CN113601257B - Microstructure array processing device and method based on variable-pitch fly cutter cutting - Google Patents
Microstructure array processing device and method based on variable-pitch fly cutter cutting Download PDFInfo
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- 238000012545 processing Methods 0.000 title claims abstract description 64
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- 238000000034 method Methods 0.000 title claims abstract description 28
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
- B23Q15/20—Automatic control or regulation of feed movement, cutting velocity or position of tool or work before or after the tool acts upon the workpiece
- B23Q15/22—Control or regulation of position of tool or workpiece
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a microstructure array processing device and method based on variable-pitch fly cutter cutting, and belongs to the technical field of ultra-precise turning. The machining device comprises a base, a machine tool X axis, a machine tool Y axis, a machine tool Z axis, a machine tool B axis, a machine tool C axis, a vacuum chuck, a variable-pitch fly cutter X axis and a workpiece clamp. In the microstructure machining process, the linear motor, the voice coil motor and the piezoelectric positioning platform which are processed by high rigidity and high frequency are selected to precisely control the rotation radius of the cutter, so that the centrifugal force condition caused by eccentric rotation of the cutter can be optimized to a certain extent, the fly-cutting machining has the capability of machining a general microstructure under the condition of not relying on slow cutter or fast cutter servo, and compared with the common turning machining, the method has the advantage of variable rotation axis, thereby also having the capability of machining a microstructure array.
Description
Technical Field
The invention relates to a microstructure array processing device and method based on variable-pitch fly cutter cutting, and belongs to the technical field of ultra-precise turning.
Background
The microstructure array is used as a miniaturized and highly integrated basic optical component, and has high filling coefficient and optical performance, so that the microstructure array is widely applied to the fields of photoelectricity, information, precision engineering and the like. Meanwhile, the micro-nano scale geometric topological feature of the microstructure array brings higher requirements to the ultra-precise processing technology. Existing manufacturing methods of photoetching, special energy fields, high-energy streams and the like are generally limited to certain special materials, and have complex process and severe environment. The mold-based imprint lithography technique is one of the most feasible ways to achieve high-efficiency fabrication of microstructure arrays, and therefore fabrication of ultra-precise molds is considered critical for microstructure array applications.
The existing preparation method of the ultra-precise die comprises ultra-precise micro-milling, ultra-precise turning based on fast knife or slow knife servo and fly knife cutting. The ultra-precise micro milling adopts a micro milling cutter and a static pressure cutter spindle, so that the ultra-precise micro milling has higher processing freedom degree and processing stability, but the milling material removing mechanism leads to the fact that the ultra-precise micro milling cannot achieve higher processing efficiency finally.
The ultra-precise turning is realized by fixing a workpiece on the surface of a main shaft through a servo technology of a feed shaft, fixing a cutter on a Z shaft, fitting a plane scanning cutting track through a machine tool main shaft and an X-direction moving shaft, and enabling the cutter to move in a feed direction at high frequency according to geometric design information of the surface of a die, so that the structure of a free curved surface is realized.
Fly-cutting has evolved from ultra-precise turning, with the exception that diamond tools are typically fixed to the surface of the spindle, the workpiece is fixed to the feed shaft, its cutting speed is constant, and the material removal process is typically discontinuous. Because the rotating radius of the cutter is fixed, the fly cutter cutting is used for micro-structure array processing, and a slow cutter or a fast cutter servo technology of a feed shaft is also required, and the difference is that the scanning modes of cutting projection planes are different, and the tracking frequency of the feed shaft does not need to be changed along with the increase of the size of a workpiece. The difficulty of fly-cutter cutting applied to microstructure surface machining is the analysis of the geometric information of the microstructure on the cutting track of the cutter, and the high-frequency servo technology of the feed shaft of the cutter is still required.
Therefore, the existing various microstructure array processing devices and methods still have the problems of poor processing quality, limited cutting efficiency, complex device structure and the like, and development of a new device and method for processing the microstructure array is needed.
Disclosure of Invention
Based on the defects existing in the prior art, the invention aims to provide a microstructure array processing device and method based on variable-pitch fly cutter cutting.
