CN210435558U - Drilling device with controllable taper in femtosecond laser processing - Google Patents
Drilling device with controllable taper in femtosecond laser processing Download PDFInfo
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- CN210435558U CN210435558U CN201921430657.6U CN201921430657U CN210435558U CN 210435558 U CN210435558 U CN 210435558U CN 201921430657 U CN201921430657 U CN 201921430657U CN 210435558 U CN210435558 U CN 210435558U
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Abstract
The utility model discloses a punching device with controllable taper in femtosecond laser processing, which comprises a femtosecond laser and a precise motion platform, wherein a main shaft of the precise motion platform is provided with a supporting mechanism, and the top of the supporting mechanism is provided with a clamp; the output of femto second laser instrument is equipped with the beam expander, the output of beam expander is equipped with the speculum, and the output of speculum is equipped with the light beam scanning module, the output of light beam scanning module is equipped with half focus mirror, and the output of half focus mirror is equipped with the half speculum that 45 degrees set up, and the reflection output of half speculum is equipped with the three-dimensional online monitoring module of high accuracy, and the transmission output of half speculum is just to the anchor clamps on the precision motion platform. The utility model discloses a high accuracy three-dimensional on-line monitoring module comes to carry out real-time detection to the light beam offset in the course of working, and carries out corresponding adjustment, effectual improvement processingquality and precision; furthermore, the utility model discloses still have the advantage that machining precision is high, stability is high.
Description
Technical Field
The utility model relates to a laser beam machining field, in particular to controllable perforating device of femto second laser beam machining tapering.
Background
In the automotive industry, the injection holes in fuel injection structures are important factors that directly affect the combustion performance of internal combustion engines. The geometric accuracy of the spray hole comprises position degree, roundness, surface roughness of the hole wall and related angles of the hole. The nozzle taper of the oil nozzle has important influence on fuel atomization, the highly atomized gasoline has high combustion efficiency, and fuel is saved. In addition, the blades of the aircraft engine rotate at high speed in high-temperature gas, bear gas load, mass load and heat load, and have severe working environment. The blade body working in the high-temperature area is provided with an air film hole, and high-temperature air flow forms a low-temperature air film which flows rapidly on the surface of the blade body through the air film hole, so that high-temperature gas is isolated, and the blade is cooled and protected. The film hole processing is easy to generate a recast layer, and the quality of the recast layer has great influence on the working reliability and service life of the blade.
At present, the methods for machining the taper hole mainly comprise four methods: manual drilling is adopted on a frequency conversion or pneumatic high-speed table; drilling by adopting a numerical control high-speed multi-spindle drilling machine; processing a spray hole by adopting an electric spark spray hole machine tool; and (5) processing the spray hole by adopting a laser drilling system. However, the above method has many disadvantages. After the drilling machining process is used for machining, the burrs of the spray holes are large, the surface quality is poor, and the limitation of machining holes with small hole diameter and large depth-diameter ratio is caused; the electric spark machining process has the advantages that the machining aperture is limited by an electrode wire, a special mechanism is required to be added for machining the inverted cone hole, and inevitable errors exist; high laser processing efficiency, high accuracy of limiting aperture, low cost, no material selectivity and the like.
The conventional laser processing taper hole device consists of a deflection motor, a spindle motor and a clamp. The method is based on the basic principle that after a deflection workbench enables laser to form a proper included angle with the surface of a workpiece, a main shaft drives the workpiece to rotate, a taper hole is machined under the action of the laser, in the aspect of a machining method, the coordinate position of the workpiece under a laser control platform is calculated by adopting trial machining and measuring the radius of a machined concentric circle and combining the laser spot distance, and machining is carried out after position compensation. In the aspect of cutting speed control, the laser adopts high-speed autorotation to meet the requirement of cutting speed, and the requirement on the rotating speed of a spindle motor is reduced.
