CN107414284A - A kind of PRK aids in micro- milling method and device - Google Patents

A kind of PRK aids in micro- milling method and device Download PDF

Info

Publication number
CN107414284A
CN107414284A CN201710783580.XA CN201710783580A CN107414284A CN 107414284 A CN107414284 A CN 107414284A CN 201710783580 A CN201710783580 A CN 201710783580A CN 107414284 A CN107414284 A CN 107414284A
Authority
CN
China
Prior art keywords
micro
mask
platform
laser
milling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710783580.XA
Other languages
Chinese (zh)
Inventor
陈涛
何凤玺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing University of Technology
Original Assignee
Beijing University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing University of Technology filed Critical Beijing University of Technology
Priority to CN201710783580.XA priority Critical patent/CN107414284A/en
Publication of CN107414284A publication Critical patent/CN107414284A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

A kind of PRK aids in micro- milling method and device, belongs to laser assisted processing technique field.The system of processing is mainly by laser, computer, laser homogenizer, mask and mask exchange platform, focusing objective len, light path deflecting system, micro- milling system, rotary table and micro- mobile work platform composition, on the premise of laser and micro- milling cutter are relatively fixed, increase by a micro- mobile work platform, position of the workpiece relative to laser is changed by the method for travelling workpiece, so as to realize that PRK aids in micro- Milling Process.The present invention is realized with quasi-molecule laser source to aid in Milling Process workpiece, and a kind of new method is provided for the processing of micro parts.