The technical problems to be solved by the invention are realized by adopting the following technical scheme:
a microstructure array processing device based on variable-pitch fly cutter cutting comprises a base, a machine tool X axis, a machine tool Y axis, a machine tool Z axis, a machine tool B axis, a machine tool C axis, a vacuum chuck, a variable-pitch fly cutter X axis and a workpiece clamp; the X-axis and the Z-axis of the machine tool are arranged on the base in a T-shaped structure, the Y-axis of the machine tool is vertically fixed on a sliding table of the X-axis of the machine tool, the B-axis of the machine tool and the C-axis of the machine tool are respectively arranged on the sliding tables of the Z-axis of the machine tool and the Y-axis of the machine tool, the X-axis of the variable-pitch fly cutter is connected with the C-axis of the machine tool through a vacuum chuck, and the workpiece clamp is connected with a rotating table of the B-axis of the machine tool.
As a preferred example, the distance-variable fly-cutter x-axis comprises a cutter fine adjustment device, a linear positioning table, a storage battery, a positioning table driver, a wireless server, a driver connecting plate, a battery connecting plate, a first balancing weight, a second balancing weight and a distance-variable fly-cutter x-axis base, wherein the cutter fine adjustment device is installed on the linear positioning table, the driver connecting plate and the battery connecting plate are all fixed on the distance-variable fly-cutter x-axis base, the positioning table driver and the wireless server are all connected with the driver connecting plate, the storage battery is clamped and fixed through two battery connecting plates, and the first balancing weight and the second balancing weight are respectively fixed on the distance-variable fly-cutter x-axis base.
As a preferred example, the linear positioning stage is selected from any one of a linear motor, a piezoelectric linear displacement stage, or a voice coil motor.
As a preferred example, the tool fine adjustment device includes an XY manual fine adjustment displacement table, a tool holder, a diamond tool, a tool holder connection plate, a slide table clamping sleeve, and a manual slide table connection plate; the XY manual fine adjustment displacement platform is connected with the linear positioning platform through the manual sliding table connecting plate, a sliding table clamping sleeve is arranged between the manual sliding table connecting plate and the cutter holder connecting plate, the cutter holder is connected with the XY manual fine adjustment displacement platform through the cutter holder connecting plate, and the diamond cutter is fixed on the cutter holder.
The method for processing the microstructure array by using the microstructure array processing device based on the variable-pitch fly cutter comprises the following steps of:
step 1: according to the geometric information of the microstructure unit to be processed, writing a triaxial turning processing program, wherein the triaxial turning processing program comprises cutter radial positioning data, main shaft fixed rotating speed and feeding shaft position, and extracting main shaft rotating speed and feeding shaft position data for driving a machine tool;
step 2: establishing a servo control model of a variable-pitch fly cutter x-axis and a machine tool Z-axis feeding shaft according to a corresponding table of the radial positioning and the feeding shaft of the cutter;
step 3: the method comprises the steps of installing a variable-pitch fly cutter x-axis on the surface of a main shaft, and enabling the axis of a base of the variable-pitch fly cutter x-axis to coincide with the axis of the main shaft of a machine tool through a meter, so that the same installation position of a cutter servo platform each time is ensured;
step 4: after the trial cutting workpiece is installed on the surface of the B axis of the machine tool, the surface of the workpiece is calibrated, and the depth information of the surface of the workpiece in the Z axis direction of the machine tool is consistent by rotating the B axis of the machine tool by a certain angle, so that the workpiece is ensured to be perpendicular to the feeding direction of the cutter;
step 5: initializing a cutter linear positioning table, and adjusting an XY manual fine adjustment displacement table after trial cutting to ensure that a cutter point of a cutter coincides with the axis of a main shaft when the rotation radius is zero and is fixed;
step 6: moving the cutter to different rotation radius states, performing secondary trial cutting on the workpiece at the working rotation speed to obtain a plurality of annular grooves, and measuring the caliber of the grooves by using an optical microscope, so as to calibrate and compensate the actual positioning accuracy of the cutter at different rotation radii under the combined action of centrifugal force and gravity;
step 7: clamping a workpiece to be processed according to the step 4, driving a machine tool C shaft and a machine tool Z shaft, reading real-time positioning data of the machine tool Z shaft through an upper computer, and driving a linear positioning table of a variable-pitch fly cutter X shaft through a servo control model established in the step 2, so that processing of a single microstructure unit is realized;
step 8: after the processing of the single micro-lens unit is completed, the surface morphology of the single micro-lens unit is measured by using a profiler, and the processing program of the micro-structure unit is compensated according to the actual measured PV value. Reprocessing the workpiece by using the compensated servo control model, thereby obtaining a target microstructure unit;
step 9: and (3) moving the X axis and the Y axis of the machine tool, changing the relative positions of the cutting axis of the cutter and the workpiece, and repeating the step (8), so that the high-efficiency cutting processing of the microstructure units can be performed at different positions of the workpiece, and the array of microstructures is realized.