The method does not mention a method for processing a hole with a high depth-diameter ratio, and simultaneously, the problem of processing and positioning can occur when a rotating motor is used for rotating and processing a taper hole.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a controllable perforating device of femto second laser beam machining tapering. The utility model detects the processing process in real time through the high-precision three-dimensional online monitoring module, so that the error generated in the processing process can be effectively adjusted, and the processing quality and precision are improved; furthermore, the utility model discloses still have the advantage that machining precision is high, stability is high.
The technical scheme of the utility model: a perforating device with controllable taper in femtosecond laser processing comprises a femtosecond laser and a precision motion platform, wherein a main shaft of the precision motion platform is provided with a supporting mechanism, and the top of the supporting mechanism is provided with a clamp; the output of femto second laser instrument is equipped with the beam expander, the output of beam expander is equipped with the speculum, and the output of speculum is equipped with the light beam scanning module, the output of light beam scanning module is equipped with half focus mirror, and the output of half focus mirror is equipped with the half speculum that 45 degrees set up, and the reflection output of half speculum is equipped with the three-dimensional online monitoring module of high accuracy, and the transmission output of half speculum is just to the anchor clamps on the precision motion platform.
In the punching device with the controllable taper processed by the femtosecond laser, the light beam scanning module comprises a displacement light wedge group and a deflection light wedge group, the displacement light wedge group comprises a first displacement light wedge and a second displacement light wedge with the same wedge angle, and the first displacement light wedge and the second displacement light wedge are linked through an up-and-down linear motion mechanism; the deflection optical wedge group comprises a first deflection optical wedge and a second deflection optical wedge which have the same wedge angle, and the first deflection optical wedge and the second deflection optical wedge are equidistantly distributed on two sides of the displacement optical wedge group through a rotating mechanism.
In the punching device with the controllable taper processed by the femtosecond laser, the central wavelength of the optical pulse of the femtosecond laser is close to 1053nm, and the pulse width is 20 fs.
In the punching device with the controllable taper in the femtosecond laser processing, the beam scanning module adopts full closed-loop control, and the deflection angle is controlled with the precision of less than or equal to 0.1 degree.
In the punching device with the controllable taper processed by the femtosecond laser, the precision motion platform is a 5-axis motion platform, the positioning precision is 0.01mm, and the repeated positioning precision is 5 micrometers.
In the punching device with the controllable taper in femtosecond laser processing, the clamp comprises a positioning clamping block arranged at the top end of the supporting mechanism, a movable clamping block is fixed on the positioning clamping block through an adjusting bolt, and clamping grooves which are relatively arranged and distributed in a stepped manner are formed in the movable clamping block and the positioning clamping block.
A femtosecond laser processing taper controllable punching process starts a femtosecond laser to emit a beam, the beam is expanded to a diameter required by processing through a beam expander and then enters a reflector, the reflector reflects the beam to a beam scanning module, a spiral beam is generated under the action of a displacement light wedge group and a deflection light wedge group, then the beam enters a semi-transparent reflector through a semi-focusing mirror, the reflected beam enters a high-precision three-dimensional online monitoring module under the action of the semi-transparent reflector, the beam transmitted through the semi-transparent reflector is used for carrying out laser punching on a sample fixed on a clamp, meanwhile, the high-precision three-dimensional online monitoring module is used for carrying out real-time detection, then adjustment is carried out, errors generated in the processing process are effectively adjusted, and the processing precision is improved.
Compared with the prior art, the utility model has the advantages of it is following:
1. the utility model detects the processing process in real time through the high-precision three-dimensional online monitoring module, so that the error generated in the processing process can be effectively adjusted, and the processing quality and precision are effectively improved; furthermore, the utility model discloses still have the advantage that machining precision is high, stability is high.