Description

A kind of PRK aids in micro- milling method and device
Technical field
The present invention relates to laser assisted micro Process field, and micro- Milling Process side is aided in more particularly to a kind of PRK Method and device.
Background technology
With high-techs such as aerospace industry, weapon industry, microelectronics industry, space development, marine technology, biological medicines The rapid development in skill field, it is more and more for the demand of the micro parts with good characteristic.While material property improves Difficulty is brought to processing.Not only speed is slow and process tool serious wear, surface matter for traditional mechanical milling method Amount is poor.The methods of electrical discharge machining, Electrolyzed Processing, ultrasonic wave processing, increases in machining accuracy than conventional tool processing, But there is also the loss of electrode in process, and the preparation of electrode also increases the cost of processing and extends the process-cycle; Ion beam processing and electron beam process do not have the loss of electrode, but the former material removing rate is relatively low, and latter devices' cost is high.These Processing method all there is it is different the defects of.
PRK is after high-power CO2Laser and Nd:After YAG Solid State Lasers, another enters the big of commercial Application Power laser, in addition to a small number of excimer lasers, PRK is all located at ultraviolet band, the wavelength pole of PRK Short, focal beam spot diameter can reach micron dimension, and because photon energy is high, focal beam spot is small, thus after focusing on hot spot power Density is up to 108~1010W/cm2.And because photon energy is larger, compared with the chemical bond energy of many materials, especially without Machine thing, its photon energy are greater than the chemical bond energy between material, so when PRK and material interact, it is accurate Molecular laser even can directly interrupt the part chemical bond of material and realize cold working sometimes.Thus it has in micro Process field Larger development potentiality.
Existing laser assisted milling attachment is all to transmit laser using optical fiber, and for as gas such as excimer lasers Body laser, because laser spot position is not easy to control, it is not used also in the micro- Milling Process of auxiliary.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the invention provides a kind of PRK to aid in micro- Milling Process side Method and device.
The technical solution adopted in the present invention is:
A kind of PRK aids in micro- milling method and device, the device of the system to include:Controlled equipped with system The even beam device (3) of computer (1), excimer laser (2), light beam of program, the mask exchange platform (4) for pasting mask, focus on Object lens (5), prism (6), prism angular adjustment apparatus (7), electro spindle (8), the micro- milling cutter being fixed on electro spindle (8) (9), two-dimensional micro-movement platform (10), rotary table (11), three-dimensional micro- mobile station (12), motor driver (13), wherein two dimension Micro-displacement platform (10), rotary table (11), three-dimensional micro- mobile station (12) composition machine table, rotary table (11) pivot With electro spindle (8) center superposition, two-dimensional micro-displacement platform (10) is fixed on rotary table (11), and workpiece is fixed on by fixture On two-dimensional micro-movement platform (10), computer (1) connects with excimer laser (2), electro spindle (8), motor driver (13) respectively Connect, the even beam device (3) of excimer laser (2), light beam, mask exchange platform (4), focusing objective len (5), prism (6) light path successively Connection, mask, which is exchanged at the incident light of platform (4), a mask, mask exchange platform (4) emergent light pass sequentially through focusing objective len (5) and On workpiece on prism (6) deviation to two-dimensional micro-displacement platform (10);Electro spindle (8), micro- milling cutter (9) and two-dimensional micro-movement platform (10) micro- milling system is formed;Motor driver (13) moves with two-dimensional micro-displacement platform (10), turntable (11), three-dimensional micro-shifting respectively Platform (12) connects.
The PRK realized using described device aids in micro- milling method, it is characterised in that including following step Suddenly:
(1) light channel structure that PRK aids in micro- Milling Process system is calibrated, makes the instruction light of excimer laser With the same overlapping of axles of Ultra-Violet Laser of quasi-molecule, the laser beam after even beam can pass perpendicularly through the hole in mask face and through poly- Focus objective lens optical axis and prism;
(2) mask is attached into mask to exchange at the incident light of platform (4), mask is adjusted to spot center position, makes by even beam Hot spot afterwards can cover whole mask aperture, and fixed tight mask and mask exchange platform;
(3) workpiece is placed on two-dimensional micro-movement platform (10) and fixed, by the micro- mobile station of movement change workpiece with it is micro- The relative position of milling cutter;
(4) incoming position of prism angular adjustment apparatus control laser facula is adjusted, material will be removed by being allowed to be radiated at The position of material;
(5) optimization processing technology parameter is selected by temperature field finite element simulation, obtains laser energy, laser pulse frequency The technological parameters such as rate, feed speed, the amount of feeding, the speed of mainshaft;
(6) laser is opened, according to the machining locus workpieces processing of planning.
Computer in the present invention includes following functions to the application interface of the system of processing:The triggering control of laser, The mask selection control of mask stage, the motor control of three-dimensional micro-displacement platform, turntable and two-dimensional micro-displacement platform, and to electricity The rotating speed control of main shaft.
Electro spindle of the present invention connects described attachment means with micro- milling cutter and sees Fig. 2, and micro- milling cutter passes through collet It is fixed on nut in attachment means, attachment means are fixed with electro spindle again.
Beneficial effects of the present invention:
The advantages of fully combining laser milling and mechanical milling of the invention, cutting for material is improved by laser milling technology Cut performance, reach reduce tool wear, reduce surface roughness, be obviously improved micro parts crudy purpose;
The present invention aids in micro- Milling Process workpiece using gas lasers such as excimer lasers as LASER Light Source, can To obtain higher machined surface quality, experimental result surface roughness has machining accuracy height, material up to 40-50nm or so The advantages that material is high to the absorptivity of light.
Brief description of the drawings
Fig. 1 is the schematic diagram that a kind of PRK of the present invention aids in micro- milling device.In figure:1. system control is housed The computer of processing procedure sequence;2. excimer laser;3. the even beam device of light beam;4. mask exchanges platform;5. focusing objective len;6. prism; 7. prism angle regulator;8. electro spindle;9. micro- milling cutter;10. two-dimensional micro-movement platform;11. rotary table;It is 12. three-dimensional Micro- mobile station;13. motor driver.
Fig. 2 is that electro spindle connects described attachment means schematic diagram with micro- milling cutter.
Fig. 3 is the fixture schematic diagram being fixed on prism on angular displacement platform.
Fig. 4 is prism angle regulator schematic diagram.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings, but the present invention is not limited to following examples.
Reference picture 1, a kind of PRK proposed by the present invention aid in micro- milling device to include:Computer and control The even beam device of software, excimer laser, light beam, mask and mask exchange platform, focusing objective len, prism, prism angle adjustment Device, electro spindle, micro- milling cutter, processing mobile work platform and motor driver.
The present invention can carry out PRK to lucite PMMA and aid in micro- milling.
PRK aids in micro- milling lucite PMMA processing specific steps to include:
(1) light channel structure that PRK aids in micro- Milling Process system is calibrated, makes the instruction light of excimer laser With the same overlapping of axles of Ultra-Violet Laser of quasi-molecule, the laser beam after even beam can pass perpendicularly through the hole in mask face and through poly- Focus objective lens optical axis and prism;
(2) mask is attached into mask to exchange at the incident light of platform, mask is adjusted to spot center position, makes after even beam Hot spot can cover whole mask aperture, and fixed tight mask and mask exchange platform;
(3) lucite PMMA is placed on two-dimensional micro-movement platform and fixed, passed through the micro- mobile station of movement and change workpiece With the relative position of micro- milling cutter;
(4) change the angle of pitch of prism by adjusting angle displacement platform, so as to control the incoming position of laser facula, be allowed to The position of material will be removed by being radiated at;
(5) laser is opened, lucite PMMA is processed according to the machining locus of planning.
(6) machine, close laser, driving power and computer.
Embodiment described above is not intended to limit the scope of the present invention, and those skilled in the art can be according to the system Various modifications and improvement are carried out, and all these changes are within the scope of the present invention.