The beneficial effects of the invention are as follows:
(1) According to the microstructure array processing device and method provided by the invention, in the microstructure processing process, the linear motor, the voice coil motor and the piezoelectric positioning platform which are processed by high rigidity and high frequency are selected for precisely controlling the rotation radius of the cutter, so that the centrifugal force condition caused by eccentric rotation of the cutter can be optimized to a certain extent, the fly-cutting processing has the capability of processing a general microstructure under the condition of not relying on slow cutter or fast cutter servo, and compared with the common turning processing, the microstructure array processing device and method have the advantage of variable rotation axes, so that the capability of processing the microstructure array is also provided;
(2) The combination of the storage battery and the wireless server enables the linear positioning table to realize stable control under the condition of external wireless cable connection, and the same function can be realized through a slip ring mode, so that the processing of a single microstructure unit has higher processing quality by virtue of calibration compensation;
(3) The difference between the processing of different microstructures is only the difference of the processing positions, and the processing processes are completely the same, so that the microstructure processing device and the microstructure processing method provided by the invention have better processing consistency, are not influenced by the size of a workpiece to be processed, and have higher processing efficiency compared with the traditional slow-cutter servo and micro-milling modes.
Drawings
FIG. 1 is a schematic perspective view of a microstructure array processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a microstructure array processing apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of an x-axis of a variable pitch fly-cutter according to an embodiment of the invention;
FIG. 4 is a schematic top view of the x-axis of a variable pitch fly-cutter according to an embodiment of the invention;
FIG. 5 is a schematic perspective view of a fine adjustment device for a tool according to an embodiment of the present invention;
FIG. 6 is a schematic diagram showing a front view of a fine adjustment device of a tool according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a general fly-cutter;
FIG. 8 is a schematic diagram of a general ultra-precise turning;
FIG. 9 is a schematic diagram of the operation of a microstructure array machining apparatus for machining microstructure elements based on variable-pitch fly cutter cutting;
FIG. 10 is a schematic diagram of the operation of a microstructure array machining apparatus for machining a microstructure array based on variable-pitch fly cutter cutting;
fig. 11 is a schematic structural diagram of a microstructure array according to an embodiment of the present invention.
In the figure: 1. a base; 2. an X axis of the machine tool; 3. a Y axis of the machine tool; 4. the Z axis of the machine tool; 5. a machine tool B axis; 6. a machine tool C axis; 7. a vacuum chuck; 8. a variable-pitch fly cutter x axis; 9. a workpiece holder; 10. a workpiece; 11. a main shaft; 12. a cutter; 13. a microstructure unit; 81. a cutter fine adjustment device; 82. a linear positioning table; 83. a storage battery; 84. a positioning table driver; 85. a wireless server; 86. a driver connection board; 87. a battery connection plate; 88. a first balancing weight; 89. a second balancing weight; 810. a variable-pitch fly cutter x-axis base; 811. XY manual fine adjustment displacement table; 812. a tool apron; 813. a diamond cutter; 814. a tool apron connecting plate; 815. the sliding table clamps the sleeve; 816. manual slip table connecting plate.
Detailed Description
The invention will be further described with reference to the following detailed drawings and examples, in order to make the technical means, the creation features, the achievement of the objects and the effects of the invention easily understood.
Examples:
as shown in fig. 1-2, the embodiment of the invention provides a microstructure array processing device based on variable-pitch fly cutter cutting, which comprises a base 1, a machine tool X-axis 2, a machine tool Y-axis 3, a machine tool Z-axis 4, a machine tool B-axis 5, a machine tool C-axis 6, a vacuum chuck 7, a variable-pitch fly cutter X-axis 8 and a workpiece clamp 9; the machine tool X-axis 2 and the machine tool Z-axis 4 are arranged on the base 1 in a T-shaped structure, the machine tool Y-axis 3 is vertically fixed on a sliding table of the machine tool X-axis 2, the machine tool B-axis 5 and the machine tool C-axis 6 are respectively arranged on the sliding tables of the machine tool Z-axis 4 and the machine tool Y-axis 3, the variable-pitch fly cutter X-axis 8 is connected with the machine tool C-axis 6 through a vacuum chuck 7, and a workpiece clamp 9 is connected with a turntable of the machine tool B-axis 5.