2. The utility model provides a beam scanning module can realize arbitrary taper hole angle processing through changing the scanning route, and wherein beam scanning module includes displacement light wedge group and deflection light wedge group, and displacement light wedge group includes the same first displacement light wedge and the same second displacement light wedge of wedge angle, and first displacement light wedge and second displacement light wedge are through the linkage of up-and-down linear motion mechanism; the deflection optical wedge group comprises a first deflection optical wedge and a second deflection optical wedge which have the same wedge angle, the first deflection optical wedge and the second deflection optical wedge are distributed on two sides of the deflection optical wedge group at equal intervals through a rotating mechanism, the light beam path is changed by correspondingly controlling the first deflection optical wedge, the second deflection optical wedge, the first deflection optical wedge and the second deflection optical wedge, and any taper hole angle processing can be realized by changing the scanning path.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic structural diagram of a beam scanning module;
FIG. 3 is a schematic diagram of the punching of a forward taper hole and a backward taper hole in the embodiment;
fig. 4 is a schematic view of the structure of the jig.
1. A femtosecond laser; 2. a precision motion platform; 3. a support mechanism; 4. a clamp; 5. a beam expander; 6. a mirror; 7. a beam scanning module; 8. a semi-transparent mirror; 9. a high-precision three-dimensional online monitoring module; 10. a first displacement wedge; 11. a second displacement wedge; 12. a first deflecting wedge; 13. a second deflecting wedge; 14. positioning the clamping block; 15. adjusting the bolt; 16. a movable clamping block; 17. a card slot; 18. a half focusing mirror.
Detailed Description
The following description is made with reference to the accompanying drawings and examples, but not to be construed as limiting the invention.
Example (b): a perforating device with controllable taper in femtosecond laser processing is shown in figures 1-4 and comprises a femtosecond laser 1 and a precision motion platform 2, wherein a main shaft of the precision motion platform 2 is provided with a supporting mechanism 3, and the top of the supporting mechanism 3 is provided with a clamp 4; the output of femto second laser instrument 1 is equipped with beam expander 5, the output of beam expander 5 is equipped with speculum 6, and the output of speculum 6 is equipped with beam scanning module 7, beam scanning module 7's output is equipped with half focusing mirror 18, and half focusing mirror 18's output is equipped with half transmitting mirror 8 that 45 degrees set up, and half transmitting mirror 8's reflection output is equipped with high accuracy three-dimensional on-line monitoring module 9, and half transmitting mirror 8's transmission output is just to anchor clamps 4 on the precision motion platform 2. The utility model detects the light beam offset in the processing process in real time through the high-precision three-dimensional online monitoring module 9, so that the error generated in the processing process can be effectively adjusted, and the processing quality and precision are effectively improved; furthermore, the utility model discloses still have the advantage that machining precision is high, stability is high.
As shown in fig. 2, the light beam scanning module 7 includes a displacement light wedge group and a deflection light wedge group, the displacement light wedge group includes a first displacement light wedge 10 and a second displacement light wedge 11 having the same wedge angle, and the first displacement light wedge 10 and the second displacement light wedge 11 are linked by an up-down linear motion mechanism; the deflection optical wedge group comprises a first deflection optical wedge 12 and a second deflection optical wedge 13 with the same wedge angle, and the first deflection optical wedge 12 and the second deflection optical wedge 13 are equidistantly distributed on two sides of the displacement optical wedge group through a rotating mechanism. The utility model discloses a to first displacement optical wedge 10 and second displacement optical wedge 11 to and first optical wedge 12 and the second that deflect optical wedge 13 and carry out corresponding control, change the light beam route, can realize arbitrary taper hole angle processing through changing the scanning route.
