter sword is realized by the laser two-dimension scanning function of galvanometer or by the accurate movement of lower straight motor
The straight cuts and polishing of mouth；
5) in Machining Arc blade diamond cutter, then need first to adjust ultraprecise slide unit on rotating platform for cutter to be processed
Center of arc, which is adjusted to be overlapped with beneath rotating platform center, realizes precision positioning, requires to adjust laser further according to tool clearance
Galvanometer angle is simultaneously focused；
6) cutter is moved near laser machining site by XY Shaft and NC Machining Test platform, it is micro- by XY Shaft and NC Machining Test platform and CCD
The real-time observing function of mirror requires to find machining starting point according to knife tool arc radial design, finally by rotary electric machine and laser system
The cutting and polishing of Circular Nose Cutting Edge are completed in the cooperation of system.
2. the method according to claim 1 prepared for straight sword and arc-blade diamond cutter femtosecond laser, feature
Be: CCD microscope in step 2) can be coaxial with the object lens of laser galvanometer or be co-axially mounted, but when not being co-axially mounted its
Focal length difference need to horizontal position distance be needed through the mobile amendment of XY Shaft and NC Machining Test platform to ensure cutter simultaneously by assembly compensation
Processing positions accurate and convenient.
3. the method according to claim 1 or 2 prepared for straight sword and arc-blade diamond cutter femtosecond laser, special
Sign is: as that can need to remove part in diamond segment when judging focal position by laser facula brightness size in step 3)
Select focus point to guarantee that cutter live part is injury-free.
4. the method according to claim 1 or 2 prepared for straight sword and arc-blade diamond cutter femtosecond laser, special
Sign is: the adjusting at knife tool arc center needs to realize by the microscopical online precise measurement of CCD in step 5).
5. the method according to claim 1 or 2 prepared for straight sword and arc-blade diamond cutter femtosecond laser, special
Sign is: linear velocity tune needed for the revolving speed of rotary electric machine needs the size and processing according to knife tool arc radius in step 6)
Section.
6. a kind of device realized described in claim 1 for femtosecond laser processing diamond cutter forming preparation, feature exist
In: the device includes cutter clamping positioning machine tool and laser-processing system, in which:
Cutter clamping positioning machine tool include bed body (1), the X being mounted on lathe to linear motor (2), Y-direction linear motor (3),
Cutter fine adjustment clamping device (5), tool-holder cylinder and the knife handle rotation of electric rotating platform (4), installation on a spinstand are slided
Platform (6)；
Laser-processing system includes that the swivel slide (7) being installed on truss (10) is used to adjust laser galvanometer deflection angle, Z axis
Linear motor (8) is mounted on (1), laser galvanometer (9), galvanometer installation truss (10) are coupled with Z axis linear motor (8)；
It installs micrometering tool setting device (11) additional on galvanometer, the daylighting of CCD microscope, laser light is realized by light source (13) connection (11)
Source importing lens combination (12) is mounted in truss (10) right side and bed body (1), laser freuqency doubling and polarising means (14) are mounted on
The output end of femto-second laser (15) simultaneously imports laser, motor and microscope software installation in PC machine (16) with respective optical path device
Process upper and with its control and detection cutter.
7. the device of femtosecond laser processing diamond cutter forming preparation according to claim 6, it is characterised in that: electronic
Rotating platform (4) adjustable rotary angle is 360 °, and resolution ratio is 0.001 °, and turntable is controlled by servo motor, can accurately be adjusted
The turned position of whole cutter.
8. the device according to claim 6 or 7 for realizing femtosecond laser processing diamond cutter forming preparation, feature exist
In: Z axis linear motor (8) drives laser galvanometer movement, and sliding stroke 50cm, positioning accuracy is up to 1 μm.
9. the device according to claim 6 or 7 for realizing picosecond laser processing diamond micropowder milling cutter forming preparation, special
Sign is: swivel slide (7) adjustable rotary angle is ± 180 °, and resolution ratio is 0.01 °, and turntable can be by motor control or control manually
It makes to adjust the rotational angle of galvanometer.
10. the device according to claim 6 for realizing femtosecond laser processing diamond micropowder milling cutter forming preparation, feature
Be: the X of lathe reaches 20cm or more to Y-direction linear motor stroke, and positioning accuracy reaches 1 μm, and maximum operational speed is more than
100mm/s。
11. the device according to claim 6 for realizing femtosecond laser processing diamond micropowder milling cutter forming preparation, feature
Be: micrometering tool setting device (11) can be vertically mounted on galvanometer (9) so that the object lens with galvanometer coaxially facilitate observation
And focusing or CCD microscope can not be co-axially mounted with the object lens of galvanometer, but its focal length difference need to pass through when not being co-axially mounted
Assembly compensation or slide unit are adjusted, while horizontal position distance is needed through the mobile amendment of XY Shaft and NC Machining Test platform to ensure tool sharpening
What is positioned is accurate and convenient.
12. the device according to claim 6 for realizing femtosecond laser processing diamond micropowder milling cutter forming preparation, feature
Be: laser freuqency doubling and polarising means (14) can be used dedicated frequency-doubling crystal and realize that femto-second laser (15) output light source is (general
For 1064nm or 800nm wavelength) 2 frequencys multiplication, 3 frequencys multiplication, to realize conversion of the infrared femtosecond laser to green light, black light；It should
Device is also needed equipped with quarter-wave plate and its axial rotating mechanism to realize that laser light source switchs to circular polarization by linear polarization to mention
High machined surface quality.
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| CN201711398567.9A CN109926731A (en) | 2017-12-18 | 2017-12-18 | A kind of method and device for the preparation of diamond cutter femtosecond laser |
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| CN201711398567.9A CN109926731A (en) | 2017-12-18 | 2017-12-18 | A kind of method and device for the preparation of diamond cutter femtosecond laser |
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| CN114985978A (en) * | 2022-06-30 | 2022-09-02 | 长沙中拓创新科技有限公司 | Diamond processing laser lathe and processing technology |
| CN114985978B (en) * | 2022-06-30 | 2023-08-18 | 长沙中拓创新科技有限公司 | Diamond processing laser lathe and processing technology |
| CN114985902A (en) * | 2022-07-05 | 2022-09-02 | 深圳市力博刀具技术有限公司 | Device for machining integral PCD cutter through laser linkage |
| CN115673420A (en) * | 2022-11-11 | 2023-02-03 | 临沂友诚制锯技术服务有限公司 | Diamond sawtooth back angle laser processing technology |
| CN115519185B (en) * | 2022-11-11 | 2023-03-21 | 临沂友诚制锯技术服务有限公司 | Machining process for machining two sides of PCD diamond saw teeth by utilizing laser |
| CN115673420B (en) * | 2022-11-11 | 2023-04-07 | 临沂友诚制锯技术服务有限公司 | Diamond sawtooth back angle laser processing technology |
| CN115519185A (en) * | 2022-11-11 | 2022-12-27 | 临沂友诚制锯技术服务有限公司 | Machining process for machining two sides of PCD diamond saw teeth by utilizing laser |
| CN116652837A (en) * | 2023-07-31 | 2023-08-29 | 烟台大学 | Diamond coating polishing equipment and method |
| CN116652837B (en) * | 2023-07-31 | 2023-10-03 | 烟台大学 | Diamond coating polishing equipment and method |
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