As shown in fig. 3-4, the variable-pitch fly-cutter x-axis 8 includes a cutter fine adjustment device 81, a linear positioning table 82, a battery 83, a positioning table driver 84, a wireless server 85, a driver connection plate 86, a battery connection plate 87, a first balancing weight 88, a second balancing weight 89, and a variable-pitch fly-cutter x-axis base 810, the cutter fine adjustment device 81 is mounted on the linear positioning table 82, the driver connection plate 86, and the battery connection plate 87 are all fixed on the variable-pitch fly-cutter x-axis base 810, the positioning table driver 84 and the wireless server 85 are all connected with the driver connection plate 86, the battery 83 is clamped and fixed by the two battery connection plates 87, and the first balancing weight 88 and the second balancing weight 89 are respectively fixed on the variable-pitch fly-cutter x-axis base 810.
As shown in fig. 5 to 6, the tool fine adjustment device 81 includes an XY manual fine adjustment displacement table 811, a tool holder 812, a diamond tool 813, a tool holder connecting plate 814, a slide table clamping sleeve 815, and a manual slide table connecting plate 816; the XY manual fine adjustment displacement table 811 is connected with the linear positioning table 82 through a manual sliding table connecting plate 816, a sliding table clamping sleeve 815 is arranged between the manual sliding table connecting plate 816 and a tool holder connecting plate 814, the tool holder 812 is connected with the XY manual fine adjustment displacement table 811 through the tool holder connecting plate 814, and the diamond tool 813 is fixed on the tool holder 812.
The linear positioning stage 82 may be a linear motor, a piezoelectric linear displacement stage, or a voice coil motor, which may be a linear servo stage with high rigidity and high response frequency.
The position of the diamond tool tip and the axis of rotation of the machine C-axis 6 can be changed by adjusting the XY manual fine adjustment displacement table 811. After the diamond tool reaches the initial position of the linear positioning table 82, the diamond tool is ensured to be on the rotating axis through trial cutting, so that the normal direction of any point of the spiral line track of the diamond tool in the cutting process is overlapped with the radial direction of the machine tool C axis 6, and the relative positions of the tool apron connecting plate 814 and the manual sliding table connecting plate 816 are adjusted after the clamping sleeve 815 of the sliding table and the screw fixation are carried out.
The linear positioning table 82 can realize radial high-frequency precise positioning of the diamond tool 813 on the surface of the machine tool C-axis 6. Different from the traditional fly cutter cutting with fixed rotation radius, the distance from the diamond cutter 813 of the variable-pitch fly cutter X-axis 8 to the rotation center of the machine tool C-axis 6 can be controlled in real time, so that a spiral line cutting track is fitted, the micro-structure unit 13 can be processed by combining the machine tool Z-axis 4, the machine tool X-axis 2 and the machine tool Y-axis 3 are released, free movement of the machine tool rotation cutting axis is realized, and finally the array processing of the micro-structure unit 13 can be completed by moving the machine tool X-axis 2 and the machine tool Y-axis 3.
The mass of the first balancing weight 88 and the mass of the second balancing weight 89 are obtained through multiple dynamic balance experiments, the dynamic unbalance amounts of the variable-pitch fly cutter x-axis 8 in two directions are respectively decomposed and measured through an online dynamic balance measuring device, after the suitable dynamic balance mass blocks are matched, the compensated dynamic balance measurement is performed, the experiments are repeated for multiple times, and the variable-pitch fly cutter x-axis 8 is guaranteed to have good balance at the initial position.
As shown in fig. 8, in the conventional ultra-precise turning, a workpiece 10 is fixed on the surface of a spindle 11 by a servo technology of a feed shaft, a tool 12 is fixed on a Z-axis, a planar scanning cutting track is fitted by a machine tool spindle 11 and an X-direction moving shaft, and the tool 12 is made to move in a feed direction at a high frequency according to geometric design information of a mold surface, so that a free-form surface structure is realized. Where fr represents the feed amount.