As shown in FIG. 3, to realize the processing of the taper hole, the rotary scanning path needs to be controlled by the deflection optical wedge set and the displacement optical wedge set to realize the processing of the forward/backward taper hole. When the translation direction of the incident light beam is just opposite to the deflection direction of the light beam, and the translation distance of the light beam is at least larger than half of the diameter of the light beam (the whole light beam is translated to the other side of the optical axis), the edge of the light beam is ensured to be at least parallel to the axis of the hole or larger than zero degree in the light propagation direction, and then the light beam rotates around the optical axis at a certain speed, so that the processing of the positive taper hole is realized, the initial radius of the rotating light beam is larger, and after the light beam is fed layer by layer, the. On the contrary, to realize the machining of the reverse taper hole, the radius of the initial rotating light beam is smaller, and the rotating light beam is increased semi-gradually after the layer-by-layer feeding. The problem of edge light blocking during deep processing of the light beam is well solved.
As shown in fig. 3, the optical beam scanning module 7 is a relative relationship between a deflection optical wedge group and a displacement optical wedge group, the optical beam scanning module realizes the scanning of a circular track by the cooperative rotation of a first deflection optical wedge 12, a second deflection optical wedge 13, a first displacement optical wedge 10, and a second displacement optical wedge 11, the relative phase relationship between the deflection optical wedge group and the displacement optical wedge group controls the radius of the circular track, and when the phase relationship changes according to a certain rule, the circular spiral scanning of the corresponding track distribution can be realized.
In the actual scanning process, based on the phase of the rotation of the displacement optical wedge set, the first deflection optical wedge 12 and the second deflection optical wedge 13 are always equidistantly distributed on two sides of the displacement optical wedge set, and form a certain equal phase included angle with the displacement optical wedge set to cooperatively rotate (and a1 is always equal to a2 in fig. 3). When the phase relation between the deflection optical wedge group and the displacement optical wedge group is changed according to a certain rule, the circular spiral scanning of corresponding track distribution can be realized.
The upper end of a coaxial CCD vertical light path in the high-precision three-dimensional online monitoring module 9 is adjusted to the center of a vertical light beam and the center of a cross mark of the CCD, and the concentricity can be guaranteed to be within 0.005 mm. Before each processing and in the processing process, the CCD cross mark center and the actual processing position of the sample piece can be compared, and the processing position degree is ensured. Before each processing and in the processing process, the CCD cross mark center and the actual processing position of the sample piece can be compared, and the processing position degree is ensured.
The high-precision three-dimensional online monitoring module 9 adopts a laser three-dimensional measurement technology to realize laser six-point positioning of a complex curved surface, can accurately position a complex three-dimensional component and the complex curved surface in processing, avoids repeated clamping errors, and greatly improves alignment efficiency.
The high-precision three-dimensional online monitoring module 9 adopts a back injury protection technology, mainly comprises the steps that a semi-transparent reflector 8 is additionally arranged in a main light path, a processing focusing mirror images the change condition of micropores in the processing process on a CCD, wherein a CCD image alignment system reads the position of a light spot formed by a laser beam on a light spot calibration plate, the offset of the light spot relative to a calibration mark point is calculated, the hole punching process is detected in real time, and automatic judgment is carried out by using image recognition software, so that the on-line automatic judgment of the punching detection is realized.
The center wavelength of the light pulse of the femtosecond laser 1 is close to 1053nm, and the pulse width is 20 fs.
The precision motion platform 2 is a 5-axis motion platform, the positioning precision is 0.01mm, and the repeated positioning precision is 5 microns.
As shown in fig. 4, the fixture 4 includes a positioning clamping block 14 disposed at the top end of the supporting mechanism 3, a movable clamping block 16 is fixed on the positioning clamping block 14 through an adjusting bolt 15, and the movable clamping block 16 and the positioning clamping block 14 are provided with clamping grooves 17 which are disposed oppositely and distributed in a stepped manner.
A femtosecond laser processing taper controllable punching process starts a femtosecond laser to emit a beam, the beam is expanded to a diameter required by processing through a beam expander and then enters a reflector, the reflector reflects the beam to a beam scanning module, a spiral beam is generated under the action of a displacement light wedge group and a deflection light wedge group, then the beam enters a semi-transparent reflector through a semi-focusing mirror, the reflected beam enters a high-precision three-dimensional online monitoring module under the action of the semi-transparent reflector, the beam transmitted through the semi-transparent reflector is used for carrying out laser punching on a sample fixed on a clamp, and meanwhile, the offset of the beam is detected in real time by the high-precision three-dimensional online monitoring module and is correspondingly adjusted, so that the processing quality is ensured.