Claims (3)

1. a kind of PRK aids in micro- milling device, it is characterised in that the device includes computer (1), quasi-molecule The even beam device (3) of laser (2), light beam, the mask exchange platform (4) for pasting mask, focusing objective len (5), prism (6), Rhizoma Sparganii Mirror angle adjusting apparatus (7), electro spindle (8), the micro- milling cutter (9) being fixed on electro spindle (8), two-dimensional micro-movement platform (10), rotation Revolving worktable (11), three-dimensional micro- mobile station (12) and motor driver (13), wherein two-dimensional micro-displacement platform (10), rotary table (11), three-dimensional micro- mobile station (12) composition machine table, rotary table (11) pivot and electro spindle (8) center superposition, two Dimension micro-displacement platform (10) is fixed on rotary table (11), and workpiece is fixed on two-dimensional micro-movement platform (10) by fixture, meter Calculation machine (1) connects with excimer laser (2), electro spindle (8), motor driver (13) respectively, excimer laser (2), light The even beam device (3) of beam, mask exchange the light path connection successively of platform (4), focusing objective len (5), prism (6), and mask exchanges entering for platform (4) Penetrating Guang Chu has a mask, and the emergent light that mask exchanges platform (4) passes sequentially through focusing objective len (5) and prism (6) deviation to two-dimentional micro- On workpiece on displacement platform (10);Electro spindle (8), micro- milling cutter (9) and two-dimensional micro-movement platform (10) form micro- milling system;Motor Driver (13) is connected with two-dimensional micro-displacement platform (10), turntable (11), three-dimensional micro- mobile station (12) respectively.
2. device according to claim 1, it is characterised in that:Micro- milling cutter is fixed on attachment means by collet and nut On, attachment means are fixed with electro spindle again.
3. realizing that PRK aids in micro- milling method using device as claimed in claim 1 or 2, its feature exists In comprising the following steps:
(1) light channel structure that PRK aids in micro- milling device is calibrated, makes the instruction light and standard of excimer laser The same overlapping of axles of Ultra-Violet Laser of molecule, the laser beam after even beam can pass perpendicularly through mask aperture and through focusing objective len light Axle and prism;
(2) mask is attached into mask to exchange at the incident light of platform (4), mask is adjusted to spot center position, makes after even beam Hot spot can cover whole mask aperture, and fixed tight mask and mask exchange platform;
(3) workpiece is placed on two-dimensional micro-movement platform (10) and fixed, passed through the micro- mobile station of movement and change workpiece and micro- milling cutter Relative position;
(4) change the angle of pitch of prism by adjusting angle displacement platform, so as to control the incoming position of laser facula, be allowed to irradiate The position of material will removed;
(5) laser is opened, according to the machining locus workpieces processing of planning.
CN201710783580.XA 2017-09-04 2017-09-04 A kind of PRK aids in micro- milling method and device Pending CN107414284A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710783580.XA CN107414284A (en) 2017-09-04 2017-09-04 A kind of PRK aids in micro- milling method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710783580.XA CN107414284A (en) 2017-09-04 2017-09-04 A kind of PRK aids in micro- milling method and device

Publications (1)

Publication Number Publication Date
CN107414284A true CN107414284A (en) 2017-12-01

Family

ID=60435572

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710783580.XA Pending CN107414284A (en) 2017-09-04 2017-09-04 A kind of PRK aids in micro- milling method and device

Country Status (1)

Country Link
CN (1) CN107414284A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857292A (en) * 2018-09-11 2018-11-23 大连理工大学 A kind of processing method of high-precision micro groove
CN110091054A (en) * 2019-05-20 2019-08-06 中国科学院宁波材料技术与工程研究所 Combined machining method based on Laser Discrete, efficient milling and laser milling
CN113210871A (en) * 2021-04-29 2021-08-06 中国石油大学(北京) Optical path system of excimer laser and preparation method of polyimide film