As shown in fig. 7, the fly-cutting has been developed from ultra-precise turning, except that the tool 12 is usually fixed to the surface of the spindle 11, the workpiece 10 is fixed to the feed shaft, its cutting speed is constant, and the material removal process is usually discontinuous. Because of the fixed radius of rotation of the tool 12, the use of fly-cutting for microstructured array machining also requires slow or fast tool servo techniques for the feed shaft, differing in the manner of scanning the cutting projection plane, without the need to change the tracking frequency of the feed shaft as the size of the workpiece 10 increases. The difficulty of fly-cutting applications for microstructure surface machining is the resolution of the geometric information of the microstructure on the cutting trajectory of the tool 12, and the high frequency servo technique of the feed axis of the tool 12 is still required.
The invention provides a microstructure array processing method based on variable-pitch fly cutter cutting, which comprises the following steps:
step 1: according to the geometric information of the microstructure unit 13 to be processed, writing a triaxial turning processing program, wherein the triaxial turning processing program comprises radial positioning data of a cutter 12, fixed rotating speed of a main shaft 11 and feeding shaft position, and extracting rotating speed of the main shaft 11 and feeding shaft position data for driving a machine tool;
step 2: according to a corresponding table of radial positioning and feeding shafts of the cutter 12, a servo control model of feeding shafts of the variable-pitch fly cutter x-axis 8 and the machine tool Z-axis 4 is established;
step 3: the variable-pitch fly cutter x-axis 8 is arranged on the surface of the main shaft 11, and the base axis of the variable-pitch fly cutter x-axis is overlapped with the axis of the main shaft 11 of the machine tool by marking a meter, so that the position of each installation of the servo platform of the cutter 12 is ensured to be the same;
step 4: after the trial cut workpiece 10 is installed on the surface of the machine tool B shaft 5, the surface of the workpiece 10 is calibrated, and the depth information of the surface of the workpiece 10 in the direction of the Z shaft 4 of the machine tool is consistent by rotating the machine tool B shaft 5 for a certain angle, so that the workpiece 10 is ensured to be perpendicular to the feeding direction of the cutter 12;
step 5: initializing a linear positioning table 82 of the cutter 12, and adjusting an XY manual fine adjustment displacement table 811 after trial cutting to enable a cutter point of the cutter 12 to coincide with the axis of the main shaft 11 and be fixed when the rotation radius is zero;
step 6: moving the cutter 12 to different rotation radius states, performing secondary trial cutting on the workpiece 10 at the working rotation speed to obtain a plurality of annular grooves, and measuring the caliber of the grooves by using an optical microscope, thereby calibrating and compensating the actual positioning accuracy of the cutter 12 under the combined action of centrifugal force and gravity at different rotation radii;
step 7: clamping a workpiece 10 to be processed according to the step 4, driving a machine tool C shaft 6 and a machine tool Z shaft 4, reading real-time positioning data of the machine tool Z shaft 4 through an upper computer, and driving a linear positioning table 82 of a variable-pitch fly cutter X shaft 8 through a servo control model established in the step 2, so as to realize processing of a single microstructure unit 13;
step 8: after the processing of the individual microlens units is completed, the surface topography thereof is measured using a profiler, and the processing program of the microstructure unit 13 is compensated according to the actual measured PV value. Reprocessing the workpiece 10 using the compensated servo control model to obtain the target microstructure unit 13;
step 9: the machine tool X axis 2 and the machine tool Y axis 3 are moved, the relative positions of the cutting axis of the cutter 12 and the workpiece 10 are changed, and the step 8 is repeated, so that the high-efficiency cutting processing of the microstructure unit 13 can be performed at different positions of the workpiece 10, and the array of microstructures is realized.
As shown in fig. 11, a schematic structural diagram of a microstructure array provided in the embodiment of the present invention is shown, and the processing requirement of the surface microstructure array is to uniformly process microstructures on the surface of brass according to a certain arrangement, the structure spacing is 2mm in the transverse direction and the longitudinal direction, the microstructure unit 13 is 0.846mm in caliber, and the microstructure depth is 67um.
Before cutting, the surface of the workpiece 10 is perpendicular to the machine tool Z axis 4 by rotating the B axis, and the tool 12 is aligned with the axis of the machine tool spindle 11 in the row Cheng Lingdian by trial cutting and adjusting the XY manual fine adjustment displacement table 811. After the cutter 12 and the workpiece 10 are installed, the variable-pitch fly cutter x-axis 8 is driven to a series of calibration positions respectively, a plurality of circular rings are processed on the trial cut piece, the actual caliber of the circular rings is compared with the driving data of the variable-pitch fly cutter x-axis 8, and the positioning error models of the fly cutters in different rotation radiuses in the actual cutting process are obtained and compensated.