Claims (6)
1. A perforating device with controllable taper in femtosecond laser processing comprises a femtosecond laser (1) and a precision motion platform (2), wherein a main shaft of the precision motion platform (2) is provided with a supporting mechanism (3), and the top of the supporting mechanism (3) is provided with a clamp (4); the method is characterized in that: the output of femto second laser instrument (1) is equipped with beam expander (5), the output of beam expander (5) is equipped with speculum (6), and the output of speculum (6) is equipped with beam scanning module (7), the output of beam scanning module (7) is equipped with half focusing mirror (18), and the output of half focusing mirror (18) is equipped with half transmitting mirror (8) that 45 degrees set up, and the reflection output of half transmitting mirror (8) is equipped with high accuracy three-dimensional on-line monitoring module (9), and the transmission output of half transmitting mirror (8) is just to anchor clamps (4) on precision motion platform (2).
2. The perforating device with the controllable taper processed by the femtosecond laser according to claim 1, characterized in that: the light beam scanning module (7) comprises a displacement light wedge group and a deflection light wedge group, the displacement light wedge group comprises a first displacement light wedge (10) and a second displacement light wedge (11) which have the same wedge angle, and the first displacement light wedge (10) and the second displacement light wedge (11) are linked through an up-and-down linear motion mechanism; the deflection optical wedge group comprises a first deflection optical wedge (12) and a second deflection optical wedge (13) which have the same wedge angle, and the first deflection optical wedge (12) and the second deflection optical wedge (13) are equidistantly distributed on two sides of the displacement optical wedge group through a rotating mechanism.
3. The perforating device with the controllable taper processed by the femtosecond laser according to claim 1, characterized in that: the center wavelength of the light pulse of the femtosecond laser (1) is close to 1053nm, and the pulse width is 20 fs.
4. The perforating device with the controllable taper processed by the femtosecond laser according to claim 1, characterized in that: the light beam scanning module (7) adopts full closed-loop control, and controls the deflection angle with the precision of less than or equal to 0.1 degree.
5. The perforating device with the controllable taper processed by the femtosecond laser according to claim 1, characterized in that: the precision motion platform (2) is a 5-axis motion platform, the positioning precision is 0.01mm, and the repeated positioning precision is 5 micrometers.
6. The perforating device with the controllable taper processed by the femtosecond laser according to claim 1, characterized in that: anchor clamps (4) are including setting up location grip block (14) on supporting mechanism (3) top, be fixed with movable grip block (16) through adjusting bolt (15) on location grip block (14), be equipped with relative setting and be draw-in groove (17) of cascaded distribution on movable grip block (16) and location grip block (14).
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| CN201921430657.6U CN210435558U (en) | 2019-08-30 | 2019-08-30 | Drilling device with controllable taper in femtosecond laser processing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110405368A (en) * | 2019-08-30 | 2019-11-05 | 温州大学 | A kind of perforating device and its drilling technology that femtosecond laser processing taper is controllable |
| CN114833472A (en) * | 2022-05-26 | 2022-08-02 | 苏州思萃声光微纳技术研究所有限公司 | Laser processing method for non-taper cooling air film hole of aero-engine flame tube |
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2019
- 2019-08-30 CN CN201921430657.6U patent/CN210435558U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110405368A (en) * | 2019-08-30 | 2019-11-05 | 温州大学 | A kind of perforating device and its drilling technology that femtosecond laser processing taper is controllable |
| CN114833472A (en) * | 2022-05-26 | 2022-08-02 | 苏州思萃声光微纳技术研究所有限公司 | Laser processing method for non-taper cooling air film hole of aero-engine flame tube |
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