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1268482A (en) * 1968-06-14 1972-03-29 Nat Res Dev Improvements in methods and apparatus for machining moving workpieces
JPH02255292A (en) * 1989-03-28 1990-10-16 Fuji Electric Co Ltd Laser processing device
CN102430904A (en) * 2011-10-19 2012-05-02 哈尔滨工业大学 Auxiliary laser heating milling device and method
CN102476237A (en) * 2010-11-23 2012-05-30 大连创达技术交易市场有限公司 Coaxial positioning laser precise processing device
CN104625421A (en) * 2015-01-18 2015-05-20 北京工业大学 Micro milling control system based on rotating laser beam mechanism
CN204545720U (en) * 2015-04-22 2015-08-12 李相玉 A kind of Portable laser cutting device
CN204657740U (en) * 2015-05-19 2015-09-23 济南微尔激光设备有限公司 A kind of full three-dimensional light-guiding transmission system of laser cutting machine
CN105108347A (en) * 2015-06-15 2015-12-02 北京工业大学 Method for quickly preparing synthetic glass microlens having adjustable curvature through excimer laser rotary etching
CN105598703A (en) * 2016-02-19 2016-05-25 广州中国科学院先进技术研究所 Laser-aided machining system and method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1268482A (en) * 1968-06-14 1972-03-29 Nat Res Dev Improvements in methods and apparatus for machining moving workpieces
JPH02255292A (en) * 1989-03-28 1990-10-16 Fuji Electric Co Ltd Laser processing device
CN102476237A (en) * 2010-11-23 2012-05-30 大连创达技术交易市场有限公司 Coaxial positioning laser precise processing device
CN102430904A (en) * 2011-10-19 2012-05-02 哈尔滨工业大学 Auxiliary laser heating milling device and method
CN104625421A (en) * 2015-01-18 2015-05-20 北京工业大学 Micro milling control system based on rotating laser beam mechanism
CN204545720U (en) * 2015-04-22 2015-08-12 李相玉 A kind of Portable laser cutting device
CN204657740U (en) * 2015-05-19 2015-09-23 济南微尔激光设备有限公司 A kind of full three-dimensional light-guiding transmission system of laser cutting machine
CN105108347A (en) * 2015-06-15 2015-12-02 北京工业大学 Method for quickly preparing synthetic glass microlens having adjustable curvature through excimer laser rotary etching
CN105598703A (en) * 2016-02-19 2016-05-25 广州中国科学院先进技术研究所 Laser-aided machining system and method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857292A (en) * 2018-09-11 2018-11-23 大连理工大学 A kind of processing method of high-precision micro groove
CN110091054A (en) * 2019-05-20 2019-08-06 中国科学院宁波材料技术与工程研究所 Combined machining method based on Laser Discrete, efficient milling and laser milling
CN113210871A (en) * 2021-04-29 2021-08-06 中国石油大学(北京) Optical path system of excimer laser and preparation method of polyimide film
CN113210871B (en) * 2021-04-29 2022-06-17 中国石油大学(北京) Preparation method of polyimide film with periodic micro-nano structure

Similar Documents

Publication Publication Date Title
CN101419336B (en) Mirror-vibrating laser three-dimensional scanning system
CN102430904A (en) Auxiliary laser heating milling device and method
CN203509355U (en) Laser three-dimensional cutting machine
CN104475971B (en) A kind of beam splitting laser multistation timesharing cutting machine and processing method
CN111347571A (en) Laser-assisted low-damage cutting machining system and method for optical hard and brittle material
CN107486640A (en) It is a kind of to improve hole taper and the laser drilling device and method of inwall quality
CN111548023B (en) Method for finely processing glass surface by using red light nanosecond laser
CN107414284A (en) A kind of PRK aids in micro- milling method and device
CN104325220B (en) A kind of multifunction laser combined-machining equipment and method
CN110722272A (en) Ultrafast laser micro-nano cutting drilling equipment and method
CN201529849U (en) Laser double-surface synchronous processing system
CN103567464A (en) Laser heating auxiliary micro-turning device and laser heating auxiliary micro-turning method
CN114770234B (en) Laser composite ultrasonic auxiliary grinding machine tool and processing method
CN113414889B (en) Method and device for compounding laser-assisted diamond cutting and laser polishing in situ
CN107030379A (en) Laser processing head, laser processing device and processing method thereof
CN114571064B (en) Laser-induced oxidation auxiliary milling composite processing device and method
CN105195903B (en) A kind of micro- water knife processing unit (plant) of laser punched for turbo blade
CN106181028A (en) A kind of five-axle linkage laser pipe cutter
CN117250907A (en) Device and method for adjusting important parameters in synchronous laser auxiliary processing in real time
CN111331263B (en) Device and method for accurately preparing turbine blade cooling hole by picosecond laser
CN109048088A (en) A kind of method and device of Long Pulse LASER and plasma jet Compound Machining micropore
CN205393786U (en) Laser processing head and laser processing device
CN210435558U (en) Drilling device with controllable taper in femtosecond laser processing
CN104625437A (en) Scanning mechanism for precision processing of laser drilling and cutting of special-shaped hole
CN115958287A (en) Laser-assisted rolling modification tool system and laser-assisted rolling method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20171201

RJ01 Rejection of invention patent application after publication