As shown in fig. 9, microstructure trial cutting is performed according to a servo control model of the feeding axes of the variable-pitch fly cutter x-axis 8 and the machine tool Z-axis 4 after compensation, and after machining is completed, the microstructure trial cutting is taken down, surface quality is measured by using a profilometer, a white light interferometer, and the like, and a machining program is subjected to secondary compensation according to a topography PV value.
As shown in fig. 10, the 1 st microstructure unit 13 shown in fig. 11 is processed on the surface of the workpiece 10 according to the control model after the secondary compensation, the machine tool X axis 2 and the machine tool Y axis 3 respectively move by 2mm after the processing is completed, the processing of the microstructure units 13 is repeated, the 2 nd microstructure unit 13 can be processed at each position 2mm away from the 1 st microstructure in the transverse and longitudinal directions, and 5 lens units arranged according to the requirements can be finally processed by repeating the steps, so that a microlens array with consistent quality is finally obtained.
Compared with the prior art, the invention has the following technical effects:
according to the microstructure array processing device and method provided by the invention, in the microstructure processing process, the linear motor, the voice coil motor and the piezoelectric positioning platform which are processed by high rigidity and high frequency are selected to precisely control the rotation radius of the cutter 12, so that the centrifugal force condition caused by eccentric rotation of the cutter 12 can be optimized to a certain extent, fly-cutting processing has the capability of processing a general microstructure under the condition of not relying on slow cutter or fast cutter servo, compared with common turning processing, the microstructure array processing device and method have the advantage of changeable rotation axes, therefore, the microstructure array processing device and method also have the capability of processing microstructure arrays, the combination of the storage battery 83 and the wireless server 85 enables the linear positioning platform 82 to realize stable control under the condition of external wireless cable connection, the same function can be realized through a slip ring mode, and the processing of a single microstructure unit 13 has higher processing quality by virtue of calibration compensation. In addition, the difference between the processing of different microstructures is only the difference of the processing positions, and the processing processes are completely the same, so that the microstructure processing device and method provided by the invention have better processing consistency, are not influenced by the size of the workpiece 10 to be processed, have higher processing efficiency and have wide application prospect compared with the traditional slow-cutter servo and micro-milling modes.
The foregoing describes in detail preferred embodiments of the present invention. It should be understood that numerous modifications and variations can be made in accordance with the concepts of the invention by one of ordinary skill in the art without undue burden. Therefore, all technical solutions which can be obtained by logic analysis, reasoning or limited experiments based on the prior art by the person skilled in the art according to the inventive concept shall be within the scope of protection defined by the claims.
Claims (3)
1. The microstructure array machining device based on the variable-pitch fly cutter cutting is characterized by comprising a base (1), a machine tool X-axis (2), a machine tool Y-axis (3), a machine tool Z-axis (4), a machine tool B-axis (5), a machine tool C-axis (6), a vacuum chuck (7), a variable-pitch fly cutter X-axis (8) and a workpiece clamp (9); the machine tool X-axis (2) and the machine tool Z-axis (4) are arranged on the base (1) in a T-shaped structure, the machine tool Y-axis (3) is vertically fixed on a sliding table of the machine tool X-axis (2), the machine tool B-axis (5) and the machine tool C-axis (6) are respectively arranged on the sliding tables of the machine tool Z-axis (4) and the machine tool Y-axis (3), the variable-pitch fly cutter X-axis (8) is connected with the machine tool C-axis (6) through a vacuum chuck (7), and the workpiece clamp (9) is connected with a turntable of the machine tool B-axis (5);
the distance-variable fly cutter x-axis (8) comprises a cutter fine-tuning device (81), a linear positioning table (82), a storage battery (83), a positioning table driver (84), a wireless server (85), a driver connecting plate (86), a battery connecting plate (87), a first balancing weight (88), a second balancing weight (89) and a distance-variable fly cutter x-axis base (810), wherein the cutter fine-tuning device (81) is arranged on the linear positioning table (82), the driver connecting plate (86) and the battery connecting plate (87) are all fixed on the distance-variable fly cutter x-axis base (810), the positioning table driver (84) and the wireless server (85) are connected with the driver connecting plate (86), the storage battery (83) is clamped and fixed through two battery connecting plates (87), and the first balancing weight (88) and the second balancing weight (89) are respectively fixed on the distance-variable fly cutter x-axis base (810);
the cutter fine adjustment device (81) comprises an XY manual fine adjustment displacement table (811), a cutter holder (812), a diamond cutter (813), a cutter holder connecting plate (814), a sliding table clamping sleeve (815) and a manual sliding table connecting plate (816); the XY manual fine adjustment displacement platform (811) is connected with the straight line positioning platform (82) through manual slip table connecting plate (816), manual slip table connecting plate (816) with be equipped with slip table clamp sleeve (815) between blade holder connecting plate (814), blade holder (812) through blade holder connecting plate (814) with XY manual fine adjustment displacement platform (811) is connected, diamond cutter (813) are fixed in on blade holder (812).
2. The micro-structure array processing device based on variable-pitch fly cutter cutting according to claim 1, wherein the linear positioning table (82) is selected from any one of a linear motor, a piezoelectric linear displacement table and a voice coil motor.
3. A method for machining a microstructure array based on variable-pitch fly-cutting as claimed in any one of claims 1 to 2, comprising the steps of:
step 1: according to the geometric information of a microstructure unit (13) to be processed, writing a triaxial turning program, wherein the triaxial turning program comprises radial positioning data of a cutter (12), a main shaft (11) is fixed in rotating speed, a feeding shaft position, and the rotating speed of the main shaft (11) and the feeding shaft position data are extracted for driving a machine tool;
step 2: according to a corresponding table of radial positioning and feeding shafts of the cutter (12), a servo control model of feeding shafts of a variable-pitch fly cutter x-axis (8) and a machine tool Z-axis (4) is established;
step 3: the variable-pitch fly cutter x-axis (8) is arranged on the surface of the main shaft (11), and the base axis of the variable-pitch fly cutter x-axis is overlapped with the axis of the main shaft (11) of the machine tool by marking a meter, so that the positions of each installation of the servo platform of the cutter (12) are ensured to be the same;
step 4: after the trial cutting workpiece (10) is installed on the surface of the machine tool B shaft (5), the surface of the workpiece (10) is calibrated, and the depth information of the surface of the workpiece (10) in the direction of the machine tool Z shaft (4) is consistent by rotating the machine tool B shaft (5) by a certain angle, so that the workpiece (10) is ensured to be perpendicular to the feeding direction of the cutter (12);
step 5: initializing a linear positioning table (82) of the cutter (12), and adjusting an XY manual fine adjustment displacement table (811) after trial cutting to ensure that the cutter point of the cutter (12) coincides with the axis of the main shaft (11) when the rotation radius is zero and is fixed;
step 6: moving the cutter (12) to different rotation radius states, performing secondary trial cutting on the workpiece (10) at the working rotation speed to obtain a plurality of annular grooves, and measuring the caliber of the grooves by using an optical microscope, so as to calibrate and compensate the actual positioning accuracy of the cutter (12) under the combined action of centrifugal force and gravity at different rotation radii;
step 7: clamping a workpiece (10) to be processed according to the step 4, driving a machine tool C shaft (6) and a machine tool Z shaft (4), reading real-time positioning data of the machine tool Z shaft (4) through an upper computer, and driving a linear positioning table (82) of a variable-pitch fly cutter x shaft (8) through a servo control model established in the step 2, so as to realize processing of a single microstructure unit (13);
step 8: after the processing of the single micro lens unit is finished, measuring the surface morphology of the single micro lens unit by using a profiler, compensating the processing program of the micro structure unit (13) according to the actually measured PV value, and reprocessing the workpiece (10) by using a compensated servo control model to obtain the target micro structure unit (13);
step 9: the machine tool X axis (2) and the machine tool Y axis (3) are moved, the relative positions of the cutting axis of the cutter (12) and the workpiece (10) are changed, and the step 8 is repeated, so that the high-efficiency cutting processing of the microstructure units (13) can be performed at different positions of the workpiece (10), and the array of microstructures is realized.
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Denomination of invention: A microstructure array machining device and method based on variable pitch flying knife cutting Granted publication date: 20230905 Pledgee: Shinan Branch of Bank of Shanghai Co.,Ltd. Pledgor: Linding optics (Shanghai) Co.,Ltd. Registration number: Y2024980041